DSC5002R0L [PANASONIC]
Silicon NPN epitaxial planar type;型号: | DSC5002R0L |
厂家: | PANASONIC |
描述: | Silicon NPN epitaxial planar type |
文件: | 总5页 (文件大小:794K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
DSC5002
Silicon NPN epitaxial planar type
For general amplification
Complementary to DSA5002
DSC2002 in SMini3 type package
Unit: mm
Features
High forward current transfer ratio hFE with excellent linearity
Low collector-emitter saturation voltage VCE(sat)
Halogen-free / RoHS compliant
(EU RoHS / UL-94 V-0 / MSL: Level 1 compliant)
Marking Symbol: C2
Packaging
DSC5002×0L Embossed type (Thermo-compression sealing): 3000 pcs / reel (standard)
Absolute Maximum Ratings Ta = 25°C
1: Base
Parameter
Collector-base voltage (Emitter open)
Collector-emitter voltage (Base open)
Emitter-base voltage (Collector open)
Collector current
Symbol
VCBO
VCEO
VEBO
IC
Rating
Unit
V
2: Emitter
3: Collector
Panasonic
JEITA
60
50
V
SMini3-F2-B
SC-85
5
500
V
Code
mA
A
Peak collector current
ICP
1
Collector power dissipation
Junction temperature
PC
150
mW
°C
°C
°C
Tj
150
Operating ambient temperature
Storage temperature
Topr
–40 to +85
–55 to +150
T
stg
Electrical Characteristics Ta = 25°C±3°C
Parameter
Symbol
Conditions
Min
60
50
5
Typ
Max
Unit
V
Collector-base voltage (Emitter open)
Collector-emitter voltage (Base open)
Emitter-base voltage (Collector open)
Collector-base cutoff current (Emitter open)
VCBO IC = 10 mA, IE = 0
VCEO IC = 2 mA, IB = 0
VEBO IE = 10 mA, IC = 0
V
V
ICBO
VCB = 20 V, IE = 0
0.1
mA
2
*
hFE1
hFE2
VCE = 10 V, IC = 150 mA
VCE = 10 V, IC = 500 mA
120
40
340
1
Forward current transfer ratio *
1
Collector-emitter saturation voltage *
VCE(sat) IC = 300 mA, IB = 30 mA
0.1
0.6
V
Transition frequency
fT
VCE = 10 V, IC = 50 mA
160
MHz
Collector output capacitance
(Common base, input open circuited)
Cob
VCB = 10 V, IE = 0, f = 1 MHz
4.8
15
pF
Note) 1. Measuring methods are based on JAPANESE INDUSTRIAL STANDARD JIS C 7030 measuring methods for transistors.
2. 1: Pulse measurement
*
2: Rank classification
*
Code
Rank
R
R
S
S
0
No-rank
120 to 340
C2
hFE1
120 to 240
C2R
170 to 340
C2S
Marking Symbol
Product of no-rank is not classified and have no marking symbol for rank.
Publication date: March 2014
Ver. EED
1
DSC5002
PC T
IC VCE
hFE IC
a
350
300
250
60
50
40
30
20
10
0
250
200
V
CE = 10 V
Ta = 25°C
I
B = 3.0 mA
2.7 mA
2.4 mA
2.1 mA
Ta = 85°C
25°C
1.8 mA
1.5 mA
150
100
200
150
100
50
−40°C
1.2 mA
0.9 mA
0.6 mA
0.3 mA
50
0
0
0
1
10
102
103
0
2
4
6
8
10
12
40
80
120
160
200
(
)
Ambient temperature Ta °C
Collector-emitter voltage VCE (V)
Collector current IC (mA)
VCE(sat) IC
IC VBE
Cob VCB
10
1
20
50
40
30
I
C / IB = 10
IE = 0
V
CE = 10 V
f = 1 MHz
Ta = 25°C
16
12
8
25°C
Ta = 85°C
−40°C
20
10
Ta = 85°C
10−1
25°C
4
−40°C
10−2
1
0
0
10
102
103
0
0.2 0.4 0.6 0.8 1.0 1.2
Base-emitter voltage VBE (V)
1
10
100
Collector current IC (mA)
Collector-base voltage VCB (V)
fT IC
250
VCE = 10 V
Ta = 25°C
200
150
100
50
0
0.1
1
10
100
Collector current IC (mA)
Ver. EED
2
DSC5002
Unit: mm
SMini3-F2-B
Land Pattern (Reference) (Unit: mm)
Ver. EED
3
Request for your special attention and precautions in using the technical information and
semiconductors described in this book
(1) If any of the products or technical information described in this book is to be exported or provided to non-residents, the laws and
regulations of the exporting country, especially, those with regard to security export control, must be observed.
(2) The technical information described in this book is intended only to show the main characteristics and application circuit examples
of the products. No license is granted in and to any intellectual property right or other right owned by Panasonic Corporation or any
other company. Therefore, no responsibility is assumed by our company as to the infringement upon any such right owned by any
other company which may arise as a result of the use of technical information described in this book.
(3) The products described in this book are intended to be used for general applications (such as office equipment, communications
equipment, measuring instruments and household appliances), or for specific applications as expressly stated in this book.
Consult our sales staff in advance for information on the following applications:
– Special applications (such as for airplanes, aerospace, automotive equipment, traffic signaling equipment, combustion equipment,
life support systems and safety devices) in which exceptional quality and reliability are required, or if the failure or malfunction of
the products may directly jeopardize life or harm the human body.
It is to be understood that our company shall not be held responsible for any damage incurred as a result of or in connection with
your using the products described in this book for any special application, unless our company agrees to your using the products in
this book for any special application.
(4) The products and product specifications described in this book are subject to change without notice for modification and/or im-
provement. At the final stage of your design, purchasing, or use of the products, therefore, ask for the most up-to-date Product
Standards in advance to make sure that the latest specifications satisfy your requirements.
(5) When designing your equipment, comply with the range of absolute maximum rating and the guaranteed operating conditions
(operating power supply voltage and operating environment etc.). Especially, please be careful not to exceed the range of absolute
maximum rating on the transient state, such as power-on, power-off and mode-switching. Otherwise, we will not be liable for any
defect which may arise later in your equipment.
Even when the products are used within the guaranteed values, take into the consideration of incidence of break down and failure
mode, possible to occur to semiconductor products. Measures on the systems such as redundant design, arresting the spread of fire
or preventing glitch are recommended in order to prevent physical injury, fire, social damages, for example, by using the products.
(6) Comply with the instructions for use in order to prevent breakdown and characteristics change due to external factors (ESD, EOS,
thermal stress and mechanical stress) at the time of handling, mounting or at customer's process. When using products for which
damp-proof packing is required, satisfy the conditions, such as shelf life and the elapsed time since first opening the packages.
(7) This book may be not reprinted or reproduced whether wholly or partially, without the prior written permission of our company.
20100202
Mouser Electronics
Authorized Distributor
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