PN312D-(N) [PANASONIC]

PIN Photodiode, PLASTIC PACKAGE-4;
PN312D-(N)
型号: PN312D-(N)
厂家: PANASONIC    PANASONIC
描述:

PIN Photodiode, PLASTIC PACKAGE-4

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PIN Photodiodes  
PNZ312DN (PN312D-(N))  
Silicon PIN Dual Photodiode  
Unit : mm  
5.0 0.1  
2.54 0.1  
4
1.8 0.3  
For optical information systems  
1.0 0.2  
3
Features  
û
10  
Fast response: tr, tf = 10 ns (typ.)  
Good photo current linearity  
Low dark current: ID = 20 nA (max.)  
Small size plastic package (flat type)  
Adoption of visible light cutoff resin  
B
A
û
10  
1.0  
+0.1  
0.2  
Ð0.05  
-0.5 0.
0.6  
1
2
10  
û
10û  
Applications  
Auto focus sensor for still cameras and vdeo ras etc.  
Distance measuring systems  
Position sensor for automatic embllines  
Eye sensor for industrial ro
5û  
5û  
1 : Anode A  
2 : Common cathode  
3 : Anode B  
4 : Common cathode  
Note) The PN312D-(N) package consists of a visible  
light cutoff resin. Therefore the chips (A and B) shown  
in the drawing cannot actually be seen.  
Absolute Maimum Ratings Ta = 25°C  
Parameter  
Symbo
Rangs  
Unit  
V
Dimensions of detection area  
Reverse oltae  
VR  
30  
Unit : mm  
3.5  
1.6  
1.6  
0.04  
wer issip
PD  
30  
mW  
°C  
Operaing atemperature  
Stoage temperature  
Topr  
Tstg  
25 ∼ +85  
30 ∼ +100  
°C  
A
B
Electrtical Characteristics Ta = 25°C 3°C  
Reverse volt
Symbol  
Conditons  
min  
typ  
max  
Unit  
V
VR  
ID  
IR = 10 µA  
VR = 10 V  
30  
Dark current  
20  
nA  
µA  
nm  
ns  
3
1
Photo current *  
IL  
VR = 10 V, L = 1000 lx
8
12  
940  
10  
5
Peak sensitivity wavelength  
λP  
tr, tf  
Ct  
VR = 10 V  
2
Response time *  
VR = 0 V, RL = 1 kΩ  
VR = 10 V, f = 1 MHz  
Capacitance between pins  
Acceptance half angle  
pF  
°
θ
Measured from the optical axis to the half power point  
65  
Note) 1. Measuring methods are based on JAPANESE INDUSTRIAL STANDARD JIS C 7031 measuring methods for diodes.  
2. The indicated values for absolute maximum ratings and electro-optical characteristics are the values corresponding to  
individual elements.  
3. *1: Measurements were made using a white tungsten lamp (color temperature T = 2856K) as a light source.  
*2: Semiconductor laser light source (λ = 900 nm )  
+10 V  
*3: Photo current measurement circuit  
R1 = R2  
R1  
R2  
Note) The part number in the parenthesis shows conventional part number.  
Publication date: June 2007  
SHE00032BED  
1
PNZ312DN  
PD Ta  
IL L  
IL Ta  
40  
30  
20  
10  
0
10 3  
160  
140  
120  
100  
80  
VR = 10 V  
L = 1000 lx  
T = 2856K  
VR = 10 V  
Ta = 25°C  
T = 2856K  
10 2  
10  
60  
1
40  
10 1  
25  
0
20  
40  
60  
80  
100  
10  
10 2  
10 3  
40 20  
0
20  
40  
60  
80 100  
Ambient temperature Ta (°C)  
uminance (lx)  
Ambient temperature Ta (°C )  
ID VR  
ID Ta  
Spectral sensitivity characteristics  
1
10  
100  
VR = 10 V  
Ta = 25°C  
VR = 0 V  
Ta =
80  
60  
40  
20  
0
1
10 1  
10 2  
10 2  
40 20  
0
4
12 120 24 8 32  
0
20  
40  
60  
80 100  
20  
400  
600  
800  
1000 1200  
ltage VR (V)  
Ambient temperature Ta (°C )  
Wavelength λ (nm)  
Direcharacteristis  
Ct VR  
tr , tf RL  
100  
80  
60  
40  
20  
0
10 3  
104  
f = 1 MHz  
T= 25°C  
Sig.in VR = 10 V  
90%  
10%  
Sig.  
out  
RL  
td  
10 2  
10  
10 3  
50 Ω  
tr  
tf  
10 2  
10  
1
Ta = 25°C  
10 2  
10 1  
1
80  
40  
0
40  
80  
10 1  
1
10  
10 2  
10 1  
1
10  
Angle θ (°)  
Reverse voltage VR (V)  
External load resistance RL (k)  
SHE00032BED  
2
Request for your special attention and precautions in using the technical information and  
semiconductors described in this book  
(1) If any of the products or technical information described in this book is to be exported or provided to non-residents, the laws and  
regulations of the exporting country, especially, those with regard to security export control, must be observed.  
(2) The technical information described in this book is intended only to show the main characteristics and application circuit examples  
of the products, and no license is granted under any intellectual property right or other right owned by our company or any other  
company. Therefore, no responsibility is assumed by our company as to the infringement upon any such right owned by any other  
company which may arise as a result of the use of technical information described in this book.  
(3) The products described in this book are intended to be used for standard applications or general electronic equipment (such as office  
equipment, communications equipment, measuring instruments and household appliances).  
Consult our sales staff in advance for information on the following applications:  
Special applications (such as for airplanes, aerospace, automobiles, traffic contrl equipment, combustion equipment, life support  
systems and safety devices) in which exceptional quality and reliability equired, or if the failure or malfunction of the prod-  
ucts may directly jeopardize life or harm the human body.  
Any applications other than the standard applications intended.  
(4) The products and product specifications described in this book re subjet to change wnotice for modification and/or im-  
provement. At the final stage of your design, purchasingouse f the roducts, therfor the most up-to-date Product  
Standards in advance to make sure that the latest specifictions saisfy your requirements.  
(5) When designing your equipment, comply with the rnge f absolute maximuing nd the guaranteed operating conditions  
(operating power supply voltage and operating nvirnt etc.). Especiallyplee be creful not to exceed the range of absolute  
maximum rating on the transient state, such as powpower-off and mode-witching. Otherwise, we will not be liable for any  
defect which may arise later in your equpment
Even when the products are used withthe guarnteed values, ake nto te cosideration of incidence of break down and failure  
mode, possible to occur to semicuctor roducts. Mesures the syems such as redundant design, arresting the spread of fire  
or preventing glitch are recomin ordeto prevent pysicainjury, fire, social damages, for example, by using the products.  
(6) Comply with the instructionfor ue in rder to prevent reakdown and characteristics change due to external factors (ESD, EOS,  
thermal stress and mcanical stress) at the time of handlin, mounting or at customer's process. When using products for which  
damp-proof packinis reqred, satisfy the condions, suh as shelf life and the elapsed time since first opening the packages.  
(7) This book may e noreprinted or repwhther wholly or partially, without the prior written permission of Matsushita  
Electric ndurial Co., Ltd.  

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