L-S110WDT [PARALIGHT]
SURFACE MOUNT DEVICE LED;
| 型号： | L-S110WDT |
| 厂家： | 
PARA LIGHT ELECTRONICS CO., LTD. |
| 描述： | SURFACE MOUNT DEVICE LED |
| 文件： | 总15页 (文件大小：290K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
DATA SHEET
PART NO.: L-S110WDT
REV: A / 4
CUSTOMER’S APPROVAL : _______________
DRAWING NO. : DS-73-06-0010
DCC : ____________
DATE : 2009-11-26 PAGE 1 of 15
PARA-FOR-065
SURFACE MOUNT DEVICE LED
Part No. : L-S110WDT
REV:A / 4
z PACKAGE OUTLINE DIMENSIONS
P.C.BOARD
R E IN FO R C IN G PIN
(NO N ELECTROD E)
LED D ICE
Notes:
1. All dimensions are in millimeters.
±
2. Tolerance is
0.1mm (.004") unless otherwise noted.
z Features
½
½
½
½
½
½
½
Wide view angle, White color SMD chip LED .
Compatible with automatic Pick & Place equipment.
Compatible with Reflow soldering and Wave soldering processes.
EIA STD package.(ANSI/EIA-481-B-2001)
I.C. compatible, low current application
Pb free product and acceptable lead-free process!.
RoHS compliant version.
● Application
½
½
½
LCD back light
Switch back lights
Illuminations.
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Part No. : L-S110WDT
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z CHIP MATERIALS
½
½
½
Dice Material : InGaN
Light Color : White
Lens Color : Light Yellow Diffused.
z Absolute Maximum Ratings(Ta=25℃)
Symbol
PD
Parameter
Rating
100
Unit
mW
Power Dissipation
Peak Forward Current
IPF
100
mA
mA
(1/10 Duty Cycle, 0.1ms Pulse Width)
Continuous Forward Current
IF
-
25
0.25
℃
℃
De-rating Linear From 25
mA/
V
VR
Reverse Voltage
5
ESD
Topr
Tstg
Electrostatic Discharge Threshold(HBM)Note A
Operating Temperature Range
2000
V
℃
℃
-40 ~ +85
-40 ~ +85
Storage Temperature Range
Note A :
HBM : Human Body Model. Seller gives no other assurances regarding the ability of to
withstand ESD.
z Electro-Optical Characteristics(Ta=25℃)
Parameter
Luminous Intensity
Radiant Intensity
Viewing Angle
Symbol
IV
Min.
100
Typ.
300
0.28
130
0.30
0.30
3.2
Max.
Unit
mcd
Test Condition
IF=20mA
Lm
2θ1/2
X
0.14
mw/sr
Deg
Note 2
CIE Chromaticity
CIE Chromaticity
Forward Voltage
Reverse Current
IF=20mA
Y
VF
3.50
50
V
IF = 20mA
VR = 5V
IR
μA
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Part No. : L-S110WDT
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Notes:
1. Luminous intensity is measured with a light sensor and filter combination that
proximities the CIE eye-response curve.
2. θ1/2 is the off-axis angle at which the luminous intensity is half the axial luminous
intensity.
3. The dominant wavelength λd is derived from the CIE chromaticity diagram and
represents the single wavelength which defines the color of the device.
4. Caution in ESD :
Static Electricity and surge damages the LED. It is recommended use a wrist band or
anti-electrostatic glove when handling the LED. All devices, equipment and machinery
must be properly grounded.
5. Major standard testing equipment by “Instrument System” Model : CAS140B Compact
Array Spectrometer and “KEITHLEY” Source Meter Model : 2400.
z Typical Electro-Optical Characteristics Curves
Fig.1 Relative Intensity vs. Wavelength
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SURFACE MOUNT DEVICE LED
Part No. : L-S110WDT
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z Typical Electro-Optical Characteristics Curves
(25℃Ambient Temperature Unless Otherwise Noted)
Fig.2Relative Luminous Intensity vs.Forward Current
Fig.1 Forward Current vs.Forward Voltage
50
40
1000
100
30
25
20
10
1
10
0
0
20
Ambient Temperature Ta(℃)
Fig.4 Forward Current Derating Curve
40
60
80 100
-60 -40 -20 -0 20 40 60 80 100
Ambient Temperature Ta(℃)
Fig.3 Luminous Intensity vs.Ambient Temperature
30°
0° 10° 20°
0° 10° 20°
30°
40°
40°
1.0
1.0
0.9
50°
0.9
50°
60°
70°
0.8
0.8
60°
70°
80°
90°
0.7
0.7
80°
90°
0.5 0.3 0.1 0.2 0.4 0.6
0.5 0.3 0.1 0.2 0.4 0.6
Fig.5 Relative Intensity vs.Angle
Fig.6 Relative Intensity vs.Angle
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z Label Explanation
CUS. PART NO: To be denominated.
CUSTOMER: To be denominated.
PART NO: Refer to P15
IV --- Luminous Intensity Code
VF --- Forward Voltage Code
WD --- Dominant Wavelength Code
LOT NO:
E
L
S 6 8 0001
A
B
C
D
E
F
A---E: For series number
B---L: Local
C---S:SMD
D---Year
F: Foreign
E---Month
F---SPEC.
PACKING QUANTITY OF BAG :
3000pcs max for 150、170、110、115 series
4000pcs max for 191 series
5000pcs max for 192 series
DATE CODE：2006 06 08
G
H
I
G--- Year
H--- Month
I --- Day
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z Reel Dimensions
Notes:
1. Taping Quantity : 3000pcs(M inimum packingquantitywillbe500pcsforremainders)
2. The tolerances unless mentioned is±0.1mm, Angle±0.5°, Unit : mm.
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z Package Dimensions Of Tape And Reel
Progressive direction
Polarity
Notes: All dimensions are in millimeters.
Moisture Resistant Packaging
Label
Reel
Label
Desiccant
Aluminum moistue-proof bag
Label
Box
435
Carton
Notes : One reel in a bag, one bag in a inner box, ten inner boxes in a carton. Unit : mm.
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z Cleaning
½
½
½
If cleaning is required , use the following solutions for less than 1 minute and less than 40℃.
Appropriate chemicals: Ethyl alcohol and isopropyl alcohol.
Effect of ultrasonic cleaning on the LED resin body differs depending on such factors as
the oscillator output, size of PCB and LED mounting method. The use of ultrasonic
cleaning should be enforced at proper output after confirming there is no problem.
z Suggest Soldering Pad Dimensions
Direction of PWB camber
and go to reflow furnace
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Part No. : L-S110WDT
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● Suggest Sn/Pb IR Reflow Soldering Profile Condition:
● Suggest Pb-Free IR Reflow Soldering Profile Condition:
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z Bin Code List
Luminous Intensity(IV), Unit:mcd@20mA
Forward Voltage(VF), Unit:V@20mA
Bin Code
Min
Max
180.0
280.0
450.0
Bin Code
K8
Min
2.80
2.95
3.10
3.25
Max
2.95
3.10
3.25
3.40
R
S
T
112.0
180.0
280.0
K9
K10
K11
Tolerance of each bin are±10%
Tolerance of each bin are±0.1Volt
Color Rank (CIE chromaticity X , Y) @ 20mA
RankW 1
Rank W2
X
Y
0.280 0.264 0.283 0.296
0.248 0.267 0.305 0.276
Rank W3
X
Y
0.287 0.283 0.330 0.330
0.295 0.305 0.360 0.339
Rank W4
X
Y
0.296 0.287 0.330 0.330
0.276 0.295 0.339 0.318
X
Y
0.330 0.330 0.361 0.356
0.318 0.360 0.385 0.351
＊ Measurement of Color coordinates : +/- 0.02
C .I.E . C h ro m atic ity D iag ram
0.40
0.38
0.36
0.34
0.32
0.30
0.28
0.26
0.24
0.22
0.20
W4
W2
y
W3
W1
0.20 0.22 0.24 0.26 0.28 0.30 0.32 0.34 0.36 0.38 0.40
x
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z CAUTIONS
1.Application Limitation :
The LED’s described here are intended to be used for ordinary electronic equipment (such as office
equipment, communication equipment and household application).Consult PARA’s sales in advance
for information on application in which exceptional quality and reliability are required, particularly
when the failure or malfunction of the LED’s may directly jeopardize life or health (such as airplanes,
automobiles, traffic control equipment, life support system and safety devices).
2.Storage :
Before opening the package :
The LEDs should be store kept at 5°C to 30°C or less and 85%RH or less.
After opening the package :
The LEDs should be kept at 5°C to 30°C or less and 70%RH or less. The LEDs should be
soldered within 168 hours(7 days) after opening the package.
Please avoid rapid transitions in ambient temperature in high humidity environments where
condensation may occur.
LEDs stored out of their original packaging for more than a week should be baked at 30°C for at 24
hours before solder assembly.
3.Soldering
Do not apply any stress to the lead frame during soldering while the LED is at high temperature.
Recommended soldering condition.
Reflow Soldering :
Pre-heat 120~150°C, 120sec. MAX., Peak temperature : 240°C Max. Soldering time : 10 sec Max.
Soldering Iron : (Not recommended)
Temperature 300°C Max., Soldering time : 3 sec. Max.(one time only), power dissipation of iron :
20W Max. use SN60 solder of solder with silver content and don’t to touch LED lens when soldering.
Wave soldering :
Pre-heat 100°C Max, Pre-heat time 60 sec. Max, Solder wave 260°C Max, Soldering time 5 sec. Max.
preformed consecutively cooling process is required between 1st and 2nd soldering processes.
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Part No. : L-S110WDT
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4. Lead-Free Soldering
For Reflow Soldering :
、
℃
1 Pre-Heat Temp:150-180 ,120sec.Max.
、
℃
2 Soldering Temp:Temperature Of Soldering Pot Over 230 ,40sec.Max.
、
℃，
3 Peak Temperature:260
5sec.
、
4 Reflow Repetition:2 Times Max.
、
5 Suggest Solder Paste Formula 93.3 Sn/3.1 Ag/3.1 Bi /0.5 Cu
For Soldering Iron (Not Recommended) :
、
℃
1 Iron Tip Temp:350 Max.
、
2 Soldering Iron:30w Max.
、
3 Soldering Time:3 Sec. Max. One Time.
For Dip Soldering :
、
℃
1 Pre-Heat Temp:150 Max. 120 Sec. Max.
、
℃
2 Bath Temp:265 Max.
、
3 Dip Time:5 Sec. Max.
5. Drive Method
Circuit model A
Circuit model B
(A)Recommended circuit.
(B)The difference of brightness between LEDs could be found due to the Vf-If characteristics of LED.
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6.Reliability Test
Classification
Test Item
Test Condition
Reference Standard
Ta= Under Room Temperature As Per Data
Sheet Maximum Rating
*Test Time= 1000HRS
MIL-STD-750D:1026 (1995)
MIL-STD-883D:1005 (1991)
JIS C 7021:B-1 (1982)
Operation Life
(-24HRS,+72HRS)*@20mA.
High Temperature
High Humidity
Storage
IR-Reflow In-Board, 2 Times
Ta= 65±5℃,RH= 90～95%
*Test Time= 1000HRS±2HRS
MIL-STD-202F:103B(1980)
JIS C 7021:B-11(1982)
Endurance Test
High Temperature
Storage
Ta= 105±5℃
Test Time= 1000HRS (-24HRS,72HRS)
MIL-STD-883D:1008 (1991)
JIS C 7021:B-10 (1982)
Low Temperature
Storage
Ta= -55±5℃
*Test Time=1000HRS (-24HRS,72H RS)
JIS C 7021:B-12 (1982)
MIL-STD-202F:107D (1980)
MIL-STD-750D:1051(1995)
MIL-STD-883D:1010 (1991)
JIS C 7021:A-4(1982)
Temperature
Cycling
105±5℃
10mins
-55±5℃
10mins
100 Cycles
100 Cycles
IR-Reflow In-Board, 2 Times
105±5℃
10mins
MIL-STD-202F:107D(1980)
MIL-STD-750D:1051(1995)
MIL-STD-883D:1011 (1991)
Thermal
Shock
-55℃±5℃
10mins
Environmental
Test
MIL-STD-202F:210A(1980)
MIL-STD-750D:2031(1995)
JIS C 7021:A-1(1982)
Solder
Resistance
Tsol= 260 ± 5℃
Dwell Time= 10 ± 1sec
MIL-STD-202F:208D(1980)
MIL-STD-750D:2026(1995)
MIL-STD-883D:2003(1991)
IEC 68 Part 2-20
Tsol= 235 ± 5℃
Immersion time 2±0.5 sec
Immersion rate 25±2.5 mm/sec
Solder ability
Coverage ≧95% of the dipped surface
JIS C 7021:A-2(1982)
7.Others:
The appearance and specifications of the product may be modified for improvement without notice.
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XXXX : Special specification for
z PART NO. SYSTEM :
customer
S 1 1 0 X C X X - X X X X
L –
T : Taping for 7 inch reel
TC : Taping for 13 inch reel
TH : IV half binning
TP : Wavelength binning
Lens color
C : Water Clear
W : White Diffused
T : Color Transparent
D : Color Diffused
G : Gap 570nm Green
Y : GaAsp 585 nm Yellow
E : GaAsp 620 nm Orange
SR : GaAlAs 634 nm Red
KG : AlInGap 570nm Super Green
KY : AlInGap 590nm Super Yellow
KF : AlInGap 605nm Super Amber
KR : AlInGap 630 nm Super Red
LB/TB : InGaN 470nm Blue
LG : InGaN 525nm Green……
0 : Single chip
1/2 : Super thin single chip
5/6 : Dual chip
F : Three chip(Full color)
150 : 1206 1.1T Type
170 : 0805 0.8T Type
191 : 0603 0.6T Type
192 : 0603 0.4T Type
110 : 1206 1.0T Type
C : Top View Type
S : Side View Type
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