AXA223021P [PANASONIC]
PCB Connector, Socket;
| 型号： | AXA223021P |
| 厂家： | 
PANASONIC |
| 描述： | PCB Connector, Socket PC 连接器 |
| 文件： | 总5页 (文件大小：239K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
(AXA2)
SOCKETS FOR
SD MEMORY
CARD (AXA2)
SOCKETS FOR MEMORY CARD
These highly reliable sockets for SD memory cards feature a low profile and
smooth insertion and removal.
3) Good aerial discharge characteristics.
FEATURES
New
1. Common
What is porosity treatment?
It is a process by which pinholes in the
1) Porosity treatment achieves a high
contact reliability.
gold-plated surface are sealed with an
extremely thin application of membrane.
We developed a porosity treatment
technology that makes it possible to
achieve a contact reliability using a thin
gold-plating process, which is as good
as that of thick gold-plating.
2) Includes simple card lock
3) Electrostatic shielding using a metal shell
2. Standard mounting type
(external terminal)
1) External terminal. Thinnest class-only
2.7 mm thick
Porosity treatment membrane
Pin hole
Surrounding gas
2) Smallest PC board mounting area in
its class
3. Standard mounting type
(internal terminal)
Gold plating
Standard mounting type Standard mounting type
(external terminal) (internal terminal)
1) Internal terminal. Thin shape-only 3.0
mm thick
Nickel plating
Base material
2) Good aerial discharge characteristics.
4. Reverse mounting type
1) Thinnest class-only 2.65 mm thick
2) Smallest PC board mounting area in
its class
• Improved insertion and removal reliability
• Improved resistance to corrosion
• Improved contact reliability for digital
signals
Reverse mounting type
PRODUCT TYPES
Card detection
Card yes/no
Packing quantity
Part name
Eject type
Mounting type
Part No.
Inner carton (1 tray)
Outer carton
External terminal
Internal terminal
AXA233021T
AXA213021T
AXA223021T
Standard mounting type
Sockets for
SD memory card
Push-push type
Done
35 pcs.
700 pcs.
Reverse mounting type
Note: Embossed packaging with an inner carton (1 reel) of 500 pieces is also available. When ordering, replace the “T” with “P” at the end of the part number. (Only applies
to AXA213021 and AXA223021.)
SPECIFICATIONS
1. Characteristics
Specifications
Item
Standard mounting type
External terminal Internal terminal
Condition
Reverse mounting
type
Rated Current
0.5 A/1 pin
Measured based on the HP4338B measurement method of
JIS C 5402.
Contact resistance
Insulation resistance
Breakdown voltage
Max. 100mΩ
Electrical
characteristics
1,000MΩ (Initial)
500V AC for 1 min.
Using 500V DC megger (applied for 1 min.)
Rated voltage is applied for one minute and check for short
circuit or damage with a detection current of 1 mA.
Frequency: 10 to 55 Hz
Vibration resistance
Card insertion force
Acceleration: 20.0 m/s2 {2.0 G}
No current interruption for more than 0.1 µs
Mechanical
characteristics
Max. 40N {4.08kgf}
Lifetime
characteristics
Insertion and removal Insertion and removal life: 10,000 times
Insertion and removal speed are at a rate of 200 times/hour or
less.
life of card
Contact resistance after testing: Max. 100 mΩ
Ambient temperature
–25°C to +90°C
No freezing or condensation in low temperatures
–40°C to +90°C
Storage temperature
(The allowable storage temperature is –40°C to +50°C if
unopened from original packaging)
No freezing or condensation in low temperatures
Environmental
characteristics
Reflow soldering: peak temperature 250°C or less
Hand soldering: Soldering iron temperature 300°C,
5 sec. or less
Resistance to
soldering heat
Sockets (shell) surface temperature for using infrared reflow
soldering machine
Humidity tolerance
(mated condition)
Contact resistance: Max. 100 mΩ
Insulation resistance: Min. 100 MΩ
MIL-STD-1344A, METHOD 1002
Temperature: 40±2°C, Humidity: 90 to 95%RH, Test time: 500 hours
Applicable memory card
Mass (Weight)
SD memory card/Multi-media card
1.7 g
2.1 g
1.5 g
110
(AXA2)
2. Material and surface treatment
Portion
Material
Surface
—
Earth shell
Lock pin
Stainless steel
Coil spring
Body
Heat resistant resin (UL94V-0)
Copper alloy
—
Slider
Terminal (Shell soldering portion)
SnPb plating over Ni substrate (Sn plating used in external terminal holding metal.)
Contact portion: PdNi plating + Au flash plating over Ni substrate
Soldering portion: Au plating over Ni substrate
Signal contact
Detection contact
Contact/Soldering portion: Au plating over Ni substrate
mm General tolerance: ±0.2
DIMENSIONS
1. Standard mounting type (external terminal)
Recommended PC board pattern
(TOP VIEW)
2.70
17.50±0.05
0.60±0.1
A
1.65±0.05
1.60±0.05
2.50±0.05
2.50±0.05
0.625±0.05
0.15
Terminal
coplanarity
MIN. 1.00
A
11.30±0.05
1.00
1.00±0.05
MIN. 1.00
13.70±0.05
12.90±0.05
12.55±0.05
1.15±0.05
φ
24.20±0.05
22.10
24.10
MIN.1.30
0.60
(14.30)
φ
13.50
27.80
SD memory card
(2.10)
Connector
mold edge
17.50
2.50±0.1
Pitch: 2.50±0.1
2.05±0.05
2.05±0.05
21.10±0.05
1.65±0.1
0.625±0.1
24.20
: Area where pattern is prohibited.
(Because part of the contact and earth shell
are close to the substrate, we recommend
that you avoid the pattern arrangement.)
A-A cross section
Detailed internal view
View of set card
Circuit schematic
No.
No.
3
2
3
No.
1
2
1
Relation of detection switches to SD memory
card attachment condition
Light protect switch
Card
detection
switch
Card attachment
condition
Write
Write
unable
enable
SD memory card
(24.00)
Card not
attached
Open
Open
Open
Open
Card attached
Closed
Closed
Terminal number
1–3
2–3
111
(AXA2)
2. Standard mounting type (internal terminal)
mm General tolerance: ±0.2
Recommended PC board pattern
(TOP VIEW)
1.85±0.05
(29.90)
MIN. 1.00
14.95±0.05
3.00
13.85±0.05
14.00
MIN. 1.00
1.00
23.00±0.05
A
2-φ 1.25±0.05(hole)
(11.50±0.05
)
φ
0.65
12.55±0.05
1.00±0.05
A
0.60±0.1
0.15
Terminal
coplanarity
2.50±0.05
14.00
14.20
14.40
15.10
15.30
15.50
0.625±0.05
2.50±0.05
17.50±0.05
SD memory card
(2.10)
2.85
1.65±0.05
12.80±0.05
Connector mold edge
1.60±0.05
17.50
2.50±0.1
13.90±0.05
1.60±0.05
Pitch: 2.50±0.1
0.625±0.1
1.65±0.1
: Area where pattern is prohibited.
11.50
11.50
0.15
(Because part of the contact and earth shell
are close to the substrate, we recommend
that you avoid the pattern arrangement.)
Terminal coplanarity
A-A cross section
Detailed internal view
View of set card
Circuit schematic
3
2
No.
3
No.
No.
2
1
Relation of detection switches to SD memory
card attachment condition
Light protect switch
Card
detection
switch
Card attachment
condition
Write
Write
1
unable
enable
12.10
12.10
Card not
attached
Closed
Closed
Closed
Open
Closed
(24.00)
SD memory card
Card attached
Open
Terminal number
1–2
2–3
112
(AXA2)
mm General tolerance: ±0.2
3. Reverse mounting type
Recommended PC board pattern
(TOP VIEW)
2.65±0.15
0.60±0.1
17.50±0.05
2.50±0.05
A
A
1.65±0.05
1.65±0.05
0.15
Terminal
coplanarity
2.50±0.05
0.625±0.05
1.20±0.05
1.00±0.05
14.10±0.05
14.45±0.05
MIN. 1.00
12.05±0.05
MIN. 1.00
12.95±0.05
0.65
12.25±0.05
1.55±0.05
φ
12.35±0.05
1.45±0.05
21.00±0.05
(10.50±0.05
)
φ
15.00
13.50
28.50±0.15
17.50
SD memory card
0.30
(2.10)
2.50±0.1
Connector
mold edge
2.50±0.1
0.625±0.1
1.65±0.1
1.80±0.05
13.50±0.05
12.40±0.05
1.40±0.05
10.50
10.50
: Area where pattern is prohibited.
A-A cross section
(Because part of the contact and earth shell
are close to the substrate, we recommend
that you avoid the pattern arrangement.)
Detailed internal view
View of set card
Circuit schematic
No.
No.
No.
3
2
1
3
2
1
Relation of detection switches to SD memory
card attachment condition
Light protect switch
Card
detection
switch
Card attachment
condition
Write
Write
unable
enable
Card not
attached
Closed
Closed
Closed
Open
Closed
(24.00)
SD memory card
Card attached
Open
Terminal number
1–2
2–3
mm
EMBOSSED TAPE AND REEL
• Tape dimensions
(Note: Only for AXA213021P and AXA223021P)
• Reel dimensions
Sockets for SD memory card
Emboss
carrier tape
(44.4+20)
Taping reel
Top cover tape
Top cover
tape
Tape
φ 1.50+00.1
Emboss carrier tape
φ
Label
(20.20) (1.75)
(40.40)
±0.3
(44.00
)
113
(AXA2)
NOTES
1. When mounting the socket
• When inserting MMCs into these sock-
ets, signal contacts No. 7 and 8 of the
socket may become shorted by contact
section No. 7 of the MMC.
• Please account for the cautions, given
above, by making sure that users are
made aware through suitable descrip-
tions in the user manuals and other doc-
uments you prepare.
When reflow soldering when the slider is
locked, heat will cause the slider to
deform and not work. Therefore, please
confirm that the slider lock is released
before mounting if you have inserted and
removed a card before soldering.
2. Cleaning after soldering
Inside the socket there is a slider section
and card detection contact/write protec-
tion mechanism. If anything such as flux
remains inside after washing, insertion
and removal will be hampered and con-
tact will be faulty. Therefore, do not use
methods that involve submersion when
cleaning. (Partial cleaning of the PCB
and soldered terminals is possible.)
3. After PC board mounting
5. Device design
• Contact failure may result if dust or dirt
enters the contact section. Please take
appropriate measures when designing
the device to prevent this from happen-
ing, for example by adding a cover.
• To ensure smooth insertion and removal
of cards, please design the chassis so
that no force is applied to the metal
shell on top of the socket. If a force is
present that pushes down on the metal
shell, the card will be pressed, which
might prevent ejection.
Warping of the PC board should be no
more than 0.03 mm for the entire connec-
tor length.
4. Card fitting
• These products are made for the design
of compact and lightweight devices and
therefore the molded part is very thin.
For this reason, design the device to
prevent undue wrenching forces from
being applied to the product during use.
• The sockets are constructed to prevent
reverse card insertion. Caution is
required because repeated, mistaken
reverse insertion may damage the
socket and card.
Regarding general notes, please
refer to pages 8 and 9.
• Forcibly removing a fitted card may
degrade the card removal prevention
lock. To remove a card, be sure to push
the card in the insertion direction to
release the slider lock before pulling out
the card.
• The card removal prevention lock does
not work for MMCs.
• The sockets are not constructed to pre-
vent reverse insertion of MMCs. If an
MMC is inserted in reverse, the position
of the card lock will be forward. If this
happens, be sure to push the card in
the insertion direction to release the
slider lock before pulling out the card.
12/1/2002
All Rights Reserved, © Copyright Matsushita Electric Works, Ltd.
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