ECEV50G010P [PANASONIC]

Aluminum Electrolytic Capacitor/V-G; 铝电解电容器/ V -G


型号：	ECEV50G010P
厂家：	PANASONIC
描述：	Aluminum Electrolytic Capacitor/V-G 铝电解电容器/ V -G 电容器铝电解电容器
文件：	总9页 (文件大小：180K)
中文：	中文翻译
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Aluminum Electrolytic Capacitor/V-G

Surface Mount Type

Discontinued

Type :

Series: G

Endurance :105°C 1000 h

■ Features

■Specification

Operating temp. range

Rated W.V. range

Nominal cap. range

Capacitance tol.

-40 to + 105°C

6.3 to 50 V .DC

0.1 to 470 µ F

±20 % (120Hz/+20°C)

I < 0.01 CV or 3 (µ A) after 2 minutes (Whichever is the greater)

DC leakage current

W.V.

6.3

tan δ

(120Hz / +20°C)

0.30 0.22 0.16 0.14 0.12 0.12

W.V. (V)

6.3

Characteristics

at Low Temperature

( Impedance ratio at 120 Hz)

-25 / +20 °C

-40 / +20 °C

After applying rated working voltage for 1000 hours at +105 ±2°C, and then being atabilized at

+20°C, capacitors shall meet following limits.

Endurance

Shelf life

Capacitance change

tan δ

DC leakage current

< ±20% of initial measured value

< 200% of initial specified value

< initial specified value

After storage for 1000 hours at +105 ±2°C with no voltage applied and then being stabilized

at +20°C, capacitor shall meet the limits specified in “Endurance”.

After reflow soldering (230°C of peak temperature and reflow time less than 20 seconds.) and

then being stabilized at 20°C, capacitor shall meet the following limits, (Infrared ray oven is also

available.)

Resistance to

Soldering Heat

< ±10% of initial measured value

< initial specified value

Capacitance change

tan δ

DC leakage current

< initial specified value

■Explanation of Part Number

Common code

Shape

W.V. code Series code

Capacitance code

Suffix

Taping

W=12 mm

φ4(B)

W=16 mm φ5,φ6.3,φ8x6.2(C,D,E)

W=24 mm φ8x10.2, φ10x10.2(F,G)

■ Marking

■ Dimensions in mm (not to scale)

@A±0.2 ( ) reference size

0.3 max

Example : 50V22µF

Rated voltage (V.DC)

Capacitance (µF)

(-): Negative polarity

marking

+0.1

E,F,G=L±0.3

-0.2

(mm)

50 G

Series identification

Size

code

-0.20 to +0.15

4.0 5.4 4.3 5.5MAX 1.8 0.65±0.1 1.0 0.35

5.0 5.4 5.3 6.5MAX 2.2 0.65±0.1 1.5 0.35 -0.20 to +0.15

6.3 5.4 6.6 7.8MAX 2.6 0.65±0.1 1.8 0.35

8.0 6.2 8.3 9.5MAX 3.4 0.65±0.1 2.2 0.35

-0.20 to +0.15

8.0 10.2 8.3 10.0MAX 3.4 0.90±0.2 3.1 0.70 ±0.2

±0.2

10.0 10.2 10.3 12.0MAX 3.5 0.90±0.2 4.6 0.70

Design, Specifications are subject to change without notice. Ask factory for technical specifications before purchase and/or use.

Whenever a doubt about safety arises from this product, please inform us immediately for technical consulation without fail.

Mar. 2005

Ñ EE3 Ñ

Aluminum Electrolytic Capacitor/V-G

Discontinued

■ Case size / Ripple current

(mA) r.m.s. (120Hz/+105°C)

● Polarized

W.V.(V)

6.3(0J)

10(1A)

16(1C)

25(1E)

35(1V) 50(1H)

Cap.(µF)

0.1 (0R1)

(R22)

(R33)

(R47)

(010)

(2R2)

(3R3)

(4R7)

(100)

(220)

(330)

(470)

(101)

(221)

(331)

(471)

0.22

0.33

0.47

1.0

100

2.2

3.3

4.7

110

160

100

220

330

470

130

210

230

Ripple

current

Size

code

270

( ) shows W.V. and capacitance

Design, Specifications are subject to change without notice. Ask factory for technical specifications before purchase and/or use.

Whenever a doubt about safety arises from this product, please inform us immediately for technical consulation without fail.

Mar. 2005

Ñ EE4 Ñ

Aluminum Electrolytic Capacitor

Application Guidelines

1.2 Operating Temperature and Life Expectancy

(1) Expected life is affected by operating temperature.

Generally, each 10°C reduction in temperature

will double the expected life. Use capacitors at

the lowest possible temperature below the

maximum guaranteed temperature.

(2) If operating conditions exceed the maximum

guaranteed limit, rapid eIectrical parameter

deterioration will occur, and irreversible damage

will result.

1. Circuit Design

Ensure that operational and mounting conditions

follw the specified conditions detailed in the catalog

and specification sheets.

1.1 Operating Temperature and Frequency

Electrolytic capacitor electrical parameters are

normally specified at 20°C temperature and 120Hz

frequency. These parameters vary with changes in

temperature and frequency. Circuit designers

should take these changes into consideration.

(1) Effects of operating temperature on electrical

parameters

a)At higher temperatures, leakage current and

capacitance increase while equivalent series

resistance(ESR) decreases.

b)At lower temperatures, leakage current and

capacitance decrease while equivalent series

resistance(ESR) increases.

Check for maximum capacitor operating tempera-

tures including ambient temperature, internal

capacitor temperature rise caused by ripple current,

and the effects of radiated heat from power

transistors, IC?s or resistors.

Avoid placing components which could conduct

heat to the capacitor from the back side of the circuit

board.

(3)The formula for calculating expected Iife at lower

operating temperatures is as fllows;

L²= L1 x 2^T1-T2where,

(2) Effects of frequency on electrical parameters

a)At higher frequencies, capacitance and

impedance decrease while tan δ increases.

b)At lower frequencies, ripple current generated

heat will rise due to an increase in equivalent

series resistance (ESR).

L¹: Guaranteed life (h) at temperature, T1° C

L²: Expected life (h) at temperature,T2°C

T¹: Maximum operating temperature (°C)

T²: Actual operating temperature, ambient

temperature + temperature rise due to

ripple currentheating(°C)

A quick eference capacitor guide for estimating

exected life is included for your reference.

■ Expected Life Estimate Quick Reference Guide

■ Failure rate curve

120

110

100

1. 85°C2000h

2.105°C1000h

3.105°C2000h

4.105°C5000h

Initial failure period

Random failure period

Wear failure period

Life Time

Time

2000

5000 10,000 20,000

50,000 100,000 200,000

(h)

24h

operat-

ion

Years

15 20 30

Years

8h/d

Design, Specifications are subject to change without notice. Ask factory for technical specifications before purchase and/or use.

Whenever a doubt about safety arises from this product, please inform us immediately for technical consulation without fail.

Mar. 2005

– EE16 –

Aluminum Electrolytic Capacitor

■ Typical failure modes and their factors

Faliure mode

Faliure mechanism (internal phenomenon)

Production factor

Application factor

Overvoltage applied

Increase in inter-

nal temperature

Increase in

Vent operates

•

internal pressure

•

Excessive ripple current

Reverse voltage applied

Severe charging-discharging

Capacitance

reduction

Reduced anode foil

capacitance

•

Reduced cathode

foil capacitance

tan d increase

AC voltage applied

•

Defect of oxide film

•

Used for a high temperature

Deterioration of

oxide film

•

Insufficient

electrolyte

•

Leakage current

increase

•

Used for a long period of time

Stress applied to leads

Electrolyte evapora-

tion

Metal particles

in capacitor

•

Insulation breakdown of film

or electrolytic paper

Short circuit

•

Burr(s) on foil leads

Leads improperly

connected

Leads improperly connected

Mechanical stress

•

Open

Use of Halogenated solvent

Corrosion

Infiltration of Cl

•

Use of adhesive

Use of coating material

Design, Specifications are subject to change without notice. Ask factory for technical specifications before purchase and/or use.

Whenever a doubt about safety arises from this product, please inform us immediately for technical consulation without fail.

Mar. 2005

– EE17 –

Aluminum Electrolytic Capacitor

The vinyl sleeve of the capacitor can be damaged

if solder passes through a lead hole for

subsequently processed parts. Special care when

locating hole positions in proximity to capacitors is

recommended.

1.3 Common Application Conditions to Avoid

The following misapplication load conditions will

cause rapid deterioration to capacitor electrical

parameters. ln addition, rapid heating and gas

generation within the capacitor can occur causing

the pressure relief vent to operate and resuItant

leakage of electrolyte. Under extreme conditions,

explosion and fire could result. Leakinq electrolyte

is combustible and electrically conductive.

(1) Reverse Voltaqe

(3) Circuit Board Hole Spacing

The circuit board holes spacing should match the

capacitor lead wire spacing within the specified

tolerances. Incorrect spacing can cause excessive

lead wire stress during the insertion process. This

may resuIt in premature capacitor failure due to

short or open circuit, increased leakage current,

or electrolyte leakage.

DC capacitors have polarity. Verify correct polarity

before insertion. For circuits with changing or

uncertain polarity,use DC bipolar capacitors. DC

bipolar capacitors are not suitable for use in AC

circuits.

(4)Land/Pad Pattern

The circuit board land/pad pattern size for chip

capacitors is specified in the following table.

(2) Charqe/Discharqe Applications

Standard capacitors are not suitable for use in

repeating charge/discharge applications. For

charqe/discharqe applications consult us and advise

actual conditions.

[ Table of Board Land Size vs. Capacitor Size]

(3) Overvoltage

Do not appIy voltaqes exceeding the maximum

specified rated voltages. Voltage up to the surge

voltage rating are acceptable for short periods of

time. Ensure that the sum of the DC voltage and

the superimposed AC ripple voltage does not

exceed the rated voltage.

Board land part

(mm)

Size

(4) Ripple Current

A(φ3)

B(φ4)

C(φ5)

D(φ6.3)

E(φ8 x 6.2L)

0.6

1.0

1.5

1.8

2.2

3.1

4.6

1.5

1.6

2.0

2.2

2.5.

2.8

3.2

4.0

4.1

Do not apply ripple currents exceeding the maximum

specified value. For high ripple current applications,

use a capacitor designed for high rippIe currents

or contact us with your requirements.

Ensure that allowable ripple currents superimposed

on low DC bias voltages do not cause reverse voltage

conditions.

F(φ8 x 10.2L)

G(φ10 x 10.2L)

Among others, when the size a is wide , back fillet can

not be made, decreasing fitting strength.

1.4 Using Two or More Capacitors in Series

or Parallel

(1) Capacitors Connected in Parallel

The circuit resistance can closely approximate the

series resistance of the capacitor causing an

imbalance of ripple current loads within the

capacitors. Careful design of wiring methods can

minimize the possibility of excessive ripple currents

applied to a capacitor.

❉Decide considering mounting condition, solderability

and fitting strength, etc. based on the design

standards of your company.

(2) Capacitors Connected in Series

Normal DC leakage current differences among

capacitors can cause voltage imbalances. The use

of voltage divider shunt resistors with consideration

to leakage currents, can prevent capacitor voltage

imbaIances.

1.5 Capacitor Mounting Considerations

(1) DoubIe - Sided Circuit Boards

Avoid wiring Pattern runs which pass between

the mounted capacitor and the circuit board. When

dipping into a solder bath, excess solder may collect

under the capacitor by capillary action and

shortcircuit the anode and cathode terminals.

(2) Circuit Board Hole Positioning

Design, Specifications are subject to change without notice. Ask factory for technical specifications before purchase and/or use.

Whenever a doubt about safety arises from this product, please inform us immediately for technical consulation without fail.

Mar. 2005

– EE18 –

Aluminum Electrolytic Capacitor

(5)Clearance for Case Mounted Pressure

Relief Vents

2.Capacitor Handling Techniques

2.1Considerations Before Using

Capacitors with case mounted pressure relief vents

require sufficient clearance to allow for proper vent

operation. The minimum clearances are dependent

on capacitor diameters as follows.

(1) Capacitors have a finite life. Do not reuse or

recycle capacitors from used equipment.

(2) Transient recovery voltage may be generated in

the capacitor due to dielectric absorption. If

required, this voltage can be discharged with a

resistor with a value of about 1 kΩ.

(3) Capacitors stored for long periods of time may

exhibit an increase in leakage current. This can

be corrected by gradually applying rated voltage

in series with a resistor of approximately 1 kΩ.

(4) If capacitors are dropped, they can be damaged

mechanically or electrically. Avoid using dropped

capacitors.

f6.3 to f16 mm : 2 mm minimum,

f18 to f35 mm : 3 mm minimum.

f40 mm or greater: 5 mm minimum

(6)Clearance for Seal Mounted Pressure

Relief Vents

A hole in the circuit board directly under the seal

vent location is required to allow proper release

of pressure.

(7)Wiring Near the Pressure Relief Vent

Avoid locating high voltage or high current wiring

or circuit board paths above the pressure relief

vent. Flammable, high temperature gas exceeding

100°C may be released which could dissolve the

wire insulation and ignite.

(5) Dented or crushed capacitors should not be

used. The seal integrity can be compromised

and loss of electrolyte/shortened life can result.

2.2Capacitor Insertion

(8)Circuit Board Patterns Under the Capacitor

Avoid circuit board runs under the capacitor as

electrolyte leakage could cause an electrical short.

(9)Screw Terminal Capacitor Mounting

● Do not orient the capacitor with the screw terminal

side of the capacitor facing downwards.

● Tighten the terminal and mounting bracket screws

within the torque range specified in the

specification.

(1) Verify the correct capacitance and rated voltage

of the capacitor.

(2) Verify the correct polarity of the capacitor before

inserting.

(3) Verify the correct hole spacing before insertion

(land pattern size on chip type) to avoid stress

on the terminals.

(4) Ensure that the auto insertion equipment lead

clinching operation does not stress the capacitor

leads where they enter the seal of the capacitor.

For chip type capacitors, excessive mounting

pressure can cause high leakage current, short

circuit, or disconnection.

1.6Electrical Isolation of the Capacitor

Completely isolate the capacitor as follows.

● Between the cathode and the case (except for

axially leaded B types) and between the anode

terminal and other circuit paths.

● Between the extra mounting terminals (on T types)

and the anode terminal, cathode terminal, and

other circuit paths.

2.3Manual Soldering

(1) Observe temperature and time soldering

specifications or do not exceed temperatures of

350°C for 3 seconds or less.

(2) If lead wires must be formed to meet terminal

board hole spacing, avoid stress on the leadwire

where it enters the capacitor seal.

(3) If a soldered capacitor must be removed and

reinserted, avoid excessive stress to the capacitor

leads.

1.7Capacitor Sleeve

The vinyl sleeve or laminate coating is intended for

marking and identification purposes and is not meant

to electrically insulate the capacitor.

The sleeving may split or crack if immersed into

solvents such as toluene or xylene, and then exposed

to high temperatures.

(4) Aviod touching the tip of the soldering iron to the

capacitor, to prevent melting of the vinyl sleeve.

Always consider safety when designing equipment

and circuits. Plan for worst case failure modes such

as short circuits and open circuits which could occur

during use.

(1)Provide protection circuits and protection devices

to allow safe failure modes.

(2)Design redundant or secondary circuits where

possible to assure continued operation in case of

main circuit failure.

Design, Specifications are subject to change without notice. Ask factory for technical specifications before purchase and/or use.

Whenever a doubt about safety arises from this product, please inform us immediately for technical consulation without fail.

Mar. 2005

– EE19 –

Aluminum Electrolytic Capacitor

2.4 Flow Soldering

2.6Other Soldering Considerations

Rapid temperature rises during the preheat

operation and resin bonding operation can cause

cracking of the capacitor vinyl sleeve. For heat

curing, do not exceed 150°C for a maximum time of

2 minutes.

(1) Don not immerse the capacitor body into the

solder bath as excessive internal pressure could

result.

(2) Observe proper soldering conditions (temperature,

time, etc.). Do not exceed the specified limits.

(3) Do not allow other parts or components to touch

the capacitor during soldering.

2.7Capacitor Handling after Soldering

(1) Avoid movement of the capacitor after soldering

to prevent excessive stress on the leadwires

where they enter the seal.

(2) Do not use the capacitor as a handle when

moving the circuit board assembly.

2.5 Reflow Soldering for Chip Capacitors

(1) For reflow, use a thermal conduction system such

as infrared radiation (IR) or hot blast. Vapor heat

transfer systems (VPS) are not recommended.

(2) Observe proper soldering conditions (temperature,

time, etc.). Do not exceed the specified limits.

(3) Reflow should be performed one time. Consult us

for additional reflow restrictions.

(3) Avoid striking the capacitor after assembly to

prevent failure due to excessive shock.

5(s)

250

Peak

temperature

2.8 Circuit Board Cleaning

(1) Circuit boards can be immersed or ultrasonically

cleaned using suitable cleaning solvents for up

to 5 minutes and up to 6 0 ° C m a x imum

temperatures. The boards should be thoroughly

rinsed and dried.

200

160°C

150

Time in

200°C or more

120(s)

Time

100

Recommended cleaning solvents include

Pine Alpha ST-100S, Sunelec B-12, DK Beclear

CW-5790, Aqua Cleaner 210SEP, Cold Cleaner

P3-375, Telpen Cleaner EC-7R, Clean-thru 750H,

Clean-thru 750L, Clean thru 710M, Techno

Cleaner 219, Techno Care FRW-17, Techno

Care FRW-1, Techno Care FRV-1, IPA (isopropyl

alcohol)

Chip capacitor reflow guaranteed condition

240

230

220

210

✽ The use of ozone depleting cleaning agents are

not recommended in the interest of protecting

the environment.

30 40

(2) Avoid using the following solvent groups unless

specifically allowed for in the specification;

● Halogenated cleaning solvents: except for solvent

resistant capacitor types, halogenated solvents

can permeate the seal and cause internal

capacitor corrosion and failure. For solvent

resistant capacitors, carefully follow the

temperature and time requirements of the

specificaion. 1-1-1 trichloroe thane should never

be used on any aluminium electrolytic capacitor.

● Alkali solvents: could attack and dissolve the

aluminum case.

Time in 200°C or more (s)

(φ3 to 6.3φ)

240

230

220

210

40 50

Time in 200°C or more (s)

(φ8 to φ10)

● Petroleum based solvents: deterioration of the

rubber seal could result.

● Xylene: deterioration of the rubber seal could

result.

● Acetone: removal of the ink markings on the

vinyl sleeve could result.

EB Series

240

230

220

210

✽ Temperature measuring method: Measure

temperature in assuming quantitative production, by

sticking the thermo-couple to the capacitor upper

10 20 30 40 50 60

Time in 200°C or more (s)

(φ10 to φ18)

part with epoxy adhesives.

Design, Specifications are subject to change without notice. Ask factory for technical specifications before purchase and/or use.

Whenever a doubt about safety arises from this product, please inform us immediately for technical consulation without fail.

Mar. 2005

– EE20 –

Aluminum Electrolytic Capacitor

(3) A thorough drying after cleaning is required to

remove residual cleaning solvents which may be

trapped between the capacitor and the circuit

board. Avoid drying temperatures which exceed

the maximum rated temperature of the capacitor.

(4) Monitor the contamination levels of the cleaning

solvents during use by electrical conductivity, pH,

specific gravity, or water content. Chlorine levels

can rise with contamination and adversely affect

the performance of the capacitor.

3.2Electrical Precautions

(1) Avoid touching the terminals of the capacitor as

possible electric shock could result. The exposed

aluminium case is not insulated and could also

cause electric shock if touched.

(2)Avoid short circuiting the area between the

capacitor terminals with conductive materials

including liquids such as acids or alkaline solutions.

4.Emergency Procedures

✽ Please consult us for additonal information about

acceptable cleaning solvents or cleaning methods.

(1) If the pressure relief vent of the capacitor

operates, immediately turn off the equipment and

disconnect from the power source. This will

minimize additional damage caused by the

vaporizing electrolyte.

Type

Cleaning permitted

Series

Surface mount type

V(Except EB

Series)

Bi-polar SU

Lead type

(2) Avoid contact with the escaping electrolyte gas

which can exceed 100°C temperatures.

L(~ 100V)

If electrolyte or gas enters the eye, immediately

flush the eye with large amounts of water.

If electrolyte or gas is ingested by mouth, gargle

with water. If electrolyte contacts the skin, wash

with soap and water.

Bi-polar KA

NHG

L(~ 100V)

5. Long Term Storage

Leakage current of a capacitor increases with long

storage times. The aluminium oxide film deteriorates

as a function of temperature and time. If used

without reconditioning, an abnormally high current

will be required to restore the oxide film. This current

surge could cause the circuit or the capacitor to fail.

Capacitor should be reconditioned by applying rated

voltage in series with a 1000 Ω, current limiting

resistor for a time period of 30 minutes.

Snap-in type

TS UP

TS HA

L(~ 100V)

2.9 Mounting Adhesives and Coating Agents

When using mounting adhesives or coating agents to

control humidity, avoid using materials containing

halogenated solvents. Also, avoid the use of

chloroprene based polymers.

✽ After applying adhesives or coatings, dry thoroughly

to prevent residual solvents from being trapped

between the capacitor and the circuit board.

5.1Environmental Conditions (Storage)

Capacitors should not be stored in the following

environments.

3.Precautions for using capacitors

3.1Environmental Conditions

(1) Temperature exposure above 35°C or below 15 °C.

(2) Direct contact with water, salt water, or oil.

(3) High humidity conditions where water could

condense on the capacitor.

(4) Exposure to toxic gases such as hydrogen

sulfide,sulfuric acid, nitric acid, chlorine, or

ammonia.

(5) Exposure to ozone, radiation, or ultraviolet rays.

(6) Vibration and shock conditions exceeding

specified requirements.

Capacitors should not be used in the following

environments.

(1) Temperature exposure above the maximum rated

or below the minimum rated temperature of the

capacitor.

(2) Direct contact with water, salt water, or oil.

(3) High humidity conditions where water could

condense on the capacitor.

(4) Exposure to toxic gases such as hydrogen sulfide,

sulfuric acid, nitric acid, chlorine, or ammonia.

(5) Exposure to ozone, radiation, or ultraviolet rays.

(6) Vibration and shock conditions exceeding

specified requirements.

Design, Specifications are subject to change without notice. Ask factory for technical specifications before purchase and/or use.

Whenever a doubt about safety arises from this product, please inform us immediately for technical consulation without fail.

Mar. 2005

– EE21 –

Aluminum Electrolytic Capacitor

6.Capacitor Disposal

When disposing of capacitors, use one of the

following methods.

●

Incinerate after crushing the capacitor or

puncturing the can wall (to prevent explosion due

to internal pressure rise). Capacitors should be

incinerated at high temperatures to prevent the

release of toxic gases such as chlorine from the

polyvinyl chloride sleeve, etc.

●

Dispose of as solid waste.

Local laws may have specific disposal

requirements which must be followed.

The application guidelines above are taken from:

Technical Report EIAJ RCR-2367 issued by the Japan

Electronic Industry Association, Inc. -

Guideline of notabilia for aluminium electrolytic

capacitors with non-solid electrolytic for use in

electronic equipment.

Refer to this Technical Report for additional details.

Design, Specifications are subject to change without notice. Ask factory for technical specifications before purchase and/or use.

Whenever a doubt about safety arises from this product, please inform us immediately for technical consulation without fail.

Mar. 2005

– EE22 –

ECEV50G010P [PANASONIC]

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