DSA90050L [PANASONIC]

Transistor;
DSA90050L
型号: DSA90050L
厂家: PANASONIC    PANASONIC
描述:

Transistor

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中文:  中文翻译
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This product complies with the RoHS Directive (EU 2002/95/EC).  
DSA9005  
Silicon PNP epitaxial planar type  
For general amplication  
Complementary to DSC9005  
DSA5005 in SSMini3 type package  
Features  
Package  
Low collector-emitter saturation voltage VCE(sat)  
Code  
Contributes to miniaturization of sets, reduction of component count.  
High forward current transfer ratio hFE with excellent linearity  
Eco-friendly Halogen-free package  
SSMini3-F3-B  
Package dimension clicks here.  
Click!  
Packaging  
Pin Name  
1. Base  
DSA9005×0L Embossed type (Thermo-compression sealing): 3000 pcs / reel (standard)  
2. Emitter  
3. Collector  
Absolute Maximum Ratings Ta = 25°C  
Parameter  
Collector-base voltage (Emitter open)  
Collector-emitter voltage (Base open)  
Emitter-base voltage (Collector open)  
Collector current  
Symbol  
VCBO  
VCEO  
VEBO  
IC  
Rating  
–60  
Unit  
V
Marking Symbol: A3  
–50  
V
–6  
V
–200  
–300  
125  
mA  
mA  
mW  
°C  
Peak collector current  
ICP  
Collector power dissipation  
Junction temperature  
PC  
Tj  
150  
Storage temperature  
T
stg  
–55 to +150  
°C  
Electrical Characteristics Ta = 25°C±3°C  
Parameter  
Symbol  
Conditions  
Min  
Typ  
Max  
Unit  
V
Collector-emitter voltage (Base open)  
Collector-base cutoff current (Emitter open)  
Emitter-base cutoff current (Collector open)  
VCEO IC = –100 mA, IB = 0  
–50  
ICBO  
IEBO  
hFE1  
hFE2  
VCB = –60 V, IE = 0  
– 0.1  
– 0.1  
390  
mA  
mA  
VEB = –6 V, IC = 0  
VCE = –6 V, IC = –1 mA  
VCE = –6 V, IC = – 0.1 mA  
150  
90  
Forward current transfer ratio *  
Collector-emitter saturation voltage  
Transition frequency  
VCE(sat) IC = –100 mA, IB = –10 mA  
– 0.3  
V
fT  
VCE = –6 V, IC = –10 mA  
150  
5.0  
MHz  
Collector output capacitance  
Cob  
VCB = –6 V, IE = 0, f = 1 MHz  
pF  
(Common base, input open circuited)  
Note) 1. Measuring methods are based on JAPANESE INDUSTRIAL STANDARD JIS C 7030 measuring methods for transistors.  
2. : Rank classication  
*
Code  
Rank  
R
R
S
S
0
No-rank  
150 to 390  
A3  
hFE1  
150 to 270  
A3R  
200 to 390  
A3S  
Marking Symbol  
Product of no-rank is not classied and have no marking symbol for rank.  
Publication date: February 2012  
Ver. AED  
1
This product complies with the RoHS Directive (EU 2002/95/EC).  
DSA9005  
PC T  
IC VCE  
hFE IC  
a
600  
150  
125  
100  
120  
100  
80  
60  
40  
20  
0
V
CE = −10 V  
Ta = 25°C  
I
B = −600 µA  
500  
400  
300  
200  
100  
0
500 µA  
400 µA  
300 µA  
Ta = 85°C  
75  
50  
25  
25°C  
200 µA  
100 µA  
30°C  
0
0
−101  
1  
10  
102  
40  
80  
120  
160  
200  
0
2  
4  
6  
8 10 12  
(
)
Ambient temperature Ta °C  
Collector current IC (mA)  
Collector-emitter voltage VCE (V)  
VCE(sat) IC  
IC VBE  
Cob VCB  
10  
1  
120  
100  
80  
60  
40  
20  
0
IC / IB = 10  
IE = 0  
V
CE = −10 V  
f = 1 MHz  
4.0  
3.0  
2.0  
1.0  
0
25°C  
Ta = 25°C  
Ta = 85°C  
30°C  
101  
Ta = 85°C  
25°C  
30°C  
102  
101  
1  
10  
102  
0
0.2 0.4 0.6 0.8 1.0 1.2  
1  
10  
102  
Base-emitter voltage VBE (V)  
Collector current IC (mA)  
Collector-base voltage VCB (V)  
fT IC  
250  
200  
150  
100  
50  
VCE = 10 V  
T
a = 25°C  
0
101  
1  
10  
102  
Collector current IC (mA)  
Ver. AED  
2
Request for your special attention and precautions in using the technical information and  
semiconductors described in this book  
(1) If any of the products or technical information described in this book is to be exported or provided to non-residents, the laws and  
regulations of the exporting country, especially, those with regard to security export control, must be observed.  
(2) The technical information described in this book is intended only to show the main characteristics and application circuit examples  
of the products. No license is granted in and to any intellectual property right or other right owned by Panasonic Corporation or any  
other company. Therefore, no responsibility is assumed by our company as to the infringement upon any such right owned by any  
other company which may arise as a result of the use of technical information described in this book.  
(3) The products described in this book are intended to be used for general applications (such as office equipment, communications  
equipment, measuring instruments and household appliances), or for specific applications as expressly stated in this book.  
Consult our sales staff in advance for information on the following applications:  
Special applications (such as for airplanes, aerospace, automotive equipment, traffic signaling equipment, combustion equipment,  
life support systems and safety devices) in which exceptional quality and reliability are required, or if the failure or malfunction of  
the products may directly jeopardize life or harm the human body.  
It is to be understood that our company shall not be held responsible for any damage incurred as a result of or in connection with  
your using the products described in this book for any special application, unless our company agrees to your using the products in  
this book for any special application.  
(4) The products and product specifications described in this book are subject to change without notice for modification and/or im-  
provement. At the final stage of your design, purchasing, or use of the products, therefore, ask for the most up-to-date Product  
Standards in advance to make sure that the latest specifications satisfy your requirements.  
(5) When designing your equipment, comply with the range of absolute maximum rating and the guaranteed operating conditions  
(operating power supply voltage and operating environment etc.). Especially, please be careful not to exceed the range of absolute  
maximum rating on the transient state, such as power-on, power-off and mode-switching. Otherwise, we will not be liable for any  
defect which may arise later in your equipment.  
Even when the products are used within the guaranteed values, take into the consideration of incidence of break down and failure  
mode, possible to occur to semiconductor products. Measures on the systems such as redundant design, arresting the spread of fire  
or preventing glitch are recommended in order to prevent physical injury, fire, social damages, for example, by using the products.  
(6) Comply with the instructions for use in order to prevent breakdown and characteristics change due to external factors (ESD, EOS,  
thermal stress and mechanical stress) at the time of handling, mounting or at customer's process. When using products for which  
damp-proof packing is required, satisfy the conditions, such as shelf life and the elapsed time since first opening the packages.  
(7) This book may be not reprinted or reproduced whether wholly or partially, without the prior written permission of our company.  
20100202  

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