EFOLM1695B0 [PANASONIC]
Ceramic Resonator, 16.93MHz Nom, ROHS COMPLIANT, CERAMIC PACKAGE-2;
| 型号： | EFOLM1695B0 |
| 厂家： | 
PANASONIC |
| 描述： | Ceramic Resonator, 16.93MHz Nom, ROHS COMPLIANT, CERAMIC PACKAGE-2 晶体 谐振器 |
| 文件： | 总4页 (文件大小：247K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
Ceramic Resonators, Chip Type
Ceramic Resonators, Chip Type
(2 Array Type)
Type:
EFOP
EFOD
EFOPS
EFOPM
EFODM
EFOLM
Type:
Type:
Type:
Type:
Type:
■ Features
■ Recommended Applications
● Clock generator for microprocessors
● Carrier circuit between telecommunication equipment
(Telephone to telephone, personal computer to printer)
● Encased in a ceramic package
● High reliability against soldering heat and mechanical
stress
● Moisture-proof sealing
(See Page 175 to 176)
■ Handling Precautions
● 1.2 mm maximum in thickness (PS/PM/DM/LM)
● Designed for reflow soldering
● Flat-bottom plate for better mounting
● RoHS compliant
■ Packaging Specifications
See Page 174, 177
■ Explanation of Part Numbers
1
2
3
4
5
6
7
8
9
10
11
12
E
F
O
3
5
8
4
Design No.
Nominal Oscillation
Frequency
Frequency
Tolerance
Product Code
Ceramic
Type
Packaging Style
B
Bulk Pack
Chip Type with 2-terminals
EFO
3584
3.58 MHz
Resonators
0
1.0 %
0.3 %
0.5 %
Embossed
Taping
2 to 13 MHz
13.1 to 20 MHz
P
D
E
1695 16.93 MHz
(Example)
3
5
1
2
3
4
5
6
7
8
9
10
11
12
E
F
O
4
0
0
4
Design No.
Nominal Oscillation
Frequency
Frequency
Tolerance
Product Code
Ceramic
Type
Packaging Style
B
Bulk Pack
Chip Type with 2-terminals
EFO
4004
4.00 MHz
Resonators
0
3
5
1.0 %
0.3 %
0.5 %
Embossed
Taping
4 to 13 MHz
16 to 20 MHz
30 to 50 MHz
4 to 13 MHz
12 to 20 MHz
PM
E
1695 16.93 MHz
LM
4005
40.0 MHz
(Example)
PS
DM
Frequency range
(MHz)
Frequency Temperature Characteristics
(–20 to +80 °C)
Attached Capacitors
(Reference)
Part Number
2.00 to 8.39
8.40 to 13.0
13.1 to 20.0
4.00 to 8.39
8.40 to 13.0
4.00 to 8.39
8.40 to 13.0
12.0 to 20.0
16.0 to 20.0
30.0 to 50.0
0.3 %
1.0 %
1.0 %
0.6 %
1.0 %
0.3 %
1.0 %
1.0 %
1.0 %
0.3 %
EFOP
EFOD
33 pF
33 pF
21 pF
EFOPS
EFOPM
EFODM
EFOLM
33 pF
18 pF
10 pF
Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use.
Should a safety concern arise regarding this product, please be sure to contact us immediately.
00 Apr. 2008
– EC171 –
Ceramic Resonators, Chip Type
■ Dimensions in mm (not to scale)
Recommended Land Dimensions
[Type EFOP]·····2.0 to 13.0 MHz
[Type EFOP, EFOPM]
Manufacturer's Logo
Oscillating Frequency
Serial No.
2.5
2.5
(7.30)
(2.70)
Terminal
Electrodes
3.20+0.30
7.80+0.50
0.20
0.20
2-0.9 to 1.2
6–R(0.20)
4-(1.00)
2.50 0.20
2.50 0.20
[Type EFOPM]·····4.0 to 13.0 MHz
Manufacturer's Logo
Oscillating Frequency
Serial No.
(7.30)
(2.70)
Terminal
Electrodes
+0.30
–0.20
3.20
+0.50
–0.20
7.80
6–R(0.20)
2–(1.00)
2.50 0.20
2.50 0.20
[Type EFOPS]·····4.0 to 13.0 MHz
[Type EFOPS]
Manufacturer's Logo
Oscillating Frequency
Serial No.
1.5
1.5
(1.60)
Terminal
Electrodes
4.50 0.20
2.00 0.30
2-0.55
2-0.8
6-(0.60)
2–(0.55)
2–1.50 0.20
[Type EFOD]·····13.1 to 20.0 MHz
[Type EFOD]
Manufacturer's Logo
Oscillating Frequency
Serial No.
1.9 1.9
(2.70)
(5.00)
Terminal
Electrodes
+0.25
–0.15
+0.50
–0.20
3.20
5.50
2-1.2
6–R(0.20)
4–(1.20)
1.90 0.20
1.90 0.20
Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use.
Should a safety concern arise regarding this product, please be sure to contact us immediately.
00 Apr. 2008
– EC172 –
Ceramic Resonators, Chip Type
■ Dimensions in mm (not to scale)
Recommended Land Dimensions
[Type EFODM]·····12.0 to 20.0MHz
[Type EFODM]
Manufacturer's Logo
1.351.35
Oscillating Frequency
Serial No.
(2.40)
(3.70)
Terminal
Electrodes
2-0.8
4.10 0.20
2.90 0.30
6–R(0.20)
2–(0.80)
2–1.35 0.20
[Type EFOLM]·····16.0 to 20.0, 30.0 to 50.0 MHz
[Type EFOLM]
Manufacturer's Logo
Oscillating Frequency
Serial No.
1.6 1.6
(3.10)
(3.90)
Terminal
Electrodes
+0.30
–0.20
+0.50
–0.20
3.60
4.40
2-0.7 to 1.0
6–R(0.20)
2–(0.80)
2–1.60 0.20
■ Test Circuits Diagram
For Oscillation Circuit
For Loop Gain
+
5 V
+
5 V
14 13
11
9
14 13
11
9
Frequency
IC
1
2
3
4
5
7
1
2
3
4
5
7
0.01
µPD4069UBC,
TC4069UBP
or similar
µPD74HCU,
TC74HCU04AP
or similar
IN
V1
Ceramic
Resonator
1 Mꢀ
1 Mꢀ
2.00 to 8.39 MHz
Ceramic
Resonator
G=20 log (V0/V1)
OUT
T.G.
Frequency Counter
Output
=–20 dBm
8.40 to 50.0 MHz
FET probe
V0
10 Mꢀ min.
2 pF max.
·····
■ Typical Characteristics
Temperature Characteristics
Type EFOP
0.8
Type EFOD
0.8
Type EFOPS
0.8
0.6
0.4
4.0 to 8.39 MHz
2.0 to 8.39 MHz
0.6
0.6
0.4
8.4 to 13 MHz
0.4
0.2
0.0
0.2
0.0
0.2
0.0
–0.2
–0.4
–0.6
–0.8
–0.2
–0.4
–0.6
–0.8
–0.2
–0.4
–0.6
–0.8
8.4 to 13 MHz
–20
0
20 40 60 80
–20
0
20 40 60 80
–20
0
20 40 60 80
Temperature (°C)
Temperature (°C)
Temperature (°C)
Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use.
Should a safety concern arise regarding this product, please be sure to contact us immediately.
00 Apr. 2008
– EC173 –
Ceramic Resonators, Chip Type
·····
■ Typical Characteristics
Temperature Characteristics
Type EFOPM
Type EFODM
Type EFOLM
0.8
0.8
0.6
0.4
0.8
0.6
0.4
30 to 50 MHz
16 to 20 MHz
2.0 to 8.39 MHz
0.6
8.4 to 13 MHz
0.4
0.2
0.0
0.2
0.0
0.2
0.0
–0.2
–0.4
–0.6
–0.8
–0.2
–0.4
–0.6
–0.8
–0.2
–0.4
–0.6
–0.8
–20
0
20 40 60 80
–20
0
20 40 60 80
–20
0
20 40 60 80
Temperature (°C)
Temperature (°C)
Temperature (°C)
■ Packaging Specifications
Supplied in bulk or taped & reel packing style
Standard Packing Quantity
●
Type
EFOP, EFOPM
EFOPS
Embossed Taping
Bulk
2500 pcs./reel
2000 pcs./reel
1000 pcs./reel
500 pcs./bag
EFOD, EFODM, EFOLM
Dimensions for Reel in mm (not to scale)
●
T
[Type EFOP, EFOPM]
φA
330
φB
C
D
E
Dim.
(mm)
5
80 min.
13.0 0.5 21.0 0.8
2.0 0.5
E
W
16.4+2.0
T
t
r
C
Dim.
(mm)
22.4 max.
3 max.
1.0
0
[Type EFOPS, EFOD, EDODM, EFOLM]
D
r
φA
180
φB
C
D
E
Dim.
(mm)
5
60 min.
13.0 0.5 21.0 0.8
2.0 0.5
W
12.4+2.0
T
t
r
Dim.
(mm)
18.4 max.
3 max.
1.0
0
φ
W
t
A
Embossed Taping
●
[Type EFOPS]
[Type EFOP, EFOPM]
Feeding hole
t
1
Feeding hole
Chip pocket
φD
0
Chip pocket
φD0
P0
t
1
3.20
P2
2.00
A
P
1
P
0
A
P
1
t
2
P
2
Tape running
direction
t2
Chip Component
Tape running direction
Chip Component
A
B
W
F
E
P1
A
B
W
F
E
P1
Dim.
Dim.
(mm)
(mm)
3.7 0.2 8.3 0.2 16.0 0.3 7.5 0.1 1.75 0.10 8.0 0.1
2.6 0.2 5.1 0.2 12.0 0.3 5.5 0.1 1.75 0.10 4.0 0.1
P2
P0
φD0
t1
t2
P2
P0
φD0
t1
t2
Dim.
(mm)
Dim.
(mm)
2.0 0.1 4.0 0.1
1.5+0.1
0.3
3.5 max.
2.0 0.1 4.0 0.1
1.5+0.1
0.6 max. 3.0 max.
0
0
[Type EFOD, EFODM, EFOLM]
Feeding hole
φD
0
t1
Chip pocket
3.60
P
0
A
P1
Type EFOLM (Example)
Tape running direction
t2
P2
Chip Component
Dim. (mm)
A
B
1
2
A
B
W
F
E
P1
Dim.
(mm)
12.0 0.3 5.5 0.1 1.75 0.10 8.0 0.1
1
2
Type EFOD
Type EFODM
Type EFOLM
3.7 0.2
3.4 0.2
4.1 0.2
6.0 0.2
4.6 0.2
4.9 0.2
P2
P0
φD0
t1
t2
Dim.
(mm)
2.0 0.1 4.0 0.1
1.5+0.1
0.6 max. 3.0 max.
0
Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use.
Should a safety concern arise regarding this product, please be sure to contact us immediately.
00 Apr. 2008
– EC174 –
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