DB3X313F0L [ROHM]

Mixer Diode, Ultra High Frequency, Silicon, TO-236AA, SC-59A, 3 PIN;


型号：	DB3X313F0L
厂家：	ROHM
描述：	Mixer Diode, Ultra High Frequency, Silicon, TO-236AA, SC-59A, 3 PIN 光电二极管
文件：	总4页 (文件大小：522K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

DB3X313F

Silicon epitaxial planar type

For small current rectiﬁcation

Unit: mm

 Features

 Low forward voltage V_Fand small reverse current I_R

 Low terminal capacitance C_t

 Halogen-free / RoHS compliant

(EU RoHS / UL-94 V-0 / MSL: Level 1 compliant)

ꢀMarking Symbol: 4Q

ꢀBasic Part Number

Dual DB2J313 (Series)

 Packaging

DB3X313F0L Embossed type (Thermo-compression sealing): 3000 pcs / reel (standard)

 Absolute Maximum Ratings T_a= 25°C

1:Anode-1

3: Cathode-1

Anode-2

Parameter

Symbol

V_R

Rating

Unit

2: Cathode-2

Reverse voltage

Panasonic

JEITA

Mini3-G3-B

SC-59A

Repetitive peak reverse voltage

V_RRM

Single

Series

Single

Series

Single

Series

200

Code

TO-236AA/SOT-23

Forward current (Average)

I_F(AV)

130

300

Peak forward current

I_FM

220

1.0

Non-repetitive peak reverse

I_FSM

surge voltage ^*

0.7

Junction temperature

T_j

125

°C

Operating ambient temperature

Storage temperature

T_opr

–40 to +85

–55 to +125

stg

Note) 1: 50 Hz sine wave 1 cycle (Non-repetitive peak current)

 Electrical Characteristics T_a= 25°C±3°C

Parameter

Symbol

Conditions

Min

Typ

Max

Unit

Forward voltage

Reverse current

V_F

I_R

C_t

t_rr

I_F= 200 mA

V_R= 30 V

0.55

Terminal capacitance

Reverse recovery time ^*

V_R= 10 V, f = 1 MHz

I_F= I_R=100 mA, I_rr= 0.1 × I_R, R_L= 100 Ω

3.8

1.5

Note) 1. Measuring methods are based on JAPANESE INDUSTRIAL STANDARD JIS C 7031 measuring methods for diodes.

2. This product is sensitive to electric shock (static electricity, etc.). Due attention must be paid on the charge of a human body and the leakage

of current from the operating equipment.

3. Absolute frequency of input and output is 1 GHz

1: t_rrmeasurement circuit

Input Pulse

Output Pulse

t_rr

Bias Application Unit (N-50BU)

t_p

t_r

10%

I_F

90%

V_R

_rr= 0.1 × I_R

t_p= 2 µs

t_r= 0.35 ns

δ = 0.05

I_F= 100 mA

I_R= 100 mA

R_L= 100 Ω

Pulse Generator

(PG-10N)

R_s= 50 Ω

Wave Form Analyzer

(SAS-8130)

R_i= 50 Ω

Publication date: May 2013

Ver. CED

DB3X313F

I_F V_F

I_R V_R

C_t V_R

10⁻²

10⁻³

T_a= 125°C

Pulse test

T_a= 25°C

100°C

85°C

10⁻¹

10⁻²

10⁻³

10⁻⁴

10⁻⁵

T_a= 125°C

10⁻⁴

10⁻⁵

10⁻⁶

10⁻⁷

25°C

−40°C

100°C

85°C

25°C

−40°C

0.2

10⁻⁸

10⁻⁹

0.4

0.6

Reverse voltage V_R(V)

Forward voltage V_F(V)

Reverse voltage V_R(V)

Ver. CED

DB3X313F

Unit: mm

Mini3-G3-B

 Land Pattern (Reference) (Unit: mm)

Ver. CED

Request for your special attention and precautions

in using the technical information and semiconductors described in this book

(1) If any of the products or technical information described in this book is to be exported or provided to non-residents, the

laws and regulations of the exporting country, especially, those with regard to security export control, must be observed.

(2) The technical information described in this book is intended only to show the main characteristics and application circuit

examples of the products. No license is granted in and to any intellectual property right or other right owned by

Panasonic Corporation or any other company. Therefore, no responsibility is assumed by our company as to the

infringement upon any such right owned by any other company which may arise as a result of the use of technical

information de-scribed in this book.

(3) The products described in this book are intended to be used for general applications (such as office equipment,

communications equipment, measuring instruments and household appliances), or for specific applications as expressly

stated in this book.

Please consult with our sales staff in advance for information on the following applications, moreover please exchange

documents separately on terms of use etc.: Special applications (such as for in-vehicle equipment, airplanes, aerospace,

automotive equipment, traffic signaling equipment, combustion equipment, medical equipment and safety devices) in

which exceptional quality and reliability are required, or if the failure or malfunction of the products may directly

jeopardize life or harm the human body.

Unless exchanging documents on terms of use etc. in advance, it is to be understood that our company shall not be held

responsible for any damage incurred as a result of or in connection with your using the products described in this book

for any special application.

(4) The products and product specifications described in this book are subject to change without notice for modification

and/or improvement. At the final stage of your design, purchasing, or use of the products, therefore, ask for the most up-

to-date Product Standards in advance to make sure that the latest specifications satisfy your requirements.

(5) When designing your equipment, comply with the range of absolute maximum rating and the guaranteed operating

conditions (operating power supply voltage and operating environment etc.). Especially, please be careful not to exceed

the range of absolute maximum rating on the transient state, such as power-on, power-off and mode-switching. Other-

wise, we will not be liable for any defect which may arise later in your equipment.

Even when the products are used within the guaranteed values, take into the consideration of incidence of break down

and failure mode, possible to occur to semiconductor products. Measures on the systems such as redundant design,

arresting the spread of fire or preventing glitch are recommended in order to prevent physical injury, fire, social damages,

for example, by using the products.

(6) Comply with the instructions for use in order to prevent breakdown and characteristics change due to external factors

(ESD, EOS, thermal stress and mechanical stress) at the time of handling, mounting or at customer's process. We do

not guarantee quality for disassembled products or the product re-mounted after removing from the mounting board.

When using products for which damp-proof packing is required, satisfy the conditions, such as shelf life and the elapsed

time since first opening the packages.

(7) When reselling products described in this book to other companies without our permission and receiving any claim of

request from the resale destination, please understand that customers will bear the burden.

(8) This book may be not reprinted or reproduced whether wholly or partially, without the prior written permission of our

company.

No.010618

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