EFOSS [PANASONIC]

Ceramic Res o na tors, Chip Type (3 Array Type) RoHS compliant; 陶瓷RES Ø娜器,芯片型号( 3阵列类型)符合RoHS标准
EFOSS
型号: EFOSS
厂家: PANASONIC    PANASONIC
描述:

Ceramic Res o na tors, Chip Type (3 Array Type) RoHS compliant
陶瓷RES Ø娜器,芯片型号( 3阵列类型)符合RoHS标准

文件: 总5页 (文件大小:256K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
Ceramic Resonators, Chip Type  
Ceramic Resonators, Chip Type  
(3 Array Type)  
Type:  
EFOS  
Type:  
EFOB  
Type:  
EFOSS  
Type:  
EFOSM  
Type:  
EFOBM  
Type:  
EFOJM  
Recommended Applications  
Clock generator for microprocessors  
Carrier circuit between telecommunication equipment  
(Telephone to telephone, personal computer to printer)  
Features  
Encased in a ceramic package  
High reliability against soldering heat and mechanical  
stress  
Moisture-proof sealing  
(See Page 175 to 176)  
Handling Precautions  
1.2 mm maximum (SS/SM/BM/JM),  
Designed for reflow soldering  
Flat-bottom plate for better mountings  
Simplifies oscillation circuits by reducing the number  
of circuit parts  
Packaging Specifications  
See Page 169 to 177  
RoHS compliant  
Explanation of Part Numbers  
1
2
3
4
5
6
7
8
9
10  
11  
12  
E
F
O
3
5
8
4
Design No.  
Nominal Oscillation  
Frequency  
Frequency  
Tolerance  
Product Code  
Ceramic  
Type  
Packaging Style  
B
Bulk Pack  
Built-In Capacitors  
Type with 3-terminals  
EFO  
3584  
3.58 MHz  
Resonators  
0
1.0 %  
0.3 %  
0.5 %  
Embossed  
Taping  
E
2 to 13 MHz  
13.1 to 20 MHz  
S
B
1695 16.93 MHz  
(Example)  
3
5
1
2
3
4
5
6
7
8
9
10  
11  
12  
E
F
O
4
0
0
4
Design No.  
Nominal Oscillation  
Frequency  
Frequency  
Tolerance  
Product Code  
Ceramic  
Type  
Packaging Style  
Built-In Capacitors  
Type with 3-terminals  
B
Bulk Pack  
EFO  
4004  
4.00 MHz  
Resonators  
0
3
5
1.0 %  
0.3 %  
0.5 %  
Embossed  
Taping  
E
4 to 13 MHz  
4 to 13 MHz  
12 to 20 MHz  
16 to 20 MHz  
30 to 50 MHz  
SS  
SM  
BM  
1695 16.93 MHz  
2005 20.00 MHz  
4005 40.00 MHz  
(Example)  
JM  
Frequency range  
(MHz)  
Frequency Temperature Characteristics  
(–20 to +80 °C)  
Built-in Capacitors  
(Reference)  
Part Number  
2.00 to 8.39  
8.40 to 13.0  
13.1 to 20.0  
4.00 to 8.39  
8.40 to 13.0  
4.00 to 8.39  
8.40 to 13.0  
12.0 to 20.0  
16.0 to 20.0  
30.0 to 50.0  
0.2 %  
1.0 %  
0.5 %  
0.2 %  
0.3 %  
0.2 %  
1.0 %  
0.3 %  
0.5 %  
0.2 %  
EFOS  
EFOB  
33 pF  
33 pF  
21 pF  
EFOSS  
EFOSM  
EFOBM  
EFOJM  
33 pF  
18 pF  
10 pF  
Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use.  
Should a safety concern arise regarding this product, please be sure to contact us immediately.  
01 Feb. 2009  
– EC166 –  
Ceramic Resonators, Chip Type  
Dimensions in mm (not to scale)  
Recommended Land Dimensions  
[Type EFOS]·····2.0 to 13.0 MHz  
[Type EFOS, EFOSM]  
Oscillating Frequency  
Serial No.  
2.5  
2.5  
(7.30)  
(2.70)  
Terminal  
Electrodes  
+0.50  
7.80  
–0.20  
+0.30  
3.20  
–0.20  
3-0.9 to 1.2  
6–R(0.20)  
6-(1.00)  
2.50 0.20  
2.50 0.20  
[Type EFOSM]·····4.0 to 13.0 MHz  
Oscillating Frequency  
Serial No.  
(7.30)  
(2.70)  
Terminal  
Electrodes  
+0.30  
–0.20  
3.20  
+0.50  
–0.20  
7.80  
6–R(0.20)  
3–(1.00)  
2.50 0.20  
2.50 0.20  
[Type EFOSS]·····4.0 to 13.0 MHz  
[Type EFOSS]  
Oscillating Frequency  
Serial No.  
1.5  
1.5  
(1.60)  
Terminal  
Electrodes  
2.00 0.30  
4.50 0.20  
3-0.55  
3-0.8  
3–(0.55)  
6–(0.60)  
2–1.50 0.20  
[Type EFOB]·····13.1 to 20.0 MHz  
[Type EFOB]  
Oscillating Frequency  
Serial No.  
1.9 1.9  
(2.70)  
(5.00)  
Terminal  
Electrodes  
5.50+00..5200  
+0.25  
–0.15  
3.20  
6–R(0.20)  
3-1.2  
6–(1.20)  
1.90 0.20  
1.90 0.20  
Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use.  
Should a safety concern arise regarding this product, please be sure to contact us immediately.  
01 Feb. 2009  
– EC167 –  
Ceramic Resonators, Chip Type  
Dimensions in mm (not to scale)  
Recommended Land Dimensions  
[Type EFOBM]·····12.0 to 20.0 MHz  
[Type EFOBM]  
Oscillating Frequency  
Serial No.  
(2.40)  
1.351.35  
(3.70)  
Terminal  
Electrodes  
2.90 0.30  
4.10 0.20  
6–R(0.20)  
3–(0.80)  
3-0.8  
2–1.35 0.20  
[Type EFOJM]·····16.0 to 20.0, 30.0 to 50.0 MHz  
[Type EFOJM]  
Oscillating Frequency  
Serial No.  
1.6 1.6  
(3.10)  
(3.90)  
Terminal  
Electrodes  
+0.30  
+0.50  
4.40  
3.60  
–0.20  
–0.20  
6–R(0.20)  
3–(0.80)  
3-0.7 to 1.0  
2–1.60 0.20  
Test Circuits Diagram  
For Oscillation Circuit  
For Loop Gain  
+
+
5 V  
IC  
5 V  
IC  
14 13  
11  
9
14 13  
11  
9
1
2
3
4
5
7
1
2
3
4
5
7
Frequency  
IC  
0.01  
IN  
V1  
1 Mꢀ  
1 Mꢀ  
µPD4069UBC,  
TC4069UBP  
or similar  
G=20 log (V0/V1)  
OUT  
2.00 to 8.39 MHz  
T.G.  
Output  
Frequency Counter  
Ceramic Resonator  
=–20dBm  
FET probe  
10 Mmin.  
2 pF max.  
µPD74HCU,  
TC74 HCU04AP  
or similar  
V0  
8.40 to 50.0 MHz  
Ceramic Resonator  
Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use.  
Should a safety concern arise regarding this product, please be sure to contact us immediately.  
01 Feb. 2009  
– EC168 –  
Ceramic Resonators, Chip Type  
·····  
Typical Characteristics  
Temperature Characteristics  
Type EFOS  
Type EFOB  
Type EFOSS  
0.8  
0.6  
0.4  
0.2  
0.8  
0.6  
0.4  
0.2  
0.8  
0.6  
0.4  
2.0 to 8.39 MHz  
8.4 to 13 MHz  
4.0 to 8.39 MHz  
0.2  
0.0  
0.0  
0.0  
–0.2  
–0.4  
–0.6  
–0.8  
–0.2  
–0.4  
–0.6  
–0.8  
–0.2  
–0.4  
–0.6  
–0.8  
8.4 to 13 MHz  
–20  
0
20 40 60 80  
–20  
0
20 40 60 80  
–20  
0
20 40 60 80  
Temperature (°C)  
Temperature (°C)  
Temperature (°C)  
Type EFOSM  
Type EFOBM  
Type EFOJM  
0.8  
0.8  
0.6  
0.4  
0.8  
0.6  
0.4  
30 to 50 MHz  
16 to 20 MHz  
2.0 to 8.39 MHz  
8.4 to 13 MHz  
0.6  
0.4  
0.2  
0.2  
0.2  
0.0  
0.0  
0.0  
–0.2  
–0.4  
–0.6  
–0.2  
–0.4  
–0.6  
–0.2  
–0.4  
–0.6  
–0.8  
–0.8  
–0.8  
–20  
0
20 40 60 80  
–20  
0
20 40 60 80  
–20  
0
20 40 60 80  
Temperature (°C)  
Temperature (°C)  
Temperature (°C)  
Packaging Specifications  
Standard Packing Quantity  
Type  
EFOS, EFOSM  
EFOSS  
Embossed Taping  
Bulk  
500 pcs./bag  
2500 pcs./reel  
2000 pcs./reel  
1000 pcs./reel  
EFOB , EFOBM, EFOJM  
Dimensions for Reel in mm (not to scale)  
[Type EFOS, EFOSM]  
T
φA  
330  
φB  
C
D
E
Dim.  
(mm)  
5
80 min.  
13.0 0.5 21.0 0.8  
2.0 0.5  
E
C
W
16.4+2.0  
T
t
r
Dim.  
(mm)  
22.4 max.  
3 max.  
1.0  
0
D
r
[Type EFOSS, EFOB, EFOBM, EFOJM]  
φA  
180  
φB  
C
D
E
Dim.  
(mm)  
5
60 min.  
13.0 0.5 21.0 0.8  
2.0 0.5  
φ
W
t
A
W
12.4+2.0  
T
t
r
Dim.  
(mm)  
18.4 max.  
3 max.  
1.0  
0
Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use.  
Should a safety concern arise regarding this product, please be sure to contact us immediately.  
01 Feb. 2009  
– EC169 –  
Ceramic Resonators, Chip Type  
[Type EFOS, EFOSM]  
[Type EFOSS]  
Feeding hole  
t1  
Feeding hole  
Chip pocket  
φD  
0
Chip pocket  
φD0  
P
0
t
1
3.20  
P2  
2.00  
A
P
1
P
0
A
P
1
t2  
P
2
Tape running  
direction  
t
2
Chip Component  
Tape running direction  
Chip Componen  
A
B
W
F
E
P1  
A
B
W
F
E
P1  
Dim.  
Dim.  
(mm)  
(mm)  
3.7 0.2 8.3 0.2 16.0 0.3 7.5 0.1 1.75 0.10 8.0 0.1  
2.6 0.2 5.1 0.2 12.0 0.3 5.5 0.1 1.75 0.10 4.0 0.1  
P2  
P0  
φD0  
t1  
t2  
P2  
P0  
φD0  
t1  
t2  
Dim.  
(mm)  
Dim.  
(mm)  
2.0 0.1 4.0 0.1  
1.5+0.1  
0.3  
3.5 max.  
2.0 0.1 4.0 0.1  
1.5+0.1 0.6 max. 3.0 max.  
0
0
[Type EFOB, EFOBM, EFOJM]  
Feeding hole  
φD  
0
t1  
Chip pocket  
3.60  
P0  
A
P
1
Type EFOJM  
(Example)  
t
2
P2  
Chip Component  
Tape running direction  
A
B
W
F
E
P1  
Dim.  
(mm)  
12.0 0.3 5.5 0.1 1.75 0.10 8.0 0.1  
1
2
P2  
P0  
φD0  
t1  
t2  
Dim.  
(mm)  
2.0 0.1 4.0 0.1  
1.5+0.1 0.6 max. 3.0 max.  
0
Dim. (mm)  
A
B
1
2
Type EFOB  
Type EFOBM  
Type EFOJM  
3.7 0.2  
3.4 0.2  
4.1 0.2  
6.0 0.2  
4.6 0.2  
4.9 0.2  
Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use.  
Should a safety concern arise regarding this product, please be sure to contact us immediately.  
01 Feb. 2009  
– EC170 –  

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