R-5775(S) [PANASONIC]

MEGTRON6 series Ultra-low transmission loss Highly heat resistant Multi-layer circuit board materials;
R-5775(S)
型号: R-5775(S)
厂家: PANASONIC    PANASONIC
描述:

MEGTRON6 series Ultra-low transmission loss Highly heat resistant Multi-layer circuit board materials

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中文:  中文翻译
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Circuit Board Materials  
電子回路基板材料  
Ultra-low transmission loss Highly heat resistant  
Multi-layer circuit board materials  
Laminate R-5775(N)* R-5775(K) R-5775(G) R-5775(S)* R-5775(R)  
超低伝送損耐熱多層基板材料  
Prepreg R-5670(N)* R-5670(K) R-5670(G)ꢀ  
*Low Dk glass cloth type R-5775(S)/R-5775(R): Buried Resistor Copper Foil  
Applications ⽤途  
ICT infrastructure equipment, Supercomputer, Measuring instrument,  
Antenna(Base station, Automotive millimeter-wave radar), Etc.  
ICT ンフラ器 ( スーパーコンュータ計測⽤機器 )、  
アンテナ ( 地局、 波レーダ )、高周波⽤途ど  
Network  
ネットワーク  
Wireless  
ワイヤレ通信  
The industry standard for high speed, ultra-low loss PCB material.  
Excellent HDI and thermal performance.  
Better  
High end zone  
Ultra-Low loss  
超高性能サーバやルータ向け材料のデァクトスタンド。  
低伝送ロスを実現し、超高性能サーバやルータの性能向上に貢  
High end/ volume zone  
Low loss  
Volume zone  
Middle Loss  
Dk 3.4 Df 0.004  
@12GHz  
Tg (DSC)  
185℃  
T288 (with copper)  
>120min  
Frequency dependence by Transmission loss  
Heat resistance of High Multi-layered  
ꢀ高多層耐熱性  
ꢀ伝送損失比較  
0
Result  
Drill diameter  
Wall to wall distance  
φ0.3mm  
-50  
R-5775(N) H-VLP  
Low Dk glass cloth  
0.5mm  
pass  
0.6mm  
pass  
-100  
-150  
-200  
-250  
(Low Dk glass cloth)  
R-5775(K)/R-5775(G)  
H-VLP  
Condition  
Normal Glass cloth  
260℃ reflow x 10times  
0
20  
40  
60  
Frequency (GHz)  
80  
100  
Construction  
32 Layers  
ꢁConstruction  
Microstrip line  
Board thickness: 4.5mm  
Measurement  
2 port S-Parameter  
10MHz-110GHz  
Sig  
Frequency  
PCB  
Thickness ; 0.100mm  
ꢀꢀꢀꢀꢀꢀ(4mil)  
GND  
De-embedded  
Multiline TRL method  
Measurement line adjust to 50Ω(Zo)  
Layer1 : Signal Line  
Layer2 : GND Plane  
(line width : 270μm)  
(Cu thickness : 24μm)  
(Cu thickness : 24μm)  
General propertiesꢀ⼀般特性  
R-5775(S)  
R-5775(R)  
Item  
Test method  
Condition Unit  
R-5775(N)  
R-5775(K)/R-5775(G)  
Low Dk glass cloth  
Normal glass cloth  
Low Dk glass cloth Normal glass cloth  
Buried Resistor Copper Foil Buried Resistor Copper Foil  
Tg  
CTE z-axis  
DSC  
A
ppm/℃  
min  
185  
45  
185  
45  
185  
45  
185  
45  
α1  
α2  
IPC-TM-650 2.4.24  
IPC-TM-650 2.4.24.1  
A
260  
>120  
3.4  
260  
>120  
3.6  
260  
260  
T288(with copper)  
Dk  
A
C-24/23/50  
A
>120  
3.4  
>120  
3.6  
Balanced-type  
circular disk resonator  
12GHz  
Df  
0.004  
0.8  
0.004  
0.8  
0.004  
0.8*²  
0.004  
0.8*²  
Peel strength*¹ 1oz(35μm) IPC-TM-650 2.4.8  
kN/m  
The sample thickness is 0.75mm.  
*1 H-VLP Copper *2 Buried Resistor Copper Foil 1/2oz (18μm)  
The above data are typical values and not guaranteed values. 上記データは当社測定による代表値であり、保証値ではありません。  
Please see the page for “Notes before you use” 商品のご採用に当たっての注意事項は こちら  
Ⓒ Panasonic Industry Co., Ltd.ꢀ202205  
industrial.panasonic.com/ww/electronic-materials  

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