EXBA10P124J [PANASONIC]

贴片电阻电路;


型号：	EXBA10P124J
厂家：	PANASONIC
描述：	贴片电阻电路电阻器
文件：	总5页 (文件大小：462K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

Chip Resistor Networks

Type: EXBD:1206

EXBE:1608

EXBA:2512

EXBQ:1506

n Features

l High density placing for digital signal circuits

á Bussed 8 or 15 resistors for pull up/down circuits

EXBD: 3.2 mm ´ 1.6 mm ´ 0.55 mm, 0.635 mm pitch

EXBE: 4.0 mm ´ 2.1 mm ´ 0.55 mm, 0.8 mm pitch

EXBA: 6.4 mm ´ 3.1 mm ´ 0.55 mm, 1.27 mm pitch

EXBQ: 3.8 mm ´ 1.6 mm ´ 0.45 mm, 0.5 mm pitch

á Available direct placing on the bus line by means of half pitch spacing without through-holes on PWB

(ÒHigh density placingÓ is shown below)

l High speed mounting using conventional placing machine

l Approved under the ISO 9001 system

Direct placement on the bus line

n Explanation of Part Numbers

The first two digits are

significant figures of

resistance value and

the third one denotes

the number of zeroes

following.

Rev.02/04

Design, Specifications are subject to change without notice. Ask factory for technical specifications before purchase and/ or use.

Whenever a doubt about safety arises from this product, please inform us immediately for technical consultation without fail.

Chip Resistor Networks

n Construction (Example : EXBD)

Protective coating

High purity alumina substrate

Terminals

n Dimensions in mm (not to scale)

EXBD

EXBE

EXBA

EXBQ

n Circuit Configuration

EXBD, EXBE

EXBA

EXBA10E

EXBQ

EXBA10P

n Ratings

Item

Specifications

Series

EXBD

EXBE

EXBA

EXBQ

Resistance Range

47 W to 1 MW (E12 series)

±5 %

100 W to 470 kW (E6 series)

Resistance Tolerance

Number of Terminals

Number of Resistors

Power Rating at 70 ¡C

10 terminals

8 resistors

16 terminals

15 resistors

0.025 W/element

0.05 W/element

0.063 W/element

Limiting Element Voltage

25 V

50 V

25 V

50 V

(Maximum Rated Continuous Working Voltage)⁽¹⁾

Maximum Overload Voltage⁽²⁾

T.C.R.

100 V

±200 ´10^-6/ûC( ppm/ûC)

Category Temperature Range

Ð55 ûC to +125 ûC

(Operating Temperature Range)

(1) Rated Continuous Working Voltage (RCWV) should be determined from RCWV= Power Rating ´ Resistance Value, or Limiting Element Voltage

(maximum RCWV) listed above, whichever is less.

(2) Overload (Short-time Overload) Test Voltage (SOTV) should be determined

from SOTV=2.5 ´ RCWV^]or Maximum Overload Voltage listed above whichever is less.

Power Derating Curve

For resistors operating in ambient temperature above

70 ¡C, power rating should be derated in accordance

with the right figure.

Design, Specifications are subject to change without notice. Ask factory for technical specifications before purchase and/ or use.

Whenever a doubt about safety arises from this product, please inform us immediately for technical consultation without fail.

Chip Resistor Networks

n Recommended Land Pattern (mm)

EXBD

EXBE

Pitch 0.8 mm

Pitch 0.635 mm

For

popular

pattern

Pitch 0.4 mmáááThrough-hole less

For high

density

]

pattern

EXBA

EXBQ

Pitch 1.27 mm

For

popular

pattern

Pitch 0.5 mm

Pitch 0.635 mmáááThrough-hole less

For high

density

]

pattern

] When designing high density land patterns, examine the reliability of isolation among the lines and adopt the

chip resistor networks.

Design, Specifications are subject to change without notice. Ask factory for technical specifications before purchase and/ or use.

Whenever a doubt about safety arises from this product, please inform us immediately for technical consultation without fail.

Chip Resistor Networks

n Packaging Specifications

Standard Quantity

Type

Thickness (mm)

0.55 ± 0.10

Weight (mg) Punched (Paper) Taping Embossed Taping

(inches)

EXBD

(1206)

5000 pcs./reel

EXBE

(1608)

4000 pcs./reel

EXBA

(2512)

EXBQ

(1506)

0.45 ± 0.10

5000 pcs./reel

n Taping Dimensions

Embossed Taping Reel

l Embossed Taping

Type

EXBE

EXBA

Type

EXBE

P₀

2.50^±0.204.40^±0.20

3.50^±0.206.80^±0.20

Dimensions

(mm)

Dimensions

(mm)

12.00^±0.305.50^±0.101.75^±0.204.00^±0.10

180.0 ^Ð3.0

60 min.

13.0^±1.0

EXBA

Type

EXBE

EXBA

Type

EXBE

EXBA

P₁

P₂

fD₀

t₁

t₂

fD₁

Dimensions

(mm)

Dimensions

(mm)

4.00^±0.102.00^±0.101.50^+0.100.25^±0.051.10^±0.201.50^+0.10

13.0^±1.0

15.4^±2.0

Punched (Paper) Taping Reel

Punched (Paper) Taping

Type

P₀

EXBD 2.00^±0.203.60^±0.20

EXBQ 1.90^±0.204.10^±0.20

EXBD

EXBQ

Dimensions

(mm)

Dimensions

(mm)

13^±1.0

8.00^±0.203.50^±0.101.75^±0.104.00^±0.10

180.0 _Ð3.0

60 min.

Type

EXBD

EXBQ

P₁

P₂

fD₀

0.84^±0.10

0.64^±0.05

EXBD

EXBQ

Dimensions

(mm)

Dimensions

(mm)

9.0^±1.0

11.4^±2.0

4.00^±0.10

2.00^±0.10

1.50^+0.10

Design, Specifications are subject to change without notice. Ask factory for technical specifications before purchase and/ or use.

Whenever a doubt about safety arises from this product, please inform us immediately for technical consultation without fail.

Chip Resistor Networks

Safety Precautions

1. Soldering

Recommendations for soldering method.

lRecommended soldering conditions for reflow

áReflow soldering should be a maximum of two times

áPlease contact us for additional information when

used in conditions other than those specified.

áPlease measure the temperature of the terminations and

For solder (Example : Sn/Pb)

Temperature

140 ¡C to 160 ¡C

Above 200 ¡C

235 ± 5 ¡C

Time

Preheating

Main heating

Peak

60 s to 120 s

30 s to 40 s

max. 10 s

every type of the printed circuit board for solderability,

study

before actual use.

For lead-free solder (Example : Sn/Ag/Cu)

Temperature

Time

Preheating

Main heating

Peak

150 ¡C to 180 ¡C

Above 230 ¡C

max. 260 ¡C

60 s to 120 s

30 s to 40 s

max. 10 s

l Flow soldering

Cosult us for using flow soldering to EXBA series. Flow soldering is not recommended for Chip Resistor Networks:

EXBD/EXBE/EXBQ, because solder bridge may occur due to the 0.635 mm/0.8 mm/0.5 mm pitch of

EXBD/EXBE/EXBQ series.

l Iron soldering

1 Solder at 350 ¡C max. and 3 seconds max. with the soldering iron tip.

2 The soldering iron tip shall not touch the protective coating of the part.

l Use rosin type flux. Do not use high-activity flux (the chlorine content is 0.2 wt% or more).

l Allow enough preheating so that the difference of soldering temperature and surface

temperature of the part is 100 ¡C or less. This temperature difference should be controlled by immersion into solvent.

l Avoiding excessive amounts of solder. More solder causes mechanical stress to the part which may result in cracking

or impaired characteristics.

2. Cleaning

l Residual flux after board washing may cause solder migration. Carefully monitor board after washing.

Carefully select the type and amount of flux to be used when no washing is done. Study type of water-soluble flux and

cleaning agent and drying condition when water washing is done. Confirm that cleaning will not affect the device

performace.

3. Others

l Take necessary precautions to avoid any abnormal stress caused by bending of the board.

l Do not use the product in high humidity atmospheres.

Design, Specifications are subject to change without notice. Ask factory for technical specifications before purchase and/ or use.

Whenever a doubt about safety arises from this product, please inform us immediately for technical consultation without fail.

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