PI6C184-02 [PERICOM]

Precision 1-13 Clock Buffer; 1-13精密时钟缓冲器
PI6C184-02
型号: PI6C184-02
厂家: PERICOM SEMICONDUCTOR CORPORATION    PERICOM SEMICONDUCTOR CORPORATION
描述:

Precision 1-13 Clock Buffer
1-13精密时钟缓冲器

时钟
文件: 总6页 (文件大小:243K)
中文:  中文翻译
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PI6C184-02  
Precision 1-13 Clock Buffer  
Features  
Description  
High speed, low noise non-inverting 1-13 buffer  
Supports up to four SDRAM DIMMs  
Low skew (<250ps) between any two output clocks  
The PI6C184-02 is a high-speed low-noise 1-13 non-inverting  
buffer designed for SDRAM clock buffer applications.  
ThisbufferisintendedtobeusedwiththePI6C104clockgenerator  
for Intel Architecture for both desktop and mobile systems.  
2
I C Serial Configuration interface  
At power up all SDRAM output are enabled and active. The  
Multiple V , V pins for noise reduction  
2
DD  
SS  
I C Serial control may be used to individually activate/deactivate  
3.3V power supply voltage  
any of the 13 output drivers.  
28-pin SSOP and SOIC packages (H, S)  
Note:  
2
Purchase of I C components from Pericom conveys a license to  
2
use them in an I C system as defined by Philips.  
Block Diagram  
Pin Configuration  
28-Pin  
H, S  
PS8319  
05/03/00  
1
PI6C184-02  
Precision 1-13 Clock Buffer  
Pin Description  
Pin  
Symbol  
Type  
Quantity  
Description  
2,3,6,7,10,11,  
SDRAM [0.5]  
SDRAM [6.11]  
SDRAM [12]  
BUF_IN  
0
0
0
1
6
6
1
1
SDRAM Byte 0 clock output  
SDRAM Byte 1 clock output  
SDRAM Byte 2 clock output  
Input for 1-13-buffer  
18,19,22,23,26,27  
12  
9
2
Data pin for I C circuitry. Has a 100k  
Internal pull-up resistor  
14  
SDATA  
I/O  
I/O  
1
1
2
Clock pin for I C circuitry. Has a  
154  
SCLOCK  
100k Internal pull-up resistor  
1,5,13,20,24,28  
4,8,16,17,21,25  
V
Power  
6
6
3.3V power supply for SDRAM buffer  
Ground for SDRAM Buffers  
DD  
V
Ground  
SS  
PI6C184-02 I2C Address Assignment  
A6 A5 A4 A3 A2 A1 A0 R/W  
PI6C184 Serial Configuration Map  
Byte0: SDRAM Active/Inactive Register  
(1 = enable, 0 = disable)  
1
1
0
1
0
0
1
0
Bit  
Pin #  
Description  
Bit 7  
Bit 6  
Bit 5  
Bit 4  
Bit 3  
Bit 2  
Bit 1  
Bit 0  
Note:  
11 SDRAM5 (Active/Inactive)  
10  
~
~
7
SDRAM4(Active/Inactive)  
Reserved  
Reserved  
SDRAM3 (Active/Inactive)  
SDRAM2 (Active/Inactive)  
SDRAM1 (Active/Inactive)  
SDRAM0 (Active/Inactive)  
6
3
2
Inactive means outputs are held LOW and  
are disabled from switching  
PS8319  
05/03/00  
2
PI6C184-02  
Precision 1-13 Clock Buffer  
2-Wire I2C Control  
The I C interface permits individual enable/disable of each  
1
2
2
Each data transfer is initiated with a start condition and ended  
with a stop condition. The first byte after a start condition is  
always a 7-bit address byte followed by a read/write bit. (HIGH  
= read from addressed device, LOW = write to addressed  
device). If the device’s own address is detected, PI6C184-02  
generates an acknowledge by pulling SDATA line LOW during  
ninth clock pulse, then accepts the following data bytes until  
another start or stop condition is detected.  
clock output and test mode enable.  
The PI6C184-02 is a slave receiver device. It can not be read  
back. Sub addressing is not supported. All preceding bytes  
must be sent in order to change one of the control bytes.  
Every bite put on the SDATA line must be 8-bits long (MSB  
first), followed by an acknowledge bit generated by the  
receiving device.  
During normal data transfers Sdata changes only when SCLK  
is LOW. Exceptions: A HIGH to LOW transition on SDATA  
while SCLK is HIGH indicates a “start” condition. A LOW to  
HIGH transition on SDATA while SCLK is HIGH is a “stop”  
condition and indicates the end of a data transfer cycle.  
3
Following acknowledgement of the address byte (D2), two more  
bytes must be sent:  
1. “Command Code” byte, and  
2. “Byte Count” byte.  
4
5
Although the data bits on these two bytes are “don’t care,” they  
must be sent and acknowledged.  
Byte1: SDRAM Active/Inactive Register  
(1 = enable, 0 = disable)  
Byte2: Optional Register for Possible Future  
Requirements (1 = enable, 0 = disable)  
6
Bit  
Bit 7  
Bit 6  
Bit 5  
Bit 4  
Bit 3  
Bit 2  
Bit 1  
Bit 0  
Pin #  
27  
Description  
Bit  
Bit 7  
Bit 6  
Bit 5  
Bit 4  
Bit 3  
Bit 2  
Bit 1  
Bit 0  
Pin #  
N/A  
12  
Description  
SDRAM11 (Active/Inactive)  
SDRAM10 (Active/Inactive)  
SDRAM9 (Active/Inactive)  
SDRAM8 (Active/Inactive)  
(Reserved)  
26  
SDRAM12 (Active/Inactive)  
(Reserved)  
7
23  
N/A  
N/A  
N/A  
N/A  
N/A  
N/A  
22  
(Reserved)  
8
N/A (Reserved)  
N/A (Reserved)  
(Reserved)  
(Reserved)  
9
19  
18  
SDRAM7 (Active/Inactive)  
SDRAM6 (Active/Inactive)  
(Reserved)  
10  
11  
12  
13  
14  
15  
(Reserved)  
Maximum Ratings  
(Above which the useful life may be impaired. For user guidelines, not tested.)  
Note:  
Stresses greater than those listed under MAXIMUM  
RATINGS may cause permanent damage to the device. This  
is a stress rating only and functional operation of the device  
at these or any other conditions above those indicated in the  
operational sections of this specification is not implied.  
Exposure to absolute maximum rating conditions for ex-  
tended periods may affect reliability.  
Storage Temperature ................................................ –65°C to +150°C  
Ambient Temperature with Power Applied ............. –0°C to +70°C  
3.3V Supply Voltage to Ground Potential ............... –0.5V to +4.6V  
DC Input Voltage ..................................................... –0.5V to +4.6V  
Supply Current (V = +3.465V, Cload = max)  
DD  
Symbol  
Parameter  
Supply Current  
Supply Current  
Supply Current  
Test Condition  
BUF_IN = 0 MHz  
Min. Typ. Max Units  
I
DD  
3
I
DD  
BUF_IN = 66.66 MHz  
BUF_IN = 100.0 MHz  
230  
360  
mA  
I
DD  
PS8319  
05/03/00  
3
PI6C184-02  
Precision 1-13 Clock Buffer  
DC Operating Specifications (V = +3.3V ±5%, T = 0°C - 70°C)  
DD  
A
Symbol  
Parameter  
Test Condition  
Min.  
Max.  
Units  
Input Voltage, V  
[0-1] = 3.3V± 5%  
DDCORE  
V
Input High Voltage  
Input Low Voltage  
Input Leakage Current  
V
2.0  
V
+0.3  
IH  
DD  
DDCORE  
V
V
IL  
V
–0.3  
0.8  
SS  
I
IL  
0 < V < V  
DD  
-5  
+5  
IN  
V
DD  
= 3.3V ± 5%  
V
Output High Voltage  
Output Low Voltage  
I
= –1mA  
2.4  
OH  
OH  
V
V
I
= –1mA  
0.4  
OL  
OL  
C
Input Pin Capacitance  
Output pins Capacitance  
Pin Inductance  
5
6
IN  
pF  
C
OUT  
L
PIN  
7
nH  
ºC  
T
Ambient Temperature  
No Airflow  
0
70  
A
SDRAM Clock Buffer Operating Specification  
Symbol  
Parameter  
Pull-up current  
Pull-up current  
Pull-down current  
Pull-down current  
Condition  
= 2.0V  
OUT  
Min. Typ. Max. Units  
I
V
–54  
OHMIN  
I
V
= 3.135V  
–46  
mA  
OHMAX  
OUT  
I
V
= 1.0V  
= 0.4V  
54  
OLMIN  
OUT  
I
V
OUT  
53  
OLMAX  
Output rise edge rate  
SDRAM only  
3.3V ±5%  
@04V-2.4V  
t
SDRAM  
SDRAM  
1.5  
1.5  
4
4
RH  
V/ns  
Output fall edge rate  
SDRAM only  
3.3V ±5%  
@2.4V-0.4V  
t
FH  
AC Timing  
66 MHz  
Min. Max.  
100 MHz  
Symbol  
Parameter  
Units  
ns  
Min.  
Max.  
tSDKP  
SDRAM CLK period  
15.0  
5.6  
5.3  
1.5  
1.5  
1.0  
1.0  
1.0  
1.0  
45  
15.5  
10.0  
3.3  
3.1  
1.5  
1.5  
1.0  
1.0  
1.0  
1.0  
45  
10.5  
tSDKH  
tSDKL  
SDRAM CLK high time  
SDRAM CLK low time  
tSDRISE  
tSDFALL  
tpLH  
SDRAM CLK rise time  
4.0  
4.0  
5.0  
5.0  
8.0  
8.0  
55  
4.0  
4.0  
5.0  
5.0  
8.0  
8.0  
55  
V/ns  
SDRAM CLK fall time  
SDRAM Buffer LH prop delay  
SDRAM Buffer HL prop delay  
SDRAM Buffer Enable delay  
SDRAM Buffer Disable delay  
tpHL  
ns  
tpZL,tpZH  
tpLZ,tpHZ  
Duty Cycle Measured at 1.5V  
%
ps  
SDRAM Output to  
tSDSKW  
250  
250  
Output Skew  
PS8319  
05/03/00  
4
PI6C184-02  
Precision 1-13 Clock Buffer  
1
2
3
4
5
6
7
8
9
Figure 1. Clock Waveforms  
Minimum and Maximum Expected Capacitive Loads  
10  
11  
12  
13  
14  
15  
Clock  
SDRAM  
Notes:  
Min Load Max Load Units  
Notes  
SDRAM DIMM  
Specification  
20 30 pF  
1. Maximum rise/fall times are guaranteed at maximum specified load.  
2. Minimum rise/fall times are guaranteed at minimum specified load.  
3. Rise/fall times are specified with pure capacitive load as shown.  
Testing is done with an additional 500resistor in parallel.  
Design Guidelines to Reduce EMI  
1. Place series resistors and CI capacitors as close as possible to the respective clock pins. Typical value  
for CI is 10 pF. Series resistor value can be increased to reduce EMI provided that the rise and fall  
time are still within the specified values.  
2. Minimize the number of “vias” of the clock traces.  
3. Route clock traces over a continuous ground plane or over a continuous power plane. Avoid routing  
clock traces from plane to plane (refer to rule #2).  
4. Position clock signals away from signals that go to any cables or any external connectors.  
PS8319  
05/03/00  
5
PI6C184-02  
Precision 1-13 Clock Buffer  
Figure 2. Design Guidelines  
28-pinSSOP(H)  
28  
1
28-pinSOIC(S)  
28  
7.40  
7.60  
.2914  
.2992  
0.254  
0.737  
.010  
.029  
1
x 45˚  
.6969 17.70  
.7125 18.10  
0.23  
0.32  
.0091  
.0125  
0-8˚  
.021  
.031  
0.533  
0.787  
2.35  
2.65  
.0926  
.1043  
0.41  
1.27  
REF  
.016  
.050  
.394  
.419  
10.00  
10.65  
SEATING  
PLANE  
0.10  
0.30  
.0040  
.0118  
.050  
BSC  
.013  
.020  
0.33  
0.51  
1.27  
X.XX  
X.XX  
DENOTES DIMENSIONS  
IN MILLIMETERS  
Ordering Information  
P/N  
Description  
PI6C184-02H  
PI6C184-02S  
28-pin SSOP Package  
28-pin SOIC Package  
Pericom Semiconductor Corporation  
2380 Bering Drive • San Jose, CA 95131 • 1-800-435-2336 • Fax (408) 435-1100 • http://www.pericom.com  
PS8319  
05/03/00  
6

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