AXT456324 [PANASONIC]
Card Edge Connector, 56 Contact(s), 2 Row(s), Male, Straight, Surface Mount Terminal, ROHS COMPLIANT;
| 型号： | AXT456324 |
| 厂家： | 
PANASONIC |
| 描述： | Card Edge Connector, 56 Contact(s), 2 Row(s), Male, Straight, Surface Mount Terminal, ROHS COMPLIANT PC 连接器 |
| 文件： | 总13页 (文件大小：490K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
For board-to-board For board-to-FPC
Narrow pitch connectors
(0.4mm pitch)
P4S
FEATURES
1. Space-saving (3.6 mm width)
Smaller compared to P4 with soldering
terminals (30 pins):
3. Greater flexibility in connector
placement.
Pattern wiring to the connector bottom is
made possible with a molded covering on
the undersurface of the connector.
Socket — 38% smaller,
Header — 34% smaller
Soldering terminals
<Socket>
<Header>
at each corner
Socket
Socket
Header
8.70 (30 pins)
3.60
Soldering
Insulation terminals
RoHS compliant
Insulation
area
area
Connector bottom:
at each
corner
Soldering
terminals
at each
Soldering terminals
at each corner
Create any thru-hole
and pattern wiring.
Header
corner
4. Connectors for inspection available
5. Shield socket is also available.
7.90 (30 pins)
2.35
APPLICATIONS
2. Strong resistance to adverse
environments! Utilizes
• Mobile devices, such as tablet PC,
note PC, digital still cameras (DSC)
and digital video cameras (DVC).
• Board-to-board connection in
measuring devices and industrial
equipment, etc.
“
” construction
for high contact reliability.
• Consumer equipment such as
handheld terminals
ORDERING INFORMATION
AXT
2
4
3: Narrow Pitch Connector P4S (0.4 mm pitch) Socket
4: Narrow Pitch Connector P4S (0.4 mm pitch) Header
Number of pins (2 digits)
Mated height
<Socket>
1: For mated height 1.5 mm and 2.0 mm
2: For mated height 2.5 mm and 3.0 mm
<Header>
1: For mated height 1.5 mm and 2.5 mm
2: For mated height 2.0 mm
3: For mated height 3.0 mm
Functions
<Socket/Header>
2: Without positioning bosses
Surface treatment (Contact portion / Terminal portion)
<Socket> 4: Ni plating on base, Au plating on surface (for Ni barrier available)
<Header> 4: Ni plating on base, Au plating on surface
ACCTB14E 201602-T
–1–
Narrow pitch connectors P4S (0.4mm pitch)
PRODUCT TYPES
Part number
Packing
Mated height
Number of pins
Socket
Header
Inner carton
Outer carton
10
16
20
22
24
26
30
32
34
36
38
40
44
46
50
54
60
64
70
80
90
100
30
40
90
100
20
30
40
60
80
100
20
30
60
80
100
AXT310124
AXT316124
AXT320124
AXT322124
AXT324124
AXT326124
AXT330124
AXT332124
AXT334124
AXT336124
AXT338124
AXT340124
AXT344124
AXT346124
AXT350124
AXT354124
AXT360124
AXT364124
AXT370124
AXT380124
AXT390124
AXT300124
AXT330124
AXT340124
AXT390124
AXT300124
AXT320224
AXT330224
AXT340224
AXT360224
AXT380224
AXT300224
AXT320224
AXT330224
AXT360224
AXT380224
AXT300224
AXT410124
AXT416124
AXT420124
AXT422124
AXT424124
AXT426124
AXT430124
AXT432124
AXT434124
AXT436124
AXT438124
AXT440124
AXT444124
AXT446124
AXT450124
AXT454124
AXT460124
AXT464124
AXT470124
AXT480124
AXT490124
AXT400124
AXT430224
AXT440224
AXT490224
AXT400224
AXT420124
AXT430124
AXT440124
AXT460124
AXT480124
AXT400124
AXT420324
AXT430324
AXT460324
AXT480324
AXT400324
1.5mm
3,000 pieces
6,000 pieces
2.0mm
2.5mm
3.0mm
Notes: 1. Regarding ordering units; During production: Please make orders in 1-reel units.
For samples, please contact our sales office.
2. The shield compatible products are also available for 14, 38, 50 and 74 pins with mated height of 1.5 mm.
ACCTB14E 201602-T
–2–
Narrow pitch connectors P4S (0.4mm pitch)
SPECIFICATIONS
1. Characteristics
Item
Specifications
0.3A/pin contact (Max. 5 A at total pin contacts)
60V AC/DC
Conditions
Rated current
Rated voltage
—
—
Rated voltage is applied for one minute and check for
short circuit or damage with a detection current of 1mA.
Dielectric strength
Electrical
150V AC for 1 min.
Min. 1,000MΩ (initial)
Max. 90mΩ
characteristics
Using 250V DC megger
(applied for 1 min.)
Insulation resistance
Based on the contact resistance measurement method
specified by JIS C 5402.
Contact resistance
Composite insertion force
Max. 0.981N/pin contact × pin contacts (initial)
Min. 0.0588N/pin contact × pin contacts
Mechanical
Composite removal force
characteristics
Contact holding force
(Socket contact)
Measuring the maximum force.
As the contact is axially pull out.
Min. 0.981N/pin contact
Ambient temperature
–55°C to +85°C
No icing or condensation.
Max. peak temperature of 260°C (on the surface of the
PC board around the connector terminals)
Infrared reflow soldering
Soldering heat resistance
300°C within 5 sec. or 350°C within 3 sec.
Soldering iron
–55°C to +85°C (product only)
–40°C to +50°C (emboss packing)
Storage temperature
No icing or condensation.
Conformed to MIL-STD-202F, method 107G
Order Temperature (°C) Time (minutes)
0
1
2
3
4
–55−3
30
Max. 5
30
5 cycles,
insulation resistance min. 100MΩ,
contact resistance max. 90mΩ
Thermal shock resistance
(header and socket mated)
85+3
Environmental
characteristics
0
Max. 5
0
–55−3
120 hours,
insulation resistance min. 100MΩ,
contact resistance max. 90mΩ
Conformed to IEC60068-2-78
Temperature 40°C 2°C,
humidity 90% to 95% R.H.
Humidity resistance
(header and socket mated)
24 hours,
insulation resistance min. 100MΩ,
contact resistance max. 90mΩ
Conformed to IEC60068-2-11
Temperature 35°C 2°C,
saltwater concentration 5% 1%
Saltwater spray resistance
(header and socket mated)
Temperature 40°C 2°C,
gas concentration 3 ppm 1 ppm,
humidity 75% to 80% R.H.
H2S resistance
(header and socket mated)
48 hours,
contact resistance max. 90mΩ
Lifetime
characteristics
Repeated insertion and removal speed of
max. 200 times/hours
Insertion and removal life
50 times
Mated height 1.5mm,
20 pin contacts Socket: 0.04 g Header: 0.02 g
Unit weight
2. Material and surface treatment
Part name
Material
Surface treatment
Molded portion
LCP resin (UL94V-0)
—
Contact portion: Ni plating on base, Au plating on surface
Terminal portion: Ni plating on base, Au plating on surface (Except for front edge of terminal)
However, the area adjacent to the socket terminal is exposed to Ni on base.
Soldering terminals portion;
Socket: Ni plating on base, Pd + Au flash plating on surface
(Expect for front edge of terminal)
Contact and Post
Copper alloy
Header: Ni plating on base, Au plating on surface
(Expect for front edge of terminal)
ACCTB14E 201602-T
–3–
Narrow pitch connectors P4S (0.4mm pitch)
The CAD data of the products with a CAD Data mark can be downloaded from: http://industrial.panasonic.com/ac/e/
DIMENSIONS (Unit: mm)
1. Socket (Mated height: 1.5mm, 2.0mm, 2.5mm, 3.0mm)
CAD Data
Dimension table (mm)
Number of pins/
dimension
A
B
C
10
16
20
22
24
26
30
32
34
36
38
40
44
46
50
54
60
64
70
80
90
100
4.70
5.90
1.60
2.80
3.50
4.70
A
Terminal coplanarity
0.08
(Contact and
soldering terminals)
E
B 0.1
6.70
3.60
5.50
0.40 0.05
0.15 0.03
7.10
4.00
5.90
7.50
4.40
6.30
7.90
4.80
6.70
8.70
5.60
7.50
9.10
6.00
7.90
9.50
6.40
8.30
9.90
6.80
8.70
10.30
10.70
11.50
11.90
12.70
13.50
14.70
15.50
16.70
18.70
20.70
22.70
7.20
9.10
7.60
9.50
8.40
10.30
10.70
11.50
12.30
13.50
14.30
15.50
17.50
19.50
21.50
8.80
9.60
10.40
11.60
12.40
13.60
15.60
17.60
19.60
(0.66)
Y (Note)
Z (Note)
Mated height/
dimension
E
1.5mm
2.0mm
2.5mm
3.0mm
1.45
1.45
2.45
2.45
0.30 0.03
C 0.1
General tolerance: 0.2
Note: Since soldering terminals are built into the body, the Y and Z parts are connected electrically.
2. Header (Mated height: 1.5mm, 2.5mm)
CAD Data
Dimension table (mm)
A
Terminal coplanarity
0.08
(Post and
soldering terminals)
Number of pins/
dimension
1.24
A
B
C
B 0.1
0.40 0.05
0.15 0.03
10
16
20
22
24
26
30
32
34
36
38
40
44
46
50
54
60
64
70
80
90
100
3.90
5.10
1.60
2.80
3.20
4.40
5.90
3.60
5.20
6.30
4.00
5.60
6.70
4.40
6.00
7.10
4.80
6.40
7.90
5.60
7.20
8.30
6.00
7.60
8.70
6.40
8.00
9.10
6.80
8.40
9.50
7.20
8.80
9.90
7.60
9.20
10.70
11.10
11.90
12.70
13.90
14.70
15.90
17.90
19.90
21.90
8.40
10.00
10.40
11.20
12.00
13.20
14.00
15.20
17.20
19.20
21.20
8.80
Soldering terminals
9.60
10.40
11.60
12.40
13.60
15.60
17.60
19.60
0.15 0.03
C 0.1
General tolerance: 0.2
Note: The soldering terminal dimensions of headers with mated heights of 1.5mm/2.5mm and 2.0mm/3.0mm are different.
ACCTB14E 201602-T
–4–
Narrow pitch connectors P4S (0.4mm pitch)
The CAD data of the products with a CAD Data mark can be downloaded from: http://industrial.panasonic.com/ac/e/
DIMENSIONS (Unit: mm)
3. Header (Mated height: 2.0mm)
CAD Data
A
Terminal coplanarity
0.08
(Post and
soldering terminals)
B 0.1
0.40 0.05
1.74
0.15 0.03
Soldering terminals
Dimension table (mm)
Number of pins/
A
B
C
dimension
30
40
7.90
9.90
5.60
7.60
7.20
9.20
0.15 0.03
C 0.1
90
19.90
21.90
17.60
19.60
19.20
21.20
100
General tolerance: 0.2
Note: The soldering terminals dimensions of headers with mated heights of 1.5mm/2.5mm and 2.0mm/3.0mm are different.
4. Header (Mated height: 3.0mm)
CAD Data
A
Terminal coplanarity
2.24
0.08
B 0.1
(Post and
soldering terminals)
0.40 0.05
0.15 0.03
Soldering terminals
Dimension table (mm)
Number of pins/
dimension
A
B
C
20
30
5.90
7.90
3.60
5.60
5.20
7.20
0.15 0.03
60
13.90
17.90
21.90
11.60
15.60
19.60
13.20
17.20
21.20
C 0.1
80
100
General tolerance: 0.2
Note: The soldering terminals dimensions of headers with mated heights of 1.5mm/2.5mm and 2.0mm/3.0mm are different.
ACCTB14E 201602-T
–5–
Narrow pitch connectors P4S (0.4mm pitch)
Socket and Header are mated
Header
Socket
Header
Socket
Header
Header
Socket
Socket
EMBOSSED TAPE DIMENSIONS (unit: mm)
• Tape dimensions (Conforming to JIS C 0806:1990.
However, some tapes have mounting hole pitches that do
not comply with the standard.)
• Plastic reel dimensions (Conforming to EIAJ ET-7200B)
Tape I
Tape II
A 0.3
A 0.3
Taping reel
D 1
Label
B
C
1.75
1.75
Top cover tape
C
Embossed carrier tape
Embossed mounting-hole
1.5+0.1 dia.
1.5+0.1 dia.
0
0
Dimension table (mm)
Number of pins
Socket/Header
Max. 24
Mated height
Type of taping
A
B
C
D
Quantity per reel
Tape I
Tape I
Tape II
16.0
24.0
32.0
—
—
7.5
11.5
14.2
17.4
25.4
33.4
3,000
3,000
3,000
Common for socket and header:
1.5mm, 2.0mm, 2.5mm and
3.0mm
26 to 70
72 to 100
28.4
Connector orientation with respect to direction of progress of embossed tape
Type
Common for P4S
Direction of
tape progress
Socket
Header
Note: There is no indication on this product regarding top-bottom or left-right orientation.
ACCTB14E 201602-T
–6–
For board-to-board For board-to-FPC
Connectors for
inspection usage
(0.4mm pitch)
P4S
FEATURES
APPLICATIONS
1. 3,000 mating and unmating cycles
2. Same external dimensions and foot
pattern as standard type.
Ideal for module unit inspection and
equipment assembly inspection
Note: Mating retention force cannot be
warranted. Please avoid using for
applications other than inspection.
3. Improved mating
Insertion and removal easy due to a
reduction in mating retention force. This
is made possible by a simple locking
structure design.
Socket
Header
RoHS compliant
TABLE OF PRODUCT TYPES
✩: Available for sale
Product name
Number of pins
10
16
20
22
24
26
30
32
34
36
38
40
44
50
54
60
70
80
90
100
P4S
for inspection
✩
✩
✩
✩
✩
✩
✩
✩
✩
✩
✩
✩
✩
✩
✩
✩
✩
✩
✩
✩
Notes: 1. You can use with each mated height in common.
2. The pickup surface shape of the inspection sockets is different from that of the standard sockets. (For details, refer to the product specification diagram.)
3. Please inquire about number of pins other than those shown above.
4. Please inquire with us regarding availability.
5. Please keep the minimum order quantities no less than 50 pieces per lot.
6. Please inquire if further information is needed.
PRODUCT TYPES
Specifications
Socket
Part No.
Specifications
Header
Part No.
AXT3E∗∗26
AXT4E∗∗26
Notes: 1. When placing an order, substitute the “∗” (asterisk) in the above part number with the number of pins for the specific connector.
2. The above part numbers are for connectors without positioning bosses, which are standard.When ordering connectors with positioning bosses, please contact our
sales office.
ACCTB14E 201602-T
–7–
Narrow pitch connectors P4S (0.4mm pitch)
NOTES
1. As shown below, excess force during insertion may
result in damage to the connector or removal of the solder.
Also, to prevent connector damage please confirm the
correct position before mating connectors.
• Socket (Mated height: 1.5mm, 2.0mm, 2.5mm and 3.0mm)
Recommended PC board pattern (TOP VIEW)
0.95 0.03
0.70 0.03
2. Keep the PC board warp no more than 0.03mm in relation
to the overall length of the connector.
0.23 0.03
0.40 0.03
Recommended metal mask pattern
Metal mask thickness: When 150 μm
(Terminal portion opening area ratio: 48%)
(Metal portion opening area ratio: 100%)
Max. 0.03 mm
Max. 0.03 mm
0.95 0.01
0.70 0.01
3. Recommended PC board and metal mask patterns
Connectors are mounted with high pitch density, intervals of 0.35
mm, 0.4 mm or 0.5 mm.
In order to reduce solder and flux rise, solder bridges and other
issues make sure the proper levels of solder is used.
The figures to the right are recommended metal mask patterns.
Please use them as a reference.
0.20 0.01
0.40 0.01
Recommended metal mask pattern
Metal mask thickness: When 120 μm
(Terminal portion opening area ratio: 60%)
(Metal portion opening area ratio: 100%)
0.95 0.01
0.70 0.01
0.20 0.01
0.40 0.01
ACCTB14E 201602-T
–8–
Narrow pitch connectors P4S (0.4mm pitch)
• Header (Mated height: 1.5mm and 2.5mm)
• Header (Mated height: 2.0mm, 3.0mm)
Recommended PC board pattern (TOP VIEW)
Recommended PC board pattern (TOP VIEW)
0.80 0.03
0.45 0.03
0.80 0.03
0.45 0.03
0.23 0.03
0.23 0.03
: Insulation area
: Insulation area
0.40 0.03
0.40 0.03
Recommended metal mask pattern
Recommended metal mask pattern
Metal mask thickness: When 150 μm
(Terminal portion opening area ratio: 49%)
(Metal portion opening area ratio: 100%)
Metal mask thickness: When 150 μm
(Terminal portion opening area ratio: 49%)
(Metal portion opening area ratio: 100%)
0.80 0.01
0.45 0.01
0.80 0.01
0.45 0.01
0.20 0.01
0.40 0.01
0.20 0.01
0.40 0.01
Recommended metal mask pattern
Recommended metal mask pattern
Metal mask thickness: When 120 μm
(Terminal portion opening area ratio: 60%)
(Metal portion opening area ratio: 100%)
Metal mask thickness: When 120 μm
(Terminal portion opening area ratio: 60%)
(Metal portion opening area ratio: 100%)
0.80 0.01
0.45 0.01
0.80 0.01
0.45 0.01
0.20 0.01
0.40 0.01
0.20 0.01
0.40 0.01
Note: The recommended PC board pattern
diagrams and metal mask pattern diagrams
for headers with mated heights of 1.5 mm/
2.5 mm and 2.0 mm/3.0 mm are different.
Please refer to the latest product
specifications when designing your
product.
ACCTB14E 201602-T
–9–
For board-to-board/board-to-FPC
Notes on Using Narrow pitch Connectors/
High Current Connectors
About safety Remarks
1) Do not use these connectors beyond
the specification sheets. The usage
outside of specified rated current,
dielectric strength, and environmental
conditions and so on may cause circuitry
damage via abnormal heating, smoke,
and fire.
2) In order to avoid accidents, your
thorough specification review is
appreciated.
Corporation cannot guarantee the quality
and reliability.
Continued usage in a state of degraded
condition may cause the deteriorated
insulation, thus result in abnormal heat,
smoke or firing. Please carry out safety
design and periodic maintenance
including redundancy design, design for
fire spread prevention, and design for
malfunction prevention so that no
accidents resulting in injury or death, fire
accidents, or social damage will be
caused as a result of failure of the
products or ending life of the products.
3) Panasonic Corporation is consistently
striving to improve quality and reliability.
However, the fact remains that electrical
components and devices generally cause
failures at a given statistical probability.
Furthermore, their durability varies with
use environments or use conditions. In
this respect, please check for actual
electrical components and devices under
actual conditions before use.
Please contact us if your usage is out of
the specifications. Otherwise, Panasonic
Regarding the design of devices and PC board patterns
1) When using the board to board
connectors, do not connect a pair of
board with multiple connectors.
Otherwise, misaligned connector
positions may cause mating failure or
product breakage.
Therefore, minimize the thickness of the
coverlay, etc. so as to prevent the
occurrence of poor soldering.
6) For all connectors of the narrow pitch
series, to prevent the PC board from
coming off during vibrations or impacts,
and to prevent loads from falling directly
on the soldered portions, be sure to
design some means to fix the PC board
in place.
the condition when the reinforcing plate is
attached to the backside of FPC where
the connector is mounted. The external
dimension of the reinforcing plate is
recommended to be larger than the
dimension of “PC board recommended
process pattern” (extended dimension of
one side is approximately 0.5 to 1.0 mm).
The materials and thickness of the
reinforcing plate are glass epoxy or
polyimide (thickness 0.2 - 0.3 mm) or
SUS (thickness 0.1 - 0.2 mm).
• As this connector has temporary locking
structure, the connector mating may be
separated by the dropping impact
depend on the size, weight or bending
force of the FPC. Please consider the
measures at usage to prevent the mating
separation.
2) With mounting equipment, there may
be up to a 0.2 to 0.3-mm error in
positioning. Be sure to design PC boards
and patterns while taking into
consideration the performance and
abilities of the required equipment.
3) Some connectors have tabs embossed
on the body to aid in positioning. When
using these connectors, make sure that
the PC board is designed with positioning
holes to match these tabs.
4) To ensure the required mechanical
strength when soldering the connector
terminals, make sure the PC board
meets recommended PC board pattern
design dimensions given.
Example) Secure in place with screws
Screw
Connector
Spacer
Spacer
PC board
When connecting PC boards, take
appropriate measures to prevent the
connector from coming off.
7) When mounting connectors on a FPC
board:
8) The narrow pitch connector series is
designed to be compact and thin.
Although ease of handling has been
taken into account, take care when
mating the connectors, as displacement
or angled mating could damage or
deform the connector.
5) PC board
• When the connector soldered to FPC is
mated or unmated, solder detachment
may occur by the force to the terminals.
Connector handling is recommended in
Control the thicknesses of the coverlay
and adhesive to prevent poor soldering.
This connector has no stand-off.
Regarding the selection of the connector placement machine and the mounting
procedures
1) Select the placement machine taking
into consideration the connector height,
required positioning accuracy, and
packaging conditions.
2) Be aware that if the chucking force of
the placement machine is too great, it
may deform the shape of the connector
body or connector terminals.
3) Be aware that during mounting,
external forces may be applied to the
connector contact surfaces and terminals
and cause deformations.
4) Depending on the size of the
6) In case of dry condition, please note
the occurrence of static electricity.
The product may be adhered to the
embossed carrier tape or the cover tape
in dry condition.
Recommended humidity is from 40%RH
to 60%RH and please remove static
electricity by ionizer in manufacturing
process.
connector being used, self alignment
may not be possible. In such cases, be
sure to carefully position the terminal with
the PC board pattern.
5) The positioning bosses give an
approximate alignment for positioning on
the PC board. For accurate positioning of
the connector when mounting it to the PC
board, we recommend using an
automatic positioning machine.
ACCTB48E 201606-T
–1–
Notes on Using Narrow pitch Connectors/High Current Connectors
Regarding soldering
■ Reflow soldering
8) Soldering conditions
3) Touch the soldering iron to the foot
pattern. After the foot pattern and
connector terminal are heated, apply the
solder wire so it melts at the end of the
connector terminals.
1) Measure the recommended profile
temperature for reflow soldering by
placing a sensor on the PC board near
the connector surface or terminals.
(Please refer to the specification for detail
because the temperature setting differs
by products.)
Please use the reflow temperature profile
conditions recommended below for
reflow soldering. Please contact us
before using a temperature profile other
than that described below (e.g. lead-free
solder).
Apply the solder
wire here
Upper limited (Solder heat resistance)
Lower limited (Solder wettability)
2) As for cream solder printing, screen
printing is recommended.
Terminal
Temperature
Small angle as
Peak temperature
possible up to
45 degrees
Peak temperature 260°C
3) When setting the screen opening area
and PC board foot pattern area, refer the
recommended PC board pattern and
window size of metal mask on the
specification sheet, and make sure that
the size of board pattern and metal mask
at the base of the terminals are not
increased.
230°C
220°C
200°C
Preheating
60 to 120 sec.
180°C
150°C
PC board
25 sec.
70 sec.
Pattern
Time
4) Be aware that soldering while applying
a load on the connector terminals may
cause improper operation of the
connector.
For products other than the ones above,
please refer to the latest product
specifications.
4) Please pay attentions not to provide
too much solder. It makes miss mating
because of interference at soldering
portion when mating.
9) The temperature profiles given in this
catalog are values measured when using
the connector on a resin-based PC
board. When performed reflow soldering
on a metal board (iron, aluminum, etc.) or
a metal table to mount on a FPC, make
sure there is no deformation or
discoloration of the connector before
mounting.
5) Thoroughly clean the soldering iron.
6) Flux from the solder wire may get on
the contact surfaces during soldering
operations. After soldering, carefully
check the contact surfaces and clean off
any solder before use.
7) These connector is low profile type. If
too much solder is supplied for hand
soldering, It makes miss mating because
of interference at soldering portion.
Please pay attentions.
Terminal
Paste
solder
PC board
foot pattern
5) When mounting on both sides of the
PC board and the connector is mounting
on the underside, use adhesives or other
means to ensure the connector is
properly fixed to the PC board. (Double
reflow soldering on the same side is
possible.)
6) The condition of solder or flux rise and
wettability varies depending on the type
of solder and flux. Solder and flux
characteristics should be taken into
consideration and also set the reflow
temperature and oxygen level.
10) Consult us when using a screen-
printing thickness other than that
recommended.
■ Solder reworking
■ Hand soldering
1) Finish reworking in one operation.
2) In case of soldering rework of bridges.
Don’t use supplementary solder flux.
Doing so may cause contact problems by
flux.
1) Set the soldering iron so that the tip
temperature is less than that given in the
table below.
Table A
3) Keep the soldering iron tip temperature
below the temperature given in Table A.
Product name
Soldering iron temperature
300°C within 5 sec.
350°C within 3 sec.
SMD type connectors
2) Do not allow flux to spread onto the
connector leads or PC board. This may
lead to flux rising up to the connector
inside.
7) Do not use resin-containing solder.
Otherwise, the contacts might be firmly
fixed.
Handling Single Components
1) Make sure not to drop or allow parts to
fall from work bench.
2) Excessive force applied to the
terminals could cause warping, come
out, or weaken the adhesive strength of
the solder. Handle with care.
3) Do not insert or remove the connector
when it is not soldered. Forcibly applied
external pressure on the terminals can
weaken the adherence of the terminals to
the molded part or cause the terminals to
lose their evenness.
Precautions for mating
Press-fitting while the mating
inlets of the socket and
header are not matched.
This product is designed with ease of
handling. However, in order to prevent the
deformation or damage of contacts and
molding, take care and do not mate the
connectors as shown right.
Strongly pressed and twisted
Tilted mating
ACCTB48E 201606-T
–2–
Notes on Using Narrow pitch Connectors/High Current Connectors
Cleaning flux from PC board
There is no need to clean this product.
If cleaning it, pay attention to the
following points to prevent the negative
effect to the product.
2) Some cleaning solvents are strong and
they may dissolve the molded part and
characters, so pure water passed liquid
solvent is recommended.
1) Keep the cleaning solvent clean and
prevent the connector contacts from
contamination.
Handling the PC board after mounting the connector
When cutting or bending the PC board
after mounting the connector, be careful
that the soldered sections are subjected
to excessive force.
The soldered areas should not be subjected to force.
Storage of connectors
1) To prevent problems from voids or air
pockets due to heat of reflow soldering,
avoid storing the connectors in areas of
high humidity.
Some connectors may change color
slightly if subjected to ultraviolet rays
during storage.This is normal and will not
affect the operation of the connector.
3) When storing the connectors with the
PC boards assembled and components
alreeady set, be careful not to stack them
up so the connectors are subjected to
excessive forces.
4) Avoid storing the connectors in
locations with excessive dust. The dust
may accumulate and cause improper
connections at the contact surfaces.
2) Depending on the connector type, the
color of the connector may vary from
connector to connector depending on
when it is produced.
Other Notes
1) Do not remove or insert the electrified
connector (in the state of carrying current
or applying voltage).
4) When coating the PC board after
soldering the connector to prevent the
deterioration of insulation, perform the
coating in such a way so that the coating
does not get on the connector.
5) There may be variations in the colors
of products from different production lots.
This is normal.
7) Product failures due to condensation
are not covered by warranty.
2) Dropping of the products or rough
mishandling may bend or damage the
terminals and possibly hinder proper
reflow soldering.
3) Before soldering, try not to insert or
remove the connector more than
absolutely necessary.
6) The connectors are not meant to be
used for switching.
Regarding sample orders to confirm proper mounting
When ordering samples to confirm
proper mounting with the placement
machine, connectors are delivered in 50-
piece units in the condition given right.
Consult a sale representative for ordering
sample units.
Please refer to the latest product
specifications when designing your
product.
Condition when delivered from manufacturing
Reel
(Delivery can also be made on a reel by
customer request.)
Required number
of products for
Embossed tape
amount required for
the mounting
sample production
(Unit 50 pcs.)
ACCTB48E 201606-T
–3–
相关型号：
AXT460164
Card Edge Connector, 60 Contact(s), 2 Row(s), Male, Straight, Surface Mount Terminal, ROHS COMPLIANT
PANASONIC
AXT470164
Card Edge Connector, 70 Contact(s), 2 Row(s), Male, Straight, Surface Mount Terminal, ROHS COMPLIANT
PANASONIC
AXT480164
Card Edge Connector, 80 Contact(s), 2 Row(s), Male, Straight, Surface Mount Terminal, ROHS COMPLIANT
PANASONIC
AXT480364
Card Edge Connector, 80 Contact(s), 2 Row(s), Male, Straight, Surface Mount Terminal, ROHS COMPLIANT
PANASONIC
AXT490164
Card Edge Connector, 90 Contact(s), 2 Row(s), Male, Straight, Surface Mount Terminal, ROHS COMPLIANT
PANASONIC
©2020 ICPDF网 联系我们和版权申明