L-T670IR4CT [PARALIGHT]
SURFACE MOUNT DEVICE LED;
| 型号： | L-T670IR4CT |
| 厂家： | 
PARA LIGHT ELECTRONICS CO., LTD. |
| 描述： | SURFACE MOUNT DEVICE LED |
| 文件： | 总12页 (文件大小：287K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
Release by
PARA LIGHT ELECTRONICS CO., LTD. PARALIGHT DCC
4F, No.1, Lane 93, Chien Yi Road, Chung Ho City, Taipei, Taiwan
Tel: 886-2-2225-3733
E-mail: para@para.com.tw
Fax: 886-2-2225-4800
http://www.para.com.tw
DATA SHEET
PART NO.: L-T670IR4CT
REV: A / 1
CUSTOMER’S APPROVAL : _______________
DCC : ____________
PAGE 1 of 12
DRAWING NO. : DS-7A-11-0007
DATE :2012-2-21
PARA-FOR-065
Release by
PARALIGHT DCC
SURFACE MOUNT DEVICE LED
Part No. : L-T670IR4CT
REV: A / 1
l Features
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Top view, Wide view angle, IR PLCC 2 package SMD LED .
EIA STD package, packing in 8mm tape on 7" diameter reels (ANSI/EIA-481-B-2001).
Compatible with automatic Pick & Place equipment.
Compatible with IR Reflow soldering and TTW soldering.
Pb free product and acceptable lead-free process.
Meet RoHS Green Product.
l Package Outline Dimensions
SIDE VIEW
0.15
TOP VIEW
3.50
c 0.80
2.40
3.20
-
POLARITY +
BACK VIEW
FRONT VIEW
0.75
0.75
Notes:
1. All dimensions are in millimeters.
±
2. Tolerance is
0.10mm (.004") unless otherwise noted.
DRAWING NO. : DS-7A-11-0007
DATE :2012-2-21
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PARA-FOR-068
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SURFACE MOUNT DEVICE LED
Part No. : L-T670IR4CT
REV: A / 1
l CHIP MATERIALS
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Dice Material : GaAlAs/GaAs
Lens Color : Water Clear
l Absolute Maximum Ratings(Ta=25℃)
Symbol
PD
Parameter
Rating
1.7
Unit
mW
Power Dissipation
Peak Forward Current
IPF
80
mA
(1/10 Duty Cycle, 0.1ms Pulse Width)
Continuous Forward Current
IF
-
20
0.25
mA
℃
℃
De-rating Linear From 25
mA/
V
VR
Topr
Tstg
Reverse Voltage
5
℃
℃
Operating Temperature Range
Storage Temperature Range
Wave Soldering Condition (Two times Max.)
Infrared Soldering Condition (Two times
MAX.)
-40 ~ +85
-40 ~ +85
260 (for 5 seconds)
240 (for 10 seconds)
-
-
Note A :
HBM : Human Body Model. Seller gives no other assurances regarding the ability of to
withstand ESD.
l Electro-Optical Characteristics (Ta=25℃)
Parameter
Symbol
IE
Min.
0.6
Typ.
1.1
Max.
Unit
Test Condition
IF=70mA
Radiant Intensity
mW/sr
Viewing Angle
2 1/2
θ
130
850
deg
nm
Note 2
Peak EmissionWavelength
p
Measurement @Peak
λ
Spectral Line Half-Width
35
nm
V
Δλ
Forward Voltage
Reverse Current
VF
IR
1.6
1.9
IF =70mA
VR = 5V
100
A
μ
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DATE :2012-2-21
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SURFACE MOUNT DEVICE LED
Part No. : L-T670IR4CT
REV: A / 1
Radiant Intensity(IE), Unit:mw/sr@70mA
Bin Code
Min
Max
D
E
F
0.45
0.71
1.12
0.71
1.12
1.80
Notes:
1. Luminous intensity is measured with a light sensor and filter combination that
proximities the CIE eye-response curve.
2.
1/2 is the off-axis angle at which the luminous intensity is half the axial luminous
θ
intensity.
3. Caution in ESD :
Static Electricity and surge damages the LED. It is recommended use a wrist band or
anti-electrostatic glove when handling the LED. All devices, equipment and machinery
must be properly grounded.
4. Major standard testing equipment by “Instrument System” Model : CAS140B Compact
Array Spectrometer and “KEITHLEY” Source Meter Model : 2400.
l Typical Electro-Optical Characteristics Curves
Fig.1 Relative Intensity vs. Wavelength
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DATE :2012-2-21
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SURFACE MOUNT DEVICE LED
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l Typical Electro-Optical Characteristics Curves
(25℃ Ambient Temperature Unless Otherwise Noted)
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DATE :2012-2-21
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SURFACE MOUNT DEVICE LED
Part No. : L-T670IR4CT
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l Reel Dimensions
Notes:
1. Taping Quantity : 2000pcs
2. The tolerances unless noted is±0.1mm, Angle±0.5°, Unit: mm.
l Suggest Soldering Pad Dimensions
1. 6
1. 8
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DATE :2012-2-21
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SURFACE MOUNT DEVICE LED
Part No. : L-T670IR4CT
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l Package Dimensions Of Tape And Reel
4. 00±0. 10
( . 157±. 004)
*0.23± 0.03
(.009± .001)
2. 00±0. 05
( . 079±. 002)
4. 00±0. 10
( . 157±. 004)
*2. 03+0. 10
( . 080+. 004)
Notes: All dimensions are in millimeters.
l Packaging Of Electronic Components On Continuous Tapes
DRAWING NO. : DS-7A-11-0007
DATE :2012-2-21
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SURFACE MOUNT DEVICE LED
Part No. : L-T670IR4CT
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l Moisture Resistant Packaging
Label
Reel
Label
Desiccant
Aluminum moistue-proof bag
Label
Box
435
Carton
Notes : One reel in a bag, one bag in a inner box, ten inner boxes in a carton. Unit : mm.
l Cleaning
If cleaning is required , use the following solutions for less than 1 minute and less than 40℃.
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Appropriate chemicals: isopropyl alcohol. (When using other solvents, it should be confirmed
beforehand whether the solvents will dissolve the package and the resin or not.)
Effect of ultrasonic cleaning on the LED resin body differs depending on such factors as
ultrasonic power and the assembled condition. Before cleaning, a pre-test should be
confirm whether any damage to the LEDS will occur.
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DATE :2012-2-21
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SURFACE MOUNT DEVICE LED
Part No. : L-T670IR4CT
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l Suggest IR Reflow Soldering Profile Condition:
240° C(MAX)
Rising
Cooling
-5℃/sec
(MAX)
+5℃/sec
(MAX)
C
C
+5℃/sec
(MAX)
Time
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DATE :2012-2-21
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SURFACE MOUNT DEVICE LED
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l CAUTIONS
1. Static Electricity:
* Static electricity or surge voltage damages the LEDs.
It is recommended that a wrist band or an anti-electrostatic glove be used when handling the LEDs.
* All devices, equipment and machinery must be properly grounded.
It is recommended that measures be taken against surge voltage to the equipment that mounts the LEDs.
* When inspecting the final products in which LEDs were assembled, it is recommended to check
whether the assembled LEDs are damaged by static electricity or not. It is easy to find static-damaged
LEDs by a light-on test or a VF test at a lower current (blew 1mA is recommended).
* Damaged LEDs will show some unusual characteristics such as the leak current remarkably increases,
the forward voltage becomes lower, or the LEDs do not light at the low current.
Criteria: (VF>2.0V,at IF=0.5m A )
2. Storage :
* Before opening the package :
The LEDs should be kept at 30°C or less and 85%RH or less. When storing the LEDs, moisture
proof packaging with absorbent material (silica gel) is recommended.
* After opening the package :
The LEDs should be kept at 30°C or less and 70%RH or less. The LEDs should be soldered within
168 hours (7 days) after opening the package. If unused LEDs remain, they should be stored in
moisture proof packages, such as sealed containers with packages of moisture absorbent material
(silica gel). It is also recommended to return the LEDs to the original moisture poof bag and to
reseal the moisture proof bag again.
If the moisture absorbent material (silica gel) has faded away or the LEDs have exceeded the
storage time, baking treatment should e performed using the following conditions.
Baking treatment: more than 24hours at 65±5℃.
* Please avoid rapid transitions in ambient temperature in high humidity environments where
condensation may occur.
3. Soldering:
Do not apply any stress to the LED lens during soldering while the LED is at high temperature.
Recommended soldering condition.
* Reflow Soldering :
Pre-heat 120~150°C, 120sec. MAX., Peak temperature : 240°C Max. Soldering time : 10 sec Max.
* Soldering Iron : (Not recommended)
Temperature350°C Max., Soldering time : 3 sec. Max.(one time only), power dissipation of iron :
20W Max. use SN60 solder of solder with silver content and don’t to touch LED lens when soldering.
4. Lead-Free Soldering
For Reflow Soldering :
、
1 Pre-Heat Temp: 150-180℃,120sec.Max.
、
2 Soldering Temp: Temperature Of Soldering Pot Over 240℃,40sec.Max.
DRAWING NO. : DS-7A-11-0007
DATE :2012-2-21
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SURFACE MOUNT DEVICE LED
Part No. : L-T670IR4CT
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、
，
3 Peak Temperature: 260℃ 10sec.
、
4 Reflow Repetition: 2 Times Max.
、
5 Suggest Solder Paste Formula : 93.3 Sn/3.1 Ag/3.1 Bi/0.5 Cu
For Soldering Iron (Not Recommended) :
、
1 Iron Tip Temp: 350℃ Max.
、
2 Soldering Iron: 30w Max.
、
3 Soldering Time: 3 Sec. Max. One Time.
5. Drive Method
Circuit model A
Circuit model B
(A)Recommended circuit.
(B)The difference of brightness between LED`s could be found due to the Vf-If characteristics of LED.
6. Reliability
Classification
Test Item
Test Condition
Ta= Under Room Temperature As Per Data Sheet
Maximum Rating
*Test Time= 1000HRS
(-24HRS,+72HRS)*@20mA.
Reference Standard
MIL-STD-750D:1026 (1995)
MIL-STD-883D:1005 (1991)
JIS C 7021:B-1 (1982)
Operation Life
High Temperature
High Humidity
Storage
IR-Reflow In-Board, 2 Times
Ta= 65±5℃,RH= 90～95%
*Test Time= 1000HRS±2HRS
MIL-STD-202F:103B(1980)
JIS C 7021:B-11(1982)
Endurance Test
High Temperature
Storage
Ta= 105±5℃
Test Time= 1000HRS (-24HRS,72HRS)
MIL-STD-883D:1008 (1991)
JIS C 7021:B-10 (1982)
Low Temperature
Storage
Ta= -55±5℃
*Test Time=1000HRS (-24HRS,72H RS)
JIS C 7021:B-12 (1982)
MIL-STD-202F:107D
(1980)
Temperature
Cycling
105±5℃
10mins
-55±5℃
10mins
MIL-STD-750D:1051(1995)
MIL-STD-883D:1010 (1991)
JIS C 7021:A-4(1982)
100 Cycles
100 Cycles
IR-Reflow In-Board, 2 Times
105±5℃
10mins
MIL-STD-202F:107D(1980)
MIL-STD-750D:1051(1995)
MIL-STD-883D:1011 (1991)
MIL-STD-202F:210A(1980)
MIL-STD-750D:2031(1995)
JIS C 7021:A-1(1982)
Thermal
Shock
-55℃±5℃
10mins
Environmental
Test
Solder
Resistance
Tsol= 260 ± 5℃
Dwell Time= 10 ± 1sec
MIL-STD-202F:208D(1980)
MIL-STD-750D:2026(1995)
MIL-STD-883D:2003(1991)
IEC 68 Part 2-20
Tsol= 235 ± 5℃
Immersion time 2±0.5 sec
Immersion rate 25±2.5 mm/sec
Solder ability
Coverage ≧95% of the dipped surface
JIS C 7021:A-2(1982)
DRAWING NO. : DS-7A-11-0007
DATE :2012-2-21
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SURFACE MOUNT DEVICE LED
Part No. : L-T670IR4CT
REV: A / 1
7.Others:
The appearance and specifications of the product may be modified for improvement without notice.
XXXX : Special specification for
●PART NO. SYSTEM :
customer
L – T 67 0 X X T - X X X X
T : Taping for 7 inch reel
TC : Taping for 13 inch reel
Lens color
C : Water Clear
W : White Diffused
T : Color Transparent
D : Color Diffused
KY : 9mil AlInGap 590nm Super Yellow
KR : 9mil AlInGap 630 nm Super Red
TE : 14mil AlInGap 624 nm Super Red
TY: 14mil AlInGap590 nm Super Yellow
LB : InGaN ITO rough 470nm Blue
LG : InGaN ITOrough520nm Green
W : InGaN + YAG White color
IR4: GaAlAs/GaAs 850nm
0 : Single chip
1/2 : Super thin single chip
5/6 : Dual chip
F : Three chip(Full color)
650 :
670 :
020 :
3020 1.3T TYPE
3528 1.9T TYPE
3812 0.6T TYPE
C : PCB Top View Type
T :PLCC Top View Type
S : Side View Type
DRAWING NO. : DS-7A-11-0007
DATE :2012-2-21
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PARA-FOR-068
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