ERJ6GEYJ222B [PANASONIC]

Fixed Resistor, Metal Glaze/thick Film, 0.125W, 2200ohm, 150V, 5% +/-Tol, 200ppm/Cel, Surface Mount, 0805, CHIP;
ERJ6GEYJ222B
型号: ERJ6GEYJ222B
厂家: PANASONIC    PANASONIC
描述:

Fixed Resistor, Metal Glaze/thick Film, 0.125W, 2200ohm, 150V, 5% +/-Tol, 200ppm/Cel, Surface Mount, 0805, CHIP

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Thick Film Chip Resistors  
Thick Film Chip Resistors  
0201, 0402, 0603, 0805, 1206,  
1210, 1812, 2010, 2512  
Type: ERJ 1G, 2G, 3G, 6G, 8G, 14,  
12, 12Z, 1T  
n Features  
l Small size and lightweight  
l High reliability  
Metal glaze thick film resistive element and three layers of electrodes  
l Compatible with placement machines  
Taping and bulk case packaging available  
l Suitable for both reflow and flow soldering  
l Approved under the ISO 9001 system  
Approved under the QS-9000 system  
l Reference Standards  
IEC 60115-8, JIS C 5201-8, EIAJ RC-2134A  
n Explanation of Part Numbers  
Packaging Specifications  
Packaging  
Code  
Punched (Paper) Taping  
(Only 3G, 6G, 8G type)  
V
Embossed Taping  
(Only 14, 12, 12Z, 1T type)  
U
B
Bulk case  
(Only 2G, 3G, 6G type)  
Punched (Paper) Taping  
2 mm pitch, 10000 pcs.  
(Only 2G, 3G type)  
X
Y
C
Punched (Paper) Taping  
2 mm pitch, 20000 pcs.  
(Only 2G type)  
Punched (Paper) Taping  
2 mm pitch, 15000 pcs.  
(Only 1G type)  
] When partly omitted, all the rest P/N factors should be moved up respectively.  
Rev.02/04  
Design, Specifications are subject to change without notice. Ask factory for technical specifications before purchase and/ or use.  
Whenever a doubt about safety arises from this product, please inform us immediately for technical consultation without fail.  
Thick Film Chip Resistors  
n Dimensions in mm (not to scale)  
n Construction  
Dimensions (mm)  
Weight  
Type  
(1000 pcs.)  
(inches)  
L
W
a
b
t
ERJ1G  
(0201)  
0.60±0.03 0.30±0.03 0.12±0.05 0.15±0.05 0.25±0.05 0.15 g  
ERJ2G  
(0402)  
1.00±0.05 0.50±0.05 0.20±0.10 0.25±0.05 0.35±0.05  
0.8 g  
2 g  
ERJ3G  
(0603)  
1.60±0.15 0.80  
0.30±0.20 0.30±0.15 0.45±0.10  
+0.15  
Ð0.05  
ERJ6G  
(0805)  
2.00±0.20 1.25±0.10 0.40±0.20 0.40±0.20 0.60±0.10  
4 g  
ERJ8G  
(1206)  
+0.05  
Ð0.20  
+0.05  
Ð0.15  
3.20  
1.60  
0.50±0.20 0.50±0.20 0.60±0.10  
10 g  
16 g  
27 g  
27 g  
45 g  
ERJ14  
(1210)  
3.20±0.20 2.50±0.20 0.50±0.20 0.50±0.20 0.60±0.10  
4.50±0.20 3.20±0.20 0.50±0.20 0.50±0.20 0.60±0.10  
5.00±0.20 2.50±0.20 0.60±0.20 0.60±0.20 0.60±0.10  
6.40±0.20 3.20±0.20 0.65±0.20 0.60±0.20 0.60±0.10  
ERJ12  
(1812)  
ERJ12Z  
(2010)  
ERJ1T  
(2512)  
n Ratings  
Power Rating Limiting Element Maximum Overload  
T.C.R.  
Type  
Resistance  
Standard  
Resistance Range (W)  
at 70 ¡C  
(W)  
Voltage (Maximum  
Voltage(2)  
(V)  
´10-6/¡C  
(inches)  
Tolerance(%)  
Resistance Values  
RCWV)(1) (V)  
(ppm/¡C)  
min.  
10  
max.  
1 M  
ERJ1G  
(0201)  
ERJ2G  
(0402)  
ERJ3G  
(0603)  
ERJ6G  
(0805)  
ERJ8G  
(1206)  
ERJ14  
(1210)  
<10 W:  
Ð100 to  
+600  
0.05  
0.063  
0.1  
15  
50  
30  
± 5  
± 5  
± 5  
± 5  
± 5  
± 5  
± 5  
± 5  
E24  
E24  
E24  
E24  
E24  
E24  
E24  
E24  
100  
100  
200  
400  
400  
400  
400  
1
1
1
1
1
1
1
2.2 M  
10 M  
10 M  
10 M  
10 M  
10 M  
1 M  
50  
10 W to  
1 MW:  
±200  
0.125  
0.25  
0.25  
0.5  
150  
200  
200  
200  
200  
ERJ12, 12Z  
(1812, 2010)  
ERJ1T  
(2512)  
1 MW<:  
Ð400 to  
+150  
1
Rated Current Maximum Overload Current  
1G  
0.5 A  
1 A  
2 A  
1 A  
2 A  
4 A  
Jumper  
2G á 3G  
6Gá8Gá14á12á12Zá1T  
(1) Rated Continuous Working Voltage (RCWV) should be determined from RCWV= Power Rating ´ Resistance Values, or Limiting Element Voltage  
Ö
(max. RCWV) listed above, whichever is less.  
(2) Overload (Short-time Overload) Test Voltage (SOTV) should be determined from SOTV=2.5 ´ Power Rating or max. Overload Voltage listed above  
whichever is less.  
Power Derating Curve  
For resistors operating in ambient temperature above  
70 ¡C, power rating should be derated in accordance  
with the right figure.  
Design, Specifications are subject to change without notice. Ask factory for technical specifications before purchase and/ or use.  
Whenever a doubt about safety arises from this product, please inform us immediately for technical consultation without fail.  
Thick Film Chip Resistors  
n Packaging Specifications  
l Standard Quantity  
Type  
(inches)  
Thickness  
(mm)  
Embossed Taping  
Punched (Paper) Taping  
Bulk Case  
(4 mm pitch)  
ERJ1G  
(0201)  
0.25  
0.35  
0.45  
0.6  
15000 pcs./reel (2 mm pitch)  
ERJ2G  
(0402)  
10000 pcs./reel (2 mm pitch)  
20000 pcs./reel (2 mm pitch)  
50000 pcs./case  
25000 pcs./case  
10000 pcs./case  
ERJ3G  
(0603)  
10000 pcs./reel (2 mm pitch)  
5000 pcs./reel (4 mm pitch)]  
ERJ6G  
(0805)  
5000 pcs./reel (4 mm pitch)]  
5000 pcs./reel (4 mm pitch)]  
ERJ8G  
(1206)  
0.6  
ERJ14  
(1210)  
0.6  
5000 pcs./reel  
5000 pcs./reel  
4000 pcs./reel  
ERJ12,12Z  
(1812,2010)  
0.6  
ERJ1T  
(2512)  
0.6  
] Please consult us if resistors other than shown above are needed.  
l Taping Reel  
l Bulk Case  
(mm)  
Type  
fA  
fB  
fC  
W
T
Dimensions  
(mm)  
1G,2G,3G  
6G,8G,14  
9.0±1.0 11.4±2.0  
13.0±1.0 15.4±2.0  
180.0Ð03.0 60 min. 13.0±1.0  
12,12Z,1T  
l Punched (Paper) Taping  
l Embossed Taping  
Type  
A
B
W
F
E
Type  
A
B
W
F
E
P1  
1G 0.38±0.05 0.68±0.05  
2G 0.70±0.05 1.20±0.05  
3G 1.10±0.10 1.90±0.10  
6G 1.65±0.15 2.50±0.20  
8G 2.00±0.15 3.60±0.20  
14 2.80±0.20 3.50±0.20 8.00±0.30 3.50±0.05  
12 3.50±0.20 4.80±0.20  
Dimensions  
(mm)  
1.75±0.10 4.00±0.10  
Dimensions  
(mm)  
8.00±0.20 3.50±0.05 1.75±0.10  
12Z 2.80±0.20 5.30±0.20 12.00±0.30 5.50±0.05  
1T 3.60±0.20 6.90±0.20  
Type  
1G  
P1  
P2  
P0  
fD0  
T
Type  
14  
P2  
P0  
fD0  
t
fD1  
0.47±0.05  
0.52±0.05  
0.70±0.05  
1 min.  
2.00±0.10  
Dimensions  
(mm)  
12  
12Z  
1T  
2G  
Dimensions  
(mm)  
2.00±0.05 4.00±0.10 1.50+0.10 1.00±0.10  
0
2.00±0.05 4.00±0.10 1.50+0.10  
1.5 min.  
3G  
0
6G 4.00±0.10  
0.84±0.05  
8G  
Design, Specifications are subject to change without notice. Ask factory for technical specifications before purchase and/ or use.  
Whenever a doubt about safety arises from this product, please inform us immediately for technical consultation without fail.  
Thick Film Chip Resistors  
n Recommended Land Pattern  
In case of flow soldering, the land width must be smaller than the Chip Resistor width to control the solder amount  
properly. Generally, the land width should be 0.7 to 0.8 times the width of chip the resistor. In case of reflow soldering,  
solder amount can be adjusted, therefore the land width should be set to 1.0 to 1.3 times chip resistor width (W).  
Dimensions (mm)  
Type  
(inches)  
a
b
c
ERJ1G(0201)  
ERJ2G(0402)  
ERJ3G(0603)  
ERJ6G(0805)  
ERJ8G(1206)  
ERJ14(1210)  
ERJ12(1812)  
ERJ12Z(2010)  
ERJ1T(2512)  
0.3 to 0.4  
0.5 to 0.6  
0.7 to 0.9  
1 to 1.4  
2 to 2.4  
2 to 2.4  
3.3 to 3.7  
3.6 to 4  
5 to 5.4  
0.8 to 0.9 0.25 to 0.35  
1.4 to 1.6  
2 to 2.2  
0.4 to 0.6  
0.8 to 1  
3.2 to 3.8  
4.4 to 5  
4.4 to 5  
5.7 to 6.5  
6.2 to 7  
7.6 to 8.6  
0.9 to 1.4  
1.2 to 1.8  
1.8 to 2.8  
2.3 to 3.5  
1.8 to 2.8  
2.3 to 3.5  
n Recommended Soldering Conditions  
Recommendations and precautions are described below.  
lRecommended soldering conditions for reflow  
áReflow soldering should be a maximum of two times  
áPlease contact us for additional information when  
used in conditions other than those specified.  
áPlease measure the temperature of terminations and study  
every type of printed circuit board for solderability, before  
actual use.  
For soldering (Example : Sn/Pb)  
Temperature  
Time  
Preheating  
Main heating  
Peak  
140 ¡C to 160 ¡C  
Above 200 ¡C  
235 ± 5 ¡C  
60 s to 120 s  
30 s to 40 s  
max. 10 s  
For lead-free soldering (Example : Sn/Ag/Cu)  
Temperature  
150 ¡C to 180 ¡C  
Above 230 ¡C  
max. 260 ¡C  
Time  
Preheating  
Main heating  
Peak  
60 s to 120 s  
30 s to 40 s  
max. 10 s  
lRecommended soldering conditions for flow  
For soldering  
For lead-free soldering  
Temperature  
140 ¡C to 160 ¡C  
245±5 ¡C  
Time  
60 s to 120 s  
20 s to 30 s  
Temperature  
150 ¡C to 180 ¡C  
max. 260 ¡C  
Time  
60 s to 120 s  
max. 10 s  
Preheating  
Soldering  
Safety Precautions  
1. If transient load (heavy load in a short time) like pulse is to be applied, carry out an evaluation and  
confirmation test with the resistors actually mounted on the board.  
When a load of more than the rated power is applied under load condition at steady state, it may  
impair performance and/or reliability of the resistor.  
Never exceed the specified rated power.  
2. Chlorine type or other highly-reactive flux is not recommended. Residue could affect performance or reliability of  
the resistors.  
3. When using a soldering iron, never let the tip of the iron touch the body of the chip resistor. When using a  
soldering iron with a tip at a high temperature, solder for as short time as possible (no more than three seconds  
and up to 350 ¡C).  
4. Avoid physical shock to the resistor and nipping of the resistor with hard tool (pliers or tweezers) as it may  
damage the protective coating of the resistor and may affect its performance.  
Design, Specifications are subject to change without notice. Ask factory for technical specifications before purchase and/ or use.  
Whenever a doubt about safety arises from this product, please inform us immediately for technical consultation without fail.  

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