MN3726FT [PANASONIC]

CCD Sensor, 542 Horiz pixels, 584 Vert pixels, 14.50-15.50V, Rectangular, Through Hole Mount, DIP-16;


型号：	MN3726FT
厂家：	PANASONIC
描述：	CCD Sensor, 542 Horiz pixels, 584 Vert pixels, 14.50-15.50V, Rectangular, Through Hole Mount, DIP-16 CD 传感器换能器
文件：	总8页 (文件大小：189K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

CCD Area Image Sensor

MN3726FT,MN3726AT

6mm (type-1/3) 512H High-Resposivity CCD Area Image Sensors

■ Overview

The MN3726FT and MN3726AT are 6mm (type-1/3)

interline transfer CCD (IT-CCD) solid state image sensor

devices.

This device uses photodiodes in the optoelectric conver-

sion section and CCDs for signal read out. The electronic

shutter function has made an exposure time of 1/10000

seconds possible. Further, this device has the features of

high sensitivity, low noise, broad dynamic range, and low

smear.

This device has a total of 316,528 pixels (542 horizontal

× 584 vertical) and provides stable and clear images with

a resolution of 330 horizontal TV-lines and 420 vertical

TV-lines.

Part Number

MN3726FT

MN3726AT

Size

System Color or B/W

PAL

Color

B/W

6mm(type-1/3)

CCIR

■ Features

• Total number of pixels: 542 (horizontal) × 584 (vertical)

• High sensitivity

• Low noise

• Broad dynamic range

• Low smear

• Low image lag

• Electronic shutter

• No image distortion

• Small size enables design of compact equipment

• High reliability

• 16-pin DIL plastic package

■ Applications

• Compact lightweight camcorders

• Communication television systems

• Door cameras

• Cameras for measurement, and medical use

MN3726FT,MN3726AT

CCD Area Image Sensor

■ Block Diagram

(2 columns OB + 512 columns valid area + 28 columns OB )

φ_V4

φ_V3

φ_V2

φ_V1

(Internal connection)

Photo diode

GND

(Internal bias) LG

Sub

Horizontal shift register

■ Pin Assignments

φ_R

φ_V4

φ_V3

φ_V2

φ_V1

Sub

φ_H2

φ_H1

(Top View)

■ Pin Descriptions

Pin No. Symbol

Descriptions

Output drain

Pin No. Symbol

Descriptions

φ_R

P-well for protection circuit

Reset pulse

φ_V1

Vertical shift register

clock pulse 1

φ_H2

φ_H1

Reset drain

Video output

φ_V2

φ_V3

φ_V4

Vertical shift register

clock pulse 2

Output load transistor gate

Output gate

Vertical shift register

clock pulse 3

Horizontal register clock pulse 2

Horizontal register clock pulse 1

Horizontal CCD input source

Substrate

Vertical shift register

clock pulse 4

Sub

P-well

CCD Area Image Sensor

MN3726FT,MN3726AT

■ Absolute Maximum Ratings and Operating Conditions

Rating

Operating condition

Unit

Parameter

Symbol

min

− 0.2

max

18.0

min

14.5

typ

15.0

max

15.5

Reset drain voltage

Output drain voltage

V_RD

V_OD

V_LG

Output load transistor

gate voltage

Supplied internally

Output gate voltage

V_OG

V_HS

Supplied internally

Horizontal CCD input source voltage

Protection P-well voltage

− 0.2

18.0

0.2

14.5

15.0

15.5

V_PT

− 10.0

φ_V(L)

− 1.2

− 1.0

− 0.7

P-well voltage

V_PW

Reference voltage

5.0

Resetꢀ

H-L

Bias

V_φR(H-L)

18.0

− 0.2

4.7

5.3

5.0

pulse voltage

V_φR(Bias)

Adjust

5.0

Horizontal register

clock pulse voltage 2

Horizontal register

clock pulse voltage 2

Vertical shift register

clock pulse voltage 1

V_φH1(H)

V_φH1(L)

V_φH2(H)

V_φH2(L)

18.0

4.5

5.5

− 0.2

− 0.1

4.5

0.1

18.0

5.0

5.5

− 0.2

− 0.1

14.5

− 0.2

− 7.3

0.8

0.1

V_φV1(H)

V_φV1(M)

V_φV1(L)

V_φV2(M)

V_φV2(L)

V_φV3(H)

V_φV3(M)

V_φV3(L)

V_φV4(M)

V_φV4(L)

18.0

15.0

15.5

0.2

− 9.0

15.0

− 9.0

18.0

− 7.0

1.0

− 6.7

1.2

Vertical shift register

clock pulse voltage 2

Vertical shift register

clock pulse voltage 3

− 7.3

14.5

− 0.2

− 7.3

0.8

− 7.0

15.0

− 6.7

15.5

0.2

− 9.0

15.0

− 7.0

1.0

− 6.7

1.2

Vertical shift register

clock pulse voltage 4

Substrate voltage

− 9.0

− 7.3

3.0

− 7.0

Adjust

25.0

− 6.7

13.8

25.5

V_Sub

φV_Sub

T_opr

− 0.2

45.0

24.5

Operating temperature

Storage temperature

− 10

− 30

°C

T_stg

Note)1. Standard light input defines

Standard light input is the one when the exposure is done at a lens aperture of F8, using a light source of 2856 K and 1050 nt, and

placing a color temperature conversion filter LB-40 (HOYA) and an IR cutting filter CAW-500 (t = 2.5 mm) in the light path.

2. *1: V_Subinternal settings guarantee blooming at 400 times light input of the standard light input.

3. *2: V_PTis set so that the following conditions are set for VL of the vertical shift clock.

ꢀ

V_PTVL

4. *3:

5. *4: V_Subwhen csing electronic shutter function

V_φR(H)

V_φR(L)

φV_Sub"H"

φV_Sub(V)

φV_Sub"L"

H-L

Bias (0 to 5.0V DC)

V_Sub(V)

MN3726FT,MN3726AT

CCD Area Image Sensor

■ Optical Characteristics

Saturatio Sensitivity Vertical

Horizontal Vertical

Image lag

output ⁿ

smear

resolution resolution

Effective

Color

S/N

Part Number

pixelsꢀ typ

typ

B/W

(dB)

(mV)

900

(mV)

typ(%)

0.002

0.003

(%)

(TV-lines)

MN3726FT

MN3726AT

Color

B/W

512 582

350

330

360

420

1,500

500

■ Graphs of Characteristics

CCD Spectral Characteristics (without color filter)

100

400

500

600

700

Wavelength (nm)

Color Filter Spectral Characteristics

100

Y_e

C_Y

M_g

G_r

400

500

600

700

Wavelength (nm)

CCD Area Image Sensor

MN3726FT,MN3726AT

■ Timing Diagram

< Field A >

620

625

BLK

φ_V1

φ_V2

φ_V3

φ_V4

< Field B >

305

310

315

320

325

330

335

BLK

φ_V1

φ_V2

φ_V3

φ_V4

MN3726FT,MN3726AT

CCD Area Image Sensor

■ Timing Diagram (continued)

T ≈ 51.8 ns

BLK

45T

178T

φ_H1

φ_H2

φ_R

2T ≈ 104 ns

φ_H1

φ_H2

φ_R

CCD Area Image Sensor

MN3726FT,MN3726AT

■ Package Dimensions (Unit：mm)

• WDIP016-P-0500C

14.00±0.08

11.40±0.10

7.00±0.08

Reference plane

Valid pixel center

(0.60)

(0.77)

0.46±0.05

0.46 M

1.78

Request for your special attention and precautions in using the technical information and

semiconductors described in this book

(1) If any of the products or technical information described in this book is to be exported or provided to non-residents, the laws and

regulations of the exporting country, especially, those with regard to security export control, must be observed.

(2) The technical information described in this book is intended only to show the main characteristics and application circuit examples

of the products, and no license is granted under any intellectual property right or other right owned by our company or any other

company. Therefore, no responsibility is assumed by our company as to the infringement upon any such right owned by any other

company which may arise as a result of the use of technical information described in this book.

(3) The products described in this book are intended to be used for standard applications or general electronic equipment (such as office

equipment, communications equipment, measuring instruments and household appliances).

Consult our sales staff in advance for information on the following applications:

– Special applications (such as for airplanes, aerospace, automobiles, traffic control equipment, combustion equipment, life support

systems and safety devices) in which exceptional quality and reliability are required, or if the failure or malfunction of the prod-

ucts may directly jeopardize life or harm the human body.

– Any applications other than the standard applications intended.

(4) The products and product specifications described in this book are subject to change without notice for modification and/or im-

provement. At the final stage of your design, purchasing, or use of the products, therefore, ask for the most up-to-date Product

Standards in advance to make sure that the latest specifications satisfy your requirements.

(5) When designing your equipment, comply with the range of absolute maximum rating and the guaranteed operating conditions

(operating power supply voltage and operating environment etc.). Especially, please be careful not to exceed the range of absolute

maximum rating on the transient state, such as power-on, power-off and mode-switching. Otherwise, we will not be liable for any

defect which may arise later in your equipment.

Even when the products are used within the guaranteed values, take into the consideration of incidence of break down and failure

mode, possible to occur to semiconductor products. Measures on the systems such as redundant design, arresting the spread of fire

or preventing glitch are recommended in order to prevent physical injury, fire, social damages, for example, by using the products.

(6) Comply with the instructions for use in order to prevent breakdown and characteristics change due to external factors (ESD, EOS,

thermal stress and mechanical stress) at the time of handling, mounting or at customer's process. When using products for which

damp-proof packing is required, satisfy the conditions, such as shelf life and the elapsed time since first opening the packages.

(7) This book may be not reprinted or reproduced whether wholly or partially, without the prior written permission of Matsushita

Electric Industrial Co., Ltd.

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