PDM57200x-R11 [P-TEC]
Low power consumption;
| 型号： | PDM57200x-R11 |
| 厂家： | 
P-tec Corporation |
| 描述： | Low power consumption |
| 文件： | 总8页 (文件大小：632K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
PRODUCT SPECIFICATION
Part Number
PDM57200 Series
Details
Features
2.0” (30.32mm) Dot Matrix Display
5x7 Array
Available in Common Anode or Cathode
Emitting Color: Pure Green, Yellow Green,
Yellow, Amber, Orange-Red, Red or Deep
Red
Low power consumption
RoHS Compliant
Gray or Black Face, White Segment
Easy mounting on PCB or socket
Mechanical Dimensions
Notes:
1. Dimensions in millimeters [inch], and tolerance is ±0.25 [.010] and angle is ±1° unless otherwise noted.
2. Bending ≤ Length*1%
3. All pins are ⌀0.50[.020]±0.1[.004]
4. Specifications subject to change without notice.
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110613 Rev0 JAS
Page 1 of 8
Device Selection Guide
Chip
Description
Model Number
Material
InGaN
Emitting Color
True Green
Yellow Green
Yellow
Amber
Orange-Red
Red
PDM57200x-G05
PDM57200x-G17
PDM57200x-Y04
PDM57200x-A11
PDM57200x-R02
PDM57200x-R11
PDM57200x-R21
Common Cathode x = (C)
/
Common Anode x = (A)
AlInGaP
Deep Red
Absolute Maximum Ratings at Ta=25°C
Parameter
Symbol
Rating
Unit
G17/Y04/A11/R02/R11/R21
G05
Power Dissipation per Dice
Derating Liner from 25°C per Dice
Continuous Forward Current Per Dice
Peak Current Per Dice (duty cycle
1/10, 1KHz)
PAD
--
IAF
70
0.33
25
114
0.4
30
mW
mA/°C
mA
IPF
90
100
mA
Reverse Voltage Per Dice
Electrostatic Discharge (HBM)
Operating Temperature
VR
ESD
Topr
Tstg
5
/
5
V
V
°C
°C
1000
-35~+85ꢀ
-35~+85ꢀ
Storage Temperature
Solder Conditions: 1/16 inch below seating plane for 3 -5 seconds at 260°C.
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110613 Rev0 JAS
Page 2 of 8
Typical Electrical and Optical Characteristics at Ta=25°C
Parameter
Symbol
Chip
Min.
Typ.
Max.
Unit
Condition
G05
G17/Y04/A11
/R02/R11/R21
--
3.2
3.8
Forward Voltage Per
Segment
VF
V
IF=20mA
--
2
2.8
G05
G17
Y04
A11
R02
R11
R21
G05
G17
Y04
A11
R02
R11
R21
--
--
--
--
--
--
--
--
--
--
--
--
--
--
--
330
22
65
90
52
--
--
--
--
--
Luminous Intensity Per
Segment
Iv
mcd
nm
IF=10mA
IF=20mA
52
27
--
--
--
--
--
--
--
--
100
*/525
572/570
592/590
612/605
632/625
644/630
660/645
--
Peak Emission
Wavelength /
Dominant Wavelength
λP/λd
Reverse Current
Luminous Intensity
Matching Ratio
IR
μA
VR=5V
Iv-m
--
--
2:1
--
IF=10mA
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110613 Rev0 JAS
Page 3 of 8
Electrical and Optical Characteristics at Ta=25°C
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110613 Rev0 JAS
Page 4 of 8
Luminous General lv Bin Grade (IF = 10mA)
Color Rank Limits (IF=20mA)
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110613 Rev0 JAS
Page 5 of 8
All Light-On Segments Feature & Pad Position
Internal Circuit Diagram
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110613 Rev0 JAS
Page 6 of 8
Precautions for Use
1. Recommended soldering conditions
1.1. Wave soldering
Basic SPEC is ≤ 5sec. When 260°C. If temperature is higher, time should be shorter (+10°C→ -1sec.).
1.2. Soldering Iron:
Power dissipation of iron should be smaller than 15W and temp should be controllable. Soldering
temperature should be under 260°C, time ≤ 3sec.
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110613 Rev0 JAS
Page 7 of 8
Packing Dimensions
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110613 Rev0 JAS
Page 8 of 8
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