AXC52401 [PANASONIC]
Card Edge Connector, 40 Contact(s), 2 Row(s), Male, ROHS COMPLIANT;
| 型号： | AXC52401 |
| 厂家： | 
PANASONIC |
| 描述： | Card Edge Connector, 40 Contact(s), 2 Row(s), Male, ROHS COMPLIANT 连接器 |
| 文件： | 总7页 (文件大小：585K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
Discontinued as of September 30, 2010
ULTRA COMPACT AND SUPER-FINE
COAXIAL WIRE CONNECTOR WITH
A MATED HEIGHT OF 1.5 mm AND
A TERMINAL PITCH OF 0.3 mm
FINE COAXIALWIRE
CONNECTOR
2) V-notch: High resistance to the
penetration of foreign matters and flux.
3. Zig-zag DIL terminals with a 0.6 mm
pitch used for the socket, facilitating
mounting on the PC board.
Compared to the 0.4 mm pitch SIL layout,
a better horizontal weight balance is
achieved.
Furthermore, these terminals offer,
(1) Better pickup balance on mounting.
(2) Good solderability due to the 0.6 mm
pitch.
● V-notch
By making contact with the edges and thus
increasing the contact pressure, this pro-
duct can eliminate flux and other foreign
matters more effectively than conventional
products, which also helps to prevent for-
eign matters from obstructing the contact.
[Cross Section of Contacts]
(3) Prevention of solder bridges during
reflow soldering.
4. Designed for fine wiring
<Product without a notch>
<V-notched product>
Cross section of
the socket side
contact
The pulse-heating system allows the use
of general-purpose equipment. A shape
designed for easy wiring has been
adopted, focusing on the operability of
fine wiring.
5. Strong resistance to pulling of the
fine wire and reliability of wired
portion.
The fine wire is sandwiched between the
two GND bars and soldered. This
structure gives better resistance to
pulling than caulking.
6. Vertical insertion style facilitates
connector mating.
Cross section of
the header side
contact
Patented (Japan, Korea, and Taiwan)
Socket
Header
3) Ni barrier: High resistance to solder
creep.
Compliance with RoHS Directive
● Ni barrier
FEATURES
The exposed nickel-plated portion of the
gold-plated contact prevents solder creep
despite the ultra low profile of the contact.
1. Ultra compact
A terminal pitch of 0.3 mm allows for a
short length and a wired height of only
1.5 mm.
[Contact]
Header post
Ni barrier
Cu Ni Au
17.2 (40 contacts)
A vertical mating system featuring a
simple locking mechanism and insertion
guide facilitates accurate mating.
1.5
0.6mm pitch
Exposed
Ni portion
Cross section of the
socket side contact
Socket contact
Note: Simultaneous molding of the header contact
achieves a construction that prevents solder creep.
4) Porosity treatment: Resistance to
corrosion.
Insertion guide
0.3mm pitch
Fine coaxial wire: 0.29 mm dia. max.
(#42 AWG max.)
2. Highly reliable
Vertical insertion style
Porosity treatment
has strong
This treatment consists in coating the sur-
face with a very thin film to seal pinholes in
the gold plating. We have developed this
porosity treatment technology, which en-
sures contact reliability for thin gold plating
comparable to that of thick gold plating.
resistance to adverse environments.
Stable contact reliability is achieved by
applying the expertise we accumulated
while developing Narrow-pitch
Anti-reverse-mating
structure
(Direction-restricted inlet)
connectors for the mobile phone market.
1) Our original bellows contact: High
resistance to drop impact and twisting
forces.
Porosity treatment film
Holding metal
Pinholes
Ambient gas
Au plating
APPLICATIONS
Devices that have a complex rotating
hinge mechanism such as mobile
phones, DSCs, and DVCs.
Ni plating
Base material
●
●
●
Improved in mating/unmating durability
Improved in resistance to corrosion
Improved in contact reliability for digital signals
Contacts are formed by bending a thin metal sheet.
This provides the contact parts with adequate
spring characteristics ensuring greater resistance
to twisting forces and drop impacts.
panasonic-electric-works.net/ac
Discontinued as of September 30, 2010
AXC5
ORDERING INFORMATION
1. Socket
2. Header (Set)
AXC 5
1
2
AXC 5
2
1
5: Fine coaxial wire connectors
5: Fine coaxial wire connectors
<Socket and Header>
1: Socket
<Socket and Header>
2: Header (Set)
<Number of contacts (2 digits)>
<Number of contacts (2 digits)>
<Function>
1: With positioning boss
2: Without positioning boss
<GND bar wiring system>
1: Wiring with solder
<Lock>
2: With lock function (soldering terminal portion)
PRODUCT TYPES
1. Socket
Packing quantity
Mated height
No. of contacts
40
Part Number
AXC514022
Inner carton (embossed)
3, 000 pieces
Outer carton
1.5mm
6, 000 pieces
Note: The standard type comes without positioning bosses. Connectors with positioning bosses are available on-demand production.
2. Header (Set)
Packing quantity
Inner carton (embossed)
1, 000 pieces
Mated height
No. of contacts
40
Part Number
AXC52401
Outer carton
2, 000 pieces
1.5mm
Note: The header removal tool is required for unmating this connector. (See PRECAUTIONS FOR USE.) Please contact us for details.
panasonic-electric-works.net/ac
Discontinued as of September 30, 2010
AXC5
SPECIFICATIONS
1. Characteristics
Item
Specifications
0.3A/terminal (Max. 5A at total contacts)
60V AC/DC
Conditions
Rated current
Rated voltage
Maximum current that one contact can conduct.
Insulation resistance
Min. 1, 000 MΩ (initial)
Using 250 V DC megger (applied for 1 minute)
Electrical
characteristics
Rated voltage is applied for one minute and check for
short circuit or damage with a detection current of 1mA.
Breakdown voltage
200 V AC for 1 minute
Measured based on the milliohmmeter measurement
method of JIS C 5402
Contact resistance
Max. 90mΩ
Composite insertion force
Max. 50N (40 contacts)(initial)
Lock strength
Mechanical
Min. 20N/30 sec. (40 contacts)(initial)
Socket connector: Min. 0.49N,
Socket soldering terminal: Min. 0.98N
Measuring the maximum force.
As the contact is axially pull out.
Contact holding force
characteristics
No breakage at mated part when 40 restrained pins are
pulled by at least 0.98 N.
Wire tensile strength (mated) 5N/30 sec.
Ambient temperature
Storage environment
–55°C to +85°C
–55°C to +85°C (Product unit)
–40°C to +50°C (Embossed packing style)
–40°C to +50°C (Tray packing style)
No freezing at low temperatures
No freezing at low temperatures
Sequence
5 cycles,
insulation resistance min. 100MΩ,
contact resistance max. 25mΩ
1. –55−30 °C, 30 minutes
Thermal shock resistance
(header and socket mated)
+10
2. 25 °C, Max. 5 minutes
−5
3. 85+30 °C, 30 minutes
Environmental
characteristics
+10
4. 25 °C, Max. 5 minutes
−5
120 hours,
insulation resistance min. 100MΩ,
contact resistance max. 25mΩ
Humidity resistance
(header and socket mated)
Bath temperature 40 2°C,
humidity 90 to 95% R.H.
24 hours,
insulation resistance min. 100MΩ,
contact resistance max. 25mΩ
Saltwater spray resistance
(header and socket mated)
Bath temperature 35 2°C,
saltwater concentration 5 1%
H2S resistance
(header and socket mated)
48 hours,
contact resistance max. 25mΩ
Bath temperature 40 2°C,
gas concentration 3 1 ppm, humidity 75 to 80% R.H.
Insertion and
removal life
Repeated insertion and removal speed of
max. 200 times/hours
Mechanical life
30 times, contact resistance max. 25mΩ
Infrared reflow soldering:
Peak temperature 260°C max.
(Surface temperature of PC board adjacent to connector
terminals)
Socket
—
—
Soldering iron: 350°C for 3 seconds max.
300°C for 5 seconds max.
Resistance to
soldering heat
Connected part pulse heat:
Peak temperature 290°C for 3 seconds max.
(Heater head must not directly contact connector molded part.)
Shell retaining part
Header
Soldering iron: 350°C for 3 seconds max.
300°C for 5 seconds max.
2. Material and surface treatment
Part name
Material
Surface treatment
—
Resin-molding portion
LCP resin (UL94V-0), Black
Contact portion: Ni plating on base, Au plating on surface (Min. 0.1µm)
Solder portion: Ni plating on base, Au plating on surface (except for thick of terminal)
Socket
Contact
Copper alloy
Soldering terminal
Copper alloy
Ni plating on base, Pd + Au flash on surface
—
Resin-molding portion
LCP resin (UL94V-0), Black
Header block
Shell
Contact portion: Ni plating on base, Au plating on surface (Min. 0.1µm)
Post
Copper alloy
Wire soldering terminal: Ni plating on base, Au plating on surface
Shell
Stainless steel
Polyimide resin
Ni plating on base, Pd + Au flash on surface
—
Insulating tape
panasonic-electric-works.net/ac
Discontinued as of September 30, 2010
AXC5
The CAD data of the products with a CAD Data mark can be downloaded from: http://panasonic-electric-works.net/ac
DIMENSIONS (Unit: mm)
• Socket
CAD Data
16.7
12.6 (Suction face)
5.55 0.1
5.85 0.1
0.6 0.05
0.3 0.05
0.05 0.05
Soldering
terminal
5.85 0.1
5.55 0.1
17.0
0.8 0.1
Terminal coplanarity
0.10
(Signal terminal)
15.2
General tolerance: 0.2
• Header
CAD Data
1.3
(0.29 dia.)
0.40
0.3
11.7
General tolerance: 0.2
• Socket and header are mated
17.2
17.0
1.5 0.15
General tolerance: 0.2
panasonic-electric-works.net/ac
Discontinued as of September 30, 2010
AXC5
EMBOSSED TAPE DIMENSIONS (Unit: mm) (Common to all sockets and headers)
• Specifications for taping
• Specifications for the plastic reel
(In accordance with JIS C 0806-1990. However, not applied to
(In accordance with EIAJET-7200B.)
the mounting-hole pitch of some connectors.)
A 0.3
B
Taping reel
E 1
1.75
C
Top cover tape
4
2
Embossed carrier tape
F
Embossed mounting-hole
D
1.5+0.1 dia.
0
Dimensions (Unit: mm)
Types
No. of contacts
A
B
C
D
E
F
Quantity per reel
3,000
Socket
40
32.0
28.4
14.2
8.0
33.4
380 dia.
Product direction with respect to the forwarding direction of the embossed tape
Type
Direction
Socket
of tape progress
PRECAUTIONS FOR USE
1. Recommended PC Board and Metal
Mask Patterns
Socket
Recommended PC board pattern (TOP VIEW)
Sockets are densely mounted with a pitch
interval of 0.4 to 0.6 mm.
Non-insulated devices prohibited.
Non-insulated solder prohibited.
In order to reduce solder bridges and
other defects, the solder amount must be
controlled and kept at a proper level.
Refer to the recommended patterns on
the right for this purpose.
5.55 0.05 5.85 0.05
0.1 0.05
Wire pull-out
direction
0.4 0.05
0.6 0.05
5.85 0.05 5.55 0.05
15.0 0.1
1.3 0.1
All devices and solder prohibited.
Recommended metal mask opening pattern
Recommended metal mask opening pattern
Metal mask thickness: When 120 µm
Metal mask thickness: When 150 µm
(Terminal opening ratio: 56%)
(Terminal opening ratio: 45%)
(Metal-part opening ratio: 100%)
(Metal-part opening ratio: 100%)
5.55 0.05
5.85 0.05
5.55 0.05
5.85 0.05
0.35 0.02
0.6 0.02
0.35 0.02
0.6 0.02
5.85 0.05
5.55 0.05
5.85 0.05
5.55 0.05
15.0 0.05
1.3 0.02
15.0 0.05
1.3 0.02
panasonic-electric-works.net/ac
Discontinued as of September 30, 2010
2. Safety precautions • Consult us when using a screen-printing
AXC5
4) Excessive twisting during insertion and
removal can lead to product damage and
separation of the terminals’ soldered
part. An excessive force applied around
the mating inlet during mating can also
lead to product damage. Therefore, be
careful when handling the product, and
during mating, always align the mating
positions and mate in parallel.
Observe the following safety precautions
to prevent accidents and injuries.
1) The use of the connector outside of the
specified rated current and withstand
voltage ranges may cause abnormal
heating, smoke, and fire. Never use the
connector beyond the specified ranges of
the product.
thickness other than that recommended.
• Depending on the size of the connector
being used, self alignment may not be
possible. Accordingly, carefully position
the terminal with the PC board pattern.
• The recommended reflow temperature
profile is given in the figure below
Temperature
2) In order to avoid accidents, make sure
you have thoroughly reviewed the
specifications before use.
Peak temperature
245°C max.
180 to 200°C
Preheating
155 to 165°C
Consult us if you plan to use the product
in a way not covered by the
specifications.
3. Precautions for harnessing and
header assembly
60 to 120 sec.
Within 30 sec.
Time
Recommended reflow temperature profile
(eutectic solder)
5) Do not pull the wires when unmating
the connector. Doing so may damage the
product or degrade the locking ability.
Unmate the connector by referring to the
figure below.
Temperature
The header of this product is wired by
soldering the 0.3 mm pitch cable. If
harnessing is desired, then carry it out
based on the separately attached
“Header Assembly Procedures”. Make
sure to get familiar with and observe all
the precautions in the procedures.
4. PC board design
Peak temperature
260°C max.
200°C
Preheating
150 to 175°C
120 sec.
70 sec.
Unmating jig
Time
insertion position
Shell
Recommended reflow temperature profile
(lead-free solder)
Design the recommended foot pattern in
order to secure the mechanical strength
in the soldered areas of the terminal.
5. Connector mounting
In case the connector is picked up by
chucking during mounting, an excessive
mounter chucking force may deform the
molded or metal part of the connector.
Consult us in advance if chucking is to be
applied.
• The temperature is measured on the
surface of the PC board near the
connector terminal.
• When performing reflow soldering on
the back of the PC board after reflow
soldering the connector, secure the
connector using, for example, an
adhesive (Double reflow soldering on the
same side is possible)
3) Reworking on a soldered portion
• Finish reworking in one operation.
• For reworking of the solder bridge, use
a soldering iron with a flat tip. Do not add
flux, otherwise, the flux may creep to the
contact parts.
Unmating jig
Insert the unmating jig and, with the lock released,
lift it directly up.
Removal of this product requires a
header removal tool. Please inquire for
details.
6) After harnessing, be careful not to
apply any excessive stress to the wire
roots.
6. Soldering
1) Manual soldering.
• Since this is a low-profile product, avoid
supplying too much solder when
soldering manually. Otherwise, solder
may creep into the vicinity of the contact
portion, or the contact can lose its
springing ability.
• Make sure that the soldering iron tip is
heated within the temperature and time
limits indicated in the specifications.
• Flux from the solder wire may adhere to
the contact surfaces during soldering
operations. After soldering, carefully
check the contact surfaces and clean off
any flux before use.
Do not apply any excessive stress
to the wire roots.
• Use a soldering iron whose tip
temperature is within the temperature
range specified in the specifications.
7. Prevention of vibration and shock
1) Since this product has a particularly
low-profile, is compact and lightweight, its
molded parts are thinned. To prevent the
connector from detaching due to vibration
and shock, make sure to consider means
to avoid applying tension to the connector
such as by providing a stopper to fix the
connector toward the mating direction or
fixing the wire.
7) Keep the PC board warp within 0.03
mm with respect to the total length of the
connector.
• Be aware that a load applied to the
connector terminals while soldering may
displace the contact.
• Thoroughly clean the iron tip.
2) Reflow soldering
2) Do not drop the product or handle it
carelessly. Otherwise, the terminals may
become deformed due to excessive force
or the solderability during reflow
0.03 mm max.
0.03 mm max.
8) The positioning boss of this product is
for rough positioning with the PC board.
For accurate positioning when mounting
the connector to a PC board, we
recommend positioning by an automated
machine.
• Screen-printing is recommended for
printing paste solder.
soldering may degrade.
• To determine the relationship between
the screen opening area and the PC-
board foot pattern area, refer to the
diagrams in the recommended patterns
for PC boards and metal masks. Make
sure to use the terminal tip as a reference
position when setting.
3) Do not insert or remove the connector
when it is not soldered. Also, forcibly
applied external pressure on the
terminals can weaken the adherence of
the terminals to the molded part or cause
the terminals to lose their evenness.
panasonic-electric-works.net/ac
Discontinued as of September 30, 2010
AXC5
9) When cutting or bending the PC board
after mounting the connector, be careful
that no excessive force is applied to the
soldered area.
Avoid excessive force on the soldered area.
8. Others
1) If you coat the PC board after
soldering, so as to prevent degradation of
the insulation, make sure that the coating
agent does not adhere to the connector.
2) Basically, you cannot perform
switching with the connector.
For other details, please verify with
the product specification sheets.
panasonic-electric-works.net/ac
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