PI4ULS5V4557ZHEX [PERICOM]

Microprocessor Circuit, PQCC16;
PI4ULS5V4557ZHEX
型号: PI4ULS5V4557ZHEX
厂家: PERICOM SEMICONDUCTOR CORPORATION    PERICOM SEMICONDUCTOR CORPORATION
描述:

Microprocessor Circuit, PQCC16

外围集成电路
文件: 总9页 (文件大小:262K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
PI4ULS5V4557  
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Dual SIM/Smart Card Power Supply and Interface Signal Switch  
Features  
Description  
Power Management and Control for two SIM Cards  
or Smart Cards  
Independent 1.8V/3V VCC Control for Both Cards  
Supports Simultaneous Powering of Both Cards  
Fast channel Switching  
The PI4ULS5V4557 provides the power conversion and  
signal level translation needed for advanced (2.5G and  
3G) cellular telephones to interface with 1.8V and 3V  
subscriber identity modules (SIMs). The device meets  
all requirements for 1.8V or 3V SIMs and contains LDO  
regulators to power 1.8V or 3V SIM cards from a 2.7V  
to 5.5V input. The output voltages can be set using the  
voltage selection pins and up to 50mA of load current  
can be supplied. A channel select pin determines which  
channel is open for communication.  
Automatic Level Translation  
Fast rise time by current pull up  
Built-In Fault Protection Circuitry  
Automatic Activation/Deactivation Sequencing  
Low Operating/Shutdown Current  
>8kV ESD on SIM Card Pins  
Meets EMV Fault Tolerance Requirements  
Packaging (Pb-free & Green): 16-Lead TQFN3x3  
Internal level translators allow controller operating  
with supplier as low as 1.4V to interface with 1.8V or  
3V Smart Cards. Battery life is maximized by a low  
operating current of 40μA and a shutdown current of  
less than 1μA.  
Pin Assignment  
16  
15  
14  
13  
Applications  
GSM, TD-SCDMA and other 3G+ Cellular Phones  
Wireless Point-to-Sale Terminals  
VCC2  
VDD  
M0  
1
2
3
4
12  
11  
10  
9
Multiple SIM Card Interfaces  
M1  
17  
VBAT  
VCC1  
CLKIN  
RSTIN  
5
6
7
8
Note: 16-Lead (3mmx3mm) Plastic QFN Exposed Pad (pin 17)  
is GND, Must Be Soldered to PCB.  
12-12-0004  
PT0395-1  
01/05/13  
1
PRELIMINARY INFORMATION: COMPANY CONFIDENTIAL  
PI4ULS5V4557  
Dual SIM/Smart Card Power Supply and  
Interface Signal Switch  
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Pin Description  
Pin  
2
Name  
VDD  
Type  
P
I
Description  
Power Input. Control logic power supply voltage input of devices.  
Power Input. Analog section power supply voltage input of devices.  
3
VBAT  
Power Outputs. 1.8V or 3V voltage output for respective SIM /Smart cards’ power  
supply VCC pin.  
Clock Outputs. Connect CLK1/2 pins to respective SIM/Smart cards’ CLK pin.  
CLK1/2 signals are derived from the CLKIN pin.  
Reset Outputs. Connect RST1/2 pins to respective SIM/Smart cards’ RST pin.  
RST1/2 signals are derived from the RSTIN pin.  
Data Ports. Connect I/O1, I/O2 pins to respective SIM/Smart cards’ I/O pin.  
Communication path can be set from DATA to I/O1 or from DATA to I/O2.  
Data Port. I/O1 or I/O2 pin transmits/receives data to/from the DATA pin.  
Reset Input. Reset signal is transmitted from RSTIN to RST1 or RST2.  
4, 1  
VCC1, VCC2  
O
O
CLK1,  
CLK2  
RST1, RST2  
5, 16  
6, 15  
7, 14  
O
I/O1,  
I/O2  
DATA  
RSTIN  
I/O  
8
9
I/O  
I
I
I
10  
13  
CLKIN  
EN  
Clock Input. Clock signal is transmitted from CLKIN to CLK1 or CLK2.  
VCC1, VCC2 Enable Control Inputs.  
Voltage Selection Inputs. VCC1, VCC2 both have two voltage values 1.8V and 3V,  
and VCC1, VCC2 voltage values can be selected at same time. Details see below Truth  
Table.  
11,12  
17  
M1, M0  
GND  
I
Ground. Exposed pad of the package bottom.  
P
Truth Table  
M1  
0
M0  
0
Selected Channel/Voltage  
Channel 1/1.8V (VCC1=1.8V)  
Channel 1/3V (VCC1=3V)  
Channel 2/1.8V (VCC2=1.8V)  
Channel 2/3V (VCC2=3V)  
0
1
1
0
1
1
Note:  
Maximum Ratings  
Stresses greater than those listed under MAXIMUM  
RATINGS may cause permanent damage to the  
device. This is a stress rating only and functional  
operation of the device at these or any other  
conditions above those indicated in the operational  
sections of this specification is not implied.  
Exposure to absolute maximum rating conditions  
for extended periods may affect reliability.  
2. The device is guaranteed to meet performance  
specifications from 0°C to 85°C . Specification over  
the -40°C to 85°C operating temperature range are  
assured by design, characterization and correlation  
with statistical controls.  
Storage Temperature...............................................................-65to +150℃  
Ambient Temperature ...............................................................-40to +85℃  
ESD(HBM) for I/O pins.............................................................................8KV  
ESD(HBM) for all pins...........................................................................7.5KV  
VBAT, VDD, DATA, RSTIN, CLKIN, EN, M0, M1 to GND ........ -0.5V to +6V  
I/O1, CLK1, RST1............................................................-0.5V to VCC1 +0.5V  
I/O2, CLK2, RST2............................................................-0.5V to VCC2 +0.5V  
ICC1, 2.........................................................................................................80mA  
VCC1, 2 Short Circuit Duration……………………………………….Indefinite  
3. ICC1, 2 based on long-term current density  
limitation.  
12-12-0004  
PT0395-1  
01/05/13  
2
PRELIMINARY INFORMATION: COMPANY CONFIDENTIAL  
PI4ULS5V4557  
Dual SIM/Smart Card Power Supply and  
Interface Signal Switch  
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DC Electrical Characteristics  
(VBAT =3.3V, VDD=1.8V, C1=C2=1μF, TA = 40°C to 85°C, unless otherwise noted.)  
Parameter  
Input Power Supply  
Description  
Test Conditions  
Min  
2.7  
Typ.  
Max  
Unit  
VBAT  
VBAT Operating Voltage  
-
-
5.5  
V
μA  
V
VCC1=3V, VCC2=0V, ICC1=0A  
VCC1=1.8V, VCC2=0V, ICC1 =0A  
IBAT  
VBAT Operating Current  
-
40  
100  
VDD  
IDD  
VDD Operating Voltage  
VDD Operating Current  
VDD Shutdown Current  
VBAT Shutdown Current  
-
-
-
1.4  
-
4
0.1  
0.1  
3.6  
15  
1
-
-
-
IDDS  
IBATS  
SIM Card Supplies  
μA  
VDD =0V  
1
3V Mode. 0mA<ICC1, 2<50mA  
1.8V Mode. 0mA<ICC1, 2<30mA  
ICC1, 2=0mA, EN to IO1/2  
2.85  
1.71  
-
3.00  
1.8  
1
3.15  
1.89  
2.5  
Output Voltage  
V
VCC1, 2  
Channel Turn on Time  
ms  
CLK1, 2  
VOL  
Low Level Output Voltage  
High Level Output Voltage  
Sink current =-200μA  
-
VCC1, 2  
0.2  
-
-
-
0.2  
-
-
-
VOH  
Source current =200μA  
Rise/Fall Time  
CLK1, 2 Frequency  
Loaded with 50pF (10% to 90%)  
-
-
16  
ns  
MHz  
10  
RST1, 2  
VOL  
Low Level Output Voltage  
High Level Output Voltage  
Rise/Fall Time  
Sink current =-200μA  
-
VCC1, 2  
0.2  
-
-
-
0.2  
ns  
VOH  
Source current =200μA  
Loaded with 50pF (10% to 90%)  
-
100  
I/O1, 2  
VOL  
Low Level Output Voltage  
High Level Output Voltage  
Sink current =-1mA (VDATA=0V)  
Source current =20μA  
-
-
-
0.3  
-
0.85×V  
CC1, 2  
VOH  
(VDATA=VDD  
)
Rise/Fall Time  
Short-Circuit current  
Loaded with 50pF (10% to 90%)  
VDATA=0V  
-
-
300  
3.5  
500  
10  
ns  
mA  
DATA  
VOL  
Low Level Output Voltage  
High Level Output Voltage  
Rise/Fall Time  
Sink current =-500μA (VI/O1, 2=0V)  
Source current =20μA  
-
-
-
0.3  
-
ns  
0.8×  
VDD  
-
VOH  
(VI/O1, 2=VCC1, 2  
)
Loaded with 50pF (10% to 90%)  
125  
500  
EN, RSFN, CLKIN, MO, M1  
0.15×  
VDD  
VIL  
Low Input Threshold  
-
-
-
0.85×V  
VIH  
High Input Threshold  
Input Current  
-
-
-
-
-
DD  
IIL (IIH)  
-1  
1
μA  
12-12-0004  
PT0395-1  
01/05/13  
3
PRELIMINARY INFORMATION: COMPANY CONFIDENTIAL  
PI4ULS5V4557  
Dual SIM/Smart Card Power Supply and  
Interface Signal Switch  
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Function Block Diagram  
VDD  
2
VBAT  
3
VCC1  
4
7
LDO1  
LDO2  
1
VCC2  
VDD  
I/O1  
14 I/O2  
RST1  
CLK1  
6
5
15 RST2  
16 CLK2  
DATA  
RSTIN  
8
9
VDD  
CLKIN 10  
Control Logic  
17  
13  
12  
11  
GND  
M1  
EN  
M0  
Function Description  
VDD (Pin 2): Power. The Control logic is referring to the voltage.  
VBAT (Pin 3): Power. The supply voltage input of analog sections.  
VCC1, VCC2 (Pins 4, 1): Two power supply outputs to the respective card sockets VCC pins and both can be set to 0V, 1.8V or 3V  
via the M0, M1and EN inputs. Only one of VCC1, VCC2 will be active at a time.  
CLK1, CLK2 (Pins 5, 16): Two clock outputs to the respective card sockets CLK pins and the clock signals are derived from the  
CLKIN pin with level shift functions. The CLK1, CLK2 pins are gated off until VCC1, VCC2 attain their correct values.  
RST1, RST2 (Pins 6, 15): Two reset outputs to the respective card sockets RST pins and the reset signals are derived from the  
RSTIN pin with level shift functions. The RST1, RST2 pins are gated off until VCC1, VCC2 attain their correct values. When a card  
is deselected, the sate of its RST is latched up to its current state.  
I/O1, I/O2 (Pins 7, 14): Two data outputs/inputs to the respective card sockets I/O pins, transmit /receive data to/from the DATA  
12-12-0004  
PT0395-1  
01/05/13  
4
PRELIMINARY INFORMATION: COMPANY CONFIDENTIAL  
PI4ULS5V4557  
Dual SIM/Smart Card Power Supply and  
Interface Signal Switch  
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pin with level shift functions. The I/O1, I/O2 pins are gated off until VCC1, VCC2 attain their correct values.  
DATA (Pin 8): Input/Output. Connect this pin to microcontroller side I/O pin. The DATA pin provides the bidirectional  
communication path to both cards. Only one of cards may be selected to communicate via the DATA pin at a time. The pin  
possesses a weak pull-up current source, allowing the controller to use an open drain output and maintain a HIGH state during  
shutdown, as long as VDD is powered.  
RSTIN (Pin 9): Input. Supply the reset signal to the cards through RST1, RST2. It is level shifted and transmitted directly to the  
RST pin of the selected card.  
CLKIN (Pin 10): Input. Supply the clock signal to the cards through CLK1, CLK2. It is level shifted and transmitted directly to  
the CLK pin of the selected card.  
M0, M1 (Pins 12, 11): Inputs. The M0, M1 pins select which set of SIM/smart card pins are active and the voltage level (1.8V or  
3V) of VCC1, VCC2. Detail please sees below Channel and Voltage Truth Table.  
EN (Pins 13): Inputs. The EN pin shuts down the chip when LOW.  
EXPOSED PAD (17): Chip Ground. This ground pad must be soldered directly to a PCB ground plane.  
The PI4ULS5V4557 features two independent SIM/Smart Card channels. Only one of these channels may be open for  
communication at a time. Each channel is able to product two voltage levels, 1.8V and 3V. The channel selection and voltage  
selection are controlled by the EN, M0 and M1 pins as shown in the table below:  
Channel and Voltage Truth Table  
EN  
1
M1  
0
M0  
0
Selected Channel/Voltage  
Channel 1/1.8V (VCC1=1.8V)  
Channel 1/3V (VCC1=3V)  
Channel 2/1.8V (VCC2=1.8V)  
Channel 2/3V (VCC2=3V)  
Channel 1 and 2 Disabled  
1
0
1
1
1
0
1
1
1
0
×
×
Bidirectional Channels  
The bidirectional channels are level shifted to the appropriate VCC1, 2 voltages at the I/O1, 2 pins. An NMOS pass transistor  
performs the level shifting. The gate of the NMOS transistor is biased such that the transistor is completely off when both sides  
have relinquished the channel. If one side of the channel asserts a LOW, then the transistor will convey LOW to the other side.  
When a channel is selected, it becomes a candidate to drive data on the DATA pin and likewise receive data from the DATA pin.  
When a channel is deselected, it’s I/O1 (or I/O2) pin will be pulled LOW and communication with the DATA pin will be disabled.  
If both channels are disabled, a weak pull-up ensures that the DATA pin is held HIGH, as long as VDD is powered.  
Auto Pull-Up Current Sources  
Internal auto pull-up current source will confirm the signal pass through bidirectional pins (DATA, I/O1, 2) and fast the signal rise  
time when normal data transmit/receive from DATA to I/O1 (I/O2) .  
Reset Channels  
When a channel is selected, the reset channel provides a level shifted path from the RSTIN pin to the RST pin of the selected card.  
PI4ULS5V4557s reset pin is pulled LOW when a channel is deselected.  
Activation/Deactivation  
Activation and deactivation sequencing is handled by built-in circuitry. Each channel may be activated or deactivated  
independently of the other. The activation sequence for each channel is initiated by bringing the EN pin HIGH. The activation  
sequence is outlined below:  
1. The RST, CLK and I/O pins are held LOW.  
2. VCC is enabled.  
3. After VCC is stable at its selected level, the I/O and RST channels are enabled.  
4. The clock channel is enabled on the rising edge of the second clock cycle after the I/O pin is enabled.  
The deactivation sequence is initiated by bringing the EN pin LOW. The deactivation sequence is outlined below:  
1. The reset channel is disabled and RST is brought LOW.  
2. The clock channel is disabled and the CLK pin is brought LOW two clock cycles after EN is brought LOW. If the clock is not  
running, the clock channel will be disabled approximately 9μs after the EN pin is brought LOW.  
12-12-0004  
PT0395-1  
01/05/13  
5
PRELIMINARY INFORMATION: COMPANY CONFIDENTIAL  
PI4ULS5V4557  
Dual SIM/Smart Card Power Supply and  
Interface Signal Switch  
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3. The I/O channel is disabled and the I/O pin is brought LOW approximately 9μs after the EN pin is brought LOW.  
4. VCC1, 2 will be depowered after the I/O pin is brought LOW.  
The activation or deactivation sequences will take place every time a card channel is enabled or disabled.  
Fault Detection  
The VCC1, 2, I/O1, 2, RST1, 2, CLK1, 2 and DATA pins are all protected against short-circuit faults. While there are no logic  
outputs to indicate that a fault has occurred, these pins will be able to tolerate the fault condition until it has been removed.  
The VCC1, 2, I/O1, 2, and RST1, 2 pins possess fault protection circuitry which will limit the current available to the pins. Each  
VCC pin is capable of supplying approximately 90mA (typ.) before the output voltage is reduced.  
The CLK1, 2 pins are designed to tolerate faults by reducing the current drive capability of their output stages. After a fault is  
detected by the internal fault detection logic, the logic waits for a fault detection delay to elapse before reducing the current drive  
capability of the output stage. The reduced current drive allows the PI4ULS5V4557 to detect when the fault has been removed.  
Capacitor Selection  
A total of four capacitors are required for proper bypassing of the PI4ULS5V4557. An input bypass capacitor is required at VBAT  
and VDD  
.
Output bypass capacitors are required on each of the Smart Card VCC pins. Due to their extremely low equivalent series resistance  
(ESR), only multilayer ceramic chip capacitors should be used to ensure proper stability and ESD protection.  
There are several types of ceramic capacitors available, each having considerably different characteristics. For example, X7R/X5R  
ceramic capacitors have excellent voltage and temperature stability but relatively low packing density. Y5V ceramic capacitors  
have apparently higher packing density but poor performance over their rated voltage or temperature ranges. Under certain voltage  
and temperature conditions Y5V and X7R/X5R ceramic capacitors can be compared directly by case size rather than specified  
value for a desired minimum capacitance.  
The VCC1, 2 outputs should be bypassed to GND with a 1μF capacitor. VDD and VBAT outputs should be bypassed to GND with a  
0.1μF capacitor. Capacitors should be placed as close to the device as possible for improved ESD tolerance.  
Compliance Testing  
Inductance due to long leads on type approval equipment can cause ringing and overshoot that leads to testing problems. Small  
amounts of capacitance and damping resistors can be included in the application without compromising the normal electrical  
performance of the PI4ULS5V4557 or Smart Card system. Generally a 100Ω resistor and a 20pF capacitor will accomplish this,  
as shown in below.  
1µF  
PI4ULS5  
V4557  
VCC1, 2  
100Ω  
100Ω  
100Ω  
20pF  
Smart  
Card  
Socket  
CLK1, 2  
RST1, 2  
I/O1, 2  
20pF  
20pF  
20pF  
Additional Components for Improved Compliance Testing  
Shutdown Modes  
The device can enter to shutdown mode by EN pin. Bring EN pin to LOW directly shutdown the device. The shutdown current is  
less than 1µA. For applications that require virtually zero shutdown current, the VDD pin can be grounded. This will reduce the  
VBAT current to well under 1µA.  
12-12-0004  
PT0395-1  
01/05/13  
6
PRELIMINARY INFORMATION: COMPANY CONFIDENTIAL  
PI4ULS5V4557  
Dual SIM/Smart Card Power Supply and  
Interface Signal Switch  
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Application Circuit  
VDD  
VBAT  
1.4V to 3.6V  
3V to 6V  
C3  
0.1µF  
C4  
0.1µF  
2
3
VDD  
VDD  
VBAT  
5
C7  
10  
9
I/O1  
RST1  
CLK1  
VCC1  
I/O  
CLKIN  
RSTIN  
DATA  
6
7
C2  
C3  
C1  
1.8V/3V  
SIM  
Card 1  
RST  
CLK  
VCC  
4
8
C1  
1µF  
17  
µContr  
oller  
GND  
C2  
1µF  
13  
12  
1
C1  
C3  
VCC  
CLK  
RST  
I/O  
EN  
VCC2  
CLK2  
RST2  
I/O2  
16  
1.8V/3V  
SIM  
Card 2  
M0  
M1  
15  
14  
C2  
C7  
11  
PI4ULS5V4557  
Typical Performance Characteristics  
I/Ox Short-circuit Current vs. Temperature  
(VDD=3.6V VBAT=5.5V)  
No load Supply Current IBAT vs. Supply Voltage VBAT  
(TA=25ICC1=ICC2=0µA)  
5.0  
4.5  
4.0  
3.5  
3.0  
100  
90  
Vccx=1.8V  
Vccx=3V  
80  
70  
60  
50  
40  
30  
-40  
-15  
10  
35  
60  
85  
2.7 3.1 3.5 3.9 4.3 4.7 5.1 5.5  
VBAT (V)  
Temperature ()  
12-12-0004  
PT0395-1  
01/05/13  
7
PRELIMINARY INFORMATION: COMPANY CONFIDENTIAL  
PI4ULS5V4557  
Dual SIM/Smart Card Power Supply and  
Interface Signal Switch  
|||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||  
VBAT Quiescent Current (IBAT-ICC) vs. Load Current  
Shutdown Current IBATS vs. Supply Voltage VBAT  
(VDD=1.8V)  
(TA=25VBAT= 3.1V)  
0.7  
100  
80  
60  
40  
20  
0
0.6  
0.5  
0.4  
0.3  
0.2  
0.1  
0
-40  
25℃  
85℃  
2.7 3.1 3.5 3.9 4.3 4.7 5.1 5.5  
VBAT (V)  
0.1  
1
10  
100  
Load Current (mA)  
Shutdown Current IDDS vs. Supply Voltage VDD  
50  
40  
30  
20  
10  
0
1.2  
1.6  
2.0  
2.4  
2.8  
3.2  
3.6  
VDD(V)  
12-12-0004  
PT0395-1  
01/05/13  
8
PRELIMINARY INFORMATION: COMPANY CONFIDENTIAL  
PI4ULS5V4557  
Dual SIM/Smart Card Power Supply and  
Interface Signal Switch  
|||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||  
Mechanical Information  
PKG. DIMENSIONS(MM)  
SYMBOL  
MIN  
0.700  
0.000  
MAX  
0.800  
0.050  
A
A1  
A3  
D
0.203REF  
2.900  
2.900  
1.600  
1.600  
0.180  
3.100  
3.100  
1.800  
1.800  
0.300  
E
D1  
E1  
b
Note:  
1) Controlling dimensions in millimeters.  
2) Ref: JEDEC MO-220J  
e
L
0.500TYP  
0.300  
0.500  
Ordering Information  
Part Number  
Package Code  
Package  
Lead Free and Green TQFN-16 3x3 (ZH)  
PI4ULS5V4557ZHE  
ZH  
Notes:  
E = Pb-free and Green  
Adding X Suffix= Tape/Reel  
Pericom Semiconductor Corporation 1-800-435-2336 www.pericom.com  
Pericom reserves the right to make changes to its products or specifications at any time, without notice, in order to improve design or performance and to supply  
the best possible product. Pericom does not assume any responsibility for use of any circuitry described other than the circuitry embodied in Pericom product. The  
company makes no representations that circuitry described herein is free from patent infringement or other rights, of Pericom.  
12-12-0004  
PT0395-1  
01/05/13  
9

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