AXK820245WG [PANASONIC]

Narrow pitch connectors (0.4mm pitch) Construction makes designing devices easier.; 窄间距连接器（ 0.4mm间距）的建设，使设计的设备更容易。


型号：	AXK820245WG
厂家：	PANASONIC
描述：	Narrow pitch connectors (0.4mm pitch) Construction makes designing devices easier. 窄间距连接器（ 0.4mm间距）的建设，使设计的设备更容易。连接器集管和边缘连接器 PC
文件：	总12页 (文件大小：403K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

AXK7, 8

For board-to-board For board-to-FPC

Narrow pitch connectors

(0.4mm pitch)

P4 Series

FEATURES

1. 0.4 mm pitch and mated heights of

1.5 mm, 2.0 mm, 2.5 mm, 3.0 mm and

3.5 mm.

2) Guides are provided to take up any

position shift and facilitate insertion.

• Without soldering terminals

2. Strong resistance to adverse

environments! Utilizes

Insertion guide

“

” construction

for high contact reliability.

Socket

Header

3. Constructed with impact dispersion

keys inside the body to disperse

shocks when dropped.

RoHS compliant

Impact dispersion key

Socket

3) Simple lock structure provides tactile

feedback to ensure excellent mating/

unmating operation feel.

Header side

contact

Simple lock

Socket side

mechanism

contact

Header

A high level of shock resistance is

ensured by dispersing impact over the

four locations where the socket

indentations and header protrusions are

mated together.

5. Design facilitates efﬁcient

mounting.

Features a terminal flatness of 0.08 mm,

construction resistant to creeping flux,

and design that allows visual inspection

of the soldered part.

Note: The following number of pins are not supported

due to suction surface factors.

• Without soldering terminals:

18 pin contacts or less

4. Construction makes designing

devices easier.

6. Connectors for inspection available

1) The lower connector bottom surface

construction prevents contact and shorts

between the PCB and metal terminals.

This enables freedom in pattern wiring,

helping to make PCB’s smaller.

APPLICATIONS

Mobile devices, such as cellular

phones, digital still cameras and

digital video cameras.

Connector bottom: Create any thru-hole and pattern wiring.

ACCTB3E 201212-T

Panasonic Corporation Automation Controls Business Unit industrial.panasonic.com/ac/e/

AXK7, 8

ORDERING INFORMATION

AXK

7: Narrow Pitch Connector P4 (0.4 mm pitch) Socket

8: Narrow Pitch Connector P4 (0.4 mm pitch) Header

Number of pins (2 digits)

Mated height

1: For mated height 1.5 mm

2: For mated height 2.0 mm

3: For mated height 2.5 mm and 3.0 mm

4: For mated height 3.5 mm

1: For mated height 1.5 mm, 2.0 mm and 2.5 mm

2: For mated height 3.0 mm and 3.5 mm

Functions

4: Without soldering terminals, without positioning bosses

Surface treatment (Contact portion / Terminal portion)

7: Ni plating on base, Au plating on surface (for Ni barrier available)

5: Ni plating on base, Au plating on surface

Other specifications

W: V notch and post edge horseshoe bend type product

Packing

∗

G: 3,000 pieces embossed tape and plastic reel × 2

Notes: 1. Only a socket of mated height 3.5 mm: 2,000 pieces embossed tape and plastic reel × 2.

2. Please note that the models with a soldering terminals (8th digit of part number is “2”) and those without a soldering terminals (8th digit of part number is “4”)

are shaped differently and are not compatible.

ACCTB3E 201212-T

Panasonic Corporation Automation Controls Business Unit industrial.panasonic.com/ac/e/

AXK7, 8

PRODUCT TYPES

Without soldering terminals

Part number

Packing

Mated height

Number of pins

Socket

Header

Inner carton

Outer carton

100

AXK714147G

AXK720147G

AXK722147G

AXK724147G

AXK726147G

AXK730147G

AXK734147G

AXK740147G

AXK744147G

AXK750147G

AXK754147G

AXK760147G

AXK764147G

AXK770147G

AXK780147G

AXK700147G

AXK714247G

AXK720247G

AXK724247G

AXK726247G

AXK730247G

AXK740247G

AXK750247G

AXK760247G

AXK770247G

AXK780247G

AXK714347G

AXK720347G

AXK724347G

AXK730347G

AXK740347G

AXK750347G

AXK760347G

AXK770347G

AXK780347G

AXK720347G

AXK724347G

AXK730347G

AXK740347G

AXK750347G

AXK760347G

AXK780347G

AXK720447G

AXK730447G

AXK740447G

AXK814145WG

AXK820145WG

AXK822145WG

AXK824145WG

AXK826145WG

AXK830145WG

AXK834145WG

AXK840145WG

AXK844145WG

AXK850145WG

AXK854145WG

AXK860145WG

AXK864145WG

AXK870145WG

AXK880145WG

AXK800145WG

AXK814145WG

AXK820145WG

AXK824145WG

AXK826145WG

AXK830145WG

AXK840145WG

AXK850145WG

AXK860145WG

AXK870145WG

AXK880145WG

AXK814145WG

AXK820145WG

AXK824145WG

AXK830145WG

AXK840145WG

AXK850145WG

AXK860145WG

AXK870145WG

AXK880145WG

AXK820245WG

AXK824245WG

AXK830245WG

AXK840245WG

AXK850245WG

AXK860245WG

AXK880245WG

AXK820245WG

AXK830245WG

AXK840245WG

1.5 mm

2.0 mm

3,000 pieces

6,000 pieces

2.5 mm

3.0 mm

3.5 mm

Socket: 2,000 pieces

Header: 3,000 pieces

Socket: 4,000 pieces

Header: 6,000 pieces

Notes: 1. Regarding ordering units; During production: Please make orders in 1-reel units.

Samples for mounting confi mation: Available in units of 50 pieces. Please consult us. (See “Regarding sample orders to confi m proper mounting” on page 169.)

Samples: Small lot orders are possible.

2. The above part numbers are for connectors without positioning bosses, which are standard.When ordering connectors with positioning bosses, please contact our

sales offic .

3. Different number of pins are available on-demand production only. Please contact us for more details.

ACCTB3E 201212-T

Panasonic Corporation Automation Controls Business Unit industrial.panasonic.com/ac/e/

AXK7, 8

SPECIFICATIONS

1. Characteristics

Item

Specification

0.3A/pin contact (Max. 5 A at total pin contacts)

60V AC/DC

Conditions

Rated current

Rated voltage

Electrical

Breakdown voltage

150V AC for 1 min.

Detection current: 1mA

characteristics

Insulation resistance

Min. 1,000MΩ (initial)

Using 250V DC megger (applied for 1 min.)

Based on the contact resistance measurement method

specified y JIS C 5402.

Contact resistance

Max. 70mΩ

Composite insertion force

Max. 0.981N {100gf}/pin contacts × pin contacts (initial)

Min. 0.0588N {6gf}/pin contacts × pin contacts

(Mated height 1.5 mm without soldering terminals type)

Min. 0.118N {12gf}/pin contacts × pin contacts

All the other types except the above

Mechanical

characteristics

Composite removal force

(Mated height 1.5 mm without soldering terminals type)

Measuring the maximum force.

As the contact is axially pull out.

Post holding force

Min. 0.981N {100gf}/pin contacts

Ambient temperature

–55°C to +85°C

Max. peak temperature of 260°C (on the surface of the

PC board around the connector terminals)

No freezing at low temperatures

Infrared refl w soldering

Soldering iron

Soldering heat resistance

Storage temperature

300°C within 5 sec. 350°C within 3 sec.

–55°C to +85°C (product only)

–40°C to +50°C (emboss packing)

No freezing at low temperatures.

No dew condensation.

Conformed to MIL-STD-202F, method 107G

Order Temperature (°C) Time (minutes)

–55₋₃

Max. 5

5 cycles,

insulation resistance min. 100MΩ,

contact resistance max. 70mΩ

Thermal shock resistance

(header and socket mated)

85⁺³

Environmental

characteristics

Max. 5

–55₋₃

120 hours,

insulation resistance min. 100MΩ,

contact resistance max. 70mΩ

Humidity resistance

(header and socket mated)

Bath temperature 40 2°C,

humidity 90 to 95% R.H.

24 hours,

insulation resistance min. 100MΩ,

contact resistance max. 70mΩ

Saltwater spray resistance

(header and socket mated)

Bath temperature 35 2°C,

saltwater concentration 5 1%

Bath temperature 40 2°C,

gas concentration 3 1 ppm,

humidity 75 to 80% R.H.

H2S resistance

(header and socket mated)

48 hours,

contact resistance max. 70mΩ

Lifetime

characteristics

Repeated insertion and removal speed of max. 200

times/hours

Insertion and removal life

50 times

Mated height 1.5mm, 20 pin contacts;

Socket: 0.04g Header: 0.02g

Unit weight

2. Material and surface treatment

Part name

Material

Surface treatment

—

Molded portion

LCP resin (UL94V-0)

Contact portion: Ni plating on base, Au plating on surface

Terminal portion: Ni plating on base, Au plating on surface (Except for thick of terminal)

However, upper terminal of Ni barrier production: Exposed over Ni

Contact and Post

Copper alloy

The area adjacent to the terminal of the sockets on models with Ni barrier is exposed to Ni on base.

Soldering terminals portion

Copper alloy

Ni plating on base, Sn plating on surface (Except for front terminal)

ACCTB3E 201212-T

Panasonic Corporation Automation Controls Business Unit industrial.panasonic.com/ac/e/

AXK7, 8

The CAD data of the products with a CAD Data mark can be downloaded from: http://industrial.panasonic.com/ac/e/

DIMENSIONS (Unit: mm)

Without Soldering Terminals

Socket (Mated height: 1.5 mm, 2.0 mm, 2.5 mm, 3.0 mm and 3.5 mm)

CAD Data

B 0.1

Dimension table (mm)

Number of pins/

dimension

0.40 0.05

5.1

6.3

6.7

7.1

7.5

8.3

9.1

2.4

3.6

—

1.6

2.8

—

0.08

0.40 0.05

0.15 0.03

4.0

2.0

4.4

2.4

4.8

2.8

5.6

3.6

6.4

4.4

100

10.3

11.1

12.3

13.1

14.3

15.1

16.3

18.3

22.3

7.6

5.6

8.4

6.4

0.80

9.6

7.6

10.4

11.6

12.4

13.6

15.6

19.6

8.4

9.6

10.4

11.6

13.6

17.6

Max. 18 pin contacts

Mated height/dimension

1.5mm

1.50

1.92

2.42

2.92

2.0mm

2.5mm, 3.0mm

3.5mm

General tolerance: 0.2

Header (Mated height: 1.5 mm, 2.0 mm, 2.5 mm, 3.0 mm and 3.5 mm)

CAD Data

B 0.1

0.40 0.05

Dimension table (mm)

0.08

Number of pins/

dimension

0.40 0.05

100

3.9

2.4

3.6

—

1.6

3.04

—

0.15 0.03

5.1

5.5

4.0

2.0

5.9

4.4

2.4

6.3

4.8

2.8

7.1

5.6

3.6

0.76

7.9

6.4

4.4

0.10 0.03

9.1

7.6

5.6

9.9

8.4

6.4

11.1

11.9

13.1

13.9

15.1

17.1

21.1

9.6

7.6

10.4

11.6

12.4

13.6

15.6

19.6

8.4

9.6

10.4

11.6

13.6

17.6

Max. 18 pin contacts

Mated height/dimension

1.5mm, 2.0mm, 2.5mm

3.0mm, 3.5mm

1.31

2.26

1.20

1.26

General tolerance: 0.2

Socket and Header are mated

ACCTB3E 201212-T

Panasonic Corporation Automation Controls Business Unit industrial.panasonic.com/ac/e/

AXK7, 8

EMBOSSED TAPE DIMENSIONS (unit: mm, Common for respective contact type, socket and header)

• Tape dimensions (Conforming to JIS C 0806-1990.

However, some tapes have mounting hole pitches that do

not comply with the standard.)

• Plastic reel dimensions (Conforming to EIAJ ET-7200B)

Tape I

Tape II

A 0.3

Taping reel

A 0.3

D 1

1.75

Top cover tape

Embossed carrier tape

Embossed mounting-hole

8.0

1.5^+0.1dia.

Dimension table (mm)

Without soldering terminals

Number of pins

Mated height

Type of taping

Quantity per reel

Socket

Header

Max. 18

20 to 70

Max. 18

20 to 70

Tape I

Tape II

Tape I

16.0

24.0

32.0

24.0

—

7.5

11.5

14.2

11.5

17.4

25.4

33.4

25.4

3,000

2,000

Common for socket and header:

1.5 mm, 2.0 mm, 2.5 mm and 3.0 mm

Header: 3.5 mm

80 to 100 80 to 100

20 to 40

28.4

—

Socket: 3.5 mm

Connector orientation with respect to direction of progress of embossed tape

Without soldering terminals

Type

Common for P4

Header

Direction of

tape progress

Socket

Note: There is no indication on this product regarding top-bottom or left-right orientation.

ACCTB3E 201212-T

Panasonic Corporation Automation Controls Business Unit industrial.panasonic.com/ac/e/

AXK7, 8

For board-to-board For board-to-FPC

Connectors for

inspection usage

(0.4mm pitch)

P4 Series

FEATURES

APPLICATIONS

1. 3,000 mating and unmating cycles

2. Same external dimensions and foot

pattern as standard type.

Ideal for module unit inspection and

equipment assembly inspection

3. Improved mating

Socket

Header

Insertion and removal easy due to a

reduction in mating retention force. This

is made possible by a simple locking

structure design.

Note: Mating retention force cannot be

warranted.

RoHS compliant

TABLE OF PRODUCT TYPES

✩: Available for sale

Number of pins

Product name

100

P4 for inspection

without soldering terminals

✩

Notes: 1. You can use with each mated height in common.

2. Please inquire about number of pins other than those shown above.

3. Please inquire with us regarding availability.

4. Please keep the minimum order quantities no less than 50 pieces per lot.

5. Please inquire if further information is needed.

PRODUCT TYPES

Specification

Part No.

Specification

Part No.

Without soldering

terminals

Without soldering

terminals

Socket

Without positioning bosses

AXK7E∗∗46G

Header

Without positioning bosses

AXK8E∗∗46WG

Notes: 1. When placing an order, substitute the “∗” (asterisk) in the above part number with the number of pins for the specific connecto .

2. The above part numbers are for connectors without positioning bosses, which are standard.When ordering connectors with positioning bosses, please contact our

local sales offic .

ACCTB3E 201212-T

Panasonic Corporation Automation Controls Business Unit industrial.panasonic.com/ac/e/

AXK7, 8

NOTES

1. As shown below, excess force

during insertion may result in damage

to the connector or removal of the

solder. Also, to prevent connector

damage please conﬁrm the correct

position before mating connectors.

Without soldering terminals

Socket

Recommended PC board pattern (TOP VIEW)

Header

Recommended PC board pattern (TOP VIEW)

0.40 0.05

0.23 0.03

0.40 0.05

0.23 0.03

0.115 0.05

0.40 0.05

0.115 0.05

0.40 0.05

2. Keep the PC board warp no more

than 0.03 mm in relation to the overall

length of the connector.

Recommended metal mask pattern

Metal mask thickness: Here, 150 µm

(Opening area ratio: 40%)

(Opening area ratio: 32%)

0.40 0.01

0.35 0.01

0.40 0.01

0.20 0.01

0.10 0.01

0.35 0.01

0.10 0.01

0.20 0.01

Max. 0.03 mm

3. Recommended PC board and metal

mask patterns

Connectors are mounted with high pitch

density, intervals of 0.35 mm, 0.4 mm or

0.5 mm.

In order to reduce solder bridges and

other issues make sure the proper levels

of solder is used.

The figures to the right are recommended

metal mask patterns. Please use them as

a reference.

Recommended metal mask pattern

Metal mask thickness: Here, 120 µm

(Opening area ratio: 40%)

(Opening area ratio: 50%)

0.40 0.01

0.35 0.01

0.40 0.01

0.20 0.01

0.10 0.01

0.35 0.01

0.10 0.01

0.20 0.01

Please refer to the latest product

specifications when designing our

product.

ACCTB3E 201212-T

Panasonic Corporation Automation Controls Business Unit industrial.panasonic.com/ac/e/

Notes on Using Narrow-pitch Connectors (Common)

Regarding the design of devices and PC board patterns

1) When connecting several connectors

together by stacking, make sure to

maintain proper accuracy in the design of

structure and mounting equipment so

that the connectors are not subjected to

twisting and torsional forces.

2) With mounting equipment, there may

be up to a 0.2 to 0.3-mm error in

positioning. Be sure to design PC boards

and patterns while taking into

5) For all connectors of the narrow-pitch

series, to prevent the PC board from

coming off during vibrations or impacts,

and to prevent loads from falling directly

on the soldered portions, be sure to

design some means to ﬁx the PC board

in place.

backside of the FPC board to which the

connector is being connected. Please

make the reinforcement board

dimensions bigger than the outer limits of

the recommended PC board pattern

(should be approximately 1 mm greater

than the outer limit).

Material should be glass epoxy or

polyimide, and the thickness should be

between 0.2 and 0.3 mm.

Example) Secure in place with screws

Screw

consideration the performance and

abilities of the required equipment.

3) Some connectors have tabs embossed

on the body to aid in positioning. When

using these connectors, make sure that

the PC board is designed with positioning

holes to match these tabs.

4) To ensure the required mechanical

strength when soldering the connector

terminals, make sure the PC board

meets recommended PC board pattern

design dimensions given.

(2) Collisions, impacts, or turning of FPC

boards, may apply forces on the

connector and cause it to come loose.

Therefore, make to design retaining

plates or screws that will ﬁx the connector

in place.

7) The narrow-pitch connector series is

designed to be compact and thin.

Although ease of handling has been

taken into account, take care when

mating the connectors, as displacement

or angled mating could damage or

deform the connector.

Connector

Spacer

PC board

When connecting PC boards, take

appropriate measures to prevent the

connector from coming off.

6) Notes when using a FPC.

(1) When the connector is soldered to an

FPC board, during its insertion and

removal procedures, forces may be

applied to the terminals and cause the

soldering to come off. It is recommended

to use a reinforcement board on the

Regarding the selection of the connector placement machine and the mounting

procedures

1) Select the placement machine taking

into consideration the connector height,

required positioning accuracy, and

packaging conditions.

2) Be aware that if the catching force of

the placement machine is too great, it

may deform the shape of the connector

body or connector terminals.

3) Be aware that during mounting,

external forces may be applied to the

connector contact surfaces and terminals

and cause deformations.

4) Depending on the size of the

6) Excessive mounter chucking force may

deform the molded or metal part of the

connector. Consult us in advance if

chucking is to be applied.

connector being used, self alignment

may not be possible. In such cases, be

sure to carefully position the terminal with

the PC board pattern.

5) The positioning bosses give an

approximate alignment for positioning on

the PC board. For accurate positioning of

the connector when mounting it to the PC

board, we recommend using an

automatic positioning machine.

ACCTB48E 201204-T

Panasonic Corporation Automation Controls Business Unit industrial.panasonic.com/ac/e/

Notes on Using Narrow-pitch Connectors (Common)

Regarding soldering

1. Reﬂow soldering

Soldering conditions

2. Hand soldering

1) Measure the recommended proﬁle

temperature for reﬂow soldering by

placing a sensor on the PC board near

the connector surface or terminals. (The

setting for the sensor will differ depending

on the sensor used, so be sure to

carefully read the instructions that comes

with it.)

Please use the reﬂow temperature proﬁle

conditions recommended below for

reﬂow soldering. Please contact us

before using a temperature proﬁle other

than that described below (e.g. lead-free

solder).

1) Set the soldering iron so that the tip

temperature is less than that given in the

table below.

Product name

Soldering iron temperature

300°C within 5 sec.

350°C within 3 sec.

SMD type connectors

• Narrow-pitch connectors

(except P8 type)

2) Do not allow ﬂux to spread onto the

connector leads or PC board. This may

lead to ﬂux rising up to the connector

inside.

3) Touch the soldering iron to the foot

pattern. After the foot pattern and

connector terminal are heated, apply the

solder wire so it melts at the end of the

connector terminals.

2) As for cream solder printing, screen

printing is recommended.

Upper limited (Solder heat resistance)

Lower limited (Solder wettability)

Temperature

3) To determine the relationship between

the screen opening area and the PC-

board foot pattern area, refer to the

diagrams in the recommended patterns

for PC boards and metal masks. Make

sure to use the terminal tip as a reference

position when setting. Avoid an excessive

amount of solder from being applied,

otherwise, interference by the solder will

cause an imperfect contact.

Peak temperature

Peak temperature 260°C

230°C

220°C

200°C

Preheating

60 to 120 sec.

180°C

150°C

25 sec.

70 sec.

Time

• Narrow-pitch connector (P8)

Apply the solder

wire here

Temperature

Peak temperature

245°C max.

200°C

Terminal

Small angle as

Preheating

155 to 165°C

possible up to

45 degrees

Terminal

Paste

60 to 120 sec.

Within 30 sec.

Time

solder

PC board

foot pattern

Pattern

For products other than the ones above,

please refer to the latest product

speciﬁcations.

7) The temperatures are measured at the

surface of the PC board near the

connector terminals. (The setting for the

sensor will differ depending on the sensor

used, so be sure to carefully read the

instructions that comes with it.)

8) The temperature proﬁles given in this

catalog are values measured when using

the connector on a resin-based PC

board. When performed reﬂow soldering

on a metal board (iron, aluminum, etc.) or

a metal table to mount on a FPC, make

sure there is no deformation or

discoloration of the connector beforehand

and then begin mounting.

9) Consult us when using a screen-

printing thickness other than that

recommended.

10) Some solder and ﬂux types may

cause serious solder creeping. Solder

and ﬂux characteristics should be taken

into consideration when setting the reﬂow

soldering conditions.

4) Consult us when using a screen-

printing thickness other than that

recommended.

5) When mounting on both sides of the

PC board and the connector is mounting

on the underside, use adhesives or other

means to ensure the connector is

properly ﬁxed to the PC board. (Double

reﬂow soldering on the same side is

possible.)

6) N²reﬂow, conducting reﬂow soldering

in a nitrogen atmosphere, increases the

solder ﬂow too greatly, enabling wicking

to occur. Make sure that the solder feed

rate and temperature proﬁle are

appropriate.

4) Be aware that soldering while applying

a load on the connector terminals may

cause improper operation of the

connector.

5) Thoroughly clean the soldering iron.

6) Flux from the solder wire may get on

the contact surfaces during soldering

operations. After soldering, carefully

check the contact surfaces and clean off

any solder before use.

7) For soldering of prototype devices

during product development, you can

perform soldering at the necessary

locations by heating with a hot-air gun by

applying cream solder to the foot pattern

beforehand. However, at this time, make

sure that the air pressure does not move

connectors by carefully holding them

down with tweezers or other similar tool.

Also, be careful not to go too close to the

connectors and melt any of the molded

components.

8) If an excessive amount of solder is

applied during manual soldering, the

solder may creep up near the contact

points, or solder interference may cause

imperfect contact.

3. Solder reworking

1) Finish reworking in one operation.

2) For reworking of the solder bridge, use

a soldering iron with a ﬂat tip. To prevent

ﬂux from climbing up to the contact

surfaces, do not add more ﬂux.

3) Keep the soldering iron tip temperature

below the temperature given in Table A.

ACCTB48E 201204-T

Panasonic Corporation Automation Controls Business Unit industrial.panasonic.com/ac/e/

Notes on Using Narrow-pitch Connectors (Common)

Handling Single Components

1) Make sure not to drop or allow parts to

fall from work bench

4) Do not insert or remove the connector

when it is not soldered. Forcibly applied

external pressure on the terminals can

weaken the adherence of the terminals to

the molded part or cause the terminals to

lose their evenness.

Excessive force applied for insertion in a

pivot action as shown may also cause

product breakage.

Align the header and socket positions

before connecting them.

2) Excessive force applied to the

terminals could cause warping, come

out, or weaken the adhesive strength of

the solder. Handle with care.

3) Repeated bending of the terminals

may cause terminals to break.

5) Excessive prying-force applied to one

end may cause product breakage and

separation of the solder joints at the

terminal.

3) Since some powerful cleaning

solutions may dissolve molded

components of the connector and wipe

off or discolor printed letters, we

recommend aqua pura electronic parts

cleaners. Please consult us if you wish to

use other types of cleaning ﬂuids.

4) Please note that the surfaces of

molded parts may whiten when cleaned

with alcohol.

Cleaning ﬂux from PC board

Handling the PC board

1) To increase the cleanliness of the

cleaning ﬂuid and cleaning operations,

prepare equipment for cleaning process

beginning with boil cleaning, ultrasonic

cleaning, and then vapor cleaning.

2) Carefully oversee the cleanliness of

the cleaning ﬂuids to make sure that the

contact surfaces do not become dirty

from the cleaning ﬂuid itself.

• Handling the PC board after

mounting the connector

When cutting or bending the PC board

after mounting the connector, be careful

that the soldered sections are subjected

to excessive force.

The soldered areas should not be subjected to force.

Storage of connectors

1) To prevent problems from voids or air

pockets due to heat of reﬂow soldering,

avoid storing the connectors in areas of

high humidity. When storing the

Some connectors may change color

slightly if subjected to ultraviolet rays

during storage.This is normal and will not

affect the operation of the connector.

3) When storing the connectors with the

PC boards assembled and components

alreeady set, be careful not to stack them

up so the connectors are subjected to

excessive forces.

4) Avoid storing the connectors in

locations with excessive dust. The dust

may accumulate and cause improper

connections at the contact surfaces.

connectors for more than six months, be

sure to consider storage area where the

humidity is properly controlled.

2) Depending on the connector type, the

color of the connector may vary from

connector to connector depending on

when it is produced.

Other Notes

1) These products are made for the

design of compact and lightweight

devices and therefore the thickness of the

molded components has been made very

thin. Therefore, be careful during

insertion and removal operations for

excessive forces applied may damage

the products.

3) Before soldering, try not to insert or

remove the connector more than

absolutely necessary.

4) When coating the PC board after

soldering the connector to prevent the

deterioration of insulation, perform the

coating in such a way so that the coating

does not get on the connector.

6) The connectors are not meant to be

used for switching.

7) Be sure not to allow external pressure

to act on connectors when assembling

PCBs or moving in block assemblies.

2) Dropping of the products or rough

mishandling may bend or damage the

terminals and possibly hinder proper

reﬂow soldering.

5) There may be variations in the colors

of products from different production lots.

This is normal.

ACCTB48E 201204-T

Panasonic Corporation Automation Controls Business Unit industrial.panasonic.com/ac/e/

Notes on Using Narrow-pitch Connectors (Common)

Regarding sample orders to conﬁrm proper mounting

When ordering samples to conﬁrm

proper mounting with the placement

machine, connectors are delivered in 50-

piece units in the condition given right.

Consult a sale representative for ordering

sample units.

Please refer to the latest product

speciﬁcations when designing your

product.

Condition when delivered from manufacturing

Reel

(Delivery can also be made on a reel by

customer request.)

Required number

Embossed tape

of products for

amount required for

sample production

the mounting

(Unit 50 pcs.)

ACCTB48E 201204-T

Panasonic Corporation Automation Controls Business Unit industrial.panasonic.com/ac/e/

AXK820245WG [PANASONIC]

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