DMA30401 [PANASONIC]

Silicon PNP epitaxial planar type; PNP硅外延平面型
DMA30401
型号: DMA30401
厂家: PANASONIC    PANASONIC
描述:

Silicon PNP epitaxial planar type
PNP硅外延平面型

文件: 总2页 (文件大小:226K)
中文:  中文翻译
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DMA30401  
Total pages  
page  
Tentative  
DMA30401  
Silicon PNP epitaxial planar type (Tr1)  
Silicon PNP epitaxial planar type (Tr2)  
For general amplification  
Marking Symbol : A7  
Package Code : SSSMini6-F2-B  
Internal Connection  
6
5
4
Absolute Maximum RatingsTa = 25 °C  
Parameter  
Symbol  
VCBO  
VCEO  
VEBO  
IC  
ICp  
PT  
Tj  
Tstg  
Rating  
-60  
-50  
-7  
-100  
Unit  
V
V
Collector-base voltage (Emitter open)  
Collector-emitter voltage (Base open)  
Emitter-base voltage (Collector open)  
Collector current  
Peak collector current  
Total power dissipation  
Tr 1  
Tr1  
Tr2  
Tr 2  
V
mA  
mA  
mW  
°C  
°C  
-200  
125  
150  
-55 to +150  
*1  
1
2
3
Overall  
Junction temperature  
Storage temperature  
Pin name  
Note: 1.  
1. Emitter(Tr1)  
2. Base(Tr1)  
4. Emitter(Tr2)  
5. Base(Tr2)  
*1 Measuring on substrate at 17 mm × 10 mm × 1 mm  
3. Collector(Tr2)  
6. Collector(Tr1)  
Electrical CharacteristicsTa = 25 °C ±3 °C  
Tr1, Tr2  
Parameter  
Symbol  
Conditions  
Min Typ Max  
Unit  
V
V
Collector-base voltage (Emitter open)  
Collector-emitter voltage (Base open)  
Emitter-base voltage (Collector open)  
Collector-base cutoff current (Emitter open)  
Collector-emitter cutoff current (Base open)  
Forward current transfer ratio  
VCBO IC = -10 μA, IE = 0  
VCEO IC = -2 mA, IB = 0  
VEBO IE = -10 μA, IC = 0  
ICBO  
ICEO  
hFE  
-60  
-50  
-7  
V
VCB = -20 V, IE = 0  
VCE = -10 V, IB = 0  
VCE = -10 V, IC = -2mA  
-0.1  
-100  
460  
μA  
μA  
-
210  
Collector-emitter saturation voltage  
Transition frequency  
VCE(sat) IC = -100 mA, IB = -10 mA  
-0.2 -0.5  
150  
V
MHz  
fT  
VCE = -10 V, IC = -2 mA  
Collector output capacitance  
(Common base, input open circuited)  
Cob  
VCB = -10 V, IE = 0, f = 1 MHz  
2
pF  
Note: Measuring methods are based on JAPANESE INDUSTRIAL STANDARD JIS C 7030 Measuring  
methods for transistors.  
Packing  
Embossed type (Thermo-compression sealing) R specification : 10 000 pcs / reel  
2010.3.1  
2010.9.6  
Revised  
Prepared  
Semiconductor Company, Panasonic Corporation  
Request for your special attention and precautions in using the technical information and  
semiconductors described in this book  
(1) If any of the products or technical information described in this book is to be exported or provided to non-residents, the laws and  
regulations of the exporting country, especially, those with regard to security export control, must be observed.  
(2) The technical information described in this book is intended only to show the main characteristics and application circuit examples  
of the products. No license is granted in and to any intellectual property right or other right owned by Panasonic Corporation or any  
other company. Therefore, no responsibility is assumed by our company as to the infringement upon any such right owned by any  
other company which may arise as a result of the use of technical information described in this book.  
(3) The products described in this book are intended to be used for general applications (such as office equipment, communications  
equipment, measuring instruments and household appliances), or for specific applications as expressly stated in this book.  
Consult our sales staff in advance for information on the following applications:  
Special applications (such as for airplanes, aerospace, automotive equipment, traffic signaling equipment, combustion equipment,  
life support systems and safety devices) in which exceptional quality and reliability are required, or if the failure or malfunction of  
the products may directly jeopardize life or harm the human body.  
It is to be understood that our company shall not be held responsible for any damage incurred as a result of or in connection with  
your using the products described in this book for any special application, unless our company agrees to your using the products in  
this book for any special application.  
(4) The products and product specifications described in this book are subject to change without notice for modification and/or im-  
provement. At the final stage of your design, purchasing, or use of the products, therefore, ask for the most up-to-date Product  
Standards in advance to make sure that the latest specifications satisfy your requirements.  
(5) When designing your equipment, comply with the range of absolute maximum rating and the guaranteed operating conditions  
(operating power supply voltage and operating environment etc.). Especially, please be careful not to exceed the range of absolute  
maximum rating on the transient state, such as power-on, power-off and mode-switching. Otherwise, we will not be liable for any  
defect which may arise later in your equipment.  
Even when the products are used within the guaranteed values, take into the consideration of incidence of break down and failure  
mode, possible to occur to semiconductor products. Measures on the systems such as redundant design, arresting the spread of fire  
or preventing glitch are recommended in order to prevent physical injury, fire, social damages, for example, by using the products.  
(6) Comply with the instructions for use in order to prevent breakdown and characteristics change due to external factors (ESD, EOS,  
thermal stress and mechanical stress) at the time of handling, mounting or at customer's process. When using products for which  
damp-proof packing is required, satisfy the conditions, such as shelf life and the elapsed time since first opening the packages.  
(7) This book may be not reprinted or reproduced whether wholly or partially, without the prior written permission of our company.  
20100202  

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