PDC393-CxMG17 [P-TEC]

Low power consumption;
PDC393-CxMG17
型号: PDC393-CxMG17
厂家: P-tec Corporation    P-tec Corporation
描述:

Low power consumption

文件: 总9页 (文件大小:975K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
PRODUCT SPECIFICATION  
Part Number  
PDC393-CxMxxx  
Details  
Features  
0.39”(10.00mm) Display  
3 Digit, 7 Segment  
Common Anode or Cathode  
AlInGaP or InGaN dice used  
Low power consumption  
RoHS Compliant  
Gray Face, White Segments or Black Face,  
White Segments  
Easy mounting on PCB or socket  
Mechanical Dimensions  
Notes:  
1. Dimensions in millimeters [inch], and tolerance is ±0.25 [.010] and angle is ±1° unless otherwise noted.  
2. Bending ≤ Length*1%  
3. All pins are Ø0.45[.018]±0.1[.004]  
4. Specifications subject to change without notice  
www.p-tec.net  
040815 Rev1 JAS  
Page 1 of 9  
Device Selection Guide  
Chip  
Emitting Color  
Description  
Note  
Model Number  
Material  
PDC393-CxMG05  
PDC393-CxMG17  
PDC393-CxMY04  
PDC393-CxMA11  
PDC393-CxMR02  
PDC393-CxMR11  
PDC393-CxMR21  
InGaN  
True Green  
Yellow Green  
Yellow  
Amber  
Orange-Red  
Red  
Common  
Cathode x=C  
/
Common  
Anode x=A  
Add “BFWS” to end  
of part number for  
Black Face, White  
Segment version  
AlInGaP  
Deep Red  
Absolute Maximum Ratings at Ta=25°C  
Parameter  
Symbol  
Rating  
Unit  
G17/Y04/A11/R02/R11/R21  
G05  
Power Dissipation per Dice  
Derating Liner from 25°C per Dice  
Continuous Forward Current Per Dice  
Peak Current Per Dice (duty cycle  
1/10, 1KHz)  
PAD  
--  
IAF  
70  
0.33  
25  
114  
0.4  
30  
mW  
mA/°C  
mA  
IPF  
90  
100  
mA  
Reverse Voltage Per Dice  
Electrostatic Discharge (HBM)  
Operating Temperature  
VR  
ESD  
Topr  
Tstg  
5
/
5
V
V
°C  
°C  
1000  
-35~+85  
-35~+85  
Storage Temperature  
Solder Conditions: 1/16 inch below seating plane for 3 -5 seconds at 260°C.  
www.p-tec.net  
040815 Rev1 JAS  
Page 2 of 9  
Electrical and Optical Characteristics at Ta=25°C  
Parameter  
Symbol  
Chip  
Min.  
Typ.  
Max.  
Unit  
Condition  
G05  
G17/Y04/A11  
/R02/R11/R21  
--  
3.2  
3.8  
Forward Voltage Per  
Segment  
VF  
V
IF=20mA  
--  
2
2.8  
G05  
G17  
Y04  
A11  
R02  
R11  
R21  
G05  
G17  
Y04  
A11  
R02  
R11  
R21  
--  
--  
--  
--  
--  
--  
--  
--  
--  
--  
--  
--  
--  
--  
--  
150  
9
38  
48  
23  
--  
--  
--  
--  
--  
Luminous Intensity Per  
Segment  
Iv  
mcd  
nm  
IF=10mA  
IF=20mA  
16  
14  
--  
--  
--  
--  
--  
--  
--  
--  
100  
*/525  
572/570  
592/590  
612/605  
632/625  
644/630  
660/645  
--  
Peak Emission  
Wavelength /  
Dominant Wavelength  
λP/λd  
Reverse Current  
Luminous Intensity  
Matching Ratio  
IR  
μA  
--  
VR=5V  
Iv-m  
--  
--  
2:1  
IF=10mA  
www.p-tec.net  
040815 Rev1 JAS  
Page 3 of 9  
Typical Electrical/Optical Characteristic Curves  
www.p-tec.net  
040815 Rev1 JAS  
Page 4 of 9  
Luminous General lv Bin Grade (IF = 10mA)  
Color Rank Limits (IF=20mA)  
www.p-tec.net  
040815 Rev1 JAS  
Page 5 of 9  
All Light-On Segments Feature & Pad Position  
Internal Circuit Diagram  
Common Anode  
Common Cathode  
www.p-tec.net  
040815 Rev1 JAS  
Page 6 of 9  
Precautions for Use  
1. Recommended soldering conditions  
1.1. Wave soldering  
Basic SPEC is 5sec. When 260°C. If temperature is higher, time should be shorter (+10°C→ -1sec.).  
1.2. Soldering Iron:  
Power dissipation of iron should be smaller than 15W and temp should be controllable. Soldering  
temperature should be under 260°C, time 3sec.  
www.p-tec.net  
040815 Rev1 JAS  
Page 7 of 9  
Packing Dimensions  
Note: 1. Specifications subject to change without notice.  
www.p-tec.net  
040815 Rev1 JAS  
Page 8 of 9  
Approved By  
Checked By  
Prepared By  
Customer Approval  
Signatures  
Record Of Revisions  
Rev.  
0
1
Comments  
Released Spec  
Logo Update  
Page  
--  
All  
Date  
11/12/13  
04/08/15  
www.p-tec.net  
040815 Rev1 JAS  
Page 9 of 9  

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