DB3X313F [PANASONIC]

Mixer Diode, HALOGEN FREE AND ROHS COMPLIANT, MINI3-G3-B, 3 PIN;
DB3X313F
型号: DB3X313F
厂家: PANASONIC    PANASONIC
描述:

Mixer Diode, HALOGEN FREE AND ROHS COMPLIANT, MINI3-G3-B, 3 PIN

光电二极管
文件: 总4页 (文件大小:443K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
This product complies with the RoHS Directive (EU 2002/95/EC).  
DB3X313F  
Silicon epitaxial planar type  
For small current rectication  
Features  
Package  
Low forward voltage VF and small reverse current IR  
Low terminal capacitance Ct  
Contributes to miniaturization of sets, reduction of component count.  
Eco-friendly Halogen-free package  
Code  
Mini3-G3-B  
Pin Name  
1: Anode-1  
2: Cathode-2  
3: Cathode-1  
Anode-2  
Basic Part Number  
Dual DB2J313 (Series)  
Marking Symbol: 4Q  
Packaging  
Internal Connection  
Embossed type (Thermo-compression sealing): 3000 pcs / reel (standard)  
3
Absolute Maximum Ratings Ta = 25°C  
Parameter  
Symbol  
VR  
Rating  
30  
Unit  
V
Reverse voltage  
Repetitive peak reverse voltage  
VRRM  
30  
V
1
2
Single  
Series  
Single  
Series  
Single  
Series  
200  
Forward current (Average)  
IF(AV)  
mA  
mA  
A
130  
300  
Peak forward current  
IFM  
220  
1.0  
Non-repetitive peak reverse  
surge voltage *  
IFSM  
Tj  
0.7  
Junction temperature  
Storage temperature  
125  
°C  
°C  
T
stg  
–55 to +125  
Note) : 50 Hz sine wave 1 cycle (Non-repetitive peak current)  
*
Electrical Characteristics Ta = 25°C±3°C  
Parameter  
Symbol  
Conditions  
Min  
Typ  
Max  
0.55  
50  
Unit  
V
Forward voltage  
Reverse current  
VF  
IR  
IF = 200 mA  
VR = 30 V  
mA  
pF  
Terminal capacitance  
Ct  
VR = 10 V, f = 1 MHz  
3.8  
1.5  
IF = IR =100 mA, Irr = 0.1 × IR ,  
RL = 100  
Reverse recovery time *  
trr  
ns  
Note) 1. Measuring methods are based on JAPANESE INDUSTRIAL STANDARD JIS C 7031 measuring methods for diodes.  
2. This product is sensitive to electric shock (static electricity, etc.). Due attention must be paid on the charge of a human body and the leakage  
of current from the operating equipment.  
3. Absolute frequency of input and output is 1 GHz  
: trr measurement circuit  
*
Input Pulse  
Output Pulse  
trr  
Bias Application Unit (N-50BU)  
tp  
tr  
t
10%  
IF  
t
A
90%  
VR  
I
rr = 0.1 × IR  
tp = 2 µs  
tr = 0.35 ns  
δ = 0.05  
IF = 100 mA  
IR = 100 mA  
RL = 100 Ω  
Pulse Generator  
Wave Form Analyzer  
(SAS-8130)  
Ri = 50 Ω  
(PG-10N)  
Rs = 50 Ω  
Publication date: April 2010  
ZKH00338AED  
1
This product complies with the RoHS Directive (EU 2002/95/EC).  
DB3X313F  
IF VF  
IR VR  
Ct VR  
102  
103  
25  
1
Ta = 125°C  
Ta = 25°C  
100°C  
85°C  
101  
20  
15  
10  
5
Ta = 125°C  
104  
105  
106  
107  
102  
103  
104  
105  
25°C  
100°C  
85°C  
30°C  
25°C  
30°C  
0.2  
108  
109  
0
0
10  
20  
30  
0
0.4  
0.6  
0
10  
20  
30  
Reverse voltage VR (V)  
Forward voltage VF (V)  
Reverse voltage VR (V)  
ZKH00338AED  
2
This product complies with the RoHS Directive (EU 2002/95/EC).  
DB3X313F  
Mini3-G3-B  
Unit: mm  
+0.10  
0.05  
0.40  
+0.10  
0.06  
0.16  
3
2
1
(0.95)  
(0.95)  
1.9 ±0.1  
+0.20  
0.05  
2.90  
ZKH00338AED  
3
Request for your special attention and precautions in using the technical information and  
semiconductors described in this book  
(1) If any of the products or technical information described in this book is to be exported or provided to non-residents, the laws and  
regulations of the exporting country, especially, those with regard to security export control, must be observed.  
(2) The technical information described in this book is intended only to show the main characteristics and application circuit examples  
of the products. No license is granted in and to any intellectual property right or other right owned by Panasonic Corporation or any  
other company. Therefore, no responsibility is assumed by our company as to the infringement upon any such right owned by any  
other company which may arise as a result of the use of technical information described in this book.  
(3) The products described in this book are intended to be used for general applications (such as office equipment, communications  
equipment, measuring instruments and household appliances), or for specific applications as expressly stated in this book.  
Consult our sales staff in advance for information on the following applications:  
Special applications (such as for airplanes, aerospace, automotive equipment, traffic signaling equipment, combustion equipment,  
life support systems and safety devices) in which exceptional quality and reliability are required, or if the failure or malfunction of  
the products may directly jeopardize life or harm the human body.  
It is to be understood that our company shall not be held responsible for any damage incurred as a result of or in connection with  
your using the products described in this book for any special application, unless our company agrees to your using the products in  
this book for any special application.  
(4) The products and product specifications described in this book are subject to change without notice for modification and/or im-  
provement. At the final stage of your design, purchasing, or use of the products, therefore, ask for the most up-to-date Product  
Standards in advance to make sure that the latest specifications satisfy your requirements.  
(5) When designing your equipment, comply with the range of absolute maximum rating and the guaranteed operating conditions  
(operating power supply voltage and operating environment etc.). Especially, please be careful not to exceed the range of absolute  
maximum rating on the transient state, such as power-on, power-off and mode-switching. Otherwise, we will not be liable for any  
defect which may arise later in your equipment.  
Even when the products are used within the guaranteed values, take into the consideration of incidence of break down and failure  
mode, possible to occur to semiconductor products. Measures on the systems such as redundant design, arresting the spread of fire  
or preventing glitch are recommended in order to prevent physical injury, fire, social damages, for example, by using the products.  
(6) Comply with the instructions for use in order to prevent breakdown and characteristics change due to external factors (ESD, EOS,  
thermal stress and mechanical stress) at the time of handling, mounting or at customer's process. When using products for which  
damp-proof packing is required, satisfy the conditions, such as shelf life and the elapsed time since first opening the packages.  
(7) This book may be not reprinted or reproduced whether wholly or partially, without the prior written permission of our company.  
20100202  

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