MN1382-C(TW) [PANASONIC]
Power Supply Support Circuit, Fixed, 1 Channel, +2.1VV, CMOS, PDSO3, MINI PACKAGE-3;
| 型号： | MN1382-C(TW) |
| 厂家： | 
PANASONIC |
| 描述： | Power Supply Support Circuit, Fixed, 1 Channel, +2.1VV, CMOS, PDSO3, MINI PACKAGE-3 光电二极管 |
| 文件： | 总24页 (文件大小：634K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
Microcomputer Peripheral LSIs
MN1380 Series
CMOS LSIs for Voltage Detection
Overview
Pin Assignment
The MN1380 series are elements that monitor the power
supply voltage supplied to microcomputers and other LSI
systems and issue reset signals for initializing the system
after the power is first applied or for preventing runaway
operation when the supply voltage fluctuates.
There is a choice of three output types: CMOS output,
N-channel open drain output, and inverted CMOS out-
put. There are also three package types: M, TO-92, ana
mini type for surface mounting.
23
MNR
Choose the ideal element for your applicatin froe
series' wide selection of detection ranks (17 ranks n
2.0 and 4.9 volts), output types, and pckagtype
2
1
3
M type package
Features
Three-pin element requiriadjstment
Wide selection of dction anks (17 ranks betwen
2.0 and 4.9 volts)
Highly precise detecon voltage
Detection volge with hysteresis characterstic
∆VD = 50 mV foranks C to K
∆VD = 00 mfor ranks L to U
Lw cuconsumptionIDD = 1µyp.) for VDD
= 5 V
1381
23R
ow fluctuation in detectiovoltage with tempera-
ture typ. 1 mV/˚)
1
2
3
TO-92 type package
Wide selection of output types: CMOS output, N-
chadraioutput, and inverted CMOS
Wiof package types: M, TO-92, and a
mini tsurface mounting.
2
LCR
Applications
1
Battery checkers
3
Power outage detectors
1=OUT
2=VDD
3=VSS
Level discriminators
Memory backup systems
Mini type package
Microcomputer reset circuits
Reset circuits for other electronic circuits
SAG00003CEM
1
MN1380 Series
Microcomputer Peripheral LSIs
MN1380 Series Naming Conventions
The MN1380 series offers a wide selection of detection ranks, output types, package types, and packaging. All
combinations use the following naming conventions. When ordering, be sure to give the correct part number using
these naming conventions.
MN13801–R (TA)
Winding direction for tape packaging
(TA) ...... Tape packaging for TO-92 type package
(TX) ...... Embossed tape packing for mini type package
(TW) ..... Embossed tape packing for mini type package
For further details, see the package specifications.
Detection voltage rank (C to U)
Output type:
Blank ········ CMOS output
1 ················ N-channel open drain output
2 ················ inverted CMOS output
Package:
0 ················ M type package
1 ················ TO-92 type package
2 ················ Mini type package
Matsushita Electronics Corporation MN1380 series of voltage detection CMOS
LSIs with low current consumptions
(Example)
MN13821–R (TW)
Embossed tape packaging
R rank (detection voltage of 4.0 to 4.3 V)
N-channel open drain output
Mini type package
MN1380 series of voltage detection CMOS LSIs with low current consumption
Minimum Packaging Unit
Bulk (M and TO-92 types) ·············· 1,000
Magazine (Mini type) ······················ 50
Taping (Mini and TO-92 types)······· 3,000
2
Microcomputer Peripheral LSIs
MN1380 Series
Series Lineup
Package
Output
CMOS output
M type Package
MN1380
TO-92 type Package
MN1381
Mini type Package
MN1382
N-channel open drain output
Inverted CMOS output
MN13801
MN13811
MN13821
MN13802
MN13812
MN13822
Detection Ranks (on Voltage)
Detection Voltage for Drop in Power Supply Voltage (VDL
)
Detection Voltage Hysteresis Width (∆VD)
Rank
Unit
Unit
min
max
min
max
C
D
E
F
2.0
2.2
2.1
2.2
2.3
2.4
2.5
2.6
2.8
3.0
3.2
3.4
3.6
3.8
4.0
4.2
4.4
4.6
2.3
2.4
2.5
2.6
2.7
2.9
3.1
3.3
3.5
3.7
3.9
4.1
4.3
4.5
4.7
4.9
V
50
300
mV
G
H
J
V
V
50
300
300
mV
mV
K
L
M
N
P
Q
R
S
100
T
U
3
MN1380 Series
Microcomputer Peripheral LSIs
Block Diagram
2
VDD
Voltage
Reference 1
+
Comparator
–
1
*
1
3
Level Converter
OUT
Output Circuit
+
Comparator
–
Voltage
Reference 2
VSS
1
Note * : Circuits vary slightly depending on the output type (CMOS output, N-channel open drain output, or inverted CMOS
output)
Pin Descriptions
Pin No.
Symbol
OUT
VDD
Function Description
Reset signal output pin
Power supply pin
Ground pin
1
2
3
VSS
4
Microcomputer Peripheral LSIs
MN1380 Series
Absolute Maximum Ratings VSS=0V, Ta=25˚C
Parameter
Symbol
VDD
VO
Rating
7.0
Unit
V
Power supply voltage
Output voltage
– 0.3 to VDD +0.3
–20 to +70
–55 to +125
V
Operating ambient temperature
Storage temperature
Ta
˚C
˚C
Tstg
Recommended Operating Conditions VSS=0V, Ta=25˚C
Parameter
Symbol
Conditions
min
typ
max
6.0
Unit
VDD
See Figures 1 and 4.
1.5
V
Power supply
voltage
Electrical Characteristics
1) DC Characteristics VSS=0V, Ta=–20˚C to +70˚C
Parameter
Symbol
Conditions
VDD = 5 V *1
min
typ
max
Unit
Power supply current
IDD
1
5
µA
V
Load resistance = 10 kW
Detection voltage for drop
in power supply voltage *2
Detection voltage hysteresis
width *2
2
2
2
2
*
*
*
*
VDL
Ta=25˚C
See Figures 1 and 4.
∆VD
mV
"H" level output voltage
VOH
CMOS output IOH=– 40µA
0.8VDD
0.8
VDD
VDD
–1.5
0.4
Inverted
VDD=1.8V
V
V
CMOS output IOH=– 0.5mA
"L" level output voltage
VOL
N-channel open VDD=1.8V
VSS
drain output
Inverted
IOL=0.7mA
DD=6.0V
V
VSS
0.6
CMOS output IOH=0.3mA
Notes
1
* : This includes the output pin's leakage current.
2
* : For particulars, see the detection voltage rank table.
5
MN1380 Series
Microcomputer Peripheral LSIs
Electrical Characteristics (continued)
2) AC Characteristics VSS=0V, Ta=25˚C
Allowable Value (typ)
Unit
Parameter
Symbol Conditions
MN1380
MN1381
MN1382
MN13801
MN13811
MN13821
MN13802
MN13812
MN13822
Rank
C
D
E
F
3.0
3.0
2.5
3.0
230.0
100.0
G
See
tOH Figures
2 and 3.
H
J
Reset release time
µs
K
L
M
N
P
Q
R
S
2.0
4.0
30.0
T
C
D
E
F
250.0
115.0
160.0
100.0
3.0
3.0
G
H
J
See
tOL Figures
2 and 3.
Reset time
µs
K
L
M
N
P
Q
R
S
15.0
35.0
3.0
T
6
Microcomputer Peripheral LSIs
MN1380 Series
Description of Operation
VDD
VDH
VDL
1.5V
0V
t
MN1380/1381/1382
MN13801/13811/13821
CMOS output, N-channel
open drain output
VOUT
tOH
tOH
tOL
tOL
0V
t
Inverted CMOS
output Figure
MN13802/13812/13822
VOUT
tOL
tOL
tOH
tOH
0V
t
Figure 1. Description of Operation
Notes
1: Output cannot be specified for power supply voltages under 1.5 V because operation is not guaranteed for that range.
2: VDL: Detection voltage for drop in power supply voltage
VDH: Detection voltage for rise in power supply voltage
tOL : Time lag between the time that the power supply voltage reaches the detection voltage (VDL or VDH) and the time that the
output pin (OUT) goes to "L" level.
tOH : Time lag between the time that the power supply voltage reaches the detection voltage (VDL or VDH) and the time that
the output pin (OUT) goes to "H" level.
3: These characteristics for the N-channel open drain output are when a load resistor is connected between the OUT and VDD
pins.
7
MN1380 Series
Microcomputer Peripheral LSIs
Description for Measuring the Output Characteristics
VDD
6.0V
1.6V
0V
t
6.0V
CMOS output, N-channel
open drain output
MN1380/1381/1382
MN13801/13811/13821
tOH
1.5V
tOL
1.0V
0V
t
MN13802/13812/13822
Inverted CMOS output
6.0V
1.6V
1.5V
tOH
tOH
1.0V
0V
t
Figure 2. Description chart of Measuring the Output Characteristics
Switch: Connect when measuring
N-channel open drain output
(MN13801/MN13811/MN13821)
100kΩ
VDD
MN1380 Series
100pF
VOUT
Figure 3. Circuit for Measuring the Output Characteristics
8
Microcomputer Peripheral LSIs
MN1380 Series
Description for Measuring the I/O Characteristics
VOUT
CMOS output, N-channel
open drain output
MN1380/1381/1382
MN13801/13811/13821
∆VD
Operation indeterminate
0
0
1.5V
VDD
VDL
VDH
VOUT
Inverted CMOS output
MN13802/13812/13822
∆VD
Operation
indeterminate
0
0
1.5V
VDD
VDL
VDH
Figure 4. Description chart for Measuring the I/O Characteristics
Notes
: Output cannot be specified for power supply voltages under 1.5 V because operation is not guaranteed for that range.
: VDL: Detection voltage for drop in power supply voltage
1
2
VDH: Detection voltage for rise in power supply voltage
: These characteristics for the N-channel open drain output are when a load resistor is connected between the OUT and VDD pins.
3
9
MN1380 Series
Microcomputer Peripheral LSIs
Application Circuit Example
Connect resistors, capacitors, and the like only to the output pin on the MN1380 series element. Note that connect-
ing them to the Power source pins changes VDH, VDL, and ∆VD.
Sample Circuit 1
Sample Circuit 2
V
DD
V
DD
R
OUT
OUT
MN1380
Series
MN1380
Series
C
C
Select the values of R and C to match the application.
10
Microcomputer Peripheral LSIs
MN1380 Series
Package Dimensions (Unit: mm)
M type package
6.9
1.5
2.5
1.0
1.5
0.7R
0.45 0.1
0.85
0.55 0.1
1.25
2.5 0.5 2.5 0.5
1
2
3
Note) The package will be changed to lead-free type (M3A). See the new package dimensions section later of this datasheet.
11
MN1380 Series
Microcomputer Peripheral LSIs
Package Dimensions (Unit: mm)(continued)
TO-92 type package
5.0 0.2
4.0 0.2
+0.2
-
0.1
0.45
2.54 0.15
2.3 0.2
1 2 3
Note) The package will be changed to lead-free type (SSIP003-P-0000S). See the new package dimensions section later of this
datasheet.
12
Microcomputer Peripheral LSIs
MN1380 Series
Package Dimensions (Unit: mm)(continued)
Mini type package
+0.2
0.3
-
2.8
0.65 0.15
1.5 +0.25
-
0.05
0.65 0.15
0.4 0.2
0.1 to 0.3
Note) The package will be changed to lead-free type (MINI-3DC). See the new package dimensions section later of this
datasheet.
13
MN1380 Series
Microcomputer Peripheral LSIs
Reference Characteristics
The following characteristics curves represent results from a specific sample therefore they do not guarantee the
characteristics for the final product.
1.4
1.2
1.0
0.8
0.6
VSS
OUT
VDD
A
0.4
0.2
0
V
0
1.0
2.0
5.0
7.0
3.0
V
4.0
6.0
(V)
DD
Figure 5.b. Measurement Circuit
Figure 5.a. IDD vs. VDD Characteristic (Rank Q)
2.0
1.5
VSS
OUT
VDD
A
1.0
0.5
5V
–40
20
Ambient temperature, Ta (˚C)
–20
0
40
60
80
Figure 6.b. Measurement Circuit
Figure 6.a. IDD Temperature Characteristic (Rank Q)
14
Microcomputer Peripheral LSIs
MN1380 Series
Reference Characteristics (continued)
4.8
4.6
4.4
VSS
OUT
4.2
VDH
VDD
V
4.0
VDL
3.8
3.6
3.4
V
20
40
60 80
–40 –20
0
Temperature Ta(˚C)
Figure 7.a. VDL/VDH Temperature Characteristic (Rank Q)
Figure 7.b. Measurement Circuit
0.3
0.25
0.2
VSS
OUT
VDD
V
0.15
0.1
V
0.05
0
–40 –20
0
20
40 60
80
Ambient temperature, Ta (˚C)
Figure 8.a. ∆VD Temperature Characteristic (Rank Q)
Figure 8.b. Measurement Circuit
15
MN1380 Series
Microcomputer Peripheral LSIs
Reference Characteristics (continued)
3
–30˚C
Room temperature
80˚C
VSS
OUT
2
1
VDD
1.8V
A
V
0
0
1.0
1.5
2.0
3.0
0.5
2.5
VOL(V)
Figure 9.a. IOL vs. VOL Characteristic
Figure 9.b. Measurement Circuit
20
–30˚C
Room temperature
15
VSS
OUT
80˚C
VDD
10
5
A
5V
V
0
2
5
3
0
1
4
VOL(V)
Figure 10.a. IOH vs. VOH Characteristic
Figure 10.b. Measurement Circuit
16
Microcomputer Peripheral LSIs
MN1380 Series
Reference Characteristics (continued)
2.5
2.0
1.5
1.0
0.5
0
VSS
OUT
VDD
1.8V
A
V
0
20
–20
–40
40
60
80
Ambient temperature, Ta (˚C)
Figure 11.a. IOL vs. Temperature Characteristic
Figure 11.b. Measurement Circuit
7.0
6.5
6.0
5.5
5.0
VSS
OUT
VDD
A
5V
V
4.5
0
20
–40
–20
40
60
80
Ambient temperature, Ta (˚C)
Figure 12.b. Measurement Circuit
Figure 12.a. IOH vs. Temperature Characteristic
17
MN1380 Series
Microcomputer Peripheral LSIs
TO-92 Type Package Taping-Specifications (MN1381/MN13811/MN13812)
0
∆h1
∆h2
A1
T
P1
P
d
F1 F2
øD0
Drawing direction
P0
Figure 13. TO-92 Type Package Taping-Dimensions (Ammunition pack)
TO-92 Type Package Taping Dimensions (Ammunition pack)
Name
Product height*
Product width*
Product thickness*
Lead width*
Symbol
Length (mm)
5.3 max
Name
Symbol
W0
Length (mm)
6.0 0.5
A
Adhesive tape width
Feed hole position
Adhesive tape position
Distance to top of product
A1
5.2 max
W1
9.0 0.5
T
4.2 max
W2
0.5 max
+0.15
– 0.1
d
0.45
H
25.0 max
Taped lead length
Product pitch
l1
P
2.0 max
12.7 1.0
12.7 0.3
Distance to
H0
19.0 0.5
bottom of product
Feed hole pitch
Feed hole position
Lead spacing
P0
Lead clinch height
Feed hole diameter
Tape thickness
H1
D0
t1
16.0 0.5
4.0 0.2
0.7 0.2
1.5 max
P1
6.35 0.5
+0.5
– 0.2
F1, F2
∆h1, ∆h2
W
2.5
Product deflection angle
Tape width
2.0 max
Total tape thickness
t2
+1.0
– 0.5
18.0
1
Note* : For further details, see the specifications issued separately.
25 elements (example)
Leave the space for at
least three elements
W
H
D
330
250
41
Unit: mm
W
D
Figure 14. Box Dimensions for TO-92 Type Packages with Ammunition pack
18
Microcomputer Peripheral LSIs
MN1380 Series
Embossed Taping Specifications for Mini Type Package (MN1382/MN13821/MN13822)
There is a choice of two orientations, TW and TX, for the product relative to the tape.
TW
TX
Tape feed hole
Tape feed hole
Drawing
direction
Drawing
direction
(Marking surface on top)
(Marking surface on top)
Figure 16. TX Orientation
Figure 15. TW Orientation
Unit: mm
+0.1
-0
ø1.5
4.0±0.1
t+0.3±0.1
A
B
3.2±0.1
4.0±0.1
Product orientation A is labeled TW; orientation B, TX.
Figure 17. Embossed Taping Dimensions for Mini Type Package
Unit: mm
ø21 0.8
2 0.5
3,000 packages per reel
10 1.5
Figure 18. Embossed Taping Reel Dimensions for Mini Type Package
19
MN1380 Series
Microcomputer Peripheral LSIs
Reliability Testing Results for MN1380 Series
(1) M type package (MN1380/MN13801/MN13802) and TO-92 type package (MN1381/MN13811/MN13812)
Test Subjects
Operating lifetime test
High-temperature storage test
Low-temperature storage test
High-temperature,
Test Conditions
VDD=5.5V, Ta=125˚C, t=1000hrs
Ta=150˚C, t=1000hrs
Results
0/15
0/15
Ta=–65˚C, t=1000hrs
0/15
Ta=85˚C, RH=85%, t=1000hrs
0/15
high-humidity storage test
High-temperature,
V
DD=5.5V, Ta=85˚C, RH=85%, t=1000hrs
0/15
0/15
0/15
high-humidity bias test
Thermal shock test
Ta=150˚C and –65˚C.
Five minutes at each temperature for ten cycles
Ta=150˚C and –65˚C.
Temperature cycle test
Thirty minutes at each temperature for ten cycles
Two atmospheres for 50 hours at ambient temperature (Ta) of 121˚C
Ambient temperature (Ta) of 230˚C for five seconds
Ambient temperature (Ta) of 270˚C for ten seconds
Pressure cooker test
Soldering test
0/15
0/15
0/15
Solder heat resistance test
(2) Mini type package (MN1382/MN13821/MN13822)
Test Subjects
Test Conditions
Results
0/15
Operating lifetime test
High-temperature storage test
Low-temperature storage test
High-temperature,
VDD=5.5V, Ta=125˚C, t=1000hrs
Ta=150˚C, t=1000hrs
0/15
Ta=–65˚C, t=1000hrs
0/15
Ta=85˚C, RH=85%, t=1000hrs
0/15
high-humidity storage test
High-temperature,
VDD=5.5V, Ta=85˚C, RH=85%, t=1000hrs
0/15
0/15
0/15
high-humidity bias test
Thermal shock test
Ta=150˚C and –65˚C.
Five minutes at each temperature for ten cycles
Ta=150˚C and –65˚C.
Temperature cycle test
Thirty minutes at each temperature for ten cycles
Two atmospheres for 24 hours at ambient temperature (Ta) of 121˚C
Ambient temperature (Ta) of 230˚C for five seconds
Ambient temperature (Ta) of 260˚C for five seconds
1
Pressure cooker test *
Soldering test
0/15
0/15
0/15
1
Solder heat resistance test *
1
Note* : Note that the testing conditions for the mini package differ from those for the other two packages.
20
Microcomputer Peripheral LSIs
MN1380 Series
New Package Dimensions (Unit: mm)
• M3A (Lead-free package)
6.90 0.10
2.50 0.10
(1.50)
(1.50)
(1.00)
R0.90
2−R0.70
1
3
0.40+0.10
-
0.05
(0.85)
0.55 0.10
2.50
2.50
21
MN1380 Series
Microcomputer Peripheral LSIs
New Package Dimensions (Unit: mm)(continued)
• SSIP003-P-0000S (Lead-free package)
4.00 0.20
5.00 0.20
0.60 0.15
0.40 0.10
2.30 0.20
0.40+0.10
-
0.05
1
3
1.27
1.27
22
Microcomputer Peripheral LSIs
MN1380 Series
New Package Dimensions (Unit: mm)(continued)
• MINI-3DC (Lead-free package)
(1.45)
0.40+0.10
-0.05
2
1
3
0.95
0.95
1.90+0.20
2.90+0.20
-0.05
Seating plane
0.10 to 0.30
0.40 0.20
23
Request for your special attention and precautions in using the technical information and
semiconductors described in this book
(1) If any of the products or technical information described in this book is to be exported or provided to non-residents, the laws and
regulations of the exporting country, especially, those with regard to security export control, must be observed.
(2) The technical information described in this book is intended only to show the main characteristics and application circuit examples
of the products, and no license is granted under any intellectual property right or other right owned by our company or any other
company. Therefore, no responsibility is assumed by our company as to the infringement upon any such right owned by any other
company which may arise as a result of the use of technical information described in this book.
(3) The products described in this book are intended to be used for standard applications or general electronic equipment (such as office
equipment, communications equipment, measuring instruments and household appliances).
Consult our sales staff in advance for information on the following applications:
– Special applications (such as for airplanes, aerospace, automobiles, traffic control equipment, combustion equipment, life support
systems and safety devices) in which exceptional quality and reliability are required, or if the failure or malfunction of the prod-
ucts may directly jeopardize life or harm the human body.
– Any applications other than the standard applications intended.
(4) The products and product specifications described in this book are subject to change without notice for modification and/or im-
provement. At the final stage of your design, purchasing, or use of the products, therefore, ask for the most up-to-date Product
Standards in advance to make sure that the latest specifications satisfy your requirements.
(5) When designing your equipment, comply with the range of absolute maximum rating and the guaranteed operating conditions
(operating power supply voltage and operating environment etc.). Especially, please be careful not to exceed the range of absolute
maximum rating on the transient state, such as power-on, power-off and mode-switching. Otherwise, we will not be liable for any
defect which may arise later in your equipment.
Even when the products are used within the guaranteed values, take into the consideration of incidence of break down and failure
mode, possible to occur to semiconductor products. Measures on the systems such as redundant design, arresting the spread of fire
or preventing glitch are recommended in order to prevent physical injury, fire, social damages, for example, by using the products.
(6) Comply with the instructions for use in order to prevent breakdown and characteristics change due to external factors (ESD, EOS,
thermal stress and mechanical stress) at the time of handling, mounting or at customer's process. When using products for which
damp-proof packing is required, satisfy the conditions, such as shelf life and the elapsed time since first opening the packages.
(7) This book may be not reprinted or reproduced whether wholly or partially, without the prior written permission of Matsushita
Electric Industrial Co., Ltd.
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SI9137DB
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