DSC9G02C0L [PANASONIC]

Silicon NPN epitaxial planar type; NPN硅外延平面型
DSC9G02C0L
型号: DSC9G02C0L
厂家: PANASONIC    PANASONIC
描述:

Silicon NPN epitaxial planar type
NPN硅外延平面型

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中文:  中文翻译
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DSC9G02  
Silicon NPN epitaxial planar type  
For high-frequency amplication  
DSC5G02 in SSMini3 type package  
Features  
Package  
Code  
High forward current transfer ratio hFE with excellent linearity  
High transition frequency fT  
SSMini3-F3-B  
Contributes to miniaturization of sets, reduction of component count.  
Eco-friendly Halogen-free package  
Pin Name  
1. Base  
2. Emitter  
3. Collector  
Packaging  
Embossed type (Thermo-compression sealing): 3000 pcs / reel (standard)  
Marking Symbol: C5  
Absolute Maximum Ratings Ta = 25°C  
Parameter  
Collector-base voltage (Emitter open)  
Collector-emitter voltage (Base open)  
Emitter-base voltage (Collector open)  
Collector current  
Symbol  
VCBO  
VCEO  
VEBO  
IC  
Rating  
Unit  
V
30  
20  
V
3
15  
V
mA  
mW  
°C  
°C  
Collector power dissipation  
Junction temperature  
PC  
125  
Tj  
150  
Storage temperature  
T
stg  
–55 to +150  
Electrical Characteristics Ta = 25°C±3°C  
Parameter  
Collector-base voltage (Emitter open)  
Emitter-base voltage (Collector open)  
Base-emitter voltage  
Symbol  
Conditions  
Min  
30  
3
Typ  
Max  
Unit  
V
VCBO IC = 10 mA, IE = 0  
VEBO IE = 10 mA, IC = 0  
V
VBE  
hFE  
fT  
VCE = 6 V, IC = 1 mA  
VCE = 6 V, IC = 1 mA  
VCE = 6 V, IC = 1 mA  
0.72  
V
Forward current transfer ratio *  
Transition frequency  
65  
260  
450  
650  
0.6  
MHz  
Reverse transfer capacitance  
(Common emitter)  
Cre  
VCE = 6 V, IC = 1 mA, f = 10.7 MHz  
pF  
Power gain  
PG  
NF  
VCE = 6 V, IC = 1 mA, f = 100 MHz  
VCE = 6 V, IC = 1 mA, f = 100 MHz  
24  
dB  
dB  
Noise gure  
3.3  
Note) 1. Measuring methods are based on JAPANESE INDUSTRIAL STANDARD JIS C 7030 measuring methods for transistors.  
2. : Rank classication  
*
Code  
Rank  
C
C
D
D
0
No-rank  
65 to 260  
C5  
hFE  
65 to 160  
C5C  
100 to 260  
C5D  
Marking Symbol  
Product of no-rank is not classied and have no marking symbol for rank.  
Publication date: September 2010  
Ver. AED  
1
DSC9G02  
PC T  
IC VCE  
hFE IC  
a
200  
150  
125  
100  
75  
20  
16  
V
CE = 6 V  
Ta = 25°C  
160  
120  
80  
Ta = 85°C  
I
B = 120 µA  
110 µA  
100 µA  
90 µA  
80 µA  
70 µA  
60 µA  
50 µA  
40 µA  
30 µA  
25°C  
12  
8
30°C  
50  
4
40  
25  
0
0
0
0
101  
1
10  
102  
40  
80  
120  
160  
200  
0
2
4
6
8
10  
12  
(
)
Ambient temperature Ta °C  
Collector current IC (mA)  
Collector-emitter voltage VCE (V)  
VCE(sat) IC  
IC VBE  
Cob VCB  
10  
1
2.0  
20  
15  
10  
5
IC / IB = 10  
IE = 0  
f = 1 MHz  
V
CE = 6 V  
Ta = 25°C  
25°C  
1.6  
1.2  
0.8  
0.4  
0
Ta = 85°C  
30°C  
Ta = 85°C  
30°C  
25°C  
101  
102  
101  
0
1
10  
102  
1
10  
100  
0
0.2 0.4 0.6 0.8 1.0 1.2  
Collector current IC (mA)  
Collector-base voltage VCB (V)  
Base-emitter voltage VBE (V)  
fT IC  
1600  
1200  
800  
400  
0
VCE = 6 V  
Ta = 25°C  
101  
1
10  
102  
Collector current IC (mA)  
Ver. AED  
2
DSC9G02  
SSMini3-F3-B  
Unit: mm  
1.60 +00..0035  
0.26 +00..0025  
3
1
2
0.13 +00..0025  
(0.50)  
(0.50)  
1.00 ±0.05  
(5°)  
Ver. AED  
3
Request for your special attention and precautions in using the technical information and  
semiconductors described in this book  
(1) If any of the products or technical information described in this book is to be exported or provided to non-residents, the laws and  
regulations of the exporting country, especially, those with regard to security export control, must be observed.  
(2) The technical information described in this book is intended only to show the main characteristics and application circuit examples  
of the products. No license is granted in and to any intellectual property right or other right owned by Panasonic Corporation or any  
other company. Therefore, no responsibility is assumed by our company as to the infringement upon any such right owned by any  
other company which may arise as a result of the use of technical information described in this book.  
(3) The products described in this book are intended to be used for general applications (such as office equipment, communications  
equipment, measuring instruments and household appliances), or for specific applications as expressly stated in this book.  
Consult our sales staff in advance for information on the following applications:  
Special applications (such as for airplanes, aerospace, automotive equipment, traffic signaling equipment, combustion equipment,  
life support systems and safety devices) in which exceptional quality and reliability are required, or if the failure or malfunction of  
the products may directly jeopardize life or harm the human body.  
It is to be understood that our company shall not be held responsible for any damage incurred as a result of or in connection with  
your using the products described in this book for any special application, unless our company agrees to your using the products in  
this book for any special application.  
(4) The products and product specifications described in this book are subject to change without notice for modification and/or im-  
provement. At the final stage of your design, purchasing, or use of the products, therefore, ask for the most up-to-date Product  
Standards in advance to make sure that the latest specifications satisfy your requirements.  
(5) When designing your equipment, comply with the range of absolute maximum rating and the guaranteed operating conditions  
(operating power supply voltage and operating environment etc.). Especially, please be careful not to exceed the range of absolute  
maximum rating on the transient state, such as power-on, power-off and mode-switching. Otherwise, we will not be liable for any  
defect which may arise later in your equipment.  
Even when the products are used within the guaranteed values, take into the consideration of incidence of break down and failure  
mode, possible to occur to semiconductor products. Measures on the systems such as redundant design, arresting the spread of fire  
or preventing glitch are recommended in order to prevent physical injury, fire, social damages, for example, by using the products.  
(6) Comply with the instructions for use in order to prevent breakdown and characteristics change due to external factors (ESD, EOS,  
thermal stress and mechanical stress) at the time of handling, mounting or at customer's process. When using products for which  
damp-proof packing is required, satisfy the conditions, such as shelf life and the elapsed time since first opening the packages.  
(7) This book may be not reprinted or reproduced whether wholly or partially, without the prior written permission of our company.  
20100202  

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