ERJ3EKF1333V [PANASONIC]
Fixed Resistor, Metal Glaze/thick Film, 0.1W, 133000ohm, 75V, 1% +/-Tol, 100ppm/Cel, Surface Mount, 0603, CHIP;
| 型号： | ERJ3EKF1333V |
| 厂家： | 
PANASONIC |
| 描述： | Fixed Resistor, Metal Glaze/thick Film, 0.1W, 133000ohm, 75V, 1% +/-Tol, 100ppm/Cel, Surface Mount, 0603, CHIP PC 电阻器 |
| 文件： | 总6页 (文件大小：264K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
Precision Thick Film Chip Resistors
Precision Thick Film Chip Resistors
ERJ G: 01005, 0201
ERJ R : 0201, 0402, 0603, 0805
ERJ E : 0603, 0805, 1206,
1210, 1812, 2010, 2512
Type:
ERJ XG, 1G
ERJ 1R, 2R, 3R, 6R
ERJ 3E, 6E, 8E, 14, 12, 1T
■ Features
● Small size and lightweight
● High reliability
Metal glaze thick film resistive element and three
layers of electrodes
● Compatible with placement machines
Taping packaging available
● Low Resistance Tolerance
ERJXG, 1G, 2R, 3E, 6E, 8E, 14, 12, 1T Series
ERJ1R, 2R, 3R, 6R Series
● Reference Standards
IEC 60115-8, JIS C 5201-8
.....
1 %
..............................
0.5 %
● Suitable for both reflow and flow soldering
■ Explanation of Part Numbers
For existing customers, we continue to use the three-digit resistance code in the part numbers.
✽
ERJ1R, 2R, 3R, 6R Series, 0.5 % type
●
1
2
3
4
5
6
7
8
9
10
11
12
E
R
J
3
R
B
D
1
0
0
2
V
Size, Power Rating
Packaging Methods
Packaging
T.C.R. Marking
T.C.R.
Product Code
Thick Film
Chip Resistors
Resistance Tolerance
Type
Code
H
Type: inches
1R : 0201
2R : 0402
3R : 0603
6R : 0805
Power R.
0.05 W
0.063 W
0.063 W
0.1 W
Code
D
Tolerance
0.5 %
Code
C
50ꢀ10–6/˚C(ppm/˚C)
(1R, 2R)
Pressed Carrier Taping
2 mm pitch
ERJ1R
50ꢀ10–6/˚C(ppm/˚C)
(3R, 6R)
Punched Carrier Taping
2 mm pitch
B
K
E
ERJ2R
X
V
100ꢀ10–6/˚C(ppm/˚C)
(1R, 2R)
ERJ3R
ERJ6R
Punched Carrier Taping
4 mm pitch
100ꢀ10–6/˚C(ppm/˚C)
(3R, 6R)
Resistance Value ✽
The first three digits are significant figures of resistance
and the last one denotes number of zeros following.
Example: 1002ৎ10 kꢁ
Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use.
Should a safety concern arise regarding this product, please be sure to contact us immediately.
Mar. 2008
Precision Thick Film Chip Resistors
ERJXG, 1G Series, 1 % type
●
1
2
3
4
5
6
7
8
9
10
11
12
E
R
J
1
G
E
F
1
0
0
2
C
Resistance Tolerance
Packaging Methods
Packaging
Size, Power Rating
Resistance Value
Product Code
Thick Film
Chip Resistors
Type : inches Power R.
XGN : 01005 0.031 W
Code
F
Tolerance
1 %
Code
Y
Type
The first three digits are significant
figures of resistance and the last
one denotes number of zeros
Pressed Carrier Taping
2 mm pitch, 20000 pcs.
ERJXGN
1GE : 0201
0.050 W
Pressed Carrier Taping
2 mm pitch, 15000 pcs.
C
ERJ1GE
ERJ2R, 3E, 6E, 8E, 14, 12, 1T Series, 1 % type
●
1
2
3
4
5
6
7
8
9
10
11
12
E
R
J
8
E
N
F
1
0
0
2
V
Size, Power Rating
Packaging Methods
Packaging
Marking
Marking
Product Code
Thick Film
Chip Resistors
Resistance Tolerance
Code
X
Type
Code
K
Type: inches
2R : 0402
3E : 0603
6E : 0805
8E : 1206
14 : 1210
12 : 1812
12 : 2010
1T : 2512
Power R.
0.1 W
0.1 W
0.125 W
0.25 W
0.5 W
0.75 W
0.75 W
1 W
Tolerance
1 %
Code
F
No marking
(2R, 3E)
Punched Carrier Taping
2 mm pitch
ERJ2R
4 digit marking
(6E, 8E, 14, 12, 1T)
ERJ3E
ERJ6E
ERJ8E
ERJ14
ERJ12
ERJ1T
N
S
Punched Carrier Taping
4 mm pitch
V
4 digit marking
[12(2010 inches)]
Embossed Carrier Taping
4 mm pitch
U
Resistance Value ✽
The first three digits are significant figures of resistance
and the 4th one denotes number of zeros following.
■ Construction
■ Dimensions in mm (not to scale)
L
a
W
t
Protective coating
b
Dimensions (mm)
a
Alumina substrate
Type
(inches)
Mass (Weight)
[g/1000pcs.]
Electrode (Inner)
L
W
b
t
0.02
0.03
0.05
0.15
0.20
0.15
0.20
0.02
0.03
0.05
0.03
0.05
0.10
0.20
0.20
0.20
0.20
0.20
0.20
0.20
0.20
0.20
0.03
0.05
0.05
0.15
0.20
0.15
0.20
0.20
0.20
0.20
0.20
0.20
0.02
0.03
0.05
0.10
0.10
0.10
0.10
0.10
0.10
0.10
0.10
0.10
ERJXG
(01005)
ERJ1G, 1R
(0201)
0.40
0.20
0.30
0.10
0.10
0.10
0.13
0.04
0.15
0.8
2
0.60
1.00
1.60
2.00
1.60
0.15
0.25
0.30
0.40
0.30
0.40
0.50
0.50
0.50
0.60
0.60
0.23
0.35
0.45
0.60
0.45
0.60
0.60
0.60
0.60
0.60
0.60
ERJ2R२
0.50–0.05 0.20
(0402)
Electrode
(Between)
0.80+0.15 0.30
ERJ3R
(0603)
२
0.10
ERJ6R२
1.25–0.05 0.40
4
(0805)
0.80+0.15 0.30
2
ERJ3EK
(0603)
ERJ6EN
(0805)
ERJ8EN
(1206)
ERJ14N
(1210)
ERJ12N
(1812)
ERJ12S
(2010)
ERJ1TN
(2512)
Thick film
resistive element
0.10
2.00–0.20 1.25–0.15 0.40
4
Electrode (Outer)
3.20+0.05 1.60+0.05 0.50
10
16
27
27
45
0.20
0.20
0.20
0.20
0.20
0.20
0.20
0.20
3.20
4.50
5.00
6.40
2.50
3.20
2.50
3.20
0.50
0.50
0.60
0.65
Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use.
Should a safety concern arise regarding this product, please be sure to contact us immediately.
Jul. 2008
Precision Thick Film Chip Resistors
■ Ratings
< 0.5 %>
Category Temperature
Range (Operating
Temperature Range)
(°C)
Limiting Element Maximum Overload Resistance
Resistance
Range
(ꢁ)
T.C.R.
Type
(inches)
Power Rating
at 70 °C (W)
Voltage (Maximum
Voltage(2)
(V)
Tolerance
(%)
[ꢀ10–6/°C
(ppm/°C)]
RCWV)(1) (V)
1 k to 100 k
(E24, E96)
ERJ1RH
(0201)
0.05
0.05
15
15
50
30
30
0.5
0.5
0.5
50
100
50
–55 to +125
–55 to +125
–55 to +125
100 to 976
(E24, E96)
ERJ1RK
(0201)
100 to 100 k
(E24, E96)
ERJ2RH
(0402)
0.063
100
10 to 97.6
102 k to 1 M
(E24, E96)
ERJ2RK
(0402)
0.063
0.063
0.063
0.1
50
50
100
100
100
200
200
0.5
0.5
0.5
0.5
0.5
100
50
–55 to +125
–55 to +125
–55 to +125
–55 to +125
–55 to +125
100 to 100 k
(E24, E96)
ERJ3RB
(0603)
10 to 97.6
102 k to 1 M
(E24, E96)
ERJ3RE
(0603)
50
100
50
100 to 100 k
(E24, E96)
ERJ6RB
(0805)
150
150
10 to 97.6
102 k to 1 M
(E24, E96)
ERJ6RE
(0805)
0.1
100
< 1 %>
Category Temperature
Range (Operating
Temperature Range)
(°C)
Limiting Element Maximum Overload Resistance
Resistance
Range
(ꢁ)
T.C.R.
Type
(inches)
Power Rating
at 70 °C (W)
Voltage (Maximum
Voltage(2)
(V)
Tolerance
(%)
[ꢀ10–6/°C
(ppm/°C)]
RCWV)(1) (V)
10 to 1 M
<100 ꢁ : 300
100 ꢁ < : 200
ERJXG
(01005)
0.031
0.05
0.1
15
25
30
1
1
1
1
1
1
1
1
1
1
–55 to +125
–55 to +125
–55 to +155
–55 to +155
–55 to +155
–55 to +155
–55 to +155
–55 to +155
–55 to +155
–55 to +155
(E24, E96)
10 to 1 M(3)
(E24, E96)
10 to 1 M
(E24, E96)
10 to 1 M
(E24, E96)
10 to 2.2 M
(E24, E96)
10 to 2.2 M
(E24, E96)
10 to 1 M
(E24, E96)
10 to 1 M
(E24, E96)
10 to 1 M
(E24, E96)
10 to 1 M
(E24, E96)
ERJ1G
(0201)
50
200
100
100
100
100
100
100
100
100
ERJ2RK
(0402)
50
100
150
200
400
400
500
500
500
ERJ3EK
(0603)
0.1
75
ERJ6EN
(0805)
0.125
0.25
0.5
150
200
200
200
200
200
ERJ8EN
(1206)
ERJ14N
(1210)
ERJ12N
(1812)
0.75
0.75
1
ERJ12S
(2010)
ERJ1TN
(2512)
ꢂ
(1) Rated Continuous Working Voltage (RCWV) shall be determined from RCWV= Power Rating ꢀ Resistance Values, or Limiting Element Voltage
(max. RCWV) listed above, whichever less.
(2) Overload (Short-time Overload) Test Voltage (SOTV) shall be determined from SOTV=2.5 ꢀ Power Rating or max. Overload Voltage listed above
whichever less.
(3) Please contact us when you need a type with a resistance of less than 10 ꢁ.
–55 °C
100
70 °C
Power Derating Curve
For resistors operated in ambient temperatures above
70 °C, power rating shall be derated in accordance
with the figure on the right.
80
60
40
20
0
2RK, 3E, 6E, 8E,
14, 12, 1T
XG, 1G, 1R, 2RH,
2RK, 3R, 6R
155 °C
125 °C
–60 –40 –20
0
20 40 60 80 100 120 140 160 180
Ambient Temperature (°C)
Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use.
Should a safety concern arise regarding this product, please be sure to contact us immediately.
Jul. 2008
Precision Thick Film Chip Resistors
■ Packaging Methods (Taping)
● Standard Quantity
Type
ERJXG
Kind of Taping
Pitch (P1)
Quantity
20000 pcs./reel
15000 pcs./reel
10000 pcs./reel
Pressed Carrier Taping
Punched Carrier Taping
ERJ1G, ERJ1R
ERJ2RH, ERJ2RK
ERJ3R२, ERJ3EK
ERJ6R२, ERJ6EN
ERJ8EN
2 mm
5000 pcs./reel
4000 pcs./reel
ERJ14N
4 mm
ERJ12N
Embossed Carrier Taping
ERJ12S
ERJ1TN
● Carrier Tape
(Unit : mm)
Pressed Carrier
Punched Carrier
Embossed Carrier
P1
P2
P0
φD0
P1
(2 mm pitch)
T
A
T
T
φD1 (Only Emboss)
Type
A
B
W
F
E
P1
P2
P0
T
0.31
0.42
0.52
0.70
φD0
φD1
–
0.03
0.05
0.05
0.10
0.15
0.15
0.20
0.20
0.20
0.20
0.03
0.05
0.05
0.10
0.20
0.20
0.20
0.20
0.20
0.20
0.05
0.05
0.05
0.05
ERJXG
0.24
0.38
0.45
0.68
1.17
0.10
ERJ1G, ERJ1R
2.00
–
ERJ2RH, ERJ2RK 0.67
ERJ3R२, ERJ3EK 1.10
ERJ6R२, ERJ6EN 1.65
–
0.20
8.00
0.05
1.90
2.50
3.60
3.50
4.80
5.30
6.90
3.50
5.50
–
–
0.10
0.05
0.10
+0.10
0.05
1.75
2.00
4.00
1.50
0.84
−0
ERJ8EN
ERJ14N
ERJ12N
ERJ12S
ERJ1TN
2.00
2.80
3.50
2.80
3.60
–
0.30
0.30
0.10
+0.10
8.00
4.00
1.0
−0
0.10
1.00
0.20
12.00
1.5 min.
● Taping Reel
(Unit : mm)
T
Type
W
φA
φB
φC
ERJXG
T
ERJ1G, ERJ1R
ERJ2RH, ERJ2RK
ERJ3R२, ERJ3EK
ERJ6R२, ERJ6EN
ERJ8EN
φC
1.0
1.0
9.0
11.4
+0
1.0
180.0
60 min. 13.0
–3.0
ERJ14N
φA
W
ERJ12N
1.0
2.0
ERJ12S
13.0
15.4
ERJ1TN
Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use.
Should a safety concern arise regarding this product, please be sure to contact us immediately.
Feb. 2006
Precision Thick Film Chip Resistors
■ Recommended Land Pattern
In case of flow soldering, the land width must be smaller than the Chip Resistor width to control the solder amount properly.
Generally, the land width should be 0.7 to 0.8 times (W) of the width of chip resistor. In case of reflow soldering, solder
amount can be adjusted, therefore the land width should be set to 1.0 to 1.3 times chip resistor width (W).
Dimensions (mm)
Type (inches)
a
b
c
Chip Resistor
ERJXG
ERJ1G, 1R (0201)
ERJ2R (0402)
ERJ3R, 3EK (0603)
ERJ6R, 6EN (0805)
(01005) 0.15 to 0.2
0.5 to 0.7 0.20 to 0.25
0.8 to 0.9 0.25 to 0.35
0.3 to 0.4
0.5 to 0.6
0.7 to 0.9
1 to 1.4
1.4 to 1.6
2 to 2.2
3.2 to 3.8
4.4 to 5
0.4 to 0.6
0.8 to 1
0.9 to 1.4
1.2 to 1.8
1.8 to 2.8
2.3 to 3.5
1.8 to 2.8
2.3 to 3.5
a
b
ERJ8EN
ERJ14N
ERJ12N
ERJ12S
ERJ1TN
(1206)
(1210)
(1812)
(2010)
(2512)
2 to 2.4
2 to 2.4
4.4 to 5
3.3 to 3.7
3.6 to 4
5.7 to 6.5
6.2 to 7
5 to 5.4
7.6 to 8.6
■ Recommended Soldering Conditions
Recommendations and precautions are described below.
Recommended soldering conditions for reflow
●
· Reflow soldering shall be performed a maximum of
two times.
· Please contact us for additional information when
used in conditions other than those specified.
· Please measure the temperature of the terminals
and study every kind of solder and printed circuit
board for solderability before actual use.
For soldering (Example : Sn/Pb)
Temperature
Time
Preheating
Main heating
Peak
140 °C to 160 °C
Above 200 °C
235 5 °C
60 s to 120 s
30 s to 40 s
max. 10 s
Peak
Preheating
For lead-free soldering (Example : Sn/Ag/Cu)
Temperature
150 °C to 180 °C
Above 230 °C
max. 260 °C
Time
Heating
Preheating
Main heating
Peak
60 s to 120 s
30 s to 40 s
max. 10 s
Time
Recommended soldering conditions for flow
●
For soldering
For lead-free soldering
Temperature
140 °C to 180 °C
245 5 °C
Time
60 s to 120 s
20 s to 30 s
Temperature
150 °C to 180 °C
max. 260 °C
Time
60 s to 120 s
max. 10 s
Preheating
Soldering
Safety Precautions
The following are precautions for individual products. Please also refer to the precautions common to Fixed Resistors
shown on page ER2 of this catalog.
1. Take measures against mechanical stress during and after mounting of Precision Thick Film Chip Resistors (hereafter
called the resistors) so as not to damage their electrodes and protective coatings.
2. If a transient load (heavy load in a short time) like a pulse is expected to be applied, check and evaluate the operations
of the resistors when installed in your products before use.
Never exceed the rated power. Otherwise, the performance and/or reliability of the resistors may be impaired.
3. Do not use halogen-based or other high-activity flux. Otherwise, the residue may impair the resistors' performance
and/or reliability.
4. When soldering with a soldering iron, never touch the resistors' bodies with the tip of the soldering iron. When using a
soldering iron with a high temperature tip, finish soldering as quickly as possible (within three seconds at 350 °C max.).
5. As the amount of applied solder becomes larger, the mechanical stress applied to the resistors increases, causing
problems such as cracks and faulty characteristics. Avoid applying an excessive amount of solder.
6. Do not apply shock to the resistors or pinch them with a hard tool (e.g. pliers and tweezers). Otherwise, the resistors'
protective coatings and bodies may be chipped, affecting their performance.
7. Avoid excessive bending of printed circuit boards in order to protect the resistors from abnormal stress.
Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use.
Should a safety concern arise regarding this product, please be sure to contact us immediately.
Feb. 2006
Safety Precautions
(Common precautions for Fixed Resistors)
• When using our products, no matter what sort of equipment they might be used for, be sure to make a written
agreement on the specifications with us in advance. The design and specifications in this catalog are subject
to change without prior notice.
• Do not use the products beyond the specifications described in this catalog.
• This catalog explains the quality and performance of the products as individual components. Before use, check
and evaluate their operations when installed in your products.
• Install the following systems for a failsafe design to ensure safety if these products are to be used in equipment
where a defect in these products may cause the loss of human life or other significant damage, such as damage to
vehicles (automobile, train, vessel), traffic lights, medical equipment, aerospace equipment, electric heating
appliances, combustion/gas equipment, rotating equipment, and disaster/crime prevention equipment.
Systems equipped with a protection circuit and a protection device
✽
Systems equipped with a redundant circuit or other system to prevent an unsafe status in the event of a single fault
✽
(1) Precautions for use
• These products are designed and manufactured for general and standard use in general electronic
equipment (e.g. AV equipment, home electric appliances, office equipment, information and communication
equipment)
• These products are not intended for use in the following special conditions. Before using the products, carefully
check the effects on their quality and performance, and determine whether or not they can be used.
1. In liquid, such as water, oil, chemicals, or organic solvent
2. In direct sunlight, outdoors, or in dust
3. In salty air or air with a high concentration of corrosive gas, such as Cl2, H2S, NH3, SO2, or NO2
4. Electric Static Discharge (ESD) Environment
These components are sensitive to static electricity and can be damaged under static shock (ESD).
Please take measures to avoid any of these environments.
Smaller components are more sensitive to ESD environment.
5. Electromagnetic Environment
Avoid any environment where strong electromagnetic waves exist.
6. In an environment where these products cause dew condensation
7. Sealing or coating of these products or a printed circuit board on which these products are mounted, with resin
or other materials
• These products generate Joule heat when energized. Carefully position these products so that their heat will not
affect the other components.
• Carefully position these products so that their temperatures will not exceed the category temperature range due
to the effects of neighboring heat-generating components. Do not mount or place heat-generating components or
inflammables, such as vinyl-coated wires, near these products .
• Note that non-cleaning solder, halogen-based highly active flux, or water-soluble flux may deteriorate the
performance or reliability of the products.
• Carefully select a flux cleaning agent for use after soldering. An unsuitable agent may deteriorate the
performance or reliability. In particular, when using water or a water-soluble cleaning agent, be careful not to leave
water residues. Otherwise, the insulation performance may be deteriorated.
(2) Precautions for storage
The performance of these products, including the solderability, is guaranteed for a year from the date of arrival at your
company, provided that they remain packed as they were when delivered and stored at a temperature of 5 °C to 35 °
C and a relative humidity of 45 % to 85 %.
Even within the above guarantee periods, do not store these products in the following conditions. Otherwise, their
electrical performance and/or solderability may be deteriorated, and the packaging materials (e.g. taping materials)
may be deformed or deteriorated, resulting in mounting failures.
1. In salty air or in air with a high concentration of corrosive gas, such as Cl2, H2S, NH3, SO2, or NO2
2. In direct sunlight
<Package markings>
Package markings include the product number, quantity, and country of origin.
In principle, the country of origin should be indicated in English.
Oct. 2007
– ER3 –
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