DSA5002S0L [PANASONIC]
Small Signal Bipolar Transistor, 0.5A I(C), 50V V(BR)CEO, 1-Element, NPN, Silicon, HALOGEN FREE AND ROHS COMPLIANT, SMINI3-F2-B, SC-85, 3 PIN;
| 型号： | DSA5002S0L |
| 厂家： | 
PANASONIC |
| 描述： | Small Signal Bipolar Transistor, 0.5A I(C), 50V V(BR)CEO, 1-Element, NPN, Silicon, HALOGEN FREE AND ROHS COMPLIANT, SMINI3-F2-B, SC-85, 3 PIN 放大器 光电二极管 晶体管 |
| 文件： | 总4页 (文件大小：782K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
DSA5002
Silicon PNP epitaxial planar type
For general amplification
Complementary to DSC5002
DSA2002 in SMini3 type package
Unit: mm
Features
High forward current transfer ratio hFE with excellent linearity
Low collector-emitter saturation voltage VCE(sat)
Halogen-free / RoHS compliant
(EU RoHS / UL-94 V-0 / MSL: Level 1 compliant)
Marking Symbol: A2
Packaging
DSA5002×0L Embossed type (Thermo-compression sealing): 3000 pcs / reel (standard)
Absolute Maximum Ratings Ta = 25°C
Parameter
Collector-base voltage (Emitter open)
Collector-emitter voltage (Base open)
Emitter-base voltage (Collector open)
Collector current
Symbol
VCBO
VCEO
VEBO
IC
Rating
–60
Unit
V
1: Base
2: Emitter
3: Collector
Panasonic
JEITA
–50
V
SMini3-F2-B
–5
V
SC-85
–500
mA
A
Code
Peak collector current
ICP
–1
Collector power dissipation
Junction temperature
PC
150
mW
°C
°C
°C
Tj
150
Operating ambient temperature
Storage temperature
Topr
–40 to +85
–55 to +150
T
stg
Electrical Characteristics Ta = 25°C±3°C
Parameter
Symbol
Conditions
Min
–60
–50
–5
Typ
Max
Unit
V
Collector-base voltage (Emitter open)
Collector-emitter voltage (Base open)
Emitter-base voltage (Collector open)
Collector-base cutoff current (Emitter open)
VCBO IC = –10 mA, IE = 0
VCEO IC = –2 mA, IB = 0
VEBO IE = –10 mA, IC = 0
V
V
ICBO
VCB = –20 V, IE = 0
– 0.1
340
mA
2
*
hFE1
hFE2
VCE = –10 V, IC = –150 mA
VCE = –10 V, IC = –500 mA
120
40
1
Forward current transfer ratio *
1
Collector-emitter saturation voltage *
VCE(sat) IC = –300 mA, IB = –30 mA
VBE(sat) IC = –300 mA, IB = –30 mA
– 0.2
– 0.9
130
– 0.6
–1.5
V
V
1
Base-emitter saturation voltage *
Transition frequency
fT
VCE = –10 V, IC = –50 mA
MHz
Collector output capacitance
(Common base, input open circuited)
Cob
VCB = –10 V, IE = 0, f = 1 MHz
7.3
15
pF
Note) 1. Measuring methods are based on JAPANESE INDUSTRIAL STANDARD JIS C 7030 measuring methods for transistors.
2. 1: Pulse measurement
*
2: Rank classification
*
Code
Rank
R
R
S
S
0
No-rank
120 to 340
A2
hFE1
120 to 240
A2R
170 to 340
A2S
Marking Symbol
Product of no-rank is not classified and have no marking symbol for rank.
Publication date: March 2014
Ver. DED
1
DSA5002
PC T
IC VCE
hFE IC
a
−120
−100
−80
−60
−40
−20
0
250
200
300
250
200
150
100
50
Ta = 25°C
V
CE = −10 V
Ta = 85°C
I
B = −500 µA
−400 µA
−300 µA
−200 µA
−100 µA
150
100
25°C
−40°C
50
0
0
0
0
−4
−8
−12
40
80
120
160
200
−1
−10
−100
−1000
(
)
Ambient temperature Ta °C
Collector-emitter voltage VCE (V)
Collector current IC (mA)
VCE(sat) IC
IC VBE
Cob VCB
−600
−500
−400
−300
−200
−100
0
−10
−1
25
20
15
IC / IB = 10
IE = 0
V
CE = −10 V
f = 1 MHz
25°C
Ta = 25°C
Ta = 85°C
−40°C
10
5
− 0.1
Ta = 85°C
−40°C
25°C
−10
− 0.01
−1
0
0
− 0.4
− 0.8
−1.2
−100
−1000
0
−10
−100
Base-emitter voltage VBE (V)
Collector current IC (mA)
Collector-base voltage VCB (V)
fT IC
250
200
150
100
50
VCE = −10 V
a = 25°C
T
0
− 0.1
−1
−10
−100
Collector current IC (mA)
Ver. DED
2
DSA5002
Unit: mm
SMini3-F2-B
Land Pattern (Reference) (Unit: mm)
Ver. DED
3
Request for your special attention and precautions in using the technical information and
semiconductors described in this book
(1) If any of the products or technical information described in this book is to be exported or provided to non-residents, the laws and
regulations of the exporting country, especially, those with regard to security export control, must be observed.
(2) The technical information described in this book is intended only to show the main characteristics and application circuit examples
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other company. Therefore, no responsibility is assumed by our company as to the infringement upon any such right owned by any
other company which may arise as a result of the use of technical information described in this book.
(3) The products described in this book are intended to be used for general applications (such as office equipment, communications
equipment, measuring instruments and household appliances), or for specific applications as expressly stated in this book.
Consult our sales staff in advance for information on the following applications:
– Special applications (such as for airplanes, aerospace, automotive equipment, traffic signaling equipment, combustion equipment,
life support systems and safety devices) in which exceptional quality and reliability are required, or if the failure or malfunction of
the products may directly jeopardize life or harm the human body.
It is to be understood that our company shall not be held responsible for any damage incurred as a result of or in connection with
your using the products described in this book for any special application, unless our company agrees to your using the products in
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provement. At the final stage of your design, purchasing, or use of the products, therefore, ask for the most up-to-date Product
Standards in advance to make sure that the latest specifications satisfy your requirements.
(5) When designing your equipment, comply with the range of absolute maximum rating and the guaranteed operating conditions
(operating power supply voltage and operating environment etc.). Especially, please be careful not to exceed the range of absolute
maximum rating on the transient state, such as power-on, power-off and mode-switching. Otherwise, we will not be liable for any
defect which may arise later in your equipment.
Even when the products are used within the guaranteed values, take into the consideration of incidence of break down and failure
mode, possible to occur to semiconductor products. Measures on the systems such as redundant design, arresting the spread of fire
or preventing glitch are recommended in order to prevent physical injury, fire, social damages, for example, by using the products.
(6) Comply with the instructions for use in order to prevent breakdown and characteristics change due to external factors (ESD, EOS,
thermal stress and mechanical stress) at the time of handling, mounting or at customer's process. When using products for which
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20100202
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