EXBS8V244J [PANASONIC]
多连贴片电阻器;
| 型号： | EXBS8V244J |
| 厂家： | 
PANASONIC |
| 描述： | 多连贴片电阻器 电阻器 |
| 文件： | 总6页 (文件大小：320K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
Chip Resistor Array
Chip Resistor Array
Type:
EXB1 : 0201 Array
EXB2 : 0402 Array
EXB3 : 0603 Array
EXBN: 0402 Array
EXBV : 0603 Array
EXBS : 0805 Array
■ Features
● High density
2 resistors in 0.8 mm ꢁ 0.6 mm size (EXB14V)
4 resistors in 1.4 mm ꢁ 0.6 mm size (EXB18V)
2 resistors in 1.0 mm ꢁ 1.0 mm size (EXB24V)
4 resistors in 2.0 mm ꢁ 1.0 mm size (EXB28V, N8V)
8 resistors in 3.8 mm ꢁ 1.6 mm size (EXB2HV)
2 resistors in 1.6 mm ꢁ 1.6 mm size (EXB34V, V4V)
4 resistors in 3.2 mm ꢁ 1.6 mm size (EXB38V, V8V)
4 resistors in 5.1 mm ꢁ 2.2 mm size (EXBS8V)
● Improvement of placement efficiency
Placement efficiency of Chip Resistor Array is two, four or eight times of the flat type chip resistor
■ Explanation of Part Numbers
1
2
3
4
5
6
7
8
9
10
11
E
X
B
V
8
V
4
7
2
J
V
Product Code
Schematics
Chip Resistor Array
Type: inches
No. of Terminal
Resistance Value
Packaging Methods
Packaging
Resistance
Tolerance
4
8
4 Terminal
8 Terminal
Type
Isolated The first two digits are
Code
Nil
Thick Film
Chip Resistor
Networks
V
type
significant figures of
resistance value and
the third one denotes
the number of zeros
following. Jumper is
expressed by R00
1
2
3
N
V
S
0201 Array
0402 Array Convex
5 %
J
Embossed Carrier Taping
4 mm pitch
EXBS8V
H 16 Terminal
Jumper
0
Terminal
0603 Array
0402 Array
0603 Array
0805 Array
Punched Carrier Taping EXB14V, 18V,
24V, 28V, N8V
X
V
2 mm pitch
Concave
Terminal
Punched Carrier Taping EXB2HV, 34V,
38V, V4V, V8V
4 mm pitch
Example: 222: 2.2 kꢀ
■ Construction (Example : Concave Terminal)
■ Schematics
● Isolated type
14V, 24V, 34V, V4V
18V, 28V, N8V, 38V, V8V, S8V
4 resistors
2 resistors
4
3
8
7
6
5
Protective coating
1
2
1
2
3
4
Alumina substrate
2HV
8 resistors
Electrode (Outer)
Thick film
16 15 14 13 12 11 10
9
8
Electrode (Between)
resistive element
Electrode (Inner)
1
2
3
4
5
6
7
Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use.
Should a safety concern arise regarding this product, please be sure to contact us immediately.
Mar. 2008
Chip Resistor Array
■ Dimensions in mm (not to scale)
(1) Convex Terminal type
EXB14V, 24V, 34V
EXB28V, 38V
A2
A1
A1
P
T
T
P
L
L
EXB2HV
A1 A2
P
T
L
Dimensions (mm)
Type
(inches)
Mass (Weight)
[g/1000 pcs.]
L
0.80
1.00
2.00
3.80
W
T
0.35
0.35
0.35
0.45
0.50
0.50
A1
A2
—
—
B
P
G
0.10
0.10
0.10
0.10
0.10
0.10
0.10
0.10
0.10
0.10
0.10
0.10
0.15
0.15
0.10
0.10
0.10
0.10
0.20
0.20
0.10
0.10
0.10
0.10
0.20
0.20
EXB14V (0201ꢁ2)
EXB24V (0402ꢁ2)
EXB28V (0402ꢁ4)
EXB2HV (0402ꢁ8)
0.60
1.00
1.00
1.60
1.60
1.60
0.35
0.15
0.18
0.20
0.30
0.30
0.30
(0.50)
(0.65)
(0.50)
(0.50)
(0.80)
(0.80)
0.15
0.25
0.25
0.30
0.30
0.35
0.5
1.2
0.10
0.10
0.10
0.20
0.20
0.10
0.10
0.10
0.15
0.15
0.40
0.45
0.35
0.65
0.65
0.10
0.35
2.0
0.10
0.35
9.0
EXB34V (0603ꢁ2) 1.60
EXB38V (0603ꢁ4) 3.20
—
3.5
0.15
0.45
7.0
(
) Reference
(2) Concave Terminal type
EXBV4V
EXBN8V, V8V, S8V
A1
A2
A1
P
P
L
T
T
L
Dimensions (mm)
A1 A2
Type
(inches)
Mass (Weight)
[g/1000 pcs.]
L
W
T
0.45
0.60
0.60
0.70
B
P
G
0.30
0.45
0.45
0.55
0.10
0.10
0.10
0.10
0.10
0.20
0.10
0.10
0.10
0.15
0.10
0.15
0.15
0.15
0.15
0.15
EXBN8V (0402ꢁ4) 2.00
EXBV4V (0603ꢁ2) 1.60
EXBV8V (0603ꢁ4) 3.20
EXBS8V (0805ꢁ4) 5.08
1.00
1.60
1.60
2.20
0.30
0.30
0.20
0.30
0.30
0.50
(0.50)
(0.80)
(0.80)
(1.27)
3.0
+0.20
–0.10
+0.20
–0.10
0.15
0.15
0.15
0.60
0.60
0.80
—
5.0
10
+0.20
–0.10
+0.20
–0.10
0.10
0.15
0.60
0.80
+0.20
–0.10
+0.20
–0.10
30
(
) Reference
(3) Flat Terminal type
EXB18V
A1
A2
P
T
L
Dimensions (mm)
A1 A2
Type
(inches)
Mass (Weight)
[g/1000 pcs.]
L
W
T
B
P
G
0.10
0.10
0.10
0.10
0.10
0.10
0.10
EXB18V (0201ꢁ4)
1.40
0.60
0.35
0.20
0.20
0.10
(0.40)
0.20
1.0
(
) Reference
Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use.
Should a safety concern arise regarding this product, please be sure to contact us immediately.
Feb. 2006
Chip Resistor Array
■ Ratings
Item
Specifications
10 ꢀ to 1 Mꢀ:E24 series
J: 5 %
Item
Specifications
14V,18V
12.5 V
25 V
Resistance Range
Limiting Element Voltage(1)
Max. Rated Continuous
2HV
Resistance Tolerance
24V,28V,N8V,38V,34V,V4V,V8V 50 V
(
)
Working Voltage
S8V
100 V
25 V
50 V
14V,24V,V4V,34V
4 terminal
14V,18V
2HV
Number of Terminals 18V,28V,N8V,38V,V8V,S8V 8 terminal
Max. Over-load Voltage (2)
2HV
16 terminal
2 terminal
24V,28V,N8V,38V,34V,V4V,V8V 100 V
S8V
200 V
14V,24V,V4V,34V
T.C.R.
200ꢁ10-6/°C(ppm/°C)
Number of Resistors 18V,28V,N8V,38V,V8V,S8V 4 terminal
2HV
8 terminal
Category Temperature Range
(Operating Temperature Range)
–55 °C to 125 °C
0.5 A
14V,28V,N8V
0.031 W/element
14V,18V
0.031 W/element
(0.1 W/package)
18V
Rated Current 2HV,24V,28V,N8V,38V,34V,V4V,V8V 1 A
Power Rating at 70 °C 24V,V4V,34V,V8V,38V
0.063 W/element
0.1 W/element
S8V
2 A
1 A
14V,18V
S8V
2HV
Max, Overload Current 2HV,24V,28V,N8V,38V,34V,V4V,V8V 2 A
0.063 W/element
(0.25 W/package)
S8V
4 A
ꢂ
(1) Rated Continuous Working Voltage (RCWV) shall be determined from RCWV= Power Rating ꢁ Resistance Value, or Limiting Element Voltage (max.
RCWV) listed above, whichever less.
(2) Overload (Short-time Overload) Test Voltage (SOTV) shall be determined from SOTV=2.5 ꢁ Power Rating or max. Overload (Voltage) listed above whichever less.
–55 °C
70 °C
100
80
60
40
20
0
Power Derating Curve
For resistors operated in ambient temperature above
70 °C, power rating shall be derated in accordance
with the figure on the right.
125 °C
20 40 60 80 100 120 140 160 180
–60 –40 –20
0
Ambient Temperature (°C)
■ Packaging Methods (Taping)
● Standard Quantity
Type
Kind of Taping
Pitch (P1)
Quantity
EXB14V, 18V
EXB24V, 28V
EXBN8V
2 mm
10000 pcs./reel
Punched Carrier Taping
Embossed Carrier Taping
EXB2HV
EXB34V, 38V
EXBV4V, V8V
EXBS8V
5000 pcs./reel
2500 pcs./reel
4 mm
Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use.
Should a safety concern arise regarding this product, please be sure to contact us immediately.
Feb. 2006
Chip Resistor Array
● Carrier Tape
Unit (mm)
Punched Carrier
Embossed Carrier
P1
P2
P0
φD0
P1
(2 mm pitch)
T
A
T
φD1 (Only Emboss)
Type
A
B
W
F
3.50
5.50
E
P1
P2
P0
T
φD0
φD1
+0.05
–0.10
EXB14V
EXB18V
EXB24V
EXB28V
EXBN8V
EXB2HV
EXB34V
EXB38V
EXBV4V
EXBV8V
EXBS8V
0.95
1.60
1.20
+0.10
–0.05
0.70
0.10
0.05
0.52
0.10
0.10
0.10
2.00
0.10
1.20
2.20
0.20
0.05
8.00
_
0.15
0.20
0.20
0.20
0.20
0.20
0.10
0.05
0.10
+0.10
4.10
1.95
3.60
1.95
3.60
5.70
1.75
2.00
4.00
1.50
–0
0.05
0.05
0.70
0.84
0.15
0.20
1.95
2.80
0.10
4.00
0.30
0.20
+0.10
1.60 max. 1.50
–0
12.00
● Taping Reel
Unit (mm)
T
Type
W
φA
φB
φC
T
EXB14V,18V
EXB24V,28V
EXBN8V
φC
1.0
1.0
9.0
11.4
180.0+–0 60 min. 13.0
1.0
EXB2HV
3.0
EXB34V,38V
EXBV4V,V8V
EXBS8V
1.0
2.0
13.0
15.4
φA
W
■ Land pattern design
Recommended land pattern design for Network chip is shown below.
Conductor
f
a
Solder Resist
b
c
b
c
(Not to scale)
Unit (mm)
d
(Not to scale)
Dimensions
Dimensions
Unit (mm)
f
Type
Type
a
b
c
a
b
c
14V
24V
0.30
0.30
0.30
0.80 to 0.90
1.4 to 1.5
18V
0.20 to 0.30 0.15 to 0.20 0.15 to 0.20 0.80 to 0.90
2 to 2.4
34V,38V 0.7 to 0.9 0.4 to 0.5 0.4 to 0.5 2.2 to 2.6
S8V 1 to 1.2 0.5 to 0.75 0.5 to 0.75 3.2 to 3.8
0.5
0.35 to 0.40
0.30
V4V,V8V 0.7 to 0.9 0.4 to 0.45 0.4 to 0.45
Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use.
Should a safety concern arise regarding this product, please be sure to contact us immediately.
Jun. 2008
Chip Resistor Array
a
f
a
f
b
b
d
c d c d
b
d c d c
d
c d c
d
c d c d
b
(Not to scale)
(Not to scale)
Dimensions
Unit (mm)
f
Dimensions
Unit (mm)
f
Type
Type
a
b
c
d
a
b
c
d
28V
N8V
0.40
0.525
0.25
0.25
0.25
0.25
1.40
1.40 to 2.00
2HV
1.00
0.425
0.25
0.25
2.00
0.45 to 0.50 0.35 to 0.38
■ Recommended Soldering Conditions
Recommendations and precautions are described below.
Recommended soldering conditions for reflow
●
· Reflow soldering shall be performed a maximum of
two times.
· Please contact us for additional information when
used in conditions other than those specified.
· Please measure the temperature of the terminals
and study every kind of solder and printed circuit
board for solderability before actual use.
For soldering (Example : Sn/Pb)
Temperature
Time
Preheating
Main heating
Peak
140 °C to 160 °C
Above 200 °C
235 5 °C
60 s to 120 s
30 s to 40 s
max. 10 s
Peak
Preheating
For lead-free soldering (Example : Sn/Ag/Cu)
Temperature
150 °C to 180 °C
Above 230 °C
max. 260 °C
Time
Heating
Preheating
Main heating
Peak
60 s to 120 s
30 s to 40 s
max. 10 s
Time
Flow soldering
●
·We do not recommend flow soldering, because a solder bridge may form.
Safety Precautions
The following are precautions for individual products. Please also refer to the precautions common to Fixed Resistors
shown on page ER3 of this catalog.
1. Take measures against mechanical stress during and after mounting of Chip Resistor Array (hereafter called the
resistors) so as not to damage their electrodes and protective coatings.
Be careful not to misplace the resistors on the land patterns. Otherwise, solder bridging may occur.
2. If a transient load (heavy load in a short time) like a pulse is expected to be applied, check and evaluate the operations
of the resistors when installed in your products before use.
Never exceed the rated power. Otherwise, the performance and/or reliability of the resistors may be impaired.
3. Do not use halogen-based or other high-activity flux. Otherwise, the residue may impair the resistors' performance
and/or reliability.
4. When soldering with a soldering iron, never touch the resistors' bodies with the tip of the soldering iron. When using a
soldering iron with a high temperature tip, finish soldering as quickly as possible (within three seconds at 350 °C max.).
5. As the amount of applied solder becomes larger, the mechanical stress applied to the resistors increases, causing
problems such as cracks and faulty characteristics. Avoid applying an excessive amounts of solder.
6. Do not apply shock to the resistors or pinch them with a hard tool (e.g. pliers and tweezers). Otherwise, the resistors'
protective coatings and bodies may be chipped, affecting their performance.
7. Avoid excessive bending of printed circuit boards in order to protect the resistors from abnormal stress.
Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use.
Should a safety concern arise regarding this product, please be sure to contact us immediately.
Feb. 2006
Safety Precautions
(Common precautions for Fixed Resistors)
• When using our products, no matter what sort of equipment they might be used for, be sure to make a written
agreement on the specifications with us in advance. The design and specifications in this catalog are subject
to change without prior notice.
• Do not use the products beyond the specifications described in this catalog.
• This catalog explains the quality and performance of the products as individual components. Before use, check
and evaluate their operations when installed in your products.
• Install the following systems for a failsafe design to ensure safety if these products are to be used in equipment
where a defect in these products may cause the loss of human life or other significant damage, such as damage to
vehicles (automobile, train, vessel), traffic lights, medical equipment, aerospace equipment, electric heating
appliances, combustion/gas equipment, rotating equipment, and disaster/crime prevention equipment.
Systems equipped with a protection circuit and a protection device
✽
Systems equipped with a redundant circuit or other system to prevent an unsafe status in the event of a single fault
✽
(1) Precautions for use
• These products are designed and manufactured for general and standard use in general electronic
equipment (e.g. AV equipment, home electric appliances, office equipment, information and communication
equipment)
• These products are not intended for use in the following special conditions. Before using the products, carefully
check the effects on their quality and performance, and determine whether or not they can be used.
1. In liquid, such as water, oil, chemicals, or organic solvent
2. In direct sunlight, outdoors, or in dust
3. In salty air or air with a high concentration of corrosive gas, such as Cl2, H2S, NH3, SO2, or NO2
4. Electric Static Discharge (ESD) Environment
These components are sensitive to static electricity and can be damaged under static shock (ESD).
Please take measures to avoid any of these environments.
Smaller components are more sensitive to ESD environment.
5. Electromagnetic Environment
Avoid any environment where strong electromagnetic waves exist.
6. In an environment where these products cause dew condensation
7. Sealing or coating of these products or a printed circuit board on which these products are mounted, with resin
or other materials
• These products generate Joule heat when energized. Carefully position these products so that their heat will not
affect the other components.
• Carefully position these products so that their temperatures will not exceed the category temperature range due
to the effects of neighboring heat-generating components. Do not mount or place heat-generating components or
inflammables, such as vinyl-coated wires, near these products .
• Note that non-cleaning solder, halogen-based highly active flux, or water-soluble flux may deteriorate the
performance or reliability of the products.
• Carefully select a flux cleaning agent for use after soldering. An unsuitable agent may deteriorate the
performance or reliability. In particular, when using water or a water-soluble cleaning agent, be careful not to leave
water residues. Otherwise, the insulation performance may be deteriorated.
(2) Precautions for storage
The performance of these products, including the solderability, is guaranteed for a year from the date of arrival at your
company, provided that they remain packed as they were when delivered and stored at a temperature of 5 °C to 35 °
C and a relative humidity of 45 % to 85 %.
Even within the above guarantee periods, do not store these products in the following conditions. Otherwise, their
electrical performance and/or solderability may be deteriorated, and the packaging materials (e.g. taping materials)
may be deformed or deteriorated, resulting in mounting failures.
1. In salty air or in air with a high concentration of corrosive gas, such as Cl2, H2S, NH3, SO2, or NO2
2. In direct sunlight
<Package markings>
Package markings include the product number, quantity, and country of origin.
In principle, the country of origin should be indicated in English.
Oct. 2007
– ER3 –
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