PAC100-CXDXXX [P-TEC]
Easy mounting on PCB or socket;型号: | PAC100-CXDXXX |
厂家: | P-tec Corporation |
描述: | Easy mounting on PCB or socket PC |
文件: | 总9页 (文件大小:914K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
PRODUCT SPECIFICATION
Part Number
PAC100-CxDxxx
Details
Features
1.0” (25.4mm) Display
1 Digit, Alphanumeric
Common Anode or Cathode
AlInGaP or InGaN dice used
Low power consumption
RoHS Compliant
Gray Face, White Segments or Black Face,
White Segments
Easy mounting on PCB or socket
Mechanical Dimensions
Notes:
1. Dimensions in millimeters [inch], and tolerance is ±0.25 [.010] and angle is ±1° unless otherwise noted.
2. Bending ≤ Length*1%
3. All pins are Ø0.510.[020]±0.1[.004]
4. Specifications subject to change without notice
www.p-tec.net
040715 Rev1 JAS
Page 1 of 9
Device Selection Guide
Chip
Emitting Color
Description
Note
Model Number
Material
PAC100-CxDG05
PAC100-CxDG17
PAC100-CxDY04
PAC100-CxDA11
PAC100-CxDR02
PAC100-CxDR11
PAC100-CxDR21
InGaN
True Green
Yellow Green
Yellow
Amber
Orange-Red
Red
Common
Cathode x=C
/
Common
Anode x=A
Add “BFWS” to end
of part number for
Black Face, White
Segment version
AlInGaP
Deep Red
Absolute Maximum Ratings at Ta=25°C
Parameter
Symbol
Rating
Unit
G17/Y04/A11/R02/R11/R21
G05
Power Dissipation per Dice
Derating Liner from 25°C per Dice
Continuous Forward Current Per Dice
Peak Current Per Dice (duty cycle
1/10, 1KHz)
PAD
--
IAF
70
0.33
25
114
0.4
30
mW
mA/°C
mA
IPF
90
100
mA
Reverse Voltage Per Dice
Electrostatic Discharge (HBM)
Operating Temperature
VR
ESD
Topr
Tstg
5
/
5
1000
V
V
°C
°C
-35~+85
-35~+85
Storage Temperature
Solder Conditions: 1/16 inch below seating plane for 3 -5 seconds at 260°C.
www.p-tec.net
040715 Rev1 JAS
Page 2 of 9
Electrical and Optical Characteristics at Ta=25°C
Parameter
Symbol
Chip
Min.
Typ.
Max.
Unit
Condition
G05
G17/Y04/A11
/R02/R11/R21
--
6.4(3.2)
7.6(3.8)
Forward Voltage Per
Segment
VF
V
IF=20mA
--
4(2)
5.6(2.8)
G05
G17
Y04
A11
R02
R11
R21
G05
G17
Y04
A11
R02
R11
R21
--
--
--
--
--
--
--
--
--
--
--
--
--
--
--
576
32
137
181
88
--
--
--
--
--
Luminous Intensity Per
Segment
Iv
mcd
nm
IF=10mA
IF=20mA
60
46
--
--
--
--
--
--
--
--
100
*/525
572/570
592/590
612/605
632/625
644/630
660/645
--
Peak Emission
Wavelength /
Dominant Wavelength
λP/λd
Reverse Current
Luminous Intensity
Matching Ratio
IR
μA
VR=10(5)V
IF=10mA
Iv-m
--
--
2:1
--
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040715 Rev1 JAS
Page 3 of 9
Typical Electrical/Optical Characteristic Curves
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040715 Rev1 JAS
Page 4 of 9
Luminous General lv Bin Grade (IF = 10mA)
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040715 Rev1 JAS
Page 5 of 9
All Light-On Segments Feature & Pad Position
Internal Circuit Diagram
Common Anode
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040715 Rev1 JAS
Page 6 of 9
Common Cathode
Precautions for Use
1. Recommended soldering conditions
1.1. Wave soldering
Basic SPEC is ≤ 5sec. When 260°C. If temperature is higher, time should be shorter (+10°C→ -1sec.).
1.2. Soldering Iron:
Power dissipation of iron should be smaller than 15W and temp should be controllable. Soldering
temperature should be under 260°C, time ≤ 3sec.
www.p-tec.net
040715 Rev1 JAS
Page 7 of 9
Packing Dimensions
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040715 Rev1 JAS
Page 8 of 9
Note: 1. Specifications subject to change without notice.
Approved By
Checked By
Prepared By
Customer Approval
Signatures
Record Of Revisions
Comments
Released Spec
Logo Update
Rev.
0
1
Page
--
All
Date
11/12/13
04/07/15
www.p-tec.net
040715 Rev1 JAS
Page 9 of 9
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