EXBA10P152J [PANASONIC]
Array/Network Resistor, Bussed, Metal Glaze/thick Film, 0.063W, 1500ohm, 50V, 5% +/-Tol, 200ppm/Cel, Surface Mount, 1225, CHIP;
| 型号： | EXBA10P152J |
| 厂家： | 
PANASONIC |
| 描述： | Array/Network Resistor, Bussed, Metal Glaze/thick Film, 0.063W, 1500ohm, 50V, 5% +/-Tol, 200ppm/Cel, Surface Mount, 1225, CHIP 电阻器 |
| 文件： | 总6页 (文件大小：178K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
Chip Resistor Networks
Chip Resistor Networks
Type:
EXBD:1206
EXBE:1608
EXBA:2512
EXBQ:1506
■ Features
● High density placing for digital signal circuits
·
Bussed 8 or 15 resistors for pull up/down circuits
EXBD: 3.2 mm ꢀ 1.6 mm ꢀ 0.55 mm, 0.635 mm pitch
EXBE: 4.0 mm ꢀ 2.1 mm ꢀ 0.55 mm, 0.8 mm pitch
EXBA: 6.4 mm ꢀ 3.1 mm ꢀ 0.55 mm, 1.27 mm pitch
EXBQ: 3.8 mm ꢀ 1.6 mm ꢀ 0.45 mm, 0.5 mm pitch
·
Available direct placing on the bus line by means of half pitch spacing without through-holes on PWB
“
”
( High density placing is shown below)
● High speed mounting using conventional placing machine
<High density placing>
Pull up resistors
VCC
Direct placement on the bus line
EXBE10C
VCC
EXBA10P
VCC
IC
IC
IC
IC
IC
IC
No through hole
Through holes
0.4 mm pitch
0.635 mm pitch
■ Explanation of Part Numbers
1
2
3
4
5
6
7
8
9
10
11
12
E
X
B
E
1
0
C
1
0
3
J
Circuit Configuration
Resistance Value
Product Code
Dimension Code of
Chip Resistor Network
Resistance Suffix for Special
Tolerance Requirements
5 %
Code Common Terminal Position
The first two digits are
significant figures of
resistance value and
the third one denotes
the number of zeros
following.
Thick Film
Resistor
Network
Type: inches
D : 1206
E : 1608
A : 2512
Q : 1506
Dimensions
3.2 mm҂1.6 mm
4.0 mm҂2.1 mm
6.4 mm҂3.1 mm
3.8 mm҂1.6 mm
J
Center common circuit
EXBD, EXBE
C
Diagonal common circuit
(Terminal 5 and Terminal 10)
EXBA10P
P
One side common circuit
(Terminal 16)
EXBQ16P
P
E
Number of
Terminals
Diagonal common circuit
(Terminal 1 and Terminal 6)
EXBA10E
10
16
Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use.
Should a safety concern arise regarding this product, please be sure to contact us immediately.
Feb. 2006
Chip Resistor Networks
■ Construction (Example : EXBD)
Protective coating
Protective coating
Electrode
(Inner)
Alumina substrate
Electrode (Outer)
Electrode (Between)
Electrode (Inner)
Thick film
resistive element
Thick film
resistive element
Alumina substrate
■ Dimensions in mm (not to scale)
EXBD
EXBE
EXBA
EXBQ
0.33 0.15
0.5 0.2
0.2 0.1
+0.15
+0.1
–0.2
f0.2 0.1
0.2 0.1
0.7 0.2
0.15
f0.3
0.2 0.1
–0.05
0.3 0.2
+0.1
–0.2
0.3 0.2
0.3 0.1
f0.3
EXBA10P
I03
I03
I03
472
0.5 0.1
0.8 0.1
0.635 0.10
0.55 0.10
1.27 0.10
6.4 0.2
0.55 0.10
0.25 0.10
4.0 0.2
3.20 0.15
0.3 0.1
0.25 0.10
0.55 0.10
0.45 0.10
0.4 0.2
3.8 0.2
0.5 0.2
0.35 0.20
EXBA10E
0.35 0.20
+0.20
0.15
–0.05
I03
Mass (Weight)[1000 pcs.] : 10 g
Mass (Weight)[1000 pcs.] : 16 g
Mass (Weight)[1000 pcs.] : 40 g
Mass (Weight)[1000 pcs.] : 9 g
■ Circuit Configuration
EXBD, EXBE
EXBA
EXBQ
EXBA10P
EXBA10E
10
10
9
8
7
9
2
8
3
7
4
6
5
10
9
2
8
3
7
4
6
5
10
7
16 15 14 13 12 11
9
8
1
6
1
2
3
4
5
6
2
3
4
5
1
1
■ Ratings
Item
Specifications
Series
EXBD
EXBE
EXBA
EXBQ
Resistance Range
47 ꢁ to 1 Mꢁ (E12)
100 ꢁ to 470 kꢁ (E6 series)
Resistance Tolerance
Number of Terminals
Number of Resistors
Power Rating at 70 °C
5%
10 terminals
8 resistors
16 terminals
15 resistors
0.025 W/element
0.05 W/element
0.063 W/element
Limiting Element Voltage
25V
50 V
25V
(Maximum Rated Continuous Working Voltage)(1)
Maximum Overload Voltage(2)
T. C. R.
50 V
100 V
50 V
200 ꢀ 10–6/ °C(ppm/ °C)
Category Temperature Range
(Operating Temperature Range)
–55 °C to +125 °C
ꢂ
(1) Rated Continuous Working Voltage (RCWV) shall be determined from RCWV= Power Rating ꢀ Resistance Value, or Limiting Element Voltage
(maximum RCWV) listed above, whichever less.
(2) Overload (Short-time Overload) Test Voltage (SOTV) shall be determined
from SOTV=2.5 ꢀ RCWV✽ or Maximum Overload Voltage listed above whichever less.
Power Derating Curve
–55 °C
70 °C
100
80
60
40
20
0
For resistors operated in ambient temperature above
70 °C, power rating shall be derated in accordance
with the figure on the right.
125 °C
20 40 60 80 100120140160180
Ambient Temperature (°C)
–60 –40 –20
0
Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use.
Should a safety concern arise regarding this product, please be sure to contact us immediately.
Feb. 2006
Chip Resistor Networks
■ Packaging Methods (Taping)
● Standard Quantity
Type
EXBD
EXBQ
EXBE
EXBA
Kind of Taping
Pitch (P1)
4 mm
Quantity
5000 pcs./reel
Punched Carrier Taping
Embossed Carrier Taping
4000 pcs./reel
● Carrier Tape
(Unit : mm)
Punched Carrier
Embossed Carrier
P1
P2
P0
fD0
T
A
T
fD1 (Only Emboss)
fD0
fD1
–
Type
EXBD
EXBQ
EXBE
EXBA
A
B
W
F
E
P1
P2
P0
T
0.84
0.64
0.20
0.20
0.20
0.20
0.20
0.10
0.05
2.00
3.60
0.20
0.30
0.05
0.20
0.10
0.20
8.00
3.50
1.75
1.75
0.20
0.20
0.20
1.90
2.50
3.50
4.10
4.40
6.80
–
0.10
0.05
0.10
+0.10
1.50
–0
4.00
2.00
4.00
0.20
+0.10
–0
12.00
5.50
1.10
1.50
● Taping Reel
(Unit : mm)
T
fA
fB
fC
Type
EXBD
EXBQ
EXBE
EXBA
W
T
1.0
1.0
9.0
11.4
+0
–3.0
1.0
180.0
60 min. 13.0
1.0
2.0
13.0
15.4
fC
fA
W
Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use.
Should a safety concern arise regarding this product, please be sure to contact us immediately.
Feb. 2006
Chip Resistor Networks
■ Recommended Land Pattern (mm)
EXBD
EXBE
Pitch 0.8 mm
0.8
0.35 to 0.4
For
Pitch 0.635 mm
popular
pattern
0.635
0.2 to 0.3
3.3 to 3.4
5.0 to 5.4
Pitch 0.4 mm···Through-hole less
0.8 0.4 0.35 to 0.4
2.6 to 2.8
0.1 to 0.15
3.6 to 4.2
For high
density
pattern✽
3.3
5.2
EXBA
EXBQ
Pitch 1.27 mm
For
popular
pattern
Pitch 0.5 mm
1.27
0.4 to 0.6
Pitch 0.635 mm···Through-hole less
EXBA10P
EXBA10E
0.20 to 0.25
0.50
0.2
1.27
0.2
1.27
0.635
0.635
For high
density
pattern✽
1.27
1.27
0.4 to 0.5
0.4 to 0.5
✽ When designing high density land patterns, examine the reliability of isolation among the lines and adopt the chip re-
sistor networks.
Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use.
Should a safety concern arise regarding this product, please be sure to contact us immediately.
Feb. 2006
Chip Resistor Networks
■ Recommended Soldering Conditions
Recommendations and precautions are described below.
Recommended soldering conditions for reflow
●
· Reflow soldering shall be performed a maximum of
two times.
· Please contact us for additional information when
used in conditions other than those specified.
· Please measure the temperature of the terminals
and study every kind of solder and printed circuit
board for solderability before actual use.
For soldering (Example : Sn/Pb)
Temperature
140 °C to 160 °C
Above 200 °C
235 5 °C
Time
Preheating
Main heating
Peak
60 s to 120 s
30 s to 40 s
max. 10 s
Peak
Preheating
For lead-free soldering (Example : Sn/Ag/Cu)
Temperature
150 °C to 180 °C
Above 230 °C
max. 260 °C
Time
Heating
Preheating
Main heating
Peak
60 s to 120 s
30 s to 40 s
max. 10 s
Time
Flow soldering
●
Please contact us regarding flow soldering of EXBA series. We do not recommend flow soldering to the
Chip Resistor Networks: EXBD/EXBE/EXBQ, because solder bridging may occur due to the narrow 0.635 mm/
0.8 mm/0.5 mm pitch of EXBD/EXBE/EXBQ type.
Safety Precautions
The following are precautions for individual products. Please also refer to the precautions common to Fixed Resistors
shown on page ER3 of this catalog.
1. Take measures against mechanical stress during and after mounting of Chip Resistor Networks (hereafter called the
resistors) so as not to damage their electrodes and protective coatings.
Be careful not to misplace the resistors on the land patterns. Otherwise, solder bridging may occur.
2. If a transient load (heavy load in a short time) like a pulse is expected to be applied, check and evaluate the operations
of the resistors when installed in your products before use.
Never exceed the rated power. Otherwise, the performance and/or reliability of the resistors may be impaired.
3. Do not use halogen-based or other high-activity flux. Otherwise, the residue may impair the resistors' performance
and/or reliability.
4. When soldering with a soldering iron, never touch the resistors' bodies with the tip of the soldering iron. When using a
soldering iron with a high temperature tip, finish soldering as quickly as possible (within three seconds at 350 °C max.).
5. As the amount of applied solder becomes larger, the mechanical stress applied to the resistors increases, causing
problems such as cracks and faulty characteristics. Avoid applying an excessive amounts of solder.
6. Do not apply shock to the resistors or pinch them with a hard tool (e.g. pliers and tweezers). Otherwise, the resistors'
protective coatings and bodies may be chipped, affecting their performance.
7. Avoid excessive bending of printed circuit boards in order to protect the resistors from abnormal stress.
Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use.
Should a safety concern arise regarding this product, please be sure to contact us immediately.
Feb. 2006
Safety Precautions
(Common precautions for Fixed Resistors)
• When using our products, no matter what sort of equipment they might be used for, be sure to make a written
agreement on the specifications with us in advance. The design and specifications in this catalog are subject
to change without prior notice.
• Do not use the products beyond the specifications described in this catalog.
• This catalog explains the quality and performance of the products as individual components. Before use, check
and evaluate their operations when installed in your products.
• Install the following systems for a failsafe design to ensure safety if these products are to be used in equipment
where a defect in these products may cause the loss of human life or other significant damage, such as damage to
vehicles (automobile, train, vessel), traffic lights, medical equipment, aerospace equipment, electric heating
appliances, combustion/gas equipment, rotating equipment, and disaster/crime prevention equipment.
Systems equipped with a protection circuit and a protection device
✽
Systems equipped with a redundant circuit or other system to prevent an unsafe status in the event of a single fault
✽
(1) Precautions for use
• These products are designed and manufactured for general and standard use in general electronic
equipment (e.g. AV equipment, home electric appliances, office equipment, information and communication
equipment)
• These products are not intended for use in the following special conditions. Before using the products, carefully
check the effects on their quality and performance, and determine whether or not they can be used.
1. In liquid, such as water, oil, chemicals, or organic solvent
2. In direct sunlight, outdoors, or in dust
3. In salty air or air with a high concentration of corrosive gas, such as Cl , H S, NH , SO , or NO
4. Electric Static Discharge (ESD) Environment
2
2
3
2
2
These components are sensitive to static electricity and can be damaged under static shock (ESD).
Please take measures to avoid any of these environments.
Smaller components are more sensitive to ESD environment.
5. Electromagnetic Environment
Avoid any environment where strong electromagnetic waves exist.
6. In an environment where these products cause dew condensation
7. Sealing or coating of these products or a printed circuit board on which these products are mounted, with resin
or other materials
• These products generate Joule heat when energized. Carefully position these products so that their heat will not
affect the other components.
• Carefully position these products so that their temperatures will not exceed the category temperature range due
to the effects of neighboring heat-generating components. Do not mount or place heat-generating components or
inflammables, such as vinyl-coated wires, near these products .
• Note that non-cleaning solder, halogen-based highly active flux, or water-soluble flux may deteriorate the
performance or reliability of the products.
• Carefully select a flux cleaning agent for use after soldering. An unsuitable agent may deteriorate the
performance or reliability. In particular, when using water or a water-soluble cleaning agent, be careful not to leave
water residues. Otherwise, the insulation performance may be deteriorated.
(2) Precautions for storage
The performance of these products, including the solderability, is guaranteed for a year from the date of arrival at your
company, provided that they remain packed as they were when delivered and stored at a temperature of 5 °C to 35 °
C and a relative humidity of 45 % to 85 %.
Even within the above guarantee periods, do not store these products in the following conditions. Otherwise, their
electrical performance and/or solderability may be deteriorated, and the packaging materials (e.g. taping materials)
may be deformed or deteriorated, resulting in mounting failures.
2
2
3
2
2
1. In salty air or in air with a high concentration of corrosive gas, such as Cl , H S, NH , SO , or NO
2. In direct sunlight
<Package markings>
Package markings include the product number, quantity, and country of origin.
In principle, the country of origin should be indicated in English.
Feb. 2006
– ER3 –
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