2SD1251AOP [PANASONIC]

Power Bipolar Transistor, 4A I(C), 80V V(BR)CEO, 1-Element, NPN, Silicon, Plastic/Epoxy, 3 Pin, N TYPE PACKAGE-3;
2SD1251AOP
型号: 2SD1251AOP
厂家: PANASONIC    PANASONIC
描述:

Power Bipolar Transistor, 4A I(C), 80V V(BR)CEO, 1-Element, NPN, Silicon, Plastic/Epoxy, 3 Pin, N TYPE PACKAGE-3

文件: 总3页 (文件大小:169K)
中文:  中文翻译
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Power Transistors  
2SD1251, 2SD1251A  
Silicon NPN triple diffusion junction type  
For power amplification  
Unit: mm  
3.4±0.3  
8.5±0.2  
6.0±0.5  
1.0±0.1  
Features  
Wide area of safe operation (ASO)  
1max.  
1.1max.  
0.5max.  
N type package enabling direct soldering of the radiating fin to  
the printed circuit board, etc. of small electronic equipment.  
0.8±0.1  
Absolute Maximum Ratings (T =25˚C)  
C
2.54±0
5.08±0.5  
Parameter  
Symbol  
Ratings  
Unit  
Base  
1
2:Collector  
3:Emitter  
N Type Package  
Collector to  
2SD1251  
2SD1251A  
2SD1251  
60  
VCBO  
V
base voltage  
Collector to  
80  
Unit: mm  
3.4±0.3  
60  
8.5
6.0±3  
VCEO  
1.0±0.1  
emitter voltage 2SD1251A  
Emitter to base voltage  
Peak collector current  
Collector current  
80  
VEBO  
ICP  
IC  
8
V
A
A
A
4
Base current  
IB  
1
30  
R0.5  
R0.5  
.8±0.1  
Collector power TC=25°C  
0 to 0.4  
2.54±0.3  
PC  
W
1.1 max.  
5.0.5  
dissipation  
Ta=5°C  
1.3  
Junction temperature  
Storage temperature  
15
˚
˚C  
1:Base  
2:Collector  
3:Emitter  
1
2
3
Tstg  
–55 to
N Type Package (DS)  
Elecricl Chteristics (T 25˚C)  
C
aramter  
Smol  
ICBO  
Conditions  
min  
typ  
max  
30  
Unit  
µA  
Clector cutf current  
Emittecutoff c
VCB = 20V, IE = 0  
IEBO  
VEB = 8V, I= 0  
1
mA  
1A  
Collector to em
voltage  
60  
80  
40  
30  
*2  
VCEO(sus)  
hFE1  
IC = 0.2A, L = 25mH  
V
VCE = 3V, IC = 0.1A  
VCE = 3V, IC = 1A  
Forward current transfer ratio  
Base to emitter voltage  
*1  
hFE2  
160  
1.2  
1
VBE  
VCE = 3V, IC = 1A  
V
V
Collector to emitter saturation voltage VCE(sat)  
Transition frequency fT  
IC = 2A, IB = 0.4A  
VCE = 10V, IC = 0.2A, f = 0.5MHz  
1
MHz  
*1  
*2  
h
Rank classification  
V
CEO(sus)  
Test circuit  
FE2  
50/60Hz mercury relay  
Rank  
hFE2  
Q
P
O
IC(A)  
0.2  
X
30 to 60  
50 to 100  
80 to 160  
L 25mH  
0.1  
120Ω  
Y
15V  
G
6V  
1Ω  
60/80  
VCE(V)  
Note: Ordering can be made by the common rank (OP rank hFE2 = 50 to 160) in the rank classification.  
1
Power Transistors  
2SD1251, 2SD1251A  
PC — Ta  
IC — VCE  
IC — VBE  
50  
2.4  
2.0  
1..6  
1.2  
0.8  
0.4  
0
3.2  
TC=25˚C  
IB=35mA  
25˚C  
TC=100˚C  
(1) TC=Ta  
(2) With a 50 × 50 × 2mm  
Al heat sink  
(3) Without heat sink  
(PC=1.3W)  
VCE=3V  
2.8  
2.4  
2.
1.6  
.2  
8  
.4  
0
–25˚C  
40  
30  
20  
10  
0
30mA  
25mA  
20mA  
(1)  
15mA  
10mA  
5mA  
(2)  
(3)  
0
20 40 60 80 100 120 140 160  
0
2
4
6
8
0  
0
0.4  
6  
2.0  
2.4  
(
)
( )  
V
( )  
Base to emge VBE V  
Ambient temperature Ta ˚C  
Collector to emitter voltge VC
VCE(sat) — IC  
FE
Cob — VCB  
30  
10  
10000  
10000  
VCE=3V  
IE=0  
f=1MHz  
TC=25˚C  
IC/IB=5  
TC=25˚C  
3000  
300
1000  
0  
3
1
TC=1˚C  
2˚C  
00  
300  
100  
˚C  
TC=100˚C  
25˚C  
0.3  
0.1  
30  
10  
30  
10  
–25˚C  
0.03  
0.01  
3
1
3
1
0.01 03  
0.1  
1
3
0.00.03  
0.1  
0.3  
1
3
0  
0.1  
0.3  
1
3
10  
30  
100  
(
A
)
( )  
( )  
Collector to base voltage VCB V  
Colctor cIC  
Collector current IC  
Area of safe operation ASO)  
Rth(t) — t  
100  
103  
102  
10  
(1) Without heat sink  
(2) With a 50 × 50 × 2mm Al heat sink  
ve pul
30  
10  
(1)  
(2)  
ICP  
t=5ms  
3
1
IC  
10ms  
300ms  
1
0.3  
0.1  
10–1  
10–2  
0.03  
0.01  
1
3
10  
30  
100 300 1000  
10–4  
10–3  
10–2  
10–1  
1
10  
102  
103  
104  
(
V
)
( )  
t s  
Collector to emitter voltage VCE  
Time  
2
Request for your special attention and precautions in using the technical information and  
semiconductors described in this book  
(1) If any of the products or technical information described in this book is to be exported or provided to non-residents, the laws and  
regulations of the exporting country, especially, those with regard to security export control, must be observed.  
(2) The technical information described in this book is intended only to show the main characteristics and application circuit examples  
of the products, and no license is granted under any intellectual property right or other right owned by our company or any other  
company. Therefore, no responsibility is assumed by our company as to the infringement upon any such right owned by any other  
company which may arise as a result of the use of technical information described in this book.  
(3) The products described in this book are intended to be used for standard applications or general electronic equipment (such as office  
equipment, communications equipment, measuring instruments and household appliances).  
Consult our sales staff in advance for information on the following applications:  
Special applications (such as for airplanes, aerospace, automobiles, traffic control equipment, combustion equipment, life support  
systems and safety devices) in which exceptional quality and reliability are required, or if the failure or malfunction of the prod-  
ucts may directly jeopardize life or harm the human body.  
Any applications other than the standard applications intended.  
(4) The products and product specifications described in this book are subject to change without notice for modification and/or im-  
provement. At the final stage of your design, purchasing, or use of the products, therefore, ask for the most up-to-date Product  
Standards in advance to make sure that the latest specifications satisfy your requirements.  
(5) When designing your equipment, comply with the range of absolute maximum rating and the guaranteed operating conditions  
(operating power supply voltage and operating environment etc.). Especially, please be careful not to exceed the range of absolute  
maximum rating on the transient state, such as power-on, power-off and mode-switching. Otherwise, we will not be liable for any  
defect which may arise later in your equipment.  
Even when the products are used within the guaranteed values, take into the consideration of incidence of break down and failure  
mode, possible to occur to semiconductor products. Measures on the systems such as redundant design, arresting the spread of fire  
or preventing glitch are recommended in order to prevent physical injury, fire, social damages, for example, by using the products.  
(6) Comply with the instructions for use in order to prevent breakdown and characteristics change due to external factors (ESD, EOS,  
thermal stress and mechanical stress) at the time of handling, mounting or at customer's process. When using products for which  
damp-proof packing is required, satisfy the conditions, such as shelf life and the elapsed time since first opening the packages.  
(7) This book may be not reprinted or reproduced whether wholly or partially, without the prior written permission of Matsushita  
Electric Industrial Co., Ltd.  

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