ERA2A0402 [PANASONIC]

Metal Film Chip Resistors, High Reliability Type; 金属片式电阻器，高可靠型


型号：	ERA2A0402
厂家：	PANASONIC
描述：	Metal Film Chip Resistors, High Reliability Type 金属片式电阻器，高可靠型电阻器
文件：	总4页 (文件大小：189K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

Metal Film Chip Resistors, High Reliability Type

Metal Film Chip Resistors,

High Reliability Type

0402, 0603, 0805, 1206

Type:

ERA 2A, 3A, 6A, 8A

■ Features

...............

..............

High reliability

Stable at high temperature and humidity

●

(85 °C 85 %RH rated load, Category temperature range : –55 to +155 °C)

Small resistance tolerance and Temperature Coefﬁcient of Resistance

Low current noise, excellent non-linearity

High accuracy

●

.........

......

High performance

Reference Standard

IEC 60115-8, JIS C 5201-8, EIAJ RC-2133A

■ Explanation of Part Numbers

Product Code

Size, Power Rating

Type: inches Power Rating

Resistance Tolerance

Packaging Methods

Packaging

Temperature Coefficient

Code

Tolerance

0.05 %

0.1 %

Type

Metal Film

Chip Resistors

Code

T.C.R.

Code

10ꢀ10^–6/°C (ppm/°C)

15ꢀ10^–6/°C (ppm/°C)

25ꢀ10^–6/°C (ppm/°C)

50ꢀ10^–6/°C (ppm/°C)

100ꢀ10^–6/°C (ppm/°C)

0.063 W

2A : 0402

Punched Carrier

Taping (2 mm pitch)

ERA2A

0.1 W

3A : 0603

ERA3A

ERA6A

ERA8A

0.125 W

0.5 %

6A : 0805

Punched Carrier

Taping (4 mm pitch)

0.25 W

8A : 1206

Resistance Value

The first two digits are significant figures of resistance

and the third one denotes number of zeros following.

(ex.) 102 : 1 kꢁ

■ Construction

■ Dimensions in mm (not to scale)

Protective coating

Electrode (Inner)

Alumina substrate

Electrode

(Between)

Dimensions (mm)

Type

Mass (Weight)

[g/1000pcs.]

(inches)

0.50^+–0.1⁰⁰⁵0.15

0.20

0.10

0.20

0.10

0.20

0.25

0.10

0.20

0.25

0.05

0.10

ERA2A

(0402)

1.00

0.25

0.35

0.6

ERA3A

(0603)

1.60

2.00

3.20

0.80

1.25

1.60

0.30

0.40

0.50

0.30

0.40

0.50

0.45

0.50

0.60

High reliability

metal film

Electrode (Outer)

0.10

ERA6A

(0805)

ERA8A

(1206)

Design and speciﬁcations are each subject to change without notice. Ask factory for the current technical speciﬁcations before purchase and/or use.

Should a safety concern arise regarding this product, please be sure to contact us immediately.

Mar. 2009

Metal Film Chip Resistors, High Reliability Type

■ Ratings

Power

Rating

Maximum

Overload

Voltage⁽²⁾

(V)

Category Temperature

Range (Operating

Temperature Range)

(°C)

Limiting Element

Voltage (Maximum

RCWV)⁽¹⁾(V)

Resistance

T.C.R.

Resistance

Range⁽³⁾

(ꢁ)

Type

(inches) at 85 °C

(W)

Type

(detail)

Tolerance [ꢀ10^–6/°C

(%)

(ppm/°C)]

100

ERA2AKD

ERA2AED

ERA2AEB

ERA3AHD

ERA3AED

ERA3AEB

ERA3APB

ERA3ARB

ERA3ARW

ERA6AHD

ERA6AED

ERA6AEB

ERA6APB

ERA6ARB

ERA6ARW

ERA8AHD

ERA8AED

ERA8AEB

0.5

0.1

0.5

0.1

0.05

0.5

0.1

0.05

0.5

0.1

10 to

47 to 100 k (E24)

10 to 43 (E24)

43 (E24)

ERA2A

0.063

(0402)

47 to 330 k (E24)

470 to 100 k (E24)

1 k to 100 k (E24)

ERA3A

0.1

150

(0603)

–55 to +155

10 to

43 (E24)

47 to 1 M (E24)

470 to 100 k (E24)

1 k to 100 k (E24)

ERA6A

0.125

100

150

200

300

(0805)

10 to

43 (E24)

ERA8A

0.25

(1206)

47 to 1 M (E24)

ꢂ

(1) Rated Continuous Working Voltage (RCWV) shall be determined from RCWV= Rated Power ꢀ Resistance Values, or Limiting Element Voltage

(max. RCWV) listed above, whichever less.

(2) Overload (Short-time Overload) Test Voltage (SOTV) shall be determined from SOTV=2.5 ꢀ Power Rating or max. Overload Voltage listed above

whichever less.

(3) E96 series resistance values are also available. Please contact us for details.

–55 °C

100

85 °C

Power Derating Curve

For resistors operated in ambient temperatures above

85 °C, power rating shall be derated in accordance

with the ﬁgure on the right.

155 °C

–60 –40 –20

20 40 60 80 100 120 140 160 180

Ambient Temperature (°C)

■ Packaging Methods (Taping)

● Standard Quantity

Type

ERA2A

Kind of Taping

Pitch (P₁)

2 mm

Quantity

10000 pcs./reel

5000 pcs./reel

Punched Carrier Taping

ERA3A, 6A, 8A

4 mm

● Carrier Taping

● Taping Reel

Sprocket hole

φD₀

Compartment

φC

Chip component

Tape running direction

P₁P₂P₀

φA

Type

0.05

0.10

0.15

0.05

0.10

0.20

0.67

1.10

1.65

2.00

1.17

1.90

2.50

3.60

Dimensions

(mm)

Dimensions

(mm)

180.0⁺^–⁰^3.0

60 min.

13.0

0.20

0.10

0.05

0.10

1.0

8.00

3.50

1.75

P₁

2.00

P₂

P₀

4.00

0.52

0.70

0.84

形式

0.10

0.05

Dimensions

(mm)

Dimensions

(mm)

0.05

+0.10

–0

1.0

2.00

1.50

9.0

11.4

4.00

6A, 8A

Design and speciﬁcations are each subject to change without notice. Ask factory for the current technical speciﬁcations before purchase and/or use.

Should a safety concern arise regarding this product, please be sure to contact us immediately.

Aug. 2009

Metal Film Chip Resistors, High Reliability Type

■ Recommended Land Pattern

In case of ﬂow soldering, the land width must be smaller than the Chip Resistor width to properly control the solder amount

properly. Generally, the land width should be 0.7 to 0.8 times (W) of the width of chip resistor. In case of reﬂow soldering,

solder amount can be adjusted, therefore the land width should be set to 1.0 to 1.3 times chip resistor width (W).

Dimensions (mm)

Type

(inches)

Chip Resistor

ERA2A(0402)

ERA3A(0603)

ERA6A(0805)

ERA8A(1206)

0.5 to 0.6

1.4 to 1.6

2 to 2.2

0.4 to 0.6

0.8 to 1

0.7 to 0.9

1 to 1.4

2 to 2.4

3.2 to 3.8

4.4 to 5.0

0.9 to 1.4

1.2 to 1.8

■ Recommended Soldering Conditions

Recommendations and precautions are described below.

Recommended soldering conditions for reﬂow

●

· Reﬂow soldering shall be performed a maximum of

two times.

· Please contact us for additional information when

used in conditions other than those speciﬁed.

· Please measure the temperature of the terminals

and study every kind of solder and printed circuit

board for solderability before actual use.

For soldering (Example : Sn/Pb)

Temperature

140 °C to 160 °C

Above 200 °C

235 5 °C

Time

Preheating

Main heating

Peak

60 s to 120 s

30 s to 40 s

max. 10 s

Peak

Preheating

For lead-free soldering (Example : Sn/Ag/Cu)

Temperature

150 °C to 180 °C

Above 230 °C

max. 260 °C

Time

Heating

Preheating

Main heating

Peak

60 s to 120 s

30 s to 40 s

max. 10 s

Time

Recommended soldering conditions for ﬂow

●

For soldering

For lead-free soldering

Temperature

140 °C to 180 °C

245 5 °C

Time

60 s to 120 s

20 s to 30 s

Temperature

150 °C to 180 °C

max. 260 °C

Time

60 s to 120 s

max. 10 s

Preheating

Soldering

Safety Precautions

The following are precautions for individual products. Please also refer to the precautions common to Fixed Resistors

shown on page ER2 of this catalog.

1. Keep the rated power and ambient temperature within the speciﬁed derating curve.

* When positioning and mounting Metal Film Chip Resistors (hereafter called the resistors), make allowance for the

effect of heat generated through close contact between the resistors and neighboring components and for the

temperature rise of adjacent heat-generating components.

2. If a transient load (heavy load in a short time) like a pulse is expected to be applied, check and evaluate the operations

of the resistors when installed in your products before use.

When applying pulses to the resistors, keep the pulse peak within the rated voltage.

3. Do not use halogen-based or other high-activity ﬂux. Otherwise, the residue may impair the resistors' performance

and/or reliability.

4. When soldering with a soldering iron, never touch the resistors' bodies with the tip of the soldering iron. When using a

soldering iron with a high temperature tip, ﬁnish soldering as quickly as possible (within three seconds at 350 °C max.).

5. As the amount of applied solder becomes larger, the mechanical stress applied to the resistors increases, causing

problems such as cracks and faulty characteristics. Avoid applying an excessive amount of solder.

6. When the resistors' protective coatings are chipped, ﬂawed, or removed, the characteristics of the resistors may be

impaired. Take special care not to apply mechanical shock during automatic mounting or cause damage during

handling of the boards with the resistors mounted.

7. Do not apply shock to the resistors or pinch them with a hard tool (e.g. pliers and tweezers). Otherwise, the resistors'

protective coatings and bodies may be chipped, affecting their performance.

8. Avoid excessive bending of printed circuit boards in order to protect the resistors from abnormal stress.

9. Do not immerse the resistors in solvent for a long time. Before using solvent, carefully check the effects of immersion.

Design and speciﬁcations are each subject to change without notice. Ask factory for the current technical speciﬁcations before purchase and/or use.

Should a safety concern arise regarding this product, please be sure to contact us immediately.

Feb. 2009

Safety Precautions

(Common precautions for Fixed Resistors)

• When using our products, no matter what sort of equipment they might be used for, be sure to make a written

agreement on the speciﬁcations with us in advance. The design and speciﬁcations in this catalog are subject

to change without prior notice.

• Do not use the products beyond the speciﬁcations described in this catalog.

• This catalog explains the quality and performance of the products as individual components. Before use, check

and evaluate their operations when installed in your products.

• Install the following systems for a failsafe design to ensure safety if these products are to be used in equipment

where a defect in these products may cause the loss of human life or other signiﬁcant damage, such as damage to

vehicles (automobile, train, vessel), trafﬁc lights, medical equipment, aerospace equipment, electric heating

appliances, combustion/gas equipment, rotating equipment, and disaster/crime prevention equipment.

Systems equipped with a protection circuit and a protection device

✽

Systems equipped with a redundant circuit or other system to prevent an unsafe status in the event of a single fault

✽

(1) Precautions for use

• These products are designed and manufactured for general and standard use in general electronic

equipment (e.g. AV equipment, home electric appliances, ofﬁce equipment, information and communication

equipment)

• These products are not intended for use in the following special conditions. Before using the products, carefully

check the effects on their quality and performance, and determine whether or not they can be used.

1. In liquid, such as water, oil, chemicals, or organic solvent

2. In direct sunlight, outdoors, or in dust

3. In salty air or air with a high concentration of corrosive gas, such as Cl₂, H₂S, NH₃, SO₂, or NO₂

4. Electric Static Discharge (ESD) Environment

These components are sensitive to static electricity and can be damaged under static shock (ESD).

Please take measures to avoid any of these environments.

Smaller components are more sensitive to ESD environment.

5. Electromagnetic Environment

Avoid any environment where strong electromagnetic waves exist.

6. In an environment where these products cause dew condensation

7. Sealing or coating of these products or a printed circuit board on which these products are mounted, with resin

or other materials

• These products generate Joule heat when energized. Carefully position these products so that their heat will not

affect the other components.

• Carefully position these products so that their temperatures will not exceed the category temperature range due

to the effects of neighboring heat-generating components. Do not mount or place heat-generating components or

inﬂammables, such as vinyl-coated wires, near these products .

• Note that non-cleaning solder, halogen-based highly active ﬂux, or water-soluble ﬂux may deteriorate the

performance or reliability of the products.

• Carefully select a ﬂux cleaning agent for use after soldering. An unsuitable agent may deteriorate the

performance or reliability. In particular, when using water or a water-soluble cleaning agent, be careful not to leave

water residues. Otherwise, the insulation performance may be deteriorated.

(2) Precautions for storage

The performance of these products, including the solderability, is guaranteed for a year from the date of arrival at your

company, provided that they remain packed as they were when delivered and stored at a temperature of 5 °C to 35 °

C and a relative humidity of 45 % to 85 %.

Even within the above guarantee periods, do not store these products in the following conditions. Otherwise, their

electrical performance and/or solderability may be deteriorated, and the packaging materials (e.g. taping materials)

may be deformed or deteriorated, resulting in mounting failures.

1. In salty air or in air with a high concentration of corrosive gas, such as Cl₂, H₂S, NH₃, SO₂, or NO₂

2. In direct sunlight

Package markings include the product number, quantity, and country of origin.

In principle, the country of origin should be indicated in English.

Oct. 2007

– ER3 –

ERA2A0402 [PANASONIC]

相关型号：

SI9130DB

SI9135LG-T1

SI9135LG-T1-E3

SI9135_11

SI9136_11

SI9130CG-T1-E3

SI9130LG-T1-E3

SI9130_11

SI9137

SI9137DB

SI9137LG

SI9122E