AXE414124 [PANASONIC]

Card Edge Connector, 14 Contact(s), 2 Row(s), Male, Straight, Surface Mount Terminal, ROHS COMPLIANT;


型号：	AXE414124
厂家：	PANASONIC
描述：	Card Edge Connector, 14 Contact(s), 2 Row(s), Male, Straight, Surface Mount Terminal, ROHS COMPLIANT PC 连接器
文件：	总6页 (文件大小：360K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

AXE3, 4

For board-to-FPC

Narrow pitch connectors

(0.4mm pitch)

A4F Series

FEATURES

1. 0.6 mm mated height low proﬁle

two-piece connectors

3. Low proﬁle and highly resistant to

various environments possible with

the use of highly reliable

2. Space-saving (3.0 mm widthwise)

Smaller compared to F4 series (40 pin

contacts):

“

”

connector design.

Socket — 40% smaller,

Header — 43% smaller

Ni barrier

Bellows contact

construction

(Against dropping!)

construction

(Against solder rise!)

Socket

Header

Soldering terminals

at each corner

Suction face: 0.8mm

Porosity

treatment

RoHS compliant

(Against corrosive

gases!)

Socket

Soldering terminals

at each corner

Suction face: 1.1mm

V notch and Double contact constructions

(Against foreign particles and flux!)

4. Simple lock structure provides

tactile feedback to ensure excellent

mating/unmating operation feel.

5. Gull-wing-shaped terminals to

facilitate visual inspections.

Header

6. Connectors for inspection available

APPLICATIONS

Mobile devices, such as cellular

phones, digital still cameras and

digital video cameras.

ORDERING INFORMATION

AXE

3: Narrow Pitch Connector A4F (0.4 mm pitch) Socket

4: Narrow Pitch Connector A4F (0.4 mm pitch) Header

Number of pins (2 digits)

Mated height

1: For mated height 0.6 mm

Functions

2: Without positioning bosses

Surface treatment (Contact portion / Terminal portion)

4: Ni plating on base, Au plating on surface (for Ni barrier available)

4: Ni plating on base, Au plating on surface

ACCTB26E 201201-T

Panasonic Corporation Automation Controls Business Unit industrial.panasonic.com/ac/e

AXE3, 4

PRODUCT TYPES

Part number

Packing

Mated height

Number of pins

Socket

Header

Inner carton (1-reel)

Outer carton

AXE310124

AXE312124

AXE314124

AXE316124

AXE320124

AXE322124

AXE324124

AXE326124

AXE328124

AXE330124

AXE332124

AXE334124

AXE336124

AXE338124

AXE340124

AXE342124

AXE344124

AXE350124

AXE354124

AXE360124

AXE364124

AXE370124

AXE380124

AXE410124

AXE412124

AXE414124

AXE416124

AXE420124

AXE422124

AXE424124

AXE426124

AXE428124

AXE430124

AXE432124

AXE434124

AXE436124

AXE438124

AXE440124

AXE442124

AXE444124

AXE450124

AXE454124

AXE460124

AXE464124

AXE470124

AXE480124

0.6mm

5,000 pieces

10,000 pieces

Notes: 1. Order unit:

For volume production: 1-inner carton (1-reel) units

Samples for mounting check: 50-connector units. Please contact our sales ofﬁce.

Samples: Small lot orders are possible. Please contact our sales ofﬁce.

2. The above part numbers are for connectors without positioning bosses, which are standard.When ordering connectors with positioning bosses, please contact our

sales ofﬁce.

3. Please contact us for connectors having a number of pins other than those listed above.

SPECIFICATIONS

ꢀ Characteristics

Item

Speciﬁcations

0.3A/pin contact (Max. 5 A at total pin contacts)

60V AC/DC

Conditions

Rated current

Rated voltage

No short-circuiting or damage at a detection current of 1 mA

when the speciﬁed voltage is applied for one minute.

Electrical

characteristics

Breakdown voltage

Insulation resistance

Contact resistance

150V AC for 1 min.

Min. 1,000MΩ (initial)

Max. 90mΩ

Using 250V DC megger (applied for 1 min.)

Based on the contact resistance measurement method

speciﬁed by JIS C 5402.

Composite insertion force

Composite removal force

Max. 1.200N/pin contacts × pin contacts (initial)

Min. 0.165N/pin contacts × pin contacts

Mechanical

characteristics

Contact holding force

(Socket contact)

Measuring the maximum force.

As the contact is axially pull out.

Min. 0.20N/pin contacts

Ambient temperature

–55°C to +85°C

No freezing at low temperatures. No dew condensation.

Peak temperature: 260°C or less (on the surface of

the PC board around the connector terminals)

Infrared reﬂow soldering

Soldering heat resistance

300°C within 5 sec. 350°C within 3 sec.

Soldering iron

–55°C to +85°C (product only)

–40°C to +50°C (emboss packing)

Storage temperature

No freezing at low temperatures. No dew condensation.

Sequence

5 cycles,

insulation resistance min. 100MΩ,

contact resistance max. 90mΩ

1. –55₋₃⁰°C, 30 minutes

2. ~ , Max. 5 minutes

3. 85⁺³₀°C, 30 minutes

4. ~ , Max. 5 minutes

Thermal shock resistance

(header and socket mated)

Environmental

characteristics

120 hours,

insulation resistance min. 100MΩ,

contact resistance max. 90mΩ

Humidity resistance

(header and socket mated)

Bath temperature 40 2°C,

humidity 90 to 95% R.H.

24 hours,

insulation resistance min. 100MΩ,

contact resistance max. 90mΩ

Saltwater spray resistance

(header and socket mated)

Bath temperature 35 2°C,

saltwater concentration 5 1%

H2S resistance

(header and socket mated)

48 hours,

contact resistance max. 90mΩ

Bath temperature 40 2°C, gas concentration 3 1 ppm,

humidity 75 to 80% R.H.

Lifetime

characteristics

Repeated insertion and removal speed of max. 200 times/

hours

Insertion and removal life

30 times

Unit weight

20 pin contact type: Socket: 0.01 g Header: 0.01 g

ACCTB26E 201201-T

Panasonic Corporation Automation Controls Business Unit industrial.panasonic.com/ac/e

AXE3, 4

ꢀ Material and surface treatment

Part name

Material

Surface treatment

Molded

portion

LCP resin

(UL94V-0)

—

Contact portion: Base: Ni plating Surface: Au plating

Terminal portion: Base: Ni plating Surface: Au plating (except the terminal tips)

The socket terminals close to the portion to be soldered have nickel barriers (exposed nickel portions).

Soldering terminals: Sockets: Base: Ni plating Surface: Pd+Au ﬂash plating (except the terminal tips)

Headers: Base: Ni plating Surface: Au plating (except the terminal tips)

Contact and

Post

Copper alloy

The CAD data of the products with a CAD Data mark can be downloaded from: http://industrial.panasonic.com/ac/e

DIMENSIONS (Unit: mm)

ꢀ Socket (Mated height: 0.6 mm)

CAD Data

Dimension table (mm)

Number of pins/

dimension

Terminal coplanarity

0.08

B 0.1

0.57

4.5

4.9

1.6

2.0

2.4

2.8

3.6

4.0

4.4

4.8

5.2

5.6

6.0

6.4

6.8

7.2

7.6

8.0

8.4

9.6

10.4

11.6

12.4

13.6

15.6

3.4

3.8

0.40 0.05

0.15 0.03

(Contact and

soldering terminals)

5.3

4.2

5.7

4.6

6.5

5.4

6.9

5.8

7.3

6.2

7.7

6.6

8.1

7.0

(0.86)

Y note

Z note

8.5

7.4

8.9

7.8

9.3

8.2

9.7

8.6

0.30 0.03

C 0.1

10.1

10.5

10.9

11.3

12.5

13.3

14.5

15.3

16.5

18.5

9.0

9.4

9.8

General tolerance: 0.2

10.2

11.4

12.2

13.4

14.2

15.4

17.4

Note: Since the soldering terminals has a single-piece construction,

sections Y and Z are electrically connected.

Dimension table (mm)

ꢀ Header (Mated height: 0.6 mm)

Number of pins/

dimension

CAD Data

Terminal coplanarity

0.46

B 0.1

0.40 0.05

0.15 0.03

0.08

3.8

4.2

1.6

2.0

2.4

2.8

3.6

4.0

4.4

4.8

5.2

5.6

6.0

6.4

6.8

7.2

7.6

8.0

8.4

9.6

10.4

11.6

12.4

13.6

15.6

3.2

3.6

(Post and

soldering terminals)

4.6

4.0

5.0

4.4

5.8

5.2

6.2

5.6

6.6

6.0

7.0

6.4

7.4

6.8

7.8

7.2

8.2

7.6

Soldering terminals

8.6

8.0

9.0

8.4

9.4

8.8

9.8

9.2

0.15 0.03

C 0.1

10.2

10.6

11.8

12.6

13.8

14.6

15.8

17.8

9.6

10.0

11.2

12.0

13.2

14.0

15.2

17.2

General tolerance: 0.2

ꢀ Socket and Header are mated

Header

Socket

ACCTB26E 201201-T

Panasonic Corporation Automation Controls Business Unit industrial.panasonic.com/ac/e

AXE3, 4

EMBOSSED TAPE DIMENSIONS (Unit: mm) (Common for respective contact types, sockets and headers)

ꢀ Speciﬁcations for taping

ꢀ Speciﬁcations for the plastic reel

(In accordance with JIS C 0806-1990. However, not applied to

(In accordance with EIAJ ET-7200B.)

the mounting-hole pitch of some connectors.)

Tape I

Tape II

(A 0.30)

(B)

Taping reel

D 1

(C)

(1.75)

(C)

(1.75)

Top cover tape

Embossed carrier tape

Embossed mounting-hole

ꢀ Dimension table (Unit: mm)

Type/Mated height

Number of pins

24 or less

26 to 70

Type of taping

Tape I

—

Quantity per reel

5,000

16.0

24.0

32.0

7.5

17.4

25.4

33.4

Common for sockets

and headers

0.6 mm

Tape II

—

11.5

14.2

5,000

Tape II

28.4

5,000

ꢀ Connector orientation with respect to embossed tape feeding direction

Type

Direction

of tape progress

Common for A4F

Header

Socket

Note: There is no indication on this product regarding top-bottom or left-right orientation.

ACCTB26E 201201-T

Panasonic Corporation Automation Controls Business Unit industrial.panasonic.com/ac/e

AXE3, 4

For board-to-FPC

Connectors for

inspection usage

(0.4mm pitch)

A4F Series

FEATURES

APPLICATIONS

1. 3,000 mating and unmating cycles

2. Same external dimensions and foot

pattern as standard type.

Ideal for module unit inspection and

equipment assembly inspection

3. Improved mating

Socket

Header

Insertion and removal easy due to a

reduction in mating retention force. This

is made possible by a simple locking

structure design.

Note: Mating retention force cannot be

warranted.

RoHS compliant

TABLE OF PRODUCT TYPES

✩: Available for sale

Product name

Number of pins

A4F

for inspection

✩

Notes: 1. Please inquire about number of pins other than those shown above.

2. Please inquire with us regarding availability.

3. Please keep the minimum order quantities no less than 50 pieces per lot.

4. Please inquire if further information is needed.

PRODUCT TYPES

Speciﬁcations

Part No.

Speciﬁcations

Without positioning bosses

Part No.

Socket

Without positioning bosses

AXE3E∗∗26

Header

AXE4E∗∗26

Note: When placing an order, substitute the “∗” (asterisk) in the above part number with the number of pins for the speciﬁc connector.

NOTES

ꢀ Recommended PC board and metal

mask patterns

• Socket (Mated height: 0.6 mm)

Recommended PC board pattern (TOP VIEW)

• Header (Mated height: 0.6 mm)

Recommended PC board pattern (TOP VIEW)

Connectors are mounted with high pitch

density, intervals of 0.35 mm, 0.4 mm or

0.5 mm.

0.40 0.03

0.23 0.03

0.40 0.03

0.23 0.03

In order to reduce solder bridges and

other issues make sure the proper levels

of solder is used.

The ﬁgures to the right are recommended

metal mask patterns. Please use them as

a reference.

0.90 0.03

0.45 0.03

0.80 0.03

1.45 0.03

: Insulation area

Recommended metal mask opening pattern

Metal mask thickness: When 120µm

(Terminal opening ratio: 70%)

(Metal-part opening ratio: 100%)

0.40 0.01

0.20 0.01

0.40 0.01

0.20 0.01

0.90 0.01

1.45 0.01

0.45 0.01

0.80 0.01

Please refer to the latest product

speciﬁcations when designing your

product.

ACCTB26E 201201-T

Panasonic Corporation Automation Controls Business Unit industrial.panasonic.com/ac/e

NOTES FOR USING ADVANCED SERIES

NARROW-PITCH CONNECTORS ^(Common)

ꢀ Connector mounting

• The temperature is measured on the

surface of the PC board near the

connector terminal.

• Some solder and ﬂux types may cause

serious solder creeping. Solder and ﬂux

characteristics should be taken into

consideration when setting the reﬂow

soldering conditions.

• When performing reﬂow soldering on

the back of the PC board after reﬂow

soldering the connector, secure the

connector using, for example, an

adhesive (Double reﬂow soldering on the

same side is possible)

3) Reworking on a soldered portion

• Finish reworking in one operation.

• For reworking of the solder bridge, use

a soldering iron with a ﬂat tip. Do not add

ﬂux, otherwise, the ﬂux may creep to the

contact parts.

• Use a soldering iron whose tip

temperature is within the temperature

range speciﬁed in the speciﬁcations.

ꢀ Do not drop or handle the

connector carelessly. Otherwise, the

terminals may become deformed due

to excessive force or applied

solderability may be degraded during

reﬂow.

ꢀ Do not insert or remove the

connector when it is not soldered.

Forcibly applied external pressure on

the terminals can weaken the

adherence of the terminals to the

molded part or cause the terminals to

lose their evenness.

ꢀ Excessive prying-force applied to

one end may cause product breakage

and separation of the solder joints at

the terminal.

ꢀ When cutting or bending the PC

board after mounting the connector,

be careful that the soldered sections

are subjected to excessive forces.

Excessive mounter chucking force may

deform the molded or metal part of the

connector. Consult us in advance if

chucking is to be applied.

ꢀ Soldering

1) Manual soldering.

• Due to the connector’s low proﬁle, if an

excessive amount of solder is applied

during manual soldering, the solder may

creep up near the contact points, or

solder interference may cause imperfect

contact.

• Make sure that the soldering iron tip is

heated within the temperature and time

limits indicated in the speciﬁcations.

• Flux from the solder wire may adhere to

the contact surfaces during soldering

operations. After soldering, carefully

check the contact surfaces and clean off

any ﬂux before use.

The soldered areas should not be subjected to forces.

ꢀ Notes when using a FPC.

• When the connector is soldered to an

FPC board, during insertion and removal

forces may be applied to the terminals

and cause the soldering to come off. It is

recommended to use a reinforcement

board on the backside of the FPC board

to which the connector is being

connected. Make sure that the reinforcing

plate is larger than the outline of the

recommended PC board pattern (Outline

+ approx. 1 mm). The reinforcing plate is

made of SUS, glass epoxy or polyimide

that is 0.2 to 0.3 mm thick.

This connector employs a simple locking

structure. However, the connector may

come off depending on the size and

weight of the FPC, layout and reaction

force of FPC, or by drop impact. Make

sure to fully check the equipment’s

condition. To prevent any problem with

loose connectors, adopt measures to

prevent the connector from coming off

inside the equipment.

• Be aware that a load applied to the

connector terminals while soldering may

displace the contact.

• Thoroughly clean the iron tip.

2) Reﬂow soldering

• Screen-printing is recommended for

printing paste solder.

• To determine the relationship between

the screen opening area and the PC-

board foot pattern area, refer to the

diagrams in the recommended patterns

for PC boards and metal masks. Make

sure to use the terminal tip as a reference

position when setting. Avoid an excessive

amount of solder from being applied,

otherwise, interference by the solder will

cause an imperfect contact.

ꢀ Other Notes

When coating the PC board after

soldering the connector (to prevent the

deterioration of insulation), perform the

coating in such a way so that the coating

does not get on the connector.

The connectors are not meant to be used

for switching.

Terminal

Paste

solder

When removing the connector, be

sure not to tilt the connector

exceeding 15 degrees widthwise.

Excessive force applied for insertion

in a pivot action as shown may also

cause product breakage.

PC board

foot pattern

Please refer to the latest product

speciﬁcations when designing your

product.

• Consult us when using a screen-printing

thickness other than that recommended.

• Depending on the size of the connector

being used, self alignment may not be

possible. Accordingly, carefully position

the terminal with the PC board pattern.

• The recommended reﬂow temperature

proﬁle is given in the ﬁgure below

Align the header and socket positions

before connecting them.

Recommended reﬂow temperature proﬁle

Upper limit (Soldering heat resistance)

Lower limit (Solder wettability)

Temperature

Peak temperature

260°C

230°C

220°C

200°C

Preheating

180°C

150°C

25 sec.

70 sec.

60 to 120 sec.

Time

ACCTB11E 201201-T

Panasonic Corporation Automation Controls Business Unit industrial.panasonic.com/ac/e

AXE414124 [PANASONIC]

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