AXN730535P [PANASONIC]

Board Stacking Connector, 30 Contact(s), 2 Row(s), Female, Straight, 0.039 inch Pitch, Surface Mount Terminal, Locking Mech, Socket;


型号：	AXN730535P
厂家：	PANASONIC
描述：	Board Stacking Connector, 30 Contact(s), 2 Row(s), Female, Straight, 0.039 inch Pitch, Surface Mount Terminal, Locking Mech, Socket
文件：	总3页 (文件大小：78K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

AXN(7/8)

NARROW PITCH

NARROW-PITCH

CONNECTORS

FOR PC BOARDS

(1.0mm) CONNECTORS

— P10 SERIES —

2. Our unique contact construction

assures high resistance to vibration

and impact.

FEATURES

1. Ultra-low 2mm profile.

3. Simple locking mechanism offers

high contact reliability.

Socket and

header are

mated

Socket

Header

APPLICATIONS

Small portable equipment, personal com-

puters, pager, video equipment, radio

communication equipment, cellular tele-

phone, PHS, etc.

SPECIFICATIONS

1. Characteristics

Item

Specifications

0.5A

Conditions

Rated current

Rated voltage

Breakdown voltage

Insulation resistance

AC, DC 60V

250V AC for 1 minute

Min. 1000M⍀

Electrical

characteristics

Detection current: 1mA

Using 500V DC megger

Measured with YHP4328A

Contact resistance

Max. 50m⍀

Composite insertion force

Composite removal force

Max. 44.1N {4.50kgf} (20 contacts)

Min. 6.67N {0.68kgf} (20 contacts)

Min. 1.96N {200gf}/Min. 1 contact (Socket)

Min. 5.88N {600gf}/Min. 2 contacts (Header)

–55°C to +85°C

Mechanical

characteristics

Measures the maximum load in the post axial

direction until removal

Holding force for contact

Ambient temperature

No freezing at low temperatures

Infrared reflow soldering

Soldering iron

Max. peak temperature of 245°C

300°C within 5 seconds

Soldering heat resistance

Sequence Temperature (°C) Time (minutes)

–55

Max. 5

−3

Thermal shock resistance

(header and socket mated)

5 cycles, insulation resistance min. 100M⍀,

contact resistance max. 50m⍀

+10

−5

−0

+10

−5

Max. 5

Environmental

characteristics

Humidity resistance

120 hours, insulation resistance min. 100M⍀,

contact resistance max. 50m⍀

24 hours, insulation resistance min. 100M⍀,

contact resistance max. 50m⍀

Bath temperature 40±2°C,

humidity 90 to 95% R.H.

Bath temperature 35±2°C,

saltwarter concentration 5±1%

Bath temperature 40±2°C,

gas concentration 3±1 ppm,

humidity 75 to 80% R.H.

Bath temperature 40±2°C,

gas concentration 10±3 ppm,

humidity 90 to 95% R.H.

(header and socket mated)

Saltwater spray resistance

(header and socket mated)

H₂S resistance

(header and socket mated)

48 hours, contact resistance max. 50m⍀

SO₂resistance

(header and socket mated)

48 hours, contact resistance max. 50m⍀

Lifetime

characteristics

Repeated insertion and removal speed of

max. 200 times/hours

Insertion and removal life

20 times

2. Material and surface treatment

Part name

Material

Surface treatment

—

Molded portion

Heat-resistant resin (UL94V-0)

Contact portion: Au plating over Ni

Terminal portion: Au plating over Ni

Contact, Post

Copper alloy

AXN(7/8)

PRODUCT TYPES

Packing quantity

Stacking height

No. of contacts

Socket

Part No.

Reel

Outer carton

AXN710535P

AXN810535P

AXN716535P

AXN816535P

AXN720535P

AXN820535P

AXN730535P

AXN830535P

AXN710535P

AXN810735P

AXN716535P

AXN816735P

AXN720535P

AXN820735P

AXN730535P

AXN830735P

Header

Socket

Header

Socket

Header

Socket

Header

Socket

Header

Socket

Header

Socket

Header

Socket

Header

2mm

1,000 pcs.

2,000 pcs.

2.5mm

Note) 16-contact type is available for on-demand production. When ordering this type, replace the 2nd and 3rd column of ordering number with “1”

and “6” respectively.

(Ex) Stacking height 2mm, 16-contact AXN716535P

mm General tolerance ±0.3

DIMENSIONS (Unit: mm)

• Socket body

Recommended PC board pattern

(mounting pad layout)

Dimension table (mm)

No. of

contacts

4.00

7.00

6.58

9.58

5.68

8.68

9.00

14.00

11.58

16.58

10.68

15.68

• Header

Recommended PC board pattern

(mounting pad layout)

Dimension table (mm)

No. of

contacts

4.00

7.00

9.00

7.70

10.70

12.70

17.70

6.88

9.88

11.88

16.88

14.00

• Socket and header are mated

Dimension table (mm)

No. of

contacts

Stacking

height

2mm

2.5mm

7.70

10.70

12.70

17.70

2.0

2.5

AXN(7/8)

EMBOSS TAPE AND REEL (Common for respective contact type and socket·header)

• Tape dimensions (Conforming to JIS C 0806-1990.

However, some tapes have mounting hole pitches that do

not comply with the standard.)

• Reel dimensions (Conforming to JIS C 0806-1990)

Connector orientation with respect to direction of progress of embossed tape

Type

Direction

of tape progress

Common for respective contact type

Header

Socket

NOTES

1. Reflow soldering

4. When mating the connector before

9. Insertion the wrong way round

(1) As for cream solder printing, screen

printing is recommended.

soldering, take care not to deform its ter-

minals or fittings. Do not apply excessive

stress to terminals as this may cause

loose terminals.

5. These models are made very thin so

that they may be smaller in size and

lighter in weight than before. Take care

not to give them excessive force when

mating them together or unmating them;

otherwise, breakage may result.

The socket and header are designed to

prevent the header from being inserted

the wrong way round. If excessive force

is applied in an attempt to do so, the

molded plastic parts may break. Be sure

to fit the header and socket together so

that the projections on the header line up

with the indentations in the socket.

(2) Recommended screen thickness for

respective stacking height type during

cream soldering is 0.15 to 0.2mm.

Please consult us when using a

screen other than recommended

thickness.

(3) Recommended conditions for the

reflow temperature profile are shown

in the figure below.

6. PC board warpage

PC board warpage should be controlled

to 0.03mm max. with respect to overall

length of connector (see figures below).

2. Preventing vibration and shock

To prevent the PC board from drop-off

faults and to protect soldered spots from

direct stress, use vibration-proof pads

across gap.

3. Since excessive force on the terminals

will cause deformation and the integrity

of the soldering will be lost during reflow

soldering, avoid dropping or rough han-

dling of the product.

7. During manual soldering, do not apply

flux to the connector leads or PC board

as connector contacts may be contami-

nated with flux.

8. The color of the connector mold resin

may differ slightly from one lot to anoth-

er, but this has no affect on connector

performance.

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