ADP11123 [PANASONIC]

Strain Guage Sensor, Gage, 0Psi Min, 21.32Psi Max, 0-100mV, Rectangular, Through Hole Mount, DIP-6;


型号：	ADP11123
厂家：	PANASONIC
描述：	Strain Guage Sensor, Gage, 0Psi Min, 21.32Psi Max, 0-100mV, Rectangular, Through Hole Mount, DIP-6
文件：	总4页 (文件大小：175K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

PF (ADP1)

PRECISION

SEMICONDUCTOR

PRESSURE SENSOR

PF PRESSURE

SENSOR

Example of pressure characteristics

• A wide range of rated pressure,

including a minute pressure

(when the rated pressure is between 98.1 kPa

{1.0 kgf/cm²}

There are 10 types of sensors covering a

wide range of rated pressure from a

minute pressure between 4.9 kPa {0.05

kgf/cm²}, to a maximum pressure of

980.7 kPa {10 kgf/cm²}.

Drive current: 1.5 mA rated current; ambient temperature: 25°C 77°F

100

• Realization of highly accurate, linear

characteristics

<Cross-section of Sensor Chip>

This sensor employs a semiconductor

strain gauge method, ensuring accurate

and linear detection characteristics. It

also has excellent repeatability of pres-

sure characteristics.

0 {0}

49 {0.5}

98.1 {1}

Silicon

Piezo resistance

strain gauge

Pressure (gauge pressure), (kPa {kgf/cm²})

Anode

junction

TYPICAL

Pressure Glass

APPLICATIONS

base

• Impressive line-up of models

• Medical equipment: Electronic hemody-

namometer

•

Taking their place alongside the stan-

dard 5kΩ bridge resistance models are

those with a 3.3kΩ resistance which is

optimally suited to 5V drive circuits.

• Home appliance: Vacuum cleaner

• Gas equipment: Microprocessor gas

meter, gas leakage detector

• Industrial equipment: Absorption

device, etc.

High reliability

die bonding

technology

• Economy model (no glass base) gives

outstanding value for consumer appli-

ances

40 kPa (0.4 kgf/cm²) and 49 kPa (0.5

kgf/cm²) units are also available.

Highly reliable wire

bonding technology

Very strong,

heat resistant body

Pressure

ORDERING INFORMATION

Ex. ADP

Part No.

Terminal profile and direction

1: DIP terminal: Dirtection opposite the

pressure inlet direction

Rated pressure

Type

Bridge resistance

Nil : 5.0kΩ

3 : 3.3kΩ

4.9 kPa {approx. 0.05 kgf/cm²}

1 : Standard type

(With glass base)

1: 14.7 kPa {approx. 0.15 kgf/cm²}

2: 34.3 kPa {approx. 0.35 kgf/cm²}

3: 49.0 kPa {approx. 0.5 kgf/cm²}

4: 98.1 kPa {approx. 1.0 kgf/cm²}

5: 196.1 kPa {approx. 2.0 kgf/cm²}

6: 343.2 kPa {approx. 3.5 kgf/cm²}

7: 490.3 kPa {approx. 5.0 kgf/cm²}

8: 833.6 kPa {approx. 8.5 kgf/cm²}

9: 980.7 kPa {approx. 10.0 kgf/cm²}

A: 40.0 kPa {approx. 0.4 kgf/cm²}

2: Economy type

(Without glass

base)

ADP1:

PF pressure sensor

2: DIP terminal: Pressure inlet direction

5.0kΩ

3.3kΩ

Bridge resistance

Terminal

Packing quantity

DIP terminal:

Direction opposite

the pressure

DIP terminal:

Direction opposite

the pressure

DIP terminal:

Pressure inlet

direction

DIP terminal:

Pressure inlet

direction

Pressure

Inner

Outer

inlet direction

4.9kPa approx. 0.05kgf/cm²

14.7kPa approx. 0.15kgf/cm²

34.3kPa approx. 0.35kgf/cm²

49.0kPa approx. 0.5kgf/cm²

98.1kPa approx. 1.0kgf/cm²

196.1kPa approx. 2.0kgf/cm²

343.2kPa approx. 3.5kgf/cm²

490.3kPa approx. 5.0kgf/cm²

833.6kPa approx. 8.5kgf/cm²

980.7kPa approx. 10.0kgf/cm²

40.0kPa approx. 0.4kgf/cm²

49.0kPa approx. 0.5kgf/cm²

ADP1101

ADP1111

ADP1121

ADP1131

ADP1141

ADP1151

ADP1161

ADP1171

ADP1181

ADP1191

——

ADP1201

ADP1211

ADP1221

ADP1231

ADP1241

ADP1251

ADP1261

ADP1271

ADP1281

ADP1291

——

Standard

type

(With glass

base)

100

pcs.

1,000

pcs.

Economy type

(Without glass

base)

ADP11A23

——

ADP12A23

——

ADP1132

ADP1232

PF (ADP1)

SPECIFICATIONS

Economy type

(Without glass base)

ꢁtandard type (With glass base)

Gauge pressure

Type

Type of pressure

Pressure medium

Air (For other medium, please consult us.)

4.9

14.7

0.15

34.3

0.35

49.0

0.5

98.1

1.0

196.1

2.0

343.2

3.5

490.3

5.0

833.6

8.5

980.7

10.0

40.0

0.4

49.0

0.5

Unit: kPa

Rated

pressure

Unit: kgf/cm²(approx.)

0.05

Twice the rated pressure

5000 1000 Ω

1.5 times the rated pressure Twice the rated pressure

Max. applied pressure

Bridge resistance

3300 600 Ω 5000 1000 Ω

–5 to 50°C –20 to 100°C

–20 to 100°C –4 to 212°F (no freezing or condensation)

–40 to 120°C –40 to 248°F (no freezing or condensation)

0 to 50°C 32 to 122°F

Ambient temperature

–7 to 122°F –4 to 212°F

–20 to 70°C –40 to 120°C

Storage temperature

–4 to 158°F –70 to 248°F

5 to 45°C 0 to 50°C

41 to 113°F 32 to 122°F

Temperature compensation range

1.5 mA DC

100 40 mV

20 mV

Drive current (constant current)

Output span voltage

Offset voltage

Linearity

Pressure hysteresis

40 20 mV

43.5 22.5 mV 85 45 mV

15 mV

0.3ꢀFꢁ

0.7ꢀFꢁ

25 mV

0.7ꢀFꢁ 0.5ꢀFꢁ

0.6ꢀFꢁ 0.4ꢀFꢁ

0.3ꢀFꢁ

0.2ꢀFꢁ

0.5ꢀFꢁ

0.6ꢀFꢁ

0.4ꢀFꢁ

Offset voltage-temperature

characteristics (0 to 50°C 32 to 122°F)

Sensitivity-temperature

characteristics (0 to 50°C 32 to 122°F)

15ꢀFꢁ

10ꢀFꢁ

5.0ꢀFꢁ

2.5ꢀFꢁ

10ꢀFꢁ 8ꢀFꢁ

1.3ꢀFꢁ 2.5ꢀFꢁ

Notes) 1. Unless otherwise specified, measurements were taken with a drive current of1.5 mA 0.01 mA at a temperature of 25°C 77°F and humidity ranging from 25ꢀ to

85ꢀ.

2. Please consult us if a pressure medium other than air is to be used.

3. This is the regulation which applies within the compensation temperature range.

4. Please consult us if the intended use involves a negative pressure.

DATA

1. Characteristics data

1-<1> Output characteristics

1-<2> Offset voltage – temperature

1-<3> ꢁensitivity – temperature

characteristics

ADP1141

characteristics (ꢀFꢁ)

ADP1141

Drive current: 1.5 mA; temperature: 25°C 77°F

Drive current: 1.5 mA; rating 5ꢀFꢁ

Drive current: 1.5 mA; rating 2.5ꢀFꢁ

100

–1

–20

–40

–2

49 {0.5}

98.1 {1}

Rated pressure

122

kpa {kgf/cm²}

Temperature (°C °F)

2. Pressure cycle range (0 to rated pressure)

Tested sample: ADP1131, temperature: 25°C 77°F

2-<1> Offset voltage range

2-<2> Output span voltage range

Even after testing for 1 million times, the vari-

ations in the offset voltage and output span

voltage are minimal.

–1

–2

1×10

5×10 1×10

1×10

5×10 1×10

Pressure cycle (cycle)

PF (ADP1)

3. Evaluation test

Tested item

Tested condition

Result

Storage at high

temperature

Temperature: Left in a 120°C 248°F constant temperature bath

Passed

Time: 1,000 hrs.

Storage at low

temperature

Temperature: Left in a –40°C –40°F constant temperature bath

Passed

Time: 1,000 hrs.

Environmental

characteristics

Temperature/humidity: Left at 40°C 104°F, 90ꢀ RH

Humidity

Time: 1,000 hrs.

Temperature: –40°C to 120°C –40°F to 248°F

1 cycle: 30 min.

Times of cycle: 100

Temperature cycle

Passed

Endurance

characteristics

High temperature/high

humidity operation

Temperature/humidity: 40°C 104°F, 90ꢀ RH

Operation times: 10⁶, rated voltage applied

Double amplitude: 1.5 mm .059 inch

Vibration: 10 to 55 Hz

Applied vibration direction: X, Y, Z 3 directions

Times: 2 hrs each

Vibration resistance

Passed

Mechanical

characteristics

Dropping height: 75 cm 29.528 inch

Times: 2 times

Pulling strength: 9.8 N {1 kgf}, 10 sec.

Dropping resistance

Terminal strength

Passed

Bending strength: 4.9 N {0.5 kgf}, left and right 90° 1 time

Soldered in

Temperature: 230°C 446°F

DIP soldering bath

Time: 5 sec.

Soldering

Resistance

Temperature: 260°C 500°F

Temperature

Time: 10 sec.

Note: For details other than listed above, please consult us.

General tolerance: 0.3 .012 mm inch

DIMENTIONS

1. Terminal direction: Direction opposite the pressure inlet

derection ADP11ꢀꢀ (ꢀ)

2. Terminal direction: Pressure inlet direction

ADP12ꢀꢀ (ꢀ)

Atmospheric

pressure

inlet hole

10.0

.394

Atmospheric

pressure

inlet hole

10.0

.394

0.5 dia.

.020 dia.

0.5 dia.

.020 dia.

8.6

.339

8.6

.339

0.25

Pressure

inlet hole

Pressure

inlet hole

10.16

.010

.400

3.0 dia.

−0.1

0.25

3.0 dia.

C0.5

.020

−0.1

2.54

.100

2.54

.100

0.8 dia.

.031 dia.

0.8 dia.

.031 dia.

.010

.118

dia.

−.004

.118

dia.

−.004

.004

1.2 ^0.1.047

0.5 ^0.1.020

0 to 15˚

C0.5

.020

+0.1

6.0

.236

0.25

.010

−0.05

+.004

−.002

R0.5

.020

6.0

.236

0.6

.024

R0.5

.020

4.0

.157

3.3 .130

4.9

1.1

.043

3.3 .130

0.6

.024

0.25

.010

.193

+0.1

0.25

.010

−0.05

+.004

−.002

0.5 ^0.1.020

1.2 ^0.1.047

.004

0.25

10.16

.010

.400

0 to 15˚

0.25

2.54

.100

2.54

.100

.010

Recommended PC board pattern

(BOTTOM VIEW)

Recommended PC board pattern

(BOTTOM VIEW)

6-0.9 dia.

6-.035 dia.

6-0.9 dia.

6-.035 dia.

10.16

.400

10.16

6 dia.

.400

.236 dia.

2.54 .100

5.08 .200

2.54

.100

2.54 .100

5.08 .200

2.54

.100

Tolerance: 0.1 .004

3. Terminal connection diagram

Terminal No.

Name

+Input

Output (−)

Power supply (+)

Output (+)

R²

+Output

−Output

No connection

Power supply (−)

Output (−)

−Input

Note: Leave terminal 4 unconnected.

PF (ADP1)

NOTES

1. Mounting

6. Other handling precautions

1) That using the wrong pressure range

or mounting method may result in acci-

dents.

8) The pressure sensor chip is construct-

ed in such a way that its output will fluc-

tuate when it is exposed to light.

Use lands on the printed-circuit boards to

which the sensor can be securely fixed.

2. Soldering

1) Due to its small size, the thermal

capacity of the pressure sensor DIP type

is low. Therefore, take steps to minimize

the effects of external heat.

Dip soldering bath: Max. 260°C 500°F, 5

sec.

ꢁoldering iron: 260 to 300°C 500 to

572°F (30W) within 5 sec.

Especially when pressure is to be

applied by means of a transparent tube,

take steps to prevent the pressure sen-

sor chip from being exposed to light.

9) Avoid using the pressure sensor chip

where it will be susceptible to ultrasonic

or other high-frequency vibration.

10) ꢁince static charge can damage the

pressure sensor chip, bear in mind the

following handling precautions.

• When storing the pressure sensor

chips, use a conductive material to

short the pins or wrap the entire chip in

aluminum foil. Plastic containers

should not be used to store or transport

the chips since they readily become

charged.

• When using the pressure sensor chips,

all the charged articles on the bench

surface and the work personnel should

be grounded so that any ambient static

will be safely discharged.

11) Due to the pressures involved, give

due consideration to the securing of the

pressure sensor DIP type and to the

securing and selection of the inlet tube.

Consult us if you have any queries.

2) Air can be used directly as a pressure

medium. Consult with us before using a

corrosive gas (such as a gas given off by

an organic solvent, sulfite or hydrogen

sulfide) as the pressure medium.

3) The pressure sensor chip is posi-

tioned inside the pressure inlet. Never

poke wires or other foreign matter

through the pressure inlet since they

may damage the chip or block the inlet.

Avoid use when the atmospheric pres-

sure inlet is blocked.

4) Leave pin No. 4 unconnected since

the pressure sensor chip may be dam-

aged if a voltage is applied to this pin.

5) Use an operating pressure which is

within the rated pressure range. Using a

pressure beyond this range may cause

damage.

6) ꢁince this pressure sensor chip does

not have a water-proof construction, con-

sult with us if it is to be used in a location

where it may be sprayed with water, etc.

7) Avoid using the pressure sensor chip

in an environment where condensation

may form. Furthermore, its output may

fluctuate if any moisture adhering to it

freezes.

2) Use a non-corrosive resin type of flux.

ꢁince the pressure sensor DIP type is

exposed to the atmosphere, do not allow

flux to enter inside.

3. Cleaning

1) ꢁince the pressure sensor chip is

exposed to the atmosphere, do not allow

cleaning fluid to enter inside.

2) Avoid ultrasonic cleaning since this

may cause breaks or disconnections in

the wiring.

4. Environment

Consult with us before using or storing

the pressure sensor chip in a place

exposed to corrosive gases (such as the

gases given off by organic solvents, sul-

fites, hydrogen sulfides, etc.) which will

adversely affect the performance of the

pressure sensor chip.

5. Quality check under actual loading

conditions

1) To assure reliability, check the sensor

under actual loading conditions. Avoid

any situation that may adversely affect

its performance.

2) As for test data, please contact us.

APPLICATION CIRCUIT

DIAGRAM (EXAMPLE)

MOUNTING METHOD

The general method for transmitting air

pressures differs depending on whether

the pressure is low or high.

Methods of transmitting air pressures

When the pressure

is low

(4.9 to 98.1 kPa)

When the pressure

is high

(196.1 to 980.7 kPa)

The pressure sensor is designed to con-

vert a voltage by means of constant cur-

rent drive and then, if necessary, it

amplifies the voltage for use. The circuit

shown below is a typical example of a

circuit in which the pressure sensor is

used.

Printed-

circuit

board

Printed-

circuit

board

• Checkpoints for use

<1> ꢁelect a pressure inlet pipe which is

sturdy enough to prevent pressure

leaks.

<2> Fix the pressure inlet pipe securely

so as to prevent pressure leaks.

<3> Do not block the pressure inlet pipe.

O-ring

Pressure

inlet pipe

Tube

If a tube is used as the pressure inlet pipe,

it may become disengaged. Therefore, use

a sturdy tube and secure it using O-rings.

Amplifier circuit unit

Constant current

circuit unit

Pressure

sensor

AMP

ADP11123 [PANASONIC]

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