AXK800145YJ [PANASONIC]

Board Stacking Connector, 100 Contact(s), 2 Row(s), Male, Straight, Surface Mount Terminal;


型号：	AXK800145YJ
厂家：	PANASONIC
描述：	Board Stacking Connector, 100 Contact(s), 2 Row(s), Male, Straight, Surface Mount Terminal 连接器
文件：	总3页 (文件大小：536K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

AXK(7/8)

NARROW PITCH

NARROW-PITCH

CONNECTORS

FOR PC BOARDS

(0.4mm) CONNECTORS

P4 SERIES

2. High impact-resistant construction.

1) Adoption of bellows-type contacts

structure.

2) Guides are provided to take up any

position shift and facilitate insertion.

The roll surfaces are in contact

with each other, providing high

contact reliability.

Insertion guide

Since the contact is formed by

bending thin plate, it has a spring-

like quality. This construction

helps make it resistant to dropping

and twisting.

2) It is constructed with impact dispersion

keys inside the body to disperse shocks

when dropped.

3) The connector has a simple lock

mechanism.

Impact dispersion Key

Socket

Header side

contact

Socket and

header are

mated

Socket

Header

Socket side

contact

Simple lock

mechanism

Ideal for FPC-to-PCB connections

Header

FPC

Reinforcing plate

0.3mm

Before

mating

Narrow-pitch

connectors

4. Design makes efﬁcient mounting.

Features a terminal ﬂatness of 0.08 mm,

construction resistant to creeping ﬂux,

and design that facilitates visual inspec-

tion of the soldered part.

A high level of shock resistance is

ensured by dispersing impact over the

four locations where the socket indenta-

tions and header protrusions are mated

together.

PCB

After

mating

1.8mm

The simple lock

A stacking height of 1.8mm including

the FPC area has been achieved.

This enables the number of pins to

be doubled white the size remains

the same as that for existing FPC

connectors. This, in turn, contributes

to making products and equipment

more compact.

mechanism ensures

that the connector

clicks into position

when it is inserted for

reliable single-action

insertion on the PCB.

3. Construction makes designing

devices easier.

1) The lower connector surface construc-

tion prevents contact and shorts between

the PCB and metal terminals. This

enables freedom in pattern wiring, help-

ing to make PCB’s smaller.

APPLICATIONS

• Cellular phones

• DVC

• Compact portable devices

FEATURES

1. A 0.4 mm pitch and stacking height

of 1.5 mm allow for extra compactness

and helps design lighter, thinner,

shorter, and smaller devices.

Connector bottom: Create any thru-hole pattern wiring.

PRODUCT TYPES

Part No.

Packing

Stacking height

No. of contacts

Socket

Header

Inner carton (1-reel)

Outer carton

Note 1)

100

AXK720145

AXK724145

AXK726145

AXK730145

AXK734145

AXK740145

AXK750145

AXK760145

AXK770145

AXK780145

AXK700145

AXK820145Y

AXK824145Y

AXK826145Y

AXK830145Y

AXK834145Y

AXK840145Y

AXK850145Y

AXK860145Y

AXK870145Y

AXK880145Y

AXK800145Y

Note 1)

“Asterisk” mark on end of part No.; “Asterisk” mark on end of part No.;

1.5 mm

J: 3,000 pieces

V: 3,000 pieces

J: 6,000 pieces

V: 15,000 pieces

Notes) 1. Regarding ordering units: During production, Please make orders in 1-reel units. Samples for mounting conﬁrmation: Please consult us. (See “Regarding sample

orders to conﬁrm proper mounting” on page 9.) Samples: Small lot orders are possible.

2. The standard type comes with no positioning bosses. Connectors with positioning bosses are available for on-demand production. For this type of connector, 8th

digit of the part no. changes from 4 to 3. e.g. Stacking height 1.5mm 20 contacts for sockets: AXK720135J

3. Connectors with holding metal are available for on-demand production.

AXK(7/8)

SPECIFICATIONS

1. Characteristics

Item

Speciﬁcations

0.3A/contact (Max. 5 A at total contacts)

60V AC/DC

Conditions

Rated current

Rated voltage

Electrical

characteristics

Breakdown voltage

Insulation resistance

150V AC for 1 minute

Detection current: 1mA

Min. 1,000MΩ (initial)

Using 250V DC megger (applied for 1 min.)

Measured based on the HP4338B measurement method

of JIS C 5402

Contact resistance

Max. 70mΩ

Composite insertion force

Composite removal force

Max. 0.981N {100gf}/contacts × contacts (initial)

Min. 0.0588N {6gf}/contacts × contacts

Mechanical

characteristics

Measures the maximum load in the post axial direction

until removal

Post holding force

Min. 0.981N {100gf}/contact

Ambient temperature

–55°C to +85°C

No freezing at low temperatures

Infrared reﬂow soldering

Soldering iron

Max. peak temperature of 245°C

300°C within 5 seconds

Soldering heat resistance

Sequence Temperature (°C) Time (minutes)

–55

Max. 5

−3

Thermal shock resistance

(header and socket mated)

5 cycles, insulation resistance min. 100MΩ,

contact resistance max. 70mΩ

+10

−5

−0

+10

−5

Environmental

characteristics

Max. 5

Humidity resistance

(header and socket mated)

120 hours, insulation resistance min. 100MΩ,

contact resistance max. 70mΩ

Bath temperature 40±2°C, humidity 90 to 95% R.H.

Saltwater spray resistance

(header and socket mated)

24 hours, insulation resistance min. 100MΩ,

contact resistance max. 70mΩ

Bath temperature 35±2°C, saltwarter concentration 5±1%

H²S resistance

(header and socket mated)

Bath temperature 40±2°C, gas concentration 3±1 ppm,

humidity 75 to 80% R.H.

48 hours, contact resistance max. 70mΩ

Repeated insertion and removal speed of max. 200 times/

hours

Insertion and removal life

50 times

Stacking height 1.5mm, 20 contacts; Socket: 0.04g

Header: 0.02g

Unit weight

2. Material and surface treatment

Part name

Material

Surface treatment

—

Molded portion

Heat-resistant resin (UL94V-0), Black

Contact portion: Au plating over Ni

Terminal portion: Au plating over Ni (Except for thick of terminal)

Contact/Post

Copper alloy

mm General tolerance ±0.2

DIMENSIONS

• Socket (stacking height: 1.5mm)

0.08

B^±0.1

Dimension table (mm)

0.40^±0.05

0.15^±0.03

No. of

1.50

contacts

6.3

7.1

3.6

4.4

7.5

4.8

8.3

5.6

9.1

6.4

0.10±0.03

10.3

12.3

14.3

16.3

18.3

22.3

7.6

9.6

11.6

13.6

15.6

19.6

100

• Header (stacking height: 1.5mm)

Dimension table (mm)

0.08

No. of

contacts

B^±0.1

0.40^±0.05

0.15^±0.03

5.1

5.9

3.6

4.4

1.31

6.3

4.8

7.1

5.6

7.9

6.4

9.1

7.6

0.10±0.03

11.1

13.1

15.1

17.1

21.1

9.6

11.6

13.6

15.6

19.6

100

AXK(7/8)

• Socket and header are mated

Stacking height 1.5 mm

EMBOSSED TAPE DIMENSIONS

Please refer to page 56.

• Socket

• Header

NOTES

1. As shown below, excess force dur-

ing insertion may result in damage to

the connector or removal of the solder.

Please be careful. Also, to prevent

connector damage plese conﬁrm the

correct position before mating con-

nectors.

Recommended PC board pattern

(TOP VIEW)

Recommended PC board pattern

(TOP VIEW)

0.40^±0.05

0.23^±0.03

0.40^±0.05

0.23^±0.03

0.115^±0.05

0.40^±0.05

0.115^±0.05

0.40^±0.05

B^±0.05

2. Keep the PC board warp no more

than 0.03 mm in relation to the overall

length of the connector.

Recommended metal mask pattern

Metal mask thickness: Here, 150 µm

(Opening area ratio: 40%)

Recommended metal mask pattern

Metal mask thickness: Here, 150 µm

(Opening area ratio: 32%)

±0.01

0.40

±0.01

0.35

±0.01

0.40

±0.01

0.20

±0.01

0.35

0.10

±0.01

0.20

±0.01

Max. 0.03mm

3. PC Boards and Recommended

Metal Mask Patterns

Connectors are mounted with high den-

sity, with a pitch interval of 0.4 to 0.5 mm.

It is therefore necessary to make sure

that the right levels of solder are used, in

order to reduce solder bridge and other

issues.The ﬁgures to the right are recom-

mended metal mask patterns. Please use

them as a reference.

Recommended metal mask pattern

Metal mask thickness: Here, 120 µm

(Opening area ratio: 50%)

Recommended metal mask pattern

Metal mask thickness: Here, 120 µm

(Opening area ratio: 40%)

±0.01

0.40

±0.01

0.35

±0.01

0.40

0.20

±0.01

0.35

0.10

±0.01

0.20

±0.01

* See the dimension table on page 14 for more information on the B dimension of the socket and header.

Regarding general notes, please

refer to pages 8 and 9.

12/1/2002

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