MN103LF08K [PANASONIC]

32-bit Single-chip Microcontroller;
MN103LF08K
型号: MN103LF08K
厂家: PANASONIC    PANASONIC
描述:

32-bit Single-chip Microcontroller

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MN103L08 Series  
32-bit Single-chip Microcontroller  
Overview  
The MN103LF08K of 32-bit single-chip microcomputers incorporate multiple types of peripheral functions. This chip series is well suited for  
camera, TV, VCR, AV, printer, telephone, FAX machine, air-conditioner, music instrument and other applications.  
This LSI has flexible and optimized hardware configurations and simple efficient instruction set. This LSI incorporates an internal ROM of  
256 KB (maximum) and RAM of 20 KB (maximum), 10 external interrupts, 71 internal interrupts including NMI, 23 timer counters, 8 sets of  
serial interfaces, A/D converter, 2 sets of watchdog timer, DMA, Buzzer, remote control reception and HDMI-CEC.  
With 5 oscillation systems (external high frequency: 4 MHz to 20 MHz/ external low frequency: 32.768 kHz/ internal high frequency: 20  
MHz/ internal low frequency: 35 kHz/ PLL: frequency multiplier of high or low frequency) contained on the chip, and the internal clock can  
be switched to four oscillation clock except the internal low oscillation. The internal clock is generated by dividing the oscillation clock or  
PLL clock. The best operation clock for the system can be selected by switching its frequency ratio by programming.  
Amachine cycle (minimum instruction execution time) is 25 ns (internal operating condition: 1.8 V, 40 MHz).  
Product Summary  
This datasheet describes the following model.  
Model  
MN103LF08K  
ROM Size  
RAM Size  
Classication  
Package  
LQFP100-P-1414  
QFP100-P-1818B  
1
256 KB  
20 KB *  
Flash EEPROM version  
Note) 1: use On-Chip-Debugger 19.5 KB  
*
Publication date: July 2012  
Ver. AEM  
1
MN103L08 Series  
Features  
CPU core  
MN103L core (The instruction set is compatible MN103S series)  
Memory 4 GB (instruct/data common use)  
LOAD-STORE architecture(3-stage pipeline)  
Machine cycle  
High-speed mode  
Low-speed mode  
25 ns/ 40 MHz (Max)  
30.5 ms/ 32.768 kHz (Max)  
Operation mode  
NORMAL mode (CPU clock operation, Peripheral circuit clock operation mode)  
SLOW mode (CPU clock operation, Peripheral circuit clock operation mode)  
HALT mode (CPU clock stop, Peripheral circuit clock operation mode)  
STOP mode (All clocks stop mode)  
ꢀ Internal memory  
MN103LF08K  
: ROM 256 KB / RAM 20 KB  
Clock oscillation circuit:  
5 circuits  
External high-speed oscillation (clkosc) : Crystal oscillator/ Ceramic oscillator  
: 4 MHz to 20 MHz  
External low-speed oscillation (clkx)  
: Crystal oscillator/ Ceramic oscillator  
: 32.768 kHz  
Internal high-speed oscillation (clkrc)  
Internal low-speed oscillation (clkrcx)  
PLL output (clkpll)  
: 20 MHz  
: 35 kHz  
: 60 MHz to 120 MHz  
Clock multiple circuit (PLL)  
Multiplication rate  
: 4, 6, 8, 10, 12, 16, 20 multiplied clock of clkosc  
2440 to 3660 multiplied clock of clkx  
: 2, 3 divided of clkpll  
Clock dividing  
Output clock  
: 20 MHz to 40 MHz (clkplldiv)  
ꢀ Internal operation clock 5 types  
CPU operation clock (clkcpu)  
Frequency  
: 40 MHz (Max)  
Clock source  
Clock dividing  
: clkplldiv, clkosc, clkrc, clkx  
: 1, 2, 4, 8, 16, 32, 64, divided of clock source  
Peripheral circuit operation clock (clkbus)  
Frequency  
: 20 MHz (Max)  
Clock source  
Clock dividing  
: clkplldiv, clkosc, clkrc, clkx  
: 2, 4, 8, 16, 32, 64, 128 divided of clock source  
(This setting is independent from the dividing clock setting of clkcpu.  
Set the frequency of clkbus to less than clkcpu.)  
Peripheral circuit operation clock (clksp)  
Frequency  
: 22 MHz (Max)  
Clock source  
Clock dividing  
: clkrc, clkosc, clkplldiv  
: 1, 2, 4, 8, 16 divided of clock source  
High-speed oscillation clock (clkoscsel)  
Frequency  
: 22 MHz (Max)  
: clkrc, clkosc  
Clock source  
Internal low-speed oscillation clock (clkrcx)  
Frequency : 42 kHz (Max)  
Ver. AEM  
2
MN103L08 Series  
Features (continued)  
ꢀ Internal operation clock (continued)  
Low-speed oscillation clock (clkx)  
Frequency  
: 32.768 kHz (Max)  
Bus interface  
Bus area  
: 2 MB × 2 banks  
Data bus  
: 8/ 16 bits  
ꢀ DMA Controller  
Transfer area  
: Internal ROM space / Internal RAM space / Internal I/O area / External memory space  
Internal ROM space / Internal RAM space / Internal I/O area / External memory space  
: 4 ch  
Channel  
Transfer form  
Transfer requests  
: 2 bus cycles transfer  
: 44 types  
External interrupts:4, Timer:19, Serial:15, IIC: 3, A/D converter:1, Remote control:1, Software:1  
: 3 modes (One word transfer / Burst transfer / Intermittent transfer)  
Transfer modes  
ꢀ Interrupt functions  
Internal interrupts : 71 factors  
(Timer:29, Serial I/F:10, IIC:6, Watchdog timer:1, DMA:12, A/D converter:1, Real-time clock: 2,  
Remote control: 4, Power Voltage Detection: 2, HDMI-CEC:1, AC zero cross: 2, System error:1)  
External interrupts : 10 factor  
(IRQn (n = 0 to 7) : 8, NMIRQ (shares an interrupt factor with IRQ7) : 1, KEY: 1)  
ꢀ Watchdog Timer  
Watchdog Timer  
On detection of error, hard reset is done inside the LSI  
(Non-maskable interrupt is generated by the rst watchdog time-out event, and hard-reset is done by a series of two time-out  
events)  
Time-out cycle : CPU clock cycle × N (N = 216, 218, 220, 227)  
Watchdog Timer2  
On detection of error, hard reset is done inside the LSI  
(Non-maskable interrupt is generated by the rst watchdog time-out event, and hard-reset is done by a series of two time-out  
events)  
Time-out cycle : Internal low-speed oscillation clock cycle × N (N = 24, 25, 26, 27, 28, 29, 210, 211, 212, 213, 214, 215)  
ꢀ Timer counter  
23 units  
General purpose 8-bit timer  
× 6 unit  
× 1 unit  
× 7 unit  
× 1 unit  
× 8 unit  
8-bit free-run timer  
General purpose 16-bit timer  
Motor control timer  
Baud rate 8-bit timer  
Timer 0 (8-bit timer)  
Timer count (Up count), external event count, timer pulse output,  
PWM output (Cycle is xed), compare register with double buffer  
Clock source : clksp, clksp/4, clksp/16, clksp/32, clksp/64, clksp/128, clkbus/2, clkbus/4, clkbus/8, clkx, external clock  
Timer 1 (8-bit timer)  
Timer count (Up count), external event count, timer pulse output,  
16-bit cascade connection (to timer 0), compare register with double buffer  
Clock source : clksp, clksp/4, clksp/16, clksp/32, clksp/64, clksp/128, clkbus/2, clkbus/4, clkbus/8, clkx, external clock  
Ver. AEM  
3
MN103L08 Series  
Features (continued)  
ꢀ Timer counter (continued)  
Timer 2 (8-bit timer)  
Timer count (Up count), external event count, timer pulse output,  
PWM output (Cycle is xed), 24-bit cascade connection (to timer 0, timer 1), compare register with double buffer  
Clock source : clksp, clksp/4, clksp/16, clksp/32, clksp/64, clksp/128, clkbus/2, clkbus/4, clkbus/8, clkx, external clock  
Timer 3 (8-bit timer)  
Timer count (Up count), external event count, timer pulse output,  
16-bit cascade connection (to timer 2), 32-bit cascade connection (to timer 0, timer 1, timer 2), compare register with double buffer  
Clock source : clksp, clksp/4, clksp/16, clksp/32, clksp/64, clksp/128, clkbus/2, clkbus/4, clkbus/8, clkx, external clock  
Timer 4 (8-bit timer)  
Timer count (Up count), external event count, timer pulse output, PWM output (Cycle is xed)  
Clock source : clksp, clksp/4, clksp/16, clksp/32, clksp/64, clksp/128, clkbus/2, clkbus/4, clkbus/8, clkx, external clock  
Timer 5 (8-bit timer)  
Timer count (Up count), external event count, timer pulse output, 16-bit cascade connection (to timer 4),  
Clock source : clksp, clksp/4, clksp/16, clksp/32, clksp/64, clksp/128, clkbus/2, clkbus/4, clkbus/8, clkx, external clock  
Timer 6 (8-bit free-running timer)  
Clock source : clksp, clkbus, clkx, clksp/212, clksp/213, clkx/212, clkx/213  
Timer 7 (16-bit timer)  
Timer count (Up count), external event count, timer pulse output,  
PWM output (cycle/duty continuous changeable), input capture (1 system)  
Clock source : clksp, clkbus, external clock, timer 5 output, timer 6 compare match cycle divided by 1, 2, 4, 16  
Timer 8 (16-bit timer)  
Timer count (Up count), external event count, timer pulse output,  
PWM output (cycle/duty continuous changeable), input capture (1 system)  
32-bit cascade connection (to 16-bit timer 7), 32-bit PWM output  
Clock source : clksp, clkbus, external clock, timer 5 output, timer 6 compare match cycle divided by 1, 2, 4, 16  
Timer 9, 10, 11, 12, 13 (16-bit timer)  
Timer count (Up count, Down count), external event count, timer pulse output,  
PWM output (cycle/duty continuous changeable), input capture (2 systems)  
Clock source : clkbus, clkbus/8, timer 0, 1 compare match cycle, external clock  
Timer M (Motor control 16-bit timer)  
Timer pulse output, external event count, complementary 3 phases PWM output (triangular wave and saw-tooth wave output,  
dead time insertion), 4 phases PWM output (triangular wave and saw-tooth wave output,  
dead time insertion), output control by external interrupt (Hi-Z output or output data is xed)  
Clock source : clksp, clkbus, external clock divided by 1, 2, 4, 16  
Timer B0, B1, B2, B3, B4 (Baud rate 8-bit timer)  
Baud rate timer for serial transfer base clock generation  
Clock source : clksp, clksp/2, clksp/4, clksp/8, clksp/16, clksp/32, clksp/64, clksp/128, clksp/256,clkbus, clkbus/2,  
clkbus/4, clkbus/8, clkbus/16, clkbus/32, clkbus/64  
Timer B5, B6, B7 (Baud rate 8-bit timer)  
Baud rate timer for IIC transfer base clock generation  
Clock source : clkx, clksp  
Ver. AEM  
4
MN103L08 Series  
Features (continued)  
Real time clock  
Calendar function (second, minute, hour, month, year)  
Alarm function, Cycle interrupt  
Clock source  
Buzzer  
Output frequency : clksp/29, clksp/210, clksp/211, clksp/212, clksp/213, clksp/214, clkx/23, clkx/24  
: clksp, clkx  
ꢀ Serial interface  
UART/ clock synchronous  
IIC  
8 channels  
: 5 channels  
: 3 channels  
Serial 0, 1, 2, 3, 4 (UART/Synchronous serial interface)  
UART  
Parity check, overrun error/framing error detection  
Transfer size can be selected from 7 to 8 bits.  
Clock Synchronous  
The communication type can be selected from 2-ware or 3-wire.  
First tansfer bit can be selected from MSB or LSB  
Arbitrary size of 2 to 8 bits are selectable.  
Continuous transmission, continuous reception, continuous transmission/reception are available.  
Synchronous edge selection of transfer clock.  
Maximum transfer rate : 5 MHz  
Clock source  
: Baud rate timer Bn output (n = 0 to 4), external clock  
Serial 5, 6, 7 (Multi master IIC)  
Multi master IIC  
100 kHz/ 400 kHz communication is supported  
7-bit, 10-bit slave address is settable  
General call communication mode is supported  
Clock source  
: Baud rate timer Bn output (n = 5 to 7), external clock  
HDMI-CEC  
HDMI-CEC  
Clock source  
HDMI Specication Compatible with CEC communication option  
: clkx, clkbus  
Remote control reception circuit: 1 unit  
Association for Electric HomeAppliances format  
Clock source  
: clkx, clkoscsel  
A/D converter Resolution:  
10 bit  
Channel  
: 16 channels  
Clock source  
: clkbus/2, clkbus/4, clkbus/8, clkbus/16, clkx × 2  
Auto reset  
Auto reset function can be selected ON/OFF  
Power supply voltage detection circuit  
Detection voltage can be set 2.2 V to 4.0 V by software  
Clock monitoring function  
Frequency error detection of external / PLL clock.  
Hardware reset or non-maskable interrupt generation can be selected by program when a frequency error is detected.  
LED driver: 8 sets  
Ver. AEM  
5
MN103L08 Series  
Features (continued)  
Port function  
I/O ports:  
87 pins  
CMOS I/O  
56 pins  
Combination CMOS I/O and oscillation pin:  
4 pins  
Combination CMOS I/O andAnalog input:  
Combination CMOS I/O and LED driver:  
Nch open drain I/O:  
16 pins  
8 pins  
3 pins  
Special function pin  
6 pins  
Reset input pin (NRST):  
1 pin (soft reset is available)  
A/D converter reference voltage input pin (VREFH):  
Capacity connect pin (VOUT18):  
Function contol pins (MMOD, NOCDMOD, ATRST):  
Power pins  
1 pin  
1 pin  
3 pins  
7 pins  
3 pins  
4 pins  
power supply pin(VDD50_1,VDD50_2)  
GND pins (VSS)  
Power supply separation  
Pins driven by VDD50_1  
68 pins (I/O ports: 62 pins)  
25 pins (I/O ports: 25 pins)  
Pins driven by VDD50_2  
Power supply voltage  
VDD50_1  
VDD50_2  
:
:
2.2 V to 5.5 V  
VDD50_1 to 5.5 V  
Operating temperature  
-40°C to + 85°C  
Package  
QFP100pin (QFP100-P-1818B)  
LQFP100pin (LQFP100-P-1414)  
Ver. AEM  
6
MN103L08 Series  
Pin Description  
VDD50_2 = VDD50_1 to 5.5V  
P00/SBI3A/TM7IOA  
1
2
75  
74  
73  
VREFH  
P01/SBO3A/TM8IOA  
P02/SBT3A  
P43/IRQ7/NMIRQ  
VDD50_2  
3
NRST  
4
72  
71  
70  
69  
68  
67  
66  
65  
64  
63  
62  
61  
60  
59  
58  
57  
56  
55  
54  
53  
52  
51  
P42/IRQ6  
XI/P44  
5
P41/TM9IOB/D15  
P40/TM9IOA/D14  
P87/LED7/D13  
XO/P45  
6
VSS  
7
OSCI/P46  
8
P86/TMMOD5/LED6/D12  
P85/TMMOD4/LED5/D11  
P84/TMMOD3/LED4/D10  
P83/TMMOD2/LED3/D9  
P82/TMMOD1/LED2/D8  
P81/TMMOD0/LED1/D7  
P80/TMMIO/LED0/D6  
P75/SBT0B/SCL5B/D5  
P74/SBO0B/SDA5B/D4  
P73/SBI0B/D3  
OSCO/P47  
9
MMOD  
10  
11  
12  
13  
14  
15  
16  
17  
18  
19  
20  
21  
22  
23  
24  
25  
VDD50_1  
MN103LF08K  
VOUT18  
ATRST  
QFP100-P-1818B  
LQFP100-P-1414  
P03/SBI0A/CEC0  
P04/SBO0A/SDA5A  
P05/SBT0A/SCL5A  
P06  
NOCDMOD  
P72/TM5IOA/D2  
P10/(OCD_SDA)  
P11/(OCD_SCL)  
P12/NCS1  
P71/TM4IOA/D1  
P70/TM3IOA/D0  
P67/TM2IOA/KEY7/A0  
P66/TM1IOA/KEY6/A1  
P65/TM0IOA/KEY5/A2  
P64/KEY4/A3  
P13/SBI4B/NWE0  
P14/SBO4B/NWE1  
P15/SBT4B/NRE  
P20/IRQ0A/SYSCLK/RMIN  
VSS  
26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50  
VDD50_1 = 2.2 to 5.5V  
Ver. AEM  
7
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semiconductors described in this book  
(1) If any of the products or technical information described in this book is to be exported or provided to non-residents, the laws and  
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(2) The technical information described in this book is intended only to show the main characteristics and application circuit examples  
of the products. No license is granted in and to any intellectual property right or other right owned by Panasonic Corporation or any  
other company. Therefore, no responsibility is assumed by our company as to the infringement upon any such right owned by any  
other company which may arise as a result of the use of technical information described in this book.  
(3) The products described in this book are intended to be used for general applications (such as office equipment, communications  
equipment, measuring instruments and household appliances), or for specific applications as expressly stated in this book.  
Consult our sales staff in advance for information on the following applications:  
Special applications (such as for airplanes, aerospace, automotive equipment, traffic signaling equipment, combustion equipment,  
life support systems and safety devices) in which exceptional quality and reliability are required, or if the failure or malfunction of  
the products may directly jeopardize life or harm the human body.  
It is to be understood that our company shall not be held responsible for any damage incurred as a result of or in connection with  
your using the products described in this book for any special application, unless our company agrees to your using the products in  
this book for any special application.  
(4) The products and product specifications described in this book are subject to change without notice for modification and/or im-  
provement. At the final stage of your design, purchasing, or use of the products, therefore, ask for the most up-to-date Product  
Standards in advance to make sure that the latest specifications satisfy your requirements.  
(5) When designing your equipment, comply with the range of absolute maximum rating and the guaranteed operating conditions  
(operating power supply voltage and operating environment etc.). Especially, please be careful not to exceed the range of absolute  
maximum rating on the transient state, such as power-on, power-off and mode-switching. Otherwise, we will not be liable for any  
defect which may arise later in your equipment.  
Even when the products are used within the guaranteed values, take into the consideration of incidence of break down and failure  
mode, possible to occur to semiconductor products. Measures on the systems such as redundant design, arresting the spread of fire  
or preventing glitch are recommended in order to prevent physical injury, fire, social damages, for example, by using the products.  
(6) Comply with the instructions for use in order to prevent breakdown and characteristics change due to external factors (ESD, EOS,  
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20100202  

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