R-F775 [PANASONIC]
Flexible circuit board materials FELIOS;
| 型号： | R-F775 |
| 厂家： | 
PANASONIC |
| 描述： | Flexible circuit board materials FELIOS |
| 文件： | 总1页 (文件大小：120K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
Superior thermal resistance
MOT 160˚C
RDo-ubFle7-si7de5d copper clad
Wide line-up of film thickness
0.5-6.0mils
RSin-gFle-7sid7ed0copper clad
Wide line-up of copper foil thickness
2-150μm
Flexible circuit board materials
Applications
Felios adhesiveless flex materials are available in a wide-range
of film and copper foil thicknesses to support all applications.
Felios offers superior thermal resistance, dimensional stability
and quality.
Avionics / Industry
Consumer Mobile Products (Smartphone,
Tablet PC), Medical, Industrial,
Avionics/Space Applications, etc.
Line-up Available in various film and copper foil combinations. Roll-cut type MAX 610mm(MD) x 500mm(TD) Roll type W=250mm, 500mm
Film thickness
Unit: mils (mm)
Copper foil thickness
0.5
(0.013)
1.0
(0.025)
●*¹
●
2.0
(0.050)
3.0
(0.075)
-
4.0
(0.100)
-
5.0
(0.125)
-
6.0
(0.150)
●
*¹
-
●
●
-
1/4oz (9μm)
●*¹
●
●
●*¹
-
●
*¹
-
●
●
●
1/3oz (12μm)
1/2oz (18μm)
1oz (35μm)
2oz (70μm)
3oz (105μm)
●
●
●
●
●
●
●
●
●
●
●
●
*²
*²
*²
*²
*²
*²
*²
*²
*²
*²
*²
*²
RA copper foil
ED copper foil
●
●
●
-
-
-
-
-
-
●
●
-
-
●
●
●
●
●
-
●
●
●
●
●
●
●
●
●
●
●
●
●
-
-
(2μm)
-
-
-
1/6oz (6μm)
1/4oz (9μm)
1/3oz (12μm)
1/2oz (18μm)
1oz (35μm)
●
●
●
●
●
●
●
●
●
●
-
●
●
-
-
-
*1 Special option *2 W=610mm is optional.
General properties
Item
Test method
JIS C 6471
Condition
Unit
R-F775
A
>330
Solder heat resistance
˚C
C-96/40/90
260
7.1
Tensile modulus
Tensile strength
ASTM D882
Internal method
JIS C 6471
A
GPa
MPa
A
542
Peel strength
CTE
RA: 1/3oz(12μm)
MD/TD/Z-axis
A
50-200˚C
A
N/mm(lb/inch)
ppm/˚C
1.35
JIS R 3251
17/19/101
0.16
Thermal conductivity
Laser flash
W/m·K
After etching MD direction
0.00 0.10
0.00 0.10
94V-0
Dimensional stability
IPC-TM-650
%
After etching TD direction
Flammability
UL
A+E-168/70
-
-
Outgas
TML/CVCM/WVR* ASTM E595-07/ASTM E595-15
%
0. / 0.05 / 0.55
62
The sample thickness is film 25μm, copper foil 12μm.
* TML: Total Mass Loss, CVCM: Collected Volatile Condensable Material, WVR: Water Vapor Recovered
Our Halogen-free materials are based on JPCA-ES-01-2003 standard and others.
The above data are typical values and not guaranteed values.
industrial.panasonic.com/ww/electronic-materials
Panasonic Industry Co., Ltd. Electronic Materials Business Division
panasonic R-F775
Panasonic Industry Co., Ltd. 202212
Please see our website for Notes before you use.
©
相关型号：
R-G545E/R-G540E
Ultra-low transmission loss Circuit board materials for IC substrate/Module
PANASONIC
©2020 ICPDF网 联系我们和版权申明