2SD1251AOP [PANASONIC]
Power Bipolar Transistor, 4A I(C), 80V V(BR)CEO, 1-Element, NPN, Silicon, Plastic/Epoxy, 3 Pin, N TYPE PACKAGE-3;型号: | 2SD1251AOP |
厂家: | PANASONIC |
描述: | Power Bipolar Transistor, 4A I(C), 80V V(BR)CEO, 1-Element, NPN, Silicon, Plastic/Epoxy, 3 Pin, N TYPE PACKAGE-3 |
文件: | 总3页 (文件大小:169K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
Power Transistors
2SD1251, 2SD1251A
Silicon NPN triple diffusion junction type
For power amplification
Unit: mm
3.4±0.3
8.5±0.2
6.0±0.5
1.0±0.1
Features
Wide area of safe operation (ASO)
■
●
1max.
1.1max.
0.5max.
●
N type package enabling direct soldering of the radiating fin to
the printed circuit board, etc. of small electronic equipment.
0.8±0.1
Absolute Maximum Ratings (T =25˚C)
■
C
2.54±0
5.08±0.5
Parameter
Symbol
Ratings
Unit
Base
1
2:Collector
3:Emitter
N Type Package
Collector to
2SD1251
2SD1251A
2SD1251
60
VCBO
V
base voltage
Collector to
80
Unit: mm
3.4±0.3
60
8.5
6.0±3
VCEO
1.0±0.1
emitter voltage 2SD1251A
Emitter to base voltage
Peak collector current
Collector current
80
VEBO
ICP
IC
8
V
A
A
A
4
Base current
IB
1
30
R0.5
R0.5
.8±0.1
Collector power TC=25°C
0 to 0.4
2.54±0.3
PC
W
1.1 max.
5.0.5
dissipation
Ta=5°C
1.3
Junction temperature
Storage temperature
15
˚
˚C
1:Base
2:Collector
3:Emitter
1
2
3
Tstg
–55 to
N Type Package (DS)
Elecricl Chteristics (T 25˚C)
■
C
aramter
Smol
ICBO
Conditions
min
typ
max
30
Unit
µA
Clector cutf current
Emittecutoff c
VCB = 20V, IE = 0
IEBO
VEB = 8V, I= 0
1
mA
1A
Collector to em
voltage
60
80
40
30
*2
VCEO(sus)
hFE1
IC = 0.2A, L = 25mH
V
VCE = 3V, IC = 0.1A
VCE = 3V, IC = 1A
Forward current transfer ratio
Base to emitter voltage
*1
hFE2
160
1.2
1
VBE
VCE = 3V, IC = 1A
V
V
Collector to emitter saturation voltage VCE(sat)
Transition frequency fT
IC = 2A, IB = 0.4A
VCE = 10V, IC = 0.2A, f = 0.5MHz
1
MHz
*1
*2
h
Rank classification
V
CEO(sus)
Test circuit
FE2
50/60Hz mercury relay
Rank
hFE2
Q
P
O
IC(A)
0.2
X
30 to 60
50 to 100
80 to 160
L 25mH
0.1
120Ω
Y
15V
G
6V
1Ω
60/80
VCE(V)
Note: Ordering can be made by the common rank (OP rank hFE2 = 50 to 160) in the rank classification.
1
Power Transistors
2SD1251, 2SD1251A
PC — Ta
IC — VCE
IC — VBE
50
2.4
2.0
1..6
1.2
0.8
0.4
0
3.2
TC=25˚C
IB=35mA
25˚C
TC=100˚C
(1) TC=Ta
(2) With a 50 × 50 × 2mm
Al heat sink
(3) Without heat sink
(PC=1.3W)
VCE=3V
2.8
2.4
2.
1.6
.2
8
.4
0
–25˚C
40
30
20
10
0
30mA
25mA
20mA
(1)
15mA
10mA
5mA
(2)
(3)
0
20 40 60 80 100 120 140 160
0
2
4
6
8
0
0
0.4
6
2.0
2.4
(
)
( )
V
( )
Base to emge VBE V
Ambient temperature Ta ˚C
Collector to emitter voltge VC
VCE(sat) — IC
FE —
Cob — VCB
30
10
10000
10000
VCE=3V
IE=0
f=1MHz
TC=25˚C
IC/IB=5
TC=25˚C
3000
300
1000
0
3
1
TC=1˚C
2˚C
00
300
100
–˚C
TC=100˚C
25˚C
0.3
0.1
30
10
30
10
–25˚C
0.03
0.01
3
1
3
1
0.01 03
0.1
1
3
0.00.03
0.1
0.3
1
3
0
0.1
0.3
1
3
10
30
100
(
A
)
( )
( )
Collector to base voltage VCB V
Colctor cIC
Collector current IC
Area of safe operation ASO)
Rth(t) — t
100
103
102
10
(1) Without heat sink
(2) With a 50 × 50 × 2mm Al heat sink
ve pul
30
10
(1)
(2)
ICP
t=5ms
3
1
IC
10ms
300ms
1
0.3
0.1
10–1
10–2
0.03
0.01
1
3
10
30
100 300 1000
10–4
10–3
10–2
10–1
1
10
102
103
104
(
V
)
( )
t s
Collector to emitter voltage VCE
Time
2
Request for your special attention and precautions in using the technical information and
semiconductors described in this book
(1) If any of the products or technical information described in this book is to be exported or provided to non-residents, the laws and
regulations of the exporting country, especially, those with regard to security export control, must be observed.
(2) The technical information described in this book is intended only to show the main characteristics and application circuit examples
of the products, and no license is granted under any intellectual property right or other right owned by our company or any other
company. Therefore, no responsibility is assumed by our company as to the infringement upon any such right owned by any other
company which may arise as a result of the use of technical information described in this book.
(3) The products described in this book are intended to be used for standard applications or general electronic equipment (such as office
equipment, communications equipment, measuring instruments and household appliances).
Consult our sales staff in advance for information on the following applications:
– Special applications (such as for airplanes, aerospace, automobiles, traffic control equipment, combustion equipment, life support
systems and safety devices) in which exceptional quality and reliability are required, or if the failure or malfunction of the prod-
ucts may directly jeopardize life or harm the human body.
– Any applications other than the standard applications intended.
(4) The products and product specifications described in this book are subject to change without notice for modification and/or im-
provement. At the final stage of your design, purchasing, or use of the products, therefore, ask for the most up-to-date Product
Standards in advance to make sure that the latest specifications satisfy your requirements.
(5) When designing your equipment, comply with the range of absolute maximum rating and the guaranteed operating conditions
(operating power supply voltage and operating environment etc.). Especially, please be careful not to exceed the range of absolute
maximum rating on the transient state, such as power-on, power-off and mode-switching. Otherwise, we will not be liable for any
defect which may arise later in your equipment.
Even when the products are used within the guaranteed values, take into the consideration of incidence of break down and failure
mode, possible to occur to semiconductor products. Measures on the systems such as redundant design, arresting the spread of fire
or preventing glitch are recommended in order to prevent physical injury, fire, social damages, for example, by using the products.
(6) Comply with the instructions for use in order to prevent breakdown and characteristics change due to external factors (ESD, EOS,
thermal stress and mechanical stress) at the time of handling, mounting or at customer's process. When using products for which
damp-proof packing is required, satisfy the conditions, such as shelf life and the elapsed time since first opening the packages.
(7) This book may be not reprinted or reproduced whether wholly or partially, without the prior written permission of Matsushita
Electric Industrial Co., Ltd.
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