ERJL08UF64MV [PANASONIC]

贴片电阻器（低电阻型）;


型号：	ERJL08UF64MV
厂家：	PANASONIC
描述：	贴片电阻器（低电阻型）电阻器
文件：	总6页 (文件大小：282K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

Thick Film Chip Resistors / Low Resistance Type

ERJ R, B: 0402, 0603, 0805, 1206, 1210, 1812, 2512

ERJ L

: 0603, 0805, 1206, 1210, 1812, 2010, 2512

Type:

ERJ 2B, 3R, 3B, 6R, 6B, 8R, 8B,

14R, 14B, 12R, 1TR

ERJ L03, L06, L08, L14, L12,

L1D, L1W

Features

Small size and lightweight

■

●

High reliability

●

Metal glaze thick ﬁlm resistive element and three layers of electrodes

Suitable for both reﬂow and ﬂow soldering

Low Resistance Value

●

ERJ2BW Type : 47 m to 91 m

ꢀ

ERJ6BW, 8BW Type : 10 m to 100 m

ꢀ

ERJ2BS, 2BQ Type : 0.1

to 1.0

ꢀ

ERJ3R, 3B, 6R, 6B, 8R, 8B, 14R, 14B, 12R, 1TR Type : 0.1

to 9.1

ꢀ

ERJL03, L06, L08 Type : 47 m to 100 m

ꢀ

ERJL14, L12 Type : 20 m to 100 m

ꢀ

ERJL1D, L1W Type : 40 m to 100 m

ꢀ

Reference Standards

●

IEC 60115-8, JIS C 5201-8

Explanation of Part Numbers

■

ERJ2BS/2BQ, 3R, 3B, 6R, 6B, 8R, 8B, 14R, 14B, 12R, 1TR Series

●

Resistance Value

Resistance Tolerance

Packaging Methods

Packaging

Product Code

Thick Film

Chip Resistors

Size, Power Rating

Type: inches Power R.

2B : 0402 0.125 W

Type

ERJ2BS

ERJ2BQ

ERJ3R/3B

ERJ6R/6B

ERJ8R/8B

ERJ14R/14B

ERJ12R

Code

Res. Value

Code

Tolerance

1 %

Code

0.1 ꢀ to 0.2 ꢀ

0.22 ꢀ to 9.1 ꢀ

Punched Carrier Taping

2 mm pitch

✽

3R : 0603

3B : 0603

0.1 W

0.2 W

2 %

5 %

✽

2B : 0.22 ꢀ to 1.0 ꢀ

Punched Carrier Taping

4 mm pitch

6R : 0805 0.125 W

6B : 0805 0.25 W

8R : 1206 0.25 W

8B : 1206 0.33 W

14R : 1210 0.25 W

Embossed Carrier Taping

4 mm pitch

ERJ1TR

14B : 1210

12R : 1812

1TR : 2512

0.5 W

1 W

Resistance Value

Shown by 3 digits or letters.

(Ex.) R22 : 0.22 ꢀ

Design and speciﬁcations are each subject to change without notice. Ask factory for the current technical speciﬁcations before purchase and/or use.

Should a safety concern arise regarding this product, please be sure to contact us immediately.

Jun. 2008

Thick Film Chip Resistors / Low Resistance Type

ERJ2BW, 6BW, 8BW Series

●

Resistance Tolerance

Packaging Methods

Packaging

Code Size:inches

Power Rating

0.125 W

0.33 W

Resistance Value

47 mꢀ to 91 mꢀ

10 mꢀ to 100 mꢀ

Product Code

Thick Film

Chip Resistors

2BW

6BW

8BW

0402

0805

1206

Type

Code

Tolerance

1 %

Code

Pressed Carrier Taping

2 mm pitch

ERJ2BW

0.5 W

2 %

Punched Carrier Taping

4 mm pitch

ERJ6BW

ERJ8BW

5 %

Resistance Value

Shown by 4 digits or letters.

(Ex.) R047 : 0.047 ꢀ=47 mꢀ

ERJL03, L06, L08, L14, L12, L1D, L1W Series

●

Res. Value

Resistance Tolerance

Packaging Methods

Packaging

Size, Power Rating

Code

Product Code

Thick Film

Chip Resistors

Type

Type: inches Power R.

Std.

Code

Tolerance

1 %

✽

20 mꢀ, 22 mꢀ, 33 mꢀ,

L03 : 0603

0.1 W

ERJL03

ERJL06

ERJL08

ERJL14

39 mꢀ, 47 mꢀ, 50 mꢀ,

Punched Carrier Taping

4 mm pitch

(

)

L06 : 0805 0.125 W

5 %

100 mꢀ

✽

L08 : 1206

L14 : 1210

L12 : 1812

L1D : 2010

L1W : 2512

0.25 W

0.33 W

0.5 W

1 W

20 mꢀ to 100 mꢀ

✽ L03, L06, L08 : 47 mꢀ to 100 mꢀ

L1D, L1W : 40 mꢀ to 100 mꢀ

Embossed Carrier Taping ERJL12

4 mm pitch

ERJL1D

ERJL1W

Resistance Value

Shown by 3 digits or letters.

(Ex.) 50 M:50 mꢀ, 10 C:100 mꢀ

■ Construction

■ Dimensions in mm (not to scale)

Protective coating

Alumina substrate

Dimensions (mm)

Type

Mass(Weight)

[g/1000pcs.]

Electrode (Inner)

(inches)

0.10

+0.10

–0.05

0.10

0.05

ERJ2BW (0402) 1.00

0.50

0.24

0.35

0.8

ERJ2BS

+0.10

–0.05

(0402) 1.00

ERJ2BQ

0.50

0.20

0.27

0.35

ERJ3R

ERJ3B (0603) 1.60

ERJL03

ERJ6BW(0805) 2.00

ERJ6R

ERJ6B (0805) 2.00

ERJL06

ERJ8BW(1206) 3.20

ERJ8R

ERJ8B (1206) 3.20

ERJL08

0.15

0.20

+0.15

–0.05

0.20

0.15

0.20

0.10

0.80

1.25

1.60

0.30

0.55

0.40

1.00

0.50

0.30

0.55

0.40

1.00

0.50

0.45

0.65

0.60

0.65

0.60

Electrode

(Between)

0.20

0.10

0.20

+0.05

–0.20

+0.05

–0.15

Thick film

resistive element

Electrode (Outer)

ERJ14R

0.20

0.10

ERJ14B (1210) 3.20

ERJL14

2.50

3.20

0.50

0.60

ERJ12R

(1812) 4.50

ERJL12

0.20

0.10

ERJL1D (2010) 5.00

2.50

3.20

0.60

0.65

0.60

1.30

0.60

1.10

6.40

ERJ1TR

(2512)

ERJL1W

0.20

0.10

6.40

Design and speciﬁcations are each subject to change without notice. Ask factory for the current technical speciﬁcations before purchase and/or use.

Should a safety concern arise regarding this product, please be sure to contact us immediately.

Mar. 2008

Thick Film Chip Resistors / Low Resistance Type

■ Ratings

Category Temperature Range

(Operating Temperature Range)

(°C)

Power Rating

at 70 °C

(W)

Resistance

Tolerance

(%)

Resistance

Range

(ꢀ)

T.C.R.

Type (inches)

[ꢁ10^–6/°C (ppm/°C)]

0.1

ERJL03 (0603)

ERJL06 (0805)

ERJL08 (1206)

47 m to 100 m ^✽2

200

100

–55 to +125

(0.2) ^✽1

0.125

1, 5

(0.25) ^✽1

0.25

(0.33) ^✽1

ERJL14 (1210)

ERJL12 (1812)

ERJL1D (2010)

ERJL1W (2512)

0.33

0.5

20 m to 100 m ^✽2

40 m to 100 m ^✽2

–55 to +125

R<47 mꢀ: 300

R>47 mꢀ: 100

1 Please contact us when resistors with guaranteed high power are needed.

✽

2 Standard R.V. : 20 m , 22 m , 33 m , 39 m , 47 m , 50 m , 100 m , Custom R.V. : Each 1 m within upper range.

✽

ꢀ

Category Temperature Range

(Operating Temperature Range)

(°C)

Power Rating

at 70 °C

(W)

Resistance

Tolerance

(%)

Resistance

Range

(ꢀ)

T.C.R.

Type (inches)

[ꢁ10^–6/°C (ppm/°C)]

ERJ2BW (0402)

ERJ2BS (0402)

ERJ2BQ (0402)

ERJ3BS (0603)

0.047 to 0.091 (E24)

0.10 to 0.20 (E24)

0.22 to 1.0 (E24)

0.10 to 0.20 (E24)

0.22 to 0.91 (E24)

1.0 to 9.1 (E24)

300

250

300

200

0.125

–55 to +125

1, 2,

0.2

1, 2,

–55 to +125

–55 to +155

–55 to +125

ERJ3BQ (0603)

R<0.015 ꢀ: 300

R>0.015 ꢀ: 200

ERJ6BW (0805)

ERJ6BS (0805)

ERJ6BQ (0805)

0.33

0.25

0.01 to 0.1 (E24)

0.10 to 0.20 (E24)

0.22 to 0.91 (E24)

1.0 to 9.1 (E24)

250

200

0.010 ꢀ < R < 0.020 ꢀ : 200

ERJ8BW (1206)

0.5

1, 2,

0.01 to 0.1 (E24) 0.020 ꢀ < R < 0.047 ꢀ : 150

0.047 ꢀ < R < 0.100 ꢀ : 100

0.10 to 0.20 (E24)

–55 to +155

–55 to +125

ERJ8BS (1206)

ERJ8BQ (1206)

ERJ14BS (1210)

ERJ14BQ (1210)

250

0.33

0.22 to 0.91 (E24)

1.0 to 9.1 (E24)

0.10 to 0.20 (E24)

0.22 to 0.91 (E24)

1.0 to 9.1 (E24)

200

100

0.5

1, 2,

–55 to +125

Category Temperature Range

(Operating Temperature Range)

(°C)

Power Rating

at 70 °C

(W)

Resistance

Tolerance

(%)

Resistance

Range

(ꢀ)

T.C.R.

Type (inches)

[ꢁ10^–6/°C (ppm/°C)]

ERJ3RS (0603)

ERJ3RQ (0603)

ERJ6RS (0805)

ERJ6RQ (0805)

ERJ8RS (1206)

ERJ8RQ (1206)

ERJ14RS (1210)

ERJ14RQ (1210)

ERJ12RS (1812)

ERJ12RQ (1812)

ERJ1TRS (2512)

ERJ1TRQ (2512)

0.10 to 0.20 (E24)

0.22 to 0.91 (E24)

300

200

250

200

250

200

100

200

100

200

100

0.1

0.125

0.25

0.5

1, 2,

–55 to +125

1.0 to 9.1

(E24)

0.10 to 0.20 (E24)

0.22 to 0.91 (E24)

1.0 to 9.1

(E24)

0.10 to 0.20 (E24)

0.22 to 0.91 (E24)

1.0 to 9.1

(E24)

0.10 to 0.20 (E24)

0.22 to 0.91 (E24)

1.0 to 9.1

(E24)

0.10 to 0.20 (E24)

0.22 to 0.91 (E24)

1.0 to 9.1

(E24)

0.10 to 0.20 (E24)

0.22 to 0.91 (E24)

1.0 to 9.1

(E24)

Design and speciﬁcations are each subject to change without notice. Ask factory for the current technical speciﬁcations before purchase and/or use.

Should a safety concern arise regarding this product, please be sure to contact us immediately.

Jun. 2008

Thick Film Chip Resistors / Low Resistance Type

–55 °C

70 °C

Power Derating Curve

100

For resistors operated in ambient temperatures above

70 °C, power rating shall be derated in accordance

with the ﬁgure on the right.

2B, 3R, 3B, 6R, 6B, 8R, 8B,

14R, 14B, 12R, 1TR,

L03, L06, L08, L14, L12, L1D, L1W

6BW, 8BW

155 °C

125 °C

–60 –40 –20

20 40 60 80 100 120 140 160 180

■ Packaging Methods (Taping)

● Standard Quantity

Ambient Temperature (°C)

Type

ERJ2BW

Kind of Taping

Pitch (P₁)

2 mm

Quantity

Pressed Carrier Taping

10000 pcs./reel

ERJ2BS, 2BQ

ERJ3R, 3B, L03

ERJ6R, 6B, L06

ERJ8R, 8B, L08

ERJ14R, 14B, L14

ERJ12R, L12

ERJL1D

Punched Carrier Taping

Embossed Carrier Taping

5000 pcs./reel

4 mm

ERJ1TR

4000 pcs./reel

3000 pcs./reel

ERJL1W

(Unit : mm)

● Carrier Tape

P₁

P₂

P₀

Pressed Carrier

Punched Carrier

Embossed Carrier

φD₀

P₁

(2 mm pitch)

φD₁(Only Emboss)

φD₀

Type

P₁

P₂

P₀

φD₁

–

0.10

0.05

0.10

0.15

0.20

0.10

0.05

ERJ2BW

0.67

1.10

1.55

1.65

1.17

0.61

0.52

0.70

0.10

2.00

0.05

0.20

ERJ2BS, 2BQ

ERJ3R, 3B, L03

ERJ6BW

–

1.90

2.30

2.50

3.60

3.50

4.80

5.30

6.90

–

0.20

8.00

0.05

3.50

5.50

–

0.05

ERJ6R, 6B, L06

0.84

–

0.10

0.05

0.10

+0.10

−0

ERJ8BW, 8R, 8B, L08 2.00

1.75

2.00

4.00

1.50

–

0.30

0.10

+0.10

ERJ14R, 14B, L14

ERJ12R, L12

ERJL1D

2.80

3.50

2.80

3.60

8.00

4.00

1.0

−0

0.10

1.00

1.60

0.20

12.00

1.5 min.

ERJ1TR

ERJL1W

● Taping Reel

(Unit : mm)

Type

φA

φB

φC

ERJ2B

ERJ3R, 3B, L03

ERJ6R, 6B, L06

ERJ8R, 8B, L08

ERJ14R, 14B, L14 180.0

ERJ12R, L12

ERJL1D

1.0

φC

9.0

11.4

–3.0

1.0

60 min. 13.0

1.0

2.0

13.0

15.4

ERJ1TR

φA

ERJL1W

Design and speciﬁcations are each subject to change without notice. Ask factory for the current technical speciﬁcations before purchase and/or use.

Should a safety concern arise regarding this product, please be sure to contact us immediately.

Feb. 2007

Thick Film Chip Resistors / Low Resistance Type

■ Recommended Land Pattern

In case of ﬂow soldering, the land width must be smaller than the Chip Resistor width to control the solder amount properly.

Generally, the land width should be 0.7 to 0.8 times (W) of the width of chip resistor. In case of reﬂow soldering, solder

amount can be adjusted, therefore the land width should be set to 1.0 to 1.3 times chip resistor width (W).

Dimensions (mm)

Type (inches)

ERJ2BW

ERJ2B

(0402)

(0402) 0.5 to 0.6

0.52

1.4 to 1.6

0.4 to 0.6

0.8 to 1

Chip Resistor

ERJ3R, 3B, L03 (0603) 0.7 to 0.9

to 2.2

ERJ6BW

ERJ6R, 6B, L06 (0805)

ERJ8BW (1206)

ERJ8R, 8B, L08 (1206)

ERJ14R, 14B, L14 (1210)

(0805)

0.9

to 1.4

1.2

to 2.4

3.2 to 3.8

4.4 to 5

5.7 to 6.5

6.2 to 7

7.6 to 8.6

1.1 to 1.4

0.9 to 1.4

1.3 to 1.8

1.2 to 1.8

1.8 to 2.8

2.3 to 3.5

1.8 to 2.8

2.3 to 3.5

ERJ12R, L12

ERJL1D

(1812) 3.3 to 3.7

(2010) 3.6 to 4

ERJ1TR

(2512)

to 5.4

ERJL1W

(2512) 3.6 to 4

■ Recommended Soldering Conditions

Recommendations and precautions are described below.

Recommended soldering conditions for reﬂow

●

· Reﬂow soldering shall be performed a maximum of

two times.

· Please contact us for additional information when

used in conditions other than those speciﬁed.

· Please measure the temperature of the terminals

and study every kind of solder and printed circuit

board for solderability before actual use.

For soldering (Example : Sn/Pb)

Temperature

Time

Preheating

Main heating

Peak

140 °C to 160 °C

Above 200 °C

235 5 °C

60 s to 120 s

30 s to 40 s

max. 10 s

Peak

Preheating

For lead-free soldering (Example : Sn/Ag/Cu)

Temperature

150 °C to 180 °C

Above 230 °C

max. 260 °C

Time

Heating

Preheating

Main heating

Peak

60 s to 120 s

30 s to 40 s

max. 10 s

Time

Recommended soldering conditions for ﬂow

●

For soldering

For lead-free soldering

Temperature

140 °C to 180 °C

245 5 °C

Time

60 s to 120 s

20 s to 30 s

Temperature

150 °C to 180 °C

max. 260 °C

Time

60 s to 120 s

max. 10 s

Preheating

Soldering

Safety Precautions

The following are precautions for individual products. Please also refer to the precautions common to Fixed Resistors

shown on page ER2 of this catalog.

1. Take measures against mechanical stress during and after mounting of Thick Film Chip Resistors (hereafter called the

resistors) so as not to damage their electrodes and protective coatings.

2. If a transient load (heavy load in a short time) like a pulse is expected to be applied, check and evaluate the operations

of the resistors when installed in your products before use.

Never exceed the rated power. Otherwise, the performance and/or reliability of the resistors may be impaired.

3. Do not use halogen-based or other high-activity ﬂux. Otherwise, the residue may impair the resistors' performance

and/or reliability.

4. When soldering with a soldering iron, never touch the resistors' bodies with the tip of the soldering iron. When using a

soldering iron with a high temperature tip, ﬁnish soldering as quickly as possible (within three seconds at 350 °C max.).

5. As the amount of applied solder becomes larger, the mechanical stress applied to the resistors increases, causing

problems such as cracks and faulty characteristics. Avoid applying an excessive amount of solder.

6. Do not apply shock to the resistors or pinch them with a hard tool (e.g. pliers and tweezers). Otherwise, the resistors'

protective coatings and bodies may be chipped, affecting their performance.

7. Avoid excessive bending of printed circuit boards in order to protect the resistors from abnormal stress.

Design and speciﬁcations are each subject to change without notice. Ask factory for the current technical speciﬁcations before purchase and/or use.

Should a safety concern arise regarding this product, please be sure to contact us immediately.

Feb. 2007

Safety Precautions

(Common precautions for Fixed Resistors)

• When using our products, no matter what sort of equipment they might be used for, be sure to make a written

agreement on the speciﬁcations with us in advance. The design and speciﬁcations in this catalog are subject

to change without prior notice.

• Do not use the products beyond the speciﬁcations described in this catalog.

• This catalog explains the quality and performance of the products as individual components. Before use, check

and evaluate their operations when installed in your products.

• Install the following systems for a failsafe design to ensure safety if these products are to be used in equipment

where a defect in these products may cause the loss of human life or other signiﬁcant damage, such as damage to

vehicles (automobile, train, vessel), trafﬁc lights, medical equipment, aerospace equipment, electric heating

appliances, combustion/gas equipment, rotating equipment, and disaster/crime prevention equipment.

Systems equipped with a protection circuit and a protection device

✽

Systems equipped with a redundant circuit or other system to prevent an unsafe status in the event of a single fault

✽

(1) Precautions for use

• These products are designed and manufactured for general and standard use in general electronic

equipment (e.g. AV equipment, home electric appliances, ofﬁce equipment, information and communication

equipment)

• These products are not intended for use in the following special conditions. Before using the products, carefully

check the effects on their quality and performance, and determine whether or not they can be used.

1. In liquid, such as water, oil, chemicals, or organic solvent

2. In direct sunlight, outdoors, or in dust

3. In salty air or air with a high concentration of corrosive gas, such as Cl₂, H₂S, NH₃, SO₂, or NO₂

4. Electric Static Discharge (ESD) Environment

These components are sensitive to static electricity and can be damaged under static shock (ESD).

Please take measures to avoid any of these environments.

Smaller components are more sensitive to ESD environment.

5. Electromagnetic Environment

Avoid any environment where strong electromagnetic waves exist.

6. In an environment where these products cause dew condensation

7. Sealing or coating of these products or a printed circuit board on which these products are mounted, with resin

or other materials

• These products generate Joule heat when energized. Carefully position these products so that their heat will not

affect the other components.

• Carefully position these products so that their temperatures will not exceed the category temperature range due

to the effects of neighboring heat-generating components. Do not mount or place heat-generating components or

inﬂammables, such as vinyl-coated wires, near these products .

• Note that non-cleaning solder, halogen-based highly active ﬂux, or water-soluble ﬂux may deteriorate the

performance or reliability of the products.

• Carefully select a ﬂux cleaning agent for use after soldering. An unsuitable agent may deteriorate the

performance or reliability. In particular, when using water or a water-soluble cleaning agent, be careful not to leave

water residues. Otherwise, the insulation performance may be deteriorated.

(2) Precautions for storage

The performance of these products, including the solderability, is guaranteed for a year from the date of arrival at your

company, provided that they remain packed as they were when delivered and stored at a temperature of 5 °C to 35 °

C and a relative humidity of 45 % to 85 %.

Even within the above guarantee periods, do not store these products in the following conditions. Otherwise, their

electrical performance and/or solderability may be deteriorated, and the packaging materials (e.g. taping materials)

may be deformed or deteriorated, resulting in mounting failures.

1. In salty air or in air with a high concentration of corrosive gas, such as Cl₂, H₂S, NH₃, SO₂, or NO₂

2. In direct sunlight

Package markings include the product number, quantity, and country of origin.

In principle, the country of origin should be indicated in English.

Oct. 2007

– ER3 –

ERJL08UF64MV [PANASONIC]

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