EZANT56AAAJ [PANASONIC]

RC Network, RC Low Pass Filter, 0.063W, 470ohm, 50V, 0.001uF, Surface Mount, 10 Pins, CHIP;


型号：	EZANT56AAAJ
厂家：	PANASONIC
描述：	RC Network, RC Low Pass Filter, 0.063W, 470ohm, 50V, 0.001uF, Surface Mount, 10 Pins, CHIP LTE 电容器电阻器网络电容器网络
文件：	总8页 (文件大小：935K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

Chip RC Networks

Type: EZASTB/SSB

^Type:E^EZ^ZA^AS^DT^T/SS

EZANT

n Features

1. Smallest SMD R/C networks

l 4 popular noise reduction circuits made from damping resistors and bypass capacitors in a smallest chip

EZADT

: 3.2 mm ´ 1.6 mm ´ 0.65 mm, 0.635 mm pitch

: 4.0 mm ´ 2.1 mm ´ 0.65 mm, 0.8 mm pitch

EZAST/SS

EZASTB/SSB : 4.0 mm ´ 2.1 mm ´ 0.65 mm, 0.65 mm pitch

EZANT

: 6.4 mm ´ 3.1 mm ´ 0.80 mm, 1.27 mm pitch

l Smaller occupied space than discrete chip resistor & chip capacitor

EZADT:50 % of 0402 (1.0 mm ´ 0.5 mm) chips placing area

EZAST/SS, EZASTB/SSB:70 % of 0402 (1.0 mm ´ 0.5 mm) chips placing area

EZANT:45 % of 0805 (2.0 mm ´ 1.2 mm) chips placing area

2. Type:EZADT, EZAST/SS, EZANT(Concave terminal type)

l Firm solder joint(2 times of convex terminal)

l Self-alignment of placement at reflow soldering

3. Type:EZASTB/SSB(Convex terminal type)

l Vision recognition shall be easy

RC Low pass filter

AC Terminator

n Recommended Applications

l Digital equipment such as Personal computers, Printers, HDD, PCMCIA cards, PDA and Word processors

l Communication equipment, Digital cordless phones, Automobile phones, GSM, PHS, DECT

l Digital audio and Video equipment

l Electric musical instruments, and digital devices

Chip RC Networks

n Explanation of Part Number

l EZADT EZAST EZANT (R/C Standard Combination)

l EZADT EZASS EZANT (R/C Except the standard Combination)

l EZASTB (R/C Standard Combination)

l EZASSB (R/C Except the standard Combination)

Chip RC Networks

n Construction

n Circuit Configuration

EZADT

EZAST/SS

EZANT ¥ EZAST/SS ¥ EZADT

EZASTB/SSB

EZANT

EZASTB/SSB

n Dimensions in mm(not to scale)

EZADT

EZAST/SS

Mass (Weight) [1000 pcs.] :11 g

Mass (Weight) [1000 pcs.] :17 g

EZANT

EZASTB/SSB

Mass (Weight) [1000 pcs.] :55 g

Mass (Weight) [1000 pcs.] :18 g

Chip RC Networks

n Ratings

Item

Specification

10 W to 100 kW

Standard : 22 W, 47 W, 100 W, 220 W, 470 W, 1 kW

±5 %

Resistance Values

Resistance Tolerance

Temperature Cofficient of Resistor (T.C.R.)

Rated Power

Limiting Element Voltage (Maximum Rated Continuous Working Voltage)

±200 ´ 10^Ð6/ûC(ppm/ûC)

0.063 W(<70 ûC⁽¹⁾)

25 V⁽²⁾

EZAD : 10 pF to 100 pF

EZAS : 10 pF to 180 pF

Standard : 22 pF, 47 pF, 100 pF

EZAN : 220 pF to 1000 pF

Standard : 220 pF, 470 pF, 1000 pF

+30 %/Ð20 %

Capacitance Values

(25 ûC, 1 kHz⁽³⁾, 1 Vrms)

Capacitance Tolerance

Capacitance Temperature Characteristics

Dissipation Factor

E Characteristic: +20 %/Ð55 %(Ð25 ûC to +85 ûC)

Less than 3 %(25 ûC, 1 kHz⁽³⁾, 1 Vrms)

EZAD : 12 V

Rated Voltage

EZAS : 25 V

EZAN : 50 V

Category Temperature Range (Operating Temperature Range)

Ð25 ûC to +85 ûC

(1) For resistors operated in ambient temperature above 70 ¡C, rated power shall be derated.(ÒPower Derating CurveÓ is shown below)

(2) Rated Voltage for resistor shall be determined from ÖRated Power´Resistance Value, or Limiting Element Voltage (Max. Rated Continuous Work-

ing Voltage) whichever less.

(3) In measuring at 1 MHz, Capacitance and Dissipation Factor are different.

Power Derating Curve

For resistors operated in ambient temperatures above

70 ¡C, power rating shall be derated in accordance

with the right figure.

n Attenuation Characteristics

lEZADT

lEZST EZASTB

lEZANT

Chip RC Networks

n Packaging Methods (Taping)

l Standard Quantity

Type

Kind of Taping

Pitch (P

4 mm

)

Quantity

EZADT

Punched Carrier Taping

Embossed Carrier Taping

5000 pcs./reel

EZAST/SS

EZASTB/SSB

EZANT

4000 pcs./reel

l Carrier Tape

(Unit : mm)

Punched Carrier

Embossed Carrier

Type

EZADT

P₁

P₂

P₀

fD₀

fD₁

2.00^±0.20

3.60^±0.20

8.00^±0.20

3.50^±0.05

1.75^±0.10

0.84^±0.10

EZAST/SS

EZASTB/SSB

EZANT

+0.10

2.50^±0.20

3.50^±0.20

4.40^±0.20

6.80^±0.20

4.00^±0.10

2.00^±0.05

4.00^±0.10

1.50

1.15^±0.20

1.30^±0.20

-0

+0.10

12.00^±0.305.50^±0.20

1.75^±0.20

1.50

-0

(Unit : mm)

l Taping Reel

Type

EZADT

9.0^±1.0

11.4^±1.0

EZAST/SS

EZASTB/SSB

EZANT

180.0

60 min. 13.0^±1.0

-3.0

13.0^±1.0

15.4^±2.0

Chip RC Networks

n Recommended Land Pattern Design

lEZADT

Dimensions

(mm)

0.9 to 1.1 0.2 to 0.3 2.6 to 2.8 0.3 to 0.4

Dimensions

(mm)

2.0 to 2.6 3.6 to 4.2

0.635

lEZAST/SS

Dimensions

(mm)

1.2 to 1.4

0.4

3.1 to 3.3 0.4 to 0.5

Dimensions

(mm)

0.8

2.9 to 3.3 4.8 to 5.2

0.8

lEZASTB/SSB

Dimensions

(mm)

1.4 to 1.6

0.35

0.45

0.3

Dimensions

(mm)

2.7 to 3.5

3.8

0.65

lEZANT

Dimensions

(mm)

2.3 to 2.5 0.4 to 0.6 5.6 to 5.8 0.4 to 0.8

Dimensions

(mm)

4.3 to 4.7 7.6 to 8.0

1.27

¥ Design to make GND pattern as large as possible, because high

frequency noise is removed from GND terminals of chip RC network.

Chip RC Networks

n Recommended Soldering Conditions

Recommendations and precautions are described below.

lRecommended soldering conditions for reflow

áReflow soldering shall be two times maximum.

áPlease contact us for additional information when you

use in conditions other than those specified.

áPlease measure a temperature of terminations and study

solderability every kind of solder and board, before actual

use.

For solder (Example : Sn/Pb)

Temperature

140 ¡C to 160 ¡C

Time

Preheating

Main heating

Peak

60 s to120 s

30 s to 40 s

max. 10 s

Above 200 ¡C

235 ± 5 ¡C

For lead-free solder (Example : Sn/Ag/Cu)

Temperature

Time

Preheating

Main heating

Peak

150 ¡C to 180 ¡C

Above 230 ¡C

max. 260 ¡C

60 s to 120 s

30 s to 40 s

max. 10 s

This product has circuits on both sides. Do not use adhesives,

because we are afraid that characteristics is impaired by adhesives.

l Flow Soldering

We can not recommend the flow soldering to the product, because we are afraid that solder bridge may

happen owing to narrow pitch of it's terminals and the characteristic of the product may be badly

affected when using adhesive to fix it on circuit board.

Cautions for Safety

The following are precautions for individual products. Please also refer to the precautions common to CR Combinations,

Fuses, and Sensors shown on page EX3 of this catalog.

1. Take measures against mechanical stress during and after mounting of Chip RC Networks (hereafter called the RC

Networks) so as not to damage their electrodes and protective coatings.

Be careful not to misplace the RC Networks on the land patterns. Otherwise, solder bridges may be caused.

2. Do not use halogen-based or other high-activity flux. Otherwise, the residue may impair the RC Networks' performance

and/or reliability.

3. Perform sufficient preheating so that the difference of the solder temperature and the RC Networks chip surface

temperature becomes 100 ¡C or less. Maintain the temperature difference within 100 ¡C during rapid cooling by

immersion into solvent after soldering.

4. When soldering with a soldering iron, never touch the RC Networks' bodies with the tip of the soldering iron. When

using a soldering iron with a high temperature tip, finish the soldering as quickly as possible (within three seconds at

350 ¡C max.).

5. As the amount of applied solder becomes larger, the mechanical stress applied to the RC Networks increases, causing

problems such as cracks and faulty characteristics. Avoid applying an excessive amount of solder.

6. Do not apply a shock to the RC Networks or pinch them with a hard tool (e.g. pliers and tweezers). Otherwise, the RC

Networks' protective coatings and bodies may be chipped, affecting their performance.

7. Avoid excessive bend of printed circuit boards in order to protect the RC Networks from abnormal stress.

8. The static capacitance may decrease by a few percent from the time of shipment due to the characteristics peculiar to

dielectric materials having a high dielectric constant.

Caution for Safety (Common precautions for CR Combinations, Fuses, and Sensors)

¥ When using our products, no matter what sort of equipment they might be used for, be sure to make a written

agreement on the specifications with us in advance. The design and specifications in this catalog are subject

to change without prior notice.

¥ Do not use the products beyond the specifications described in this catalog.

¥ This catalog explains the quality and performance of the products as individual components. Before use, check

and evaluate their operations when installed in your products.

¥ Install the following systems for a failsafe design to ensure safety if these products are to be used in equipment

where a defect in these products may cause the loss of human life or other significant damage, such as damage to

vehicles (automobile, train, vessel), traffic lights, medical equipment, aerospace equipment, electric heating

appliances, combustion/gas equipment, rotating equipment, and disaster/crime prevention equipment.

] Systems equipped with a protection circuit and a protection device

] Systems equipped with a redundant circuit or other system to prevent an unsafe status in the event of a single fault

(1) Precautions for use

¥ These products are designed and manufactured for general purpose and standard use in general electronic

equipment (e.g. AV equipment, home electric appliances, office equipment, information and communication

equipment)

¥ These products are not intended for use in the following special conditions. Before using the products,

carefully check the effects on their quality and performance, and determine whether or not they can be used.

1. In liquid, such as water, oil, chemicals, or organic solvent

2. In direct sunlight, outdoors, or in dust

3. In salty air or air with a high concentration of corrosive gas, such as Cl

, H

S, NH

, SO

, or NO

4. In an environment where strong static electricity or electromagnetic waves exist

5. In an environment where these products cause dew condensation

6. Sealing or coating of these products or a printed circuit board on which these products are mounted, with

resin or other materials

¥ These products generate Joule heat when energized. Carefully position these products so that their heat will

not affect the other components.

¥ Carefully position these products so that their temperatures will not exceed the category temperature range due

to the effects of neighboring heat-generating components. Do not mount or place heat-generating components

or inflammables, such as vinyl-coated wires, near these products (except Thermal Cutoffs).

¥ Note that non-cleaning solder, halogen-based highly active flux, or water-soluble flux may deteriorate the

performance or reliability of the products.

¥ Carefully select a flux cleaning agent for use after soldering. An unsuitable agent may deteriorate the performance

or reliability. In particular, when using water or a water-soluble cleaning agent, be careful not to leave water

residues. Otherwise, the insulation performance may be deteriorated.

(2) Precautions for storage

The performance of these products, including the solderability, is guaranteed for a year from the date of arrival

at your company, provided that they remain packed as they were when delivered and stored at a temperature

of 5 ¡C to 35 ¡C and a relative humidity of 45 % to 85 %.

The performance of Combinations(EMI Filters) is guaranteed for 6 months or a year from the outgoing inspection

date indicated on the packages, provided that they are stored at a temperature of -5 ¡C to +40 ¡C and a relative

humidity of 40 % to 60 %. Check the guarantee period in the specifications. The performance of Thermal

Cutoffs is guaranteed for a year from the outgoing inspection date indicated on the packages, provided that

they are stored at a temperature of -10 ¡C to +40 ¡C and a relative humidity of 30 % to 75 %.

Even within the above guarantee periods, do not store these products in the following conditions. Otherwise,

their electrical performance and/or solderability may be deteriorated, and the packaging materials (e.g. taping

materials) may be deformed or deteriorated, resulting in mounting failures.

1. In salty air or in air with a high concentration of corrosive gas, such as Cl

2. In direct sunlight

, H

S, NH

, SO

, or NO

Package markings include the product number, quantity, and country of origin.

In principle, the country of origin should be indicated in English.

– EX3 –

EZANT56AAAJ [PANASONIC]

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