ERJ6GEYJ244V [PANASONIC]

Fixed Resistor, Metal Glaze/thick Film, 0.125W, 240000ohm, 150V, 5% +/-Tol, 200ppm/Cel, Surface Mount, 0805, CHIP, ROHS COMPLIANT;


型号：	ERJ6GEYJ244V
厂家：	PANASONIC
描述：	Fixed Resistor, Metal Glaze/thick Film, 0.125W, 240000ohm, 150V, 5% +/-Tol, 200ppm/Cel, Surface Mount, 0805, CHIP, ROHS COMPLIANT 电阻器
文件：	总5页 (文件大小：223K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

Thick Film Chip Resistors

01005, 0201, 0402, 0603, 0805,

1206, 1210, 1812, 2010, 2512

Type:

ERJ XG, 1G, 2G, 3G, 6G, 8G,

14, 12, 12Z, 1T

■ Features

● Small size and lightweight

● High reliability

Metal glaze thick ﬁlm resistive element and three layers of electrodes

● Compatible with placement machines

Taping packaging available

● Suitable for both reﬂow and ﬂow soldering

● Reference Standards

IEC 60115-8, JIS C 5201-8, EIAJ RC-2134B

Explanation of Part Numbers

■

ERJXGN, 1GE, 2GE, 3GE, 6GE, 8GE, 14, 12, 12Z, 1T Series, 5 % type

●

Packaging Methods

Packaging

Marking

Resistance Tolerance

Size, Power Rating

Type : inches Power R.

XGN: 01005 0.031 W

Product Code

Thick Film

Chip Resistors

Type

Code

Marking

Code

Tolerance

5 %

Pressed Carrier Taping

2 mm pitch, 20000 pcs.

Value Marking on

black side

No marking

ERJXGN

1GE : 0201

2GE : 0402

3GE : 0603

6GE : 0805

8GE : 1206

14 : 1210

0.05 W

0.1 W

0.125 W

0.25 W

0.5 W

Jumper

Pressed Carrier Taping

2 mm pitch, 15000 pcs.

✽

Nil

ERJ1GE

ERJ2GE

Punched Carrier Taping

2 mm pitch, 10000 pcs.

Resistance Value

The first two digits are significant figures of resistance and

the third one denotes number of zeros following.

Decimal Point is expressed by R as 4.7 = 4R7.

Jumper is expressed by R00.

ERJ3GE

ERJ6GE

ERJ8GE

ERJ14

ERJ12

ERJ12Z

ERJ1T

Punched Carrier Taping

4 mm pitch

12 : 1812

12Z : 2010

1T : 2512

0.75 W

1 W

Embossed CarrierTaping

4 mm pitch

✽ When omitted, the rest of the P/N factors shall be moved up respectively.

(Only XGN, 1GN, 2GE type)

Design and speciﬁcations are each subject to change without notice. Ask factory for the current technical speciﬁcations before purchase and/or use.

Should a safety concern arise regarding this product, please be sure to contact us immediately.

Jul. 2008

Thick Film Chip Resistors

■ Dimensions in mm (not to scale)

■ Construction

Protective coating

Electrode (Inner)

Alumina substrate

Dimensions (mm)

Type

(inches)

Mass (Weight)

(g/1000 pcs.)

ERJXG

(01005)

ERJ1G

(0201)

ERJ2G

(0402)

ERJ3G

(0603)

ERJ6G

(0805)

ERJ8G

(1206)

ERJ14

(1210)

ERJ12

(1812)

0.02

0.03

0.05

0.03

0.05

0.10

0.20

0.03

0.05

0.15

0.20

0.02

0.03

0.05

0.10

0.40

0.60

1.00

1.60

2.00

3.20

4.50

5.00

6.40

0.20

0.30

0.50

0.80

1.25

1.60

2.50

3.20

2.50

3.20

0.10

0.15

0.25

0.30

0.40

0.50

0.60

0.13

0.04

0.15

0.8

0.03

0.05

0.15

0.20

0.10

0.20

0.30

0.40

0.50

0.60

0.65

0.23

0.35

0.45

0.60

Electrode

(Between)

+0.15

–0.05

0.10

+0.05

–0.20

+0.05

–0.15

0.20

Thick film

resistive element

Electrode (Outer)

ERJ12Z

(2010)

ERJ1T

(2512)

■ Ratings

Category Temperature

Range (Operating

Temperature Range)

(°C)

Limiting Element Maximum Overload Resistance

Resistance

Range

(ꢀ)

T.C.R.

Type

(inches)

Power Rating

at 70 °C (W)

Voltage (Maximum

Voltage⁽²⁾

(V)

Tolerance

(%)

[ꢁ10^–6/°C

(ppm/°C)]

RCWV)⁽¹⁾(V)

<10 ꢀ : –100 to +600

ERJXG

(01005)

0.031

4.7 to 1 M (E24) 10 ꢀ to 100 ꢀ : 300

100 ꢀ< : 200

–55 to +125

ERJ1G

(0201)

0.05

0.1

1 to 10 M (E24)

–55 to +125

–55 to +155

<10 ꢀ:

ERJ2G

100

150

200

400

500

1 to 10 M (E24)

(0402)

–100 to +600

ERJ3G

(0603)

0.1

1 to 10 M (E24)

ERJ6G

0.125

0.25

0.5

150

200

(0805)

10 ꢀ to 1 Mꢀ:

ERJ8G

(1206)

1 to 10 M (E24)

200

ERJ14

1 to 10 M (E24)

(1210)

ERJ12

(1812)

0.75

1 to 10 M (E24)

1 Mꢀ<:

1 to 10 M (E24)

ERJ12Z

(2010)

–400 to +150

ERJ1T

(2512)

1 to 1 M (E24)

ꢂ

(1) Rated Continuous Working Voltage (RCWV) shall be determined from RCWV= Power Rating ꢁ Resistance Values, or Limiting Element Voltage

(max. RCWV) listed above, whichever less.

(2) Overload (Short-time Overload) Test Voltage (SOTV) shall be determined from SOTV=2.5ꢁPower Rating or max. Overload Voltage listed above

whichever less.

Power Derating Curve

Type

Rated Current Maximum Overload Current

For resistors operated in ambient temperatures above

70 °C, power rating shall be derated in accordance

with the ﬁgure below.

(inches)

(A)

ERJXG (01005)

ERJ1G (0201)

ERJ2G (0402)

ERJ3G (0603)

ERJ6G (0805)

ERJ8G (1206)

ERJ14 (1210)

ERJ12 (1812)

ERJ12Z (2010)

ERJ1T (2512)

0.5

–55 °C

100

70 °C

2G, 3G, 6G, 8G,

14, 12, 12Z, 1T

XG, 1G

125 °C

20 40 60 80 100 120 140 160 180

155 °C

–60 –40 –20

Ambient Temperature (°C)

Design and speciﬁcations are each subject to change without notice. Ask factory for the current technical speciﬁcations before purchase and/or use.

Should a safety concern arise regarding this product, please be sure to contact us immediately.

Jul. 2008

Thick Film Chip Resistors

■ Packaging Methods (Taping)

● Standard Quantity

Type

Kind of Taping

Pitch (P₁)

2 mm

Quantity

ERJXG

ERJ1G

ERJ2G

ERJ3G

ERJ6G

ERJ8G

ERJ14

ERJ12

ERJ12Z

ERJ1T

20000 pcs./reel

15000 pcs./reel

10000 pcs./reel

Pressed Carrier Taping

Punched Carrier Taping

5000 pcs./reel

4 mm

Embossed Carrier Taping

4000 pcs./reel

● Carrier Tape

(Unit : mm)

Pressed Carrier

Punched Carrier

Embossed Carrier

P₁

P₂

P₀

φD₀

P₁

(2 mm pitch)

φD₁(Only Emboss)

Type

0.45

0.68

1.17

1.90

2.50

3.60

3.50

4.80

5.30

6.90

P₁

P₂

P₀

0.31

0.42

0.52

0.70

φD₀

φD₁

–

0.03

0.05

0.10

0.15

0.20

0.03

0.05

0.10

0.20

0.05

ERJXG

ERJ1G

ERJ2G

ERJ3G

ERJ6G

ERJ8G

ERJ14

ERJ12

ERJ12Z

ERJ1T

0.24

0.38

0.67

1.10

1.65

2.00

2.80

3.50

2.80

3.60

0.10

2.00

0.20

8.00

0.05

3.50

5.50

–

0.10

0.05

0.10

+0.10

0.05

1.75

2.00

4.00

1.50

0.84

−0

0.30

0.10

+0.10

8.00

4.00

1.0

−0

0.10

1.00

0.20

12.00

1.5 min.

● Taping Reel

(Unit : mm)

Type

φA

φB

φC

ERJXG

ERJ1G

ERJ2G

ERJ3G

ERJ6G

ERJ8G

ERJ14

ERJ12

ERJ12Z

ERJ1T

φC

1.0

9.0

11.4

1.0

180.0

60 min. 13.0

–3.0

1.0

2.0

φA

13.0

15.4

Design and speciﬁcations are each subject to change without notice. Ask factory for the current technical speciﬁcations before purchase and/or use.

Should a safety concern arise regarding this product, please be sure to contact us immediately.

Feb. 2006

Thick Film Chip Resistors

■ Recommended Land Pattern

In case of ﬂow soldering, the land width must be smaller than the Chip Resistor width to control the solder amount properly.

Generally, the land width should be 0.7 to 0.8 times (W) of the width of chip resistor. In case of reﬂow soldering, solder

amount can be adjusted, therefore the land width should be set to 1.0 to 1.3 times chip resistor width (W).

Dimensions (mm)

Type

(inches)

Chip Resistor

ERJXG(01005) 0.15 to 0.20

0.5 to 0.7

0.8 to 0.9

1.4 to 1.6

2 to 2.2

3.2 to 3.8

4.4 to 5

5.7 to 6.5

6.2 to 7

0.20 to 0.25

0.25 to 0.35

0.4 to 0.6

0.8 to 1

ERJ1G(0201)

ERJ2G(0402)

ERJ3G(0603)

ERJ6G(0805)

ERJ8G(1206)

ERJ14(1210)

ERJ12(1812)

ERJ12Z(2010)

ERJ1T(2512)

0.3 to 0.4

0.5 to 0.6

0.7 to 0.9

1 to 1.4

2 to 2.4

3.3 to 3.7

3.6 to 4

5 to 5.4

0.9 to 1.4

1.2 to 1.8

1.8 to 2.8

2.3 to 3.5

1.8 to 2.8

2.3 to 3.5

7.6 to 8.6

■ Recommended Soldering Conditions

Recommendations and precautions are described below.

Recommended soldering conditions for reﬂow

●

· Reﬂow soldering shall be performed a maximum of

two times.

· Please contact us for additional information when

used in conditions other than those speciﬁed.

· Please measure the temperature of the terminals

and study every kind of solder and printed circuit

board for solderability before actual use.

For soldering (Example : Sn/Pb)

Temperature

Time

Preheating

Main heating

Peak

140 °C to 160 °C

Above 200 °C

235 5 °C

60 s to 120 s

30 s to 40 s

max. 10 s

Peak

Preheating

For lead-free soldering (Example : Sn/Ag/Cu)

Temperature

150 °C to 180 °C

Above 230 °C

max. 260 °C

Time

Heating

Preheating

Main heating

Peak

60 s to 120 s

30 s to 40 s

max. 10 s

Time

Recommended soldering conditions for ﬂow

●

For soldering

For lead-free soldering

Temperature

140 °C to 180 °C

245 5 °C

Time

60 s to 120 s

20 s to 30 s

Temperature

150 °C to 180 °C

max. 260 °C

Time

60 s to 120 s

max. 10 s

Preheating

Soldering

Safety Precautions

The following are precautions for individual products. Please also refer to the precautions common to Fixed Resistors

shown on page ER2 of this catalog.

1. Take measures against mechanical stress during and after mounting of Thick Film Chip Resistors (hereafter called the

resistors) so as not to damage their electrodes and protective coatings.

2. If a transient load (heavy load in a short time) like a pulse is expected to be applied, check and evaluate the operations

of the resistors when installed in your products before use.

Never exceed the rated power. Otherwise, the performance and/or reliability of the resistors may be impaired.

3. Do not use halogen-based or other high-activity ﬂux. Otherwise, the residue may impair the resistors' performance

and/or reliability.

4. When soldering with a soldering iron, never touch the resistors' bodies with the tip of the soldering iron. When using a

soldering iron with a high temperature tip, ﬁnish soldering as quickly as possible (within three seconds at 350 °C max.).

5. As the amount of applied solder becomes larger, the mechanical stress applied to the resistors increases, causing

problems such as cracks and faulty characteristics. Avoid applying an excessive amount of solder.

6. Do not apply shock to the resistors or pinch them with a hard tool (e.g. pliers and tweezers). Otherwise, the resistors'

protective coatings and bodies may be chipped, affecting their performance.

7. Avoid excessive bending of printed circuit boards in order to protect the resistors from abnormal stress.

Design and speciﬁcations are each subject to change without notice. Ask factory for the current technical speciﬁcations before purchase and/or use.

Should a safety concern arise regarding this product, please be sure to contact us immediately.

Feb. 2006

Safety Precautions

(Common precautions for Fixed Resistors)

• When using our products, no matter what sort of equipment they might be used for, be sure to make a written

agreement on the speciﬁcations with us in advance. The design and speciﬁcations in this catalog are subject

to change without prior notice.

• Do not use the products beyond the speciﬁcations described in this catalog.

• This catalog explains the quality and performance of the products as individual components. Before use, check

and evaluate their operations when installed in your products.

• Install the following systems for a failsafe design to ensure safety if these products are to be used in equipment

where a defect in these products may cause the loss of human life or other signiﬁcant damage, such as damage to

vehicles (automobile, train, vessel), trafﬁc lights, medical equipment, aerospace equipment, electric heating

appliances, combustion/gas equipment, rotating equipment, and disaster/crime prevention equipment.

Systems equipped with a protection circuit and a protection device

✽

Systems equipped with a redundant circuit or other system to prevent an unsafe status in the event of a single fault

✽

(1) Precautions for use

• These products are designed and manufactured for general and standard use in general electronic

equipment (e.g. AV equipment, home electric appliances, ofﬁce equipment, information and communication

equipment)

• These products are not intended for use in the following special conditions. Before using the products, carefully

check the effects on their quality and performance, and determine whether or not they can be used.

1. In liquid, such as water, oil, chemicals, or organic solvent

2. In direct sunlight, outdoors, or in dust

3. In salty air or air with a high concentration of corrosive gas, such as Cl₂, H₂S, NH₃, SO₂, or NO₂

4. Electric Static Discharge (ESD) Environment

These components are sensitive to static electricity and can be damaged under static shock (ESD).

Please take measures to avoid any of these environments.

Smaller components are more sensitive to ESD environment.

5. Electromagnetic Environment

Avoid any environment where strong electromagnetic waves exist.

6. In an environment where these products cause dew condensation

7. Sealing or coating of these products or a printed circuit board on which these products are mounted, with resin

or other materials

• These products generate Joule heat when energized. Carefully position these products so that their heat will not

affect the other components.

• Carefully position these products so that their temperatures will not exceed the category temperature range due

to the effects of neighboring heat-generating components. Do not mount or place heat-generating components or

inﬂammables, such as vinyl-coated wires, near these products .

• Note that non-cleaning solder, halogen-based highly active ﬂux, or water-soluble ﬂux may deteriorate the

performance or reliability of the products.

• Carefully select a ﬂux cleaning agent for use after soldering. An unsuitable agent may deteriorate the

performance or reliability. In particular, when using water or a water-soluble cleaning agent, be careful not to leave

water residues. Otherwise, the insulation performance may be deteriorated.

(2) Precautions for storage

The performance of these products, including the solderability, is guaranteed for a year from the date of arrival at your

company, provided that they remain packed as they were when delivered and stored at a temperature of 5 °C to 35 °

C and a relative humidity of 45 % to 85 %.

Even within the above guarantee periods, do not store these products in the following conditions. Otherwise, their

electrical performance and/or solderability may be deteriorated, and the packaging materials (e.g. taping materials)

may be deformed or deteriorated, resulting in mounting failures.

1. In salty air or in air with a high concentration of corrosive gas, such as Cl₂, H₂S, NH₃, SO₂, or NO₂

2. In direct sunlight

Package markings include the product number, quantity, and country of origin.

In principle, the country of origin should be indicated in English.

Oct. 2007

– ER3 –

ERJ6GEYJ244V [PANASONIC]

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