DZ2W0130 [PANASONIC]

Zener Diode, 13V V(Z), 5%, 1W, Silicon, Unidirectional, HALOGEN FREE, MINI2-F3-B, 2 PIN;
DZ2W0130
型号: DZ2W0130
厂家: PANASONIC    PANASONIC
描述:

Zener Diode, 13V V(Z), 5%, 1W, Silicon, Unidirectional, HALOGEN FREE, MINI2-F3-B, 2 PIN

测试 二极管
文件: 总4页 (文件大小:421K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
This product complies with the RoHS Directive (EU 2002/95/EC).  
DZ2W024  
Silicon epitaxial planar type  
For constant voltage / waveform clipper and surge absorption circuit  
Capability of withstanding a high surge type  
Features  
Package  
Code  
Excellent rising characteristics of zener current IZ  
Low zener operating resistance RZ  
Mini2-F3-B  
Contributes to miniaturization of sets, reduction of component count.  
Eco-friendly Halogen-free package  
Pin Name  
1. Cathode  
2. Anode  
Packaging  
Marking Symbol: 1J  
Embossed type (Thermo-compression sealing): 3000 pcs / reel (standard)  
Absolute Maximum Ratings Ta = 25°C  
Parameter  
Symbol  
IFRM  
PT  
Rating  
Unit  
mA  
W
Repetitive peak forward current  
500  
1
Total power dissipation*  
1
150  
Junction temperature  
Storage temperature  
Tj  
°C  
T
stg  
–55 to +150  
100  
°C  
2
Non-repetitive reverse surge power dissipation*  
PZSM  
W
Note) 1: Mounted on ceramics print circuit board.  
*
Board size: 50 mm × 50 mm, Board thickness: 0.8 mm, Soldering size: 2 mm × 2 mm  
2: t = 0.1 ms  
*
Electrical Characteristics Ta = 25°C±3°C  
Parameter  
Forward voltage  
Symbol  
Conditions  
Min  
Typ  
Max  
1.2  
Unit  
V
VF  
VZ  
RZ  
IR  
IF = 200 mA  
IZ = 20 mA  
IZ = 20 mA  
VR = 1 V  
1, 2  
Zener voltage *  
2.28  
2.40  
2.52  
150  
200  
V
Zener operating resistance  
Reverse current  
W
mA  
3
Temperature coefcient of zener voltage *  
SZ  
IZ = 20 mA  
–1.4  
mV/°C  
Note) 1. Measuring methods are based on JAPANESE INDUSTRIAL STANDARD JIS C 7031 measuring methods for diodes.  
2. Absolute frequency of input and output is 5 MHz.  
3. *1: The temperature must be controlled 25°C for VZ measurement. VZ value measured at other temperature must be adjusted to VZ (25°C)  
2: V guaranteed 20 ms after current ow.  
*
*
Z
3: T = 25°C to 150°C  
j
Publication date: May 2011  
Ver. AED  
1
This product complies with the RoHS Directive (EU 2002/95/EC).  
DZ2W024  
IF VF  
IZ VZ  
IR VR  
102  
103  
102  
T
a = 25°C  
Ta = 25°C  
Ta = 25°C  
101  
103  
10−5  
107  
10  
1
10  
1
101  
101  
102  
102  
103  
103  
0
109  
0.4  
0.8  
1.2  
0
1.0  
2.0  
3.0  
0
0.5  
1.0  
1.5  
2.0  
Forward voltage VF (V)  
Zener voltage VZ (V)  
Reverse voltage VR (V)  
RZ IZ  
SZ IZ  
Ct VR  
103  
102  
5
3
3500  
Ta = 25°C  
Ta = 25°C  
3000  
2500  
2000  
1500  
1000  
1
1  
3  
5  
10  
500  
0
1
101  
0
0.5  
1.0  
1.5  
2.0  
1
10  
102  
0
4
8
12  
16  
20  
Reverse voltage VR (V)  
Zener current IZ (mA)  
Zener current IZ (mA)  
Ver. AED  
2
This product complies with the RoHS Directive (EU 2002/95/EC).  
DZ2W024  
Mini2-F3-B  
Unit: mm  
1.60�ꢀ0.10  
2
1
+0.05  
0.02  
0.13  
0.90 p0.10  
Ver. AED  
3
Request for your special attention and precautions in using the technical information and  
semiconductors described in this book  
(1) If any of the products or technical information described in this book is to be exported or provided to non-residents, the laws and  
regulations of the exporting country, especially, those with regard to security export control, must be observed.  
(2) The technical information described in this book is intended only to show the main characteristics and application circuit examples  
of the products. No license is granted in and to any intellectual property right or other right owned by Panasonic Corporation or any  
other company. Therefore, no responsibility is assumed by our company as to the infringement upon any such right owned by any  
other company which may arise as a result of the use of technical information described in this book.  
(3) The products described in this book are intended to be used for general applications (such as office equipment, communications  
equipment, measuring instruments and household appliances), or for specific applications as expressly stated in this book.  
Consult our sales staff in advance for information on the following applications:  
Special applications (such as for airplanes, aerospace, automotive equipment, traffic signaling equipment, combustion equipment,  
life support systems and safety devices) in which exceptional quality and reliability are required, or if the failure or malfunction of  
the products may directly jeopardize life or harm the human body.  
It is to be understood that our company shall not be held responsible for any damage incurred as a result of or in connection with  
your using the products described in this book for any special application, unless our company agrees to your using the products in  
this book for any special application.  
(4) The products and product specifications described in this book are subject to change without notice for modification and/or im-  
provement. At the final stage of your design, purchasing, or use of the products, therefore, ask for the most up-to-date Product  
Standards in advance to make sure that the latest specifications satisfy your requirements.  
(5) When designing your equipment, comply with the range of absolute maximum rating and the guaranteed operating conditions  
(operating power supply voltage and operating environment etc.). Especially, please be careful not to exceed the range of absolute  
maximum rating on the transient state, such as power-on, power-off and mode-switching. Otherwise, we will not be liable for any  
defect which may arise later in your equipment.  
Even when the products are used within the guaranteed values, take into the consideration of incidence of break down and failure  
mode, possible to occur to semiconductor products. Measures on the systems such as redundant design, arresting the spread of fire  
or preventing glitch are recommended in order to prevent physical injury, fire, social damages, for example, by using the products.  
(6) Comply with the instructions for use in order to prevent breakdown and characteristics change due to external factors (ESD, EOS,  
thermal stress and mechanical stress) at the time of handling, mounting or at customer's process. When using products for which  
damp-proof packing is required, satisfy the conditions, such as shelf life and the elapsed time since first opening the packages.  
(7) This book may be not reprinted or reproduced whether wholly or partially, without the prior written permission of our company.  
20100202  

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