74HC4094DB [NXP]
8-stage shift-and-store bus register; 8级移位 - 和 - 存储总线寄存器型号: | 74HC4094DB |
厂家: | NXP |
描述: | 8-stage shift-and-store bus register |
文件: | 总23页 (文件大小:203K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
74HC4094; 74HCT4094
8-stage shift-and-store bus register
Rev. 6 — 31 December 2012
Product data sheet
1. General description
The 74HC4094; 74HCT4094 is an 8-bit serial-in/serial or parallel-out shift register with a
storage register and 3-state outputs. Both the shift and storage register have separate
clocks. The device features a serial input (D) and two serial outputs (QS1 and QS2) to
enable cascading. Data is shifted on the LOW-to-HIGH transitions of the CP input. Data is
available at QS1 on the LOW-to-HIGH transitions of the CP input to allow cascading when
clock edges are fast. The same data is available at QS2 on the next HIGH-to-LOW
transition of the CP input to allow cascading when clock edges are slow. The data in the
shift register is transferred to the storage register when the STR input is HIGH. Data in the
storage register appears at the outputs whenever the output enable input (OE) is HIGH. A
LOW on OE causes the outputs to assume a high-impedance OFF-state. Operation of the
OE input does not affect the state of the registers. Inputs include clamp diodes. This
enables the use of current limiting resistors to interface inputs to voltages in excess of
VCC
.
2. Features and benefits
Complies with JEDEC standard JESD7A
Input levels:
For 74HC4094: CMOS level
For 74HCT4094: TTL level
Low-power dissipation
ESD protection:
HBM JESD22-A114F exceeds 2 000 V
MM JESD22-A115-A exceeds 200 V
Specified from 40 C to +85 C and from 40 C to +125 C
3. Applications
Serial-to-parallel data conversion
Remote control holding register
74HC4094; 74HCT4094
NXP Semiconductors
8-stage shift-and-store bus register
4. Ordering information
Table 1.
Ordering information
Type number
Package
Temperature range Name
Description
Version
74HC4094N
40 C to +125 C
40 C to +125 C
40 C to +125 C
40 C to +125 C
DIP16
plastic dual in-line package; 16 leads (300 mil)
SOT38-4
74HCT4094N
74HC4094D
SO16
plastic small outline package; 16 leads; body width
3.9 mm
SOT109-1
SOT338-1
SOT403-1
74HCT4094D
74HC4094DB
74HCT4094DB
74HC4094PW
SSOP16
TSSOP16
plastic shrink small outline package; 16 leads;
body width 5.3 mm
plastic thin shrink small outline package; 16 leads;
body width 4.4 mm
5. Functional diagram
3
1
1
C2
15
EN3
CP
STR
QS1
QS2
QP0
QP1
QP2
9
SRG8
3
10
4
C1/
2
4
5
1D
2D
3
5
6
6
2
D
7
QP3
QP4
QP5
QP6
QP7
7
14
13
12
11
9
14
13
12
11
OE
15
10
001aaf111
001aaf112
Fig 1. Functional diagram
Fig 2. Logic symbol
74HC_HCT4094
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2012. All rights reserved.
Product data sheet
Rev. 6 — 31 December 2012
2 of 23
74HC4094; 74HCT4094
NXP Semiconductors
8-stage shift-and-store bus register
D
2
3
8-STAGE SHIFT
REGISTER
QS2
10
CP
QS1
9
STR
OE
8-BIT STORAGE
REGISTER
1
15
3-STATE OUTPUTS
QP0 QP1 QP2 QP3 QP4 QP5 QP6 QP7
14 13 12 11
4
5
6
7
001aaf119
Fig 3. Logic diagram
STAGE 0
STAGES 1 TO 6
STAGE 7
D
D
Q
D
Q
D
Q
QS1
QS2
CP
CP
D
Q
FF 0
FF 7
CP
CP
LE
LATCH
D
Q
D
Q
LE
LE
LATCH 0
LATCH 7
STR
OE
001aag799
QP0
QP2
QP4
QP6
QP1
QP3
QP5
QP7
Fig 4. Logic diagram
74HC_HCT4094
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2012. All rights reserved.
Product data sheet
Rev. 6 — 31 December 2012
3 of 23
74HC4094; 74HCT4094
NXP Semiconductors
8-stage shift-and-store bus register
6. Pinning information
6.1 Pinning
74HC4094
74HCT4094
1
2
3
4
5
6
7
8
16
15
14
13
12
11
10
9
STR
D
V
CC
74HC4094
74HCT4094
OE
CP
QP4
QP5
QP6
QP7
QS2
QS1
1
2
3
4
5
6
7
8
16
15
14
13
12
11
10
9
STR
D
V
CC
OE
QP0
QP1
QP2
QP3
GND
CP
QP4
QP5
QP6
QP7
QS2
QS1
QP0
QP1
QP2
QP3
GND
001aan577
001aan578
Fig 5. Pin configuration DIP16 and SO16
Fig 6. Pin configuration SSOP16 and TSSOP16
6.2 Pin description
Table 2.
Symbol
STR
Pin description
Pin
1
Description
strobe input
data input
D
2
CP
3
clock input
QP0 to QP7
VSS
4, 5, 6, 7, 14, 13, 12, 11
parallel output
8
ground supply voltage
serial output
QS1, QS2
OE
9, 10
15
output enable input
supply voltage
VDD
16
74HC_HCT4094
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2012. All rights reserved.
Product data sheet
Rev. 6 — 31 December 2012
4 of 23
74HC4094; 74HCT4094
NXP Semiconductors
8-stage shift-and-store bus register
7. Functional description
Table 3.
Function table[1]
Inputs
Parallel outputs
Serial outputs
CP
OE
L
STR
X
D
X
X
X
L
QP0
Z
QPn
Z
QS1
Q6S
NC
QS2
NC
L
X
Z
Z
Q7S
NC
H
H
H
H
L
NC
L
NC
Q6S
Q6S
Q6S
NC
H
QPn 1
QPn 1
NC
NC
H
H
H
H
NC
H
NC
Q7S
[1] At the positive clock edge, the information in the 7th register stage is transferred to the 8th register stage and the QSn outputs.
H = HIGH voltage level; L = LOW voltage level; X = don’t care;
= positive-going transition; = negative-going transition;
Z = HIGH-impedance OFF-state; NC = no change;
Q6S = the data in register stage 6 before the LOW to HIGH clock transition;
Q7S = the data in register stage 7 before the HIGH to LOW clock transition.
CLOCK INPUT
DATA INPUT
STROBE INPUT
OUTPUT ENABLE INPUT
INTERNAL Q0S (FF 0)
Z-state
OUTPUT QP0
INTERNAL Q6S (FF 6)
Z-state
OUTPUT QP6
SERIAL OUTPUT QS1
SERIAL OUTPUT QS2
001aaf117
Fig 7. Timing diagram
74HC_HCT4094
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2012. All rights reserved.
Product data sheet
Rev. 6 — 31 December 2012
5 of 23
74HC4094; 74HCT4094
NXP Semiconductors
8-stage shift-and-store bus register
8. Limiting values
Table 4.
Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134). Voltages are referenced to GND (ground = 0 V).
Symbol
VCC
IIK
Parameter
Conditions
Min
Max
+7
Unit
V
supply voltage
0.5
input clamping current
output clamping current
output current
VI < 0.5 V or VI > VCC + 0.5 V
VO < 0.5 V or VO > VCC + 0.5 V
VO = 0.5 V to (VCC + 0.5 V)
-
20
20
25
+50
50
+150
750
500
mA
mA
mA
mA
mA
C
IOK
-
IO
-
ICC
supply current
-
IGND
Tstg
Ptot
ground current
-
storage temperature
total power dissipation
65
[1]
[2]
DIP16 package
-
-
mW
mW
SO16, SSOP16 and TSSOP16 packages
[1] For DIP16 package: Ptot derates linearly with 12 mW/K above 70 C.
[2] For SO16: Ptot derates linearly with 8 mW/K above 70 C.
For SSOP16 and TSSOP16 packages: Ptot derates linearly with 5.5 mW/K above 60 C.
9. Recommended operating conditions
Table 5.
Recommended operating conditions
Voltages are referenced to GND (ground = 0 V)
Symbol Parameter Conditions
74HC4094
74HCT4094
Unit
Min
Typ
Max
6.0
Min
Typ
Max
5.5
VCC
VCC
+125
-
VCC
VI
supply voltage
2.0
5.0
4.5
5.0
V
input voltage
0
-
VCC
VCC
+125
625
139
83
0
-
V
VO
output voltage
0
-
0
-
V
Tamb
t/V
ambient temperature
input transition rise and fall rate VCC = 2.0 V
VCC = 4.5 V
40
+25
40
+25
C
-
-
-
-
-
-
-
-
ns/V
ns/V
ns/V
1.67
-
1.67
-
139
-
VCC = 6.0 V
74HC_HCT4094
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2012. All rights reserved.
Product data sheet
Rev. 6 — 31 December 2012
6 of 23
74HC4094; 74HCT4094
NXP Semiconductors
8-stage shift-and-store bus register
10. Static characteristics
Table 6.
Static characteristics
At recommended operating conditions; voltages are referenced to GND (ground = 0 V).
Symbol Parameter
Conditions
25 C
Min Typ
40 C to +85 C 40 C to +125 C Unit
Max
Min
Max
Min
Max
74HC4094
VIH
HIGH-level
input voltage
VCC = 2.0 V
1.5
1.2
2.4
3.2
0.8
-
-
1.5
-
-
1.5
-
-
V
V
V
V
V
V
VCC = 4.5 V
3.15
3.15
3.15
VCC = 6.0 V
4.2
-
4.2
-
4.2
-
VIL
LOW-level
input voltage
VCC = 2.0 V
-
-
-
0.5
-
-
-
0.5
1.35
1.8
-
-
-
0.5
1.35
1.8
VCC = 4.5 V
2.1 1.35
VCC = 6.0 V
2.8
1.8
VOH
HIGH-level
VI = VIH or VIL
output voltage
IO = 20 A; VCC = 2.0 V
IO = 20 A; VCC = 4.5 V
IO = 20 A; VCC = 6.0 V
1.9
4.4
5.9
2.0
4.5
6.0
-
-
-
-
-
1.9
4.4
-
-
-
-
-
1.9
4.4
5.9
3.7
5.2
-
-
-
-
-
V
V
V
V
V
5.9
IO = 4.0 mA; VCC = 4.5 V 3.98 4.32
IO = 5.2 mA; VCC = 6.0 V 5.48 5.81
VI = VIH or VIL
3.84
5.34
VOL
LOW-level
output voltage
IO = 20 A; VCC = 2.0 V
IO = 20 A; VCC = 4.5 V
IO = 20 A; VCC = 6.0 V
IO = 4.0 mA; VCC = 4.5 V
IO = 5.2 mA; VCC = 6.0 V
-
-
-
-
-
-
0
0
0
0.1
0.1
0.1
-
-
-
-
-
-
0.1
0.1
-
-
-
-
-
-
0.1
0.1
0.1
0.4
0.4
1.0
V
V
0.1
V
0.15 0.26
0.16 0.26
0.33
0.33
1.0
V
V
II
input leakage
current
VI = VCC or GND;
VCC = 6.0 V
-
0.1
A
IOZ
OFF-state
output current VO = VCC or GND;
VCC = 6.0 V
VI = VIH or VIL;
-
-
0.5
-
-
5.0
-
-
10.0 A
ICC
CI
supply current VI = VCC or GND; IO = 0 A;
VCC = 6.0 V
-
-
-
8.0
-
80
160
A
input
3.5
pF
capacitance
74HCT4094
VIH
HIGH-level
input voltage
VCC = 4.5 V to 5.5 V
VCC = 4.5 V to 5.5 V
2.0
-
1.6
1.2
-
2.0
-
-
2.0
-
-
V
V
VIL
LOW-level
0.8
0.8
0.8
input voltage
VOH
HIGH-level
output voltage
VI = VIH or VIL; VCC = 4.5 V
IO = 20 A
4.4
4.5
-
-
4.4
-
-
4.4
3.7
-
-
V
V
IO = 4.0 mA
3.98 4.32
3.84
VOL
LOW-level
output voltage
VI = VIH or VIL; VCC = 4.5 V
IO = 20 A
-
-
0
0.1
-
-
0.1
-
-
0.1
0.4
V
V
IO = 4.0 mA
0.15 0.26
0.33
74HC_HCT4094
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2012. All rights reserved.
Product data sheet
Rev. 6 — 31 December 2012
7 of 23
74HC4094; 74HCT4094
NXP Semiconductors
8-stage shift-and-store bus register
Table 6.
Static characteristics …continued
At recommended operating conditions; voltages are referenced to GND (ground = 0 V).
Symbol Parameter
Conditions
25 C
Min Typ
40 C to +85 C 40 C to +125 C Unit
Max
Min
Max
Min
Max
II
input leakage
current
VI = VCC or GND;
VCC = 5.5 V
-
-
0.1
-
1.0
-
1.0
A
A
IOZ
OFF-state
VI = VIH or VIL; VCC = 5.5 V;
-
-
0.5
-
-
5.0
-
-
10
output current VO = VCC or GND per input
pin; other inputs at VCC or
GND; IO = 0 A
ICC
supply current VI = VCC or GND; IO = 0 A;
-
-
8.0
80
160
A
VCC = 5.5 V
ICC
additional
VI = VCC 2.1 V;
supply current other inputs at VCC or GND;
VCC = 4.5 V to 5.5 V;
IO = 0 A
per input pin; STR input
per input pin; OE input
per input pin; CP input
per input pin; D input
-
-
-
-
-
100
150
150
40
360
540
540
144
-
-
-
-
-
450
675
675
180
-
-
-
-
490
735
735
196
A
A
A
A
pF
CI
input
3.5
capacitance
74HC_HCT4094
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2012. All rights reserved.
Product data sheet
Rev. 6 — 31 December 2012
8 of 23
74HC4094; 74HCT4094
NXP Semiconductors
8-stage shift-and-store bus register
11. Dynamic characteristics
Table 7.
Dynamic characteristics
Voltages are referenced to GND (ground = 0 V); CL = 50 pF unless otherwise specified; for test circuit see Figure 12.
Symbol Parameter Conditions
74HC4094
25 C
40 C to +85 C 40 C to +125 C Unit
Min
Typ Max Min
Max
Min
Max
[1]
[1]
[1]
[1]
tpd
propagation CP to QS1; see Figure 8
delay
VCC = 2.0 V
-
-
-
-
50
18
15
14
150
30
-
-
-
-
-
190
38
-
-
-
-
-
225
45
-
ns
ns
ns
ns
VCC = 4.5 V
VCC = 5 V; CL = 15 pF
VCC = 6.0 V
26
33
38
CP to QS2; see Figure 8
VCC = 2.0 V
-
-
-
-
44
16
13
13
135
27
-
-
-
-
-
170
34
-
-
-
-
-
205
41
-
ns
ns
ns
ns
VCC = 4.5 V
VCC = 5 V; CL = 15 pF
VCC = 6.0 V
23
29
35
CP to QPn; see Figure 8
VCC = 2.0 V
-
-
-
-
63
23
20
18
195
39
-
-
-
-
-
245
49
-
-
-
-
-
295
59
-
ns
ns
ns
ns
VCC = 4.5 V
VCC = 5 V; CL = 15 pF
VCC = 6.0 V
33
42
50
STR to QPn; see Figure 9
VCC = 2.0 V
-
-
-
-
58
21
18
17
180
36
-
-
-
-
-
225
45
-
-
-
-
-
270
54
-
ns
ns
ns
ns
VCC = 4.5 V
VCC = 5 V; CL = 15 pF
VCC = 6.0 V
31
38
46
[2]
[3]
[4]
ten
tdis
tt
enable time OE to QPn; see Figure 11
VCC = 2.0 V
-
-
-
55
20
16
175
35
-
-
-
220
44
-
-
-
265
53
ns
ns
ns
VCC = 4.5 V
VCC = 6.0 V
30
37
45
disable time OE to QPn; see Figure 11
VCC = 2.0 V
-
-
-
41
15
12
125
25
-
-
-
155
31
-
-
-
190
38
ns
ns
ns
VCC = 4.5 V
VCC = 6.0 V
21
26
32
transition
time
QPn and QSn; see
Figure 8
VCC = 2.0 V
VCC = 4.5 V
VCC = 6.0 V
-
-
-
19
7
75
15
13
-
-
-
95
19
16
-
-
-
110
22
ns
ns
ns
6
19
74HC_HCT4094
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2012. All rights reserved.
Product data sheet
Rev. 6 — 31 December 2012
9 of 23
74HC4094; 74HCT4094
NXP Semiconductors
8-stage shift-and-store bus register
Table 7.
Dynamic characteristics …continued
Voltages are referenced to GND (ground = 0 V); CL = 50 pF unless otherwise specified; for test circuit see Figure 12.
Symbol Parameter Conditions 25 C 40 C to +85 C 40 C to +125 C Unit
Typ Max Min
Min
Max
Min
Max
tW
pulse width CP HIGH or LOW;
see Figure 8
VCC = 2.0 V
VCC = 4.5 V
VCC = 6.0 V
80
16
14
14
5
-
-
-
100
20
-
-
-
120
24
-
-
-
ns
ns
ns
4
17
20
STR HIGH; see Figure 9
VCC = 2.0 V
VCC = 4.5 V
80
16
14
14
5
-
-
-
100
20
-
-
-
120
24
-
-
-
ns
ns
ns
VCC = 6.0 V
4
17
20
tsu
set-up time D to CP; see Figure 10
VCC = 2.0 V
50
10
9
14
5
-
-
-
65
13
11
-
-
-
75
15
13
-
-
-
ns
ns
ns
VCC = 4.5 V
VCC = 6.0 V
4
CP to STR; see Figure 9
VCC = 2.0 V
100
20
28
10
8
-
-
-
125
25
-
-
-
150
30
-
-
-
ns
ns
ns
VCC = 4.5 V
VCC = 6.0 V
17
21
26
th
hold time
D to CP; see Figure 10
VCC = 2.0 V
3
3
3
-6
-2
-2
-
-
-
3
3
3
-
-
-
3
3
3
-
-
-
ns
ns
ns
VCC = 4.5 V
VCC = 6.0 V
CP to STR; see Figure 9
VCC = 2.0 V
0
0
0
-14
-5
-
-
-
0
0
0
-
-
-
0
0
0
-
-
-
ns
ns
ns
VCC = 4.5 V
VCC = 6.0 V
-4
fmax
maximum
frequency
CP; see Figure 8
VCC = 2.0 V
6.0
30
-
28
87
-
-
-
-
-
4.8
24
-
-
-
-
-
-
4.0
20
-
-
-
-
-
-
MHz
MHz
MHz
MHz
pF
VCC = 4.5 V
VCC = 5 V; CL = 15 pF
VCC = 6.0 V
95
35
-
103
83
28
-
24
-
[5]
CPD
power
CL = 50 pF; f = 1 MHz;
VI = GND to VCC
dissipation
capacitance
74HC_HCT4094
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2012. All rights reserved.
Product data sheet
Rev. 6 — 31 December 2012
10 of 23
74HC4094; 74HCT4094
NXP Semiconductors
8-stage shift-and-store bus register
Table 7.
Dynamic characteristics …continued
Voltages are referenced to GND (ground = 0 V); CL = 50 pF unless otherwise specified; for test circuit see Figure 12.
Symbol Parameter Conditions
25 C
40 C to +85 C 40 C to +125 C Unit
Min
Typ Max Min
Max
Min
Max
74HCT4094
[1]
[1]
[1]
[1]
tpd
propagation CP to QS1; see Figure 8
delay
VCC = 4.5 V
-
-
23
19
39
-
-
-
49
-
-
-
59
-
ns
ns
VCC = 5 V; CL = 15 pF
CP to QS2; see Figure 8
VCC = 4.5 V
-
-
21
18
36
-
-
-
45
-
-
-
54
-
ns
ns
VCC = 5 V; CL = 15 pF
CP to QPn; see Figure 8
VCC = 4.5 V
-
-
25
21
43
-
-
-
54
-
-
-
65
-
ns
ns
VCC = 5 V; CL = 15 pF
STR to QPn; see Figure 9
VCC = 4.5 V
-
-
22
19
39
-
-
-
49
-
-
-
59
-
ns
ns
VCC = 5 V; CL = 15 pF
[2]
[3]
[4]
ten
tdis
tt
enable time OE to QPn; see Figure 11
VCC = 4.5 V
-
-
20
21
35
35
-
-
44
44
-
-
53
53
ns
ns
disable time OE to QPn; see Figure 11
VCC = 4.5 V
transition
time
QPn and QSn; see
Figure 8
VCC = 4.5 V
-
7
15
-
19
-
22
ns
tW
pulse width CP HIGH or LOW;
see Figure 8
VCC = 4.5 V
16
16
10
20
4
7
5
-
-
-
-
-
-
20
20
13
25
4
-
-
-
-
-
-
24
24
15
30
4
-
-
-
-
-
-
ns
ns
ns
ns
ns
ns
STR HIGH; see Figure 9
VCC = 4.5 V
set-up time Dn to CP; see Figure 10
VCC = 4.5 V
tsu
4
CP to STR; see Figure 9
VCC = 4.5 V
9
th
hold time
Dn to CP; see Figure 10
VCC = 4.5 V
0
CP to STR; see Figure 9
VCC = 4.5 V
0
4
0
0
fmax
maximum
frequency
CP; see Figure 8
VCC = 4.5 V
30
-
80
86
92
-
-
-
24
-
-
-
-
20
-
-
-
-
MHz
MHz
pF
VCC = 5 V; CL = 15 pF
[5]
CPD
power
CL = 50 pF; f = 1 MHz;
VI = GND to VCC
-
-
-
dissipation
capacitance
[1] tpd is the same as tPLH and tPHL
.
74HC_HCT4094
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Product data sheet
Rev. 6 — 31 December 2012
11 of 23
74HC4094; 74HCT4094
NXP Semiconductors
8-stage shift-and-store bus register
[2] ten is the same as tPZH and tPZL
.
[3]
tdis is the same as tPLZ and tPHZ.
[4] tt is the same as tTHL and tTLH
.
[5] CPD is used to determine the dynamic power dissipation (PD in W).
PD = CPD VCC2 fi N + (CL VCC2 fo) where:
fi = input frequency in MHz;
fo = output frequency in MHz;
CL = output load capacitance in pF;
VCC = supply voltage in V;
N = number of inputs switching;
(CL VCC2 fo) = sum of outputs.
12. Waveforms
1/f
max
V
I
CP input
QPn, QS1 output
QS2 output
V
M
GND
t
W
t
t
PHL
PLH
V
OH
90 %
10 %
V
M
V
OL
t
t
THL
TLH
t
t
PHL
PLH
V
OH
V
M
V
OL
aaa-003132
Measurement points are given in Table 8.
VOL and VOH are typical voltage output levels that occur with the output load.
Fig 8. Propagation delay input (CP) to output (QPn, QS1, QS2), output transition time, clock input (CP) pulse
width and the maximum frequency (CP)
74HC_HCT4094
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Product data sheet
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74HC4094; 74HCT4094
NXP Semiconductors
8-stage shift-and-store bus register
V
I
CP input
STR input
QPn output
V
M
GND
t
t
h
su
V
I
V
M
GND
t
W
t
t
PHL
PLH
V
OH
V
M
V
OL
001aaf114
Measurement points are given in Table 8.
OL and VOH are typical voltage output levels that occur with the output load.
V
Fig 9. Propagation delay strobe input (STR) to output (QPn), strobe input (STR) pulse width and the clock
set-up and hold times for strobe input
V
I
V
CP input
M
GND
t
t
su
su
t
t
h
h
V
I
V
D input
M
GND
V
OH
V
QPn, QS1, QS2 output
M
V
OL
001aaf115
Measurement points are given in Table 8.
VOL and VOH are typical voltage output levels that occur with the output load.
Fig 10. The data input (D) to clock input (CP) set-up times and clock input (CP) to data input (D) hold times
74HC_HCT4094
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Product data sheet
Rev. 6 — 31 December 2012
13 of 23
74HC4094; 74HCT4094
NXP Semiconductors
8-stage shift-and-store bus register
V
I
V
M
OE input
GND
t
PZL
t
PLZ
V
CC
output
V
LOW-to-OFF
OFF-to-LOW
M
V
X
V
OL
t
t
PHZ
PZH
V
OH
V
Y
output
HIGH-to-OFF
OFF-to-HIGH
V
M
GND
outputs
enabled
outputs
disabled
outputs
enabled
001aaf116
Measurement points are given in Table 8.
VOL and VOH are typical voltage output levels that occur with the output load.
Fig 11. Enable and disable times
Table 8.
Type
Measurement points
Input
VM
Output
VM
VX
VY
74HC4094
0.5VCC
1.3 V
0.5VCC
1.3 V
0.1VOH
0.1VOH
0.9VOH
0.9VOH
74HCT4094
74HC_HCT4094
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Product data sheet
Rev. 6 — 31 December 2012
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74HC4094; 74HCT4094
NXP Semiconductors
8-stage shift-and-store bus register
t
W
V
I
90 %
negative
pulse
V
V
V
M
M
10 %
0 V
t
t
r
f
t
t
f
r
V
I
90 %
positive
pulse
V
M
M
10 %
0 V
t
W
V
CC
V
CC
V
V
O
I
R
L
S1
G
open
DUT
R
T
C
L
001aad983
Test data is given in Table 9.
Definitions test circuit:
RT = Termination resistance should be equal to output impedance Zo of the pulse generator.
CL = Load capacitance including jig and probe capacitance.
RL = Load resistance.
S1 = Test selection switch.
Fig 12. Test circuit for measuring switching times
Table 9.
Type
Test data
Input
Load
S1 position
tPHL, tPLH
open
VI
tr, tf
6 ns
6 ns
CL
RL
tPZH, tPHZ
GND
tPZL, tPLZ
VCC
74HC4094
VCC
3 V
15 pF, 50 pF
15 pF, 50 pF
1 k
1 k
74HCT4094
open
GND
VCC
74HC_HCT4094
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Product data sheet
Rev. 6 — 31 December 2012
15 of 23
74HC4094; 74HCT4094
NXP Semiconductors
8-stage shift-and-store bus register
13. Package outline
DIP16: plastic dual in-line package; 16 leads (300 mil)
SOT38-4
D
M
E
A
2
A
A
1
L
c
e
w M
Z
b
1
(e )
1
b
b
2
16
9
M
H
pin 1 index
E
1
8
0
5
10 mm
scale
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
(1)
A
A
A
2
(1)
(1)
Z
1
w
UNIT
mm
b
b
b
c
D
E
e
e
L
M
M
H
1
2
1
E
max.
min.
max.
max.
1.73
1.30
0.53
0.38
1.25
0.85
0.36
0.23
19.50
18.55
6.48
6.20
3.60
3.05
8.25
7.80
10.0
8.3
4.2
0.51
3.2
2.54
0.1
7.62
0.3
0.254
0.01
0.76
0.068 0.021 0.049 0.014
0.051 0.015 0.033 0.009
0.77
0.73
0.26
0.24
0.14
0.12
0.32
0.31
0.39
0.33
inches
0.17
0.02
0.13
0.03
Note
1. Plastic or metal protrusions of 0.25 mm (0.01 inch) maximum per side are not included.
REFERENCES
OUTLINE
EUROPEAN
PROJECTION
ISSUE DATE
VERSION
IEC
JEDEC
JEITA
95-01-14
03-02-13
SOT38-4
Fig 13. Package outline SOT38-4 (DIP16)
74HC_HCT4094
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Product data sheet
Rev. 6 — 31 December 2012
16 of 23
74HC4094; 74HCT4094
NXP Semiconductors
8-stage shift-and-store bus register
SO16: plastic small outline package; 16 leads; body width 3.9 mm
SOT109-1
D
E
A
X
v
c
y
H
M
A
E
Z
16
9
Q
A
2
A
(A )
3
A
1
pin 1 index
θ
L
p
L
1
8
e
w
M
detail X
b
p
0
2.5
scale
5 mm
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
A
(1)
(1)
(1)
UNIT
A
A
A
b
c
D
E
e
H
L
L
p
Q
v
w
y
Z
θ
1
2
3
p
E
max.
0.25
0.10
1.45
1.25
0.49
0.36
0.25
0.19
10.0
9.8
4.0
3.8
6.2
5.8
1.0
0.4
0.7
0.6
0.7
0.3
mm
1.27
0.05
1.05
0.041
1.75
0.25
0.01
0.25
0.01
0.25
0.1
8o
0o
0.010 0.057
0.004 0.049
0.019 0.0100 0.39
0.014 0.0075 0.38
0.16
0.15
0.244
0.228
0.039 0.028
0.016 0.020
0.028
0.012
inches
0.069
0.01 0.004
Note
1. Plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included.
REFERENCES
OUTLINE
EUROPEAN
PROJECTION
ISSUE DATE
VERSION
IEC
JEDEC
JEITA
99-12-27
03-02-19
SOT109-1
076E07
MS-012
Fig 14. Package outline SOT109-1 (SO16)
74HC_HCT4094
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Product data sheet
Rev. 6 — 31 December 2012
17 of 23
74HC4094; 74HCT4094
NXP Semiconductors
8-stage shift-and-store bus register
SSOP16: plastic shrink small outline package; 16 leads; body width 5.3 mm
SOT338-1
D
E
A
X
c
y
H
v
M
A
E
Z
9
16
Q
A
2
A
(A )
3
A
1
pin 1 index
θ
L
p
L
8
1
detail X
w
M
b
p
e
0
2.5
5 mm
scale
DIMENSIONS (mm are the original dimensions)
A
(1)
(1)
(1)
UNIT
A
A
A
b
c
D
E
e
H
L
L
Q
v
w
y
Z
θ
p
p
1
2
3
E
max.
8o
0o
0.21
0.05
1.80
1.65
0.38
0.25
0.20
0.09
6.4
6.0
5.4
5.2
7.9
7.6
1.03
0.63
0.9
0.7
1.00
0.55
mm
2
0.25
0.65
1.25
0.2
0.13
0.1
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
REFERENCES
OUTLINE
EUROPEAN
PROJECTION
ISSUE DATE
VERSION
IEC
JEDEC
JEITA
99-12-27
03-02-19
SOT338-1
MO-150
Fig 15. Package outline SOT338-1 (SSOP16)
74HC_HCT4094
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Product data sheet
Rev. 6 — 31 December 2012
18 of 23
74HC4094; 74HCT4094
NXP Semiconductors
8-stage shift-and-store bus register
TSSOP16: plastic thin shrink small outline package; 16 leads; body width 4.4 mm
SOT403-1
D
E
A
X
c
y
H
v
M
A
E
Z
9
16
Q
(A )
3
A
2
A
A
1
pin 1 index
θ
L
p
L
1
8
detail X
w
M
b
p
e
0
2.5
5 mm
scale
DIMENSIONS (mm are the original dimensions)
A
(1)
(2)
(1)
UNIT
A
A
A
b
c
D
E
e
H
L
L
Q
v
w
y
Z
θ
1
2
3
p
E
p
max.
8o
0o
0.15
0.05
0.95
0.80
0.30
0.19
0.2
0.1
5.1
4.9
4.5
4.3
6.6
6.2
0.75
0.50
0.4
0.3
0.40
0.06
mm
1.1
0.65
0.25
1
0.2
0.13
0.1
Notes
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
2. Plastic interlead protrusions of 0.25 mm maximum per side are not included.
REFERENCES
OUTLINE
EUROPEAN
PROJECTION
ISSUE DATE
VERSION
IEC
JEDEC
JEITA
99-12-27
03-02-18
SOT403-1
MO-153
Fig 16. Package outline SOT403-1 (TSSOP16)
74HC_HCT4094
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Product data sheet
Rev. 6 — 31 December 2012
19 of 23
74HC4094; 74HCT4094
NXP Semiconductors
8-stage shift-and-store bus register
14. Abbreviations
Table 10. Abbreviations
Acronym
CMOS
ESD
Description
Complementary Metal Oxide Semiconductor
ElectroStatic Discharge
Human Body Model
HBM
MM
Machine Model
15. Revision history
Table 11. Revision history
Document ID
Release date Data sheet status
20121231 Product data sheet
• General description updated.
20120628 Product data sheet
Change notice
Supersedes
74HC_HCT4094 v.6
Modifications:
-
74HC_HCT4094 v.5
74HC_HCT4094 v.5
Modifications:
-
74HC_HCT4094 v.4
74HC_HCT4094 v.3
• VX and VY measurement points added to Table 8.
74HC_HCT4094 v.4
Modifications:
20111219
• Legal pages updated.
20110214 Product data sheet
Product specification
Product data sheet
-
74HC_HCT4094 v.3
-
-
74HC_HCT4094_CNV v.2
-
74HC_HCT4094_CNV v.2 19970901
74HC_HCT4094
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Product data sheet
Rev. 6 — 31 December 2012
20 of 23
74HC4094; 74HCT4094
NXP Semiconductors
8-stage shift-and-store bus register
16. Legal information
16.1 Data sheet status
Document status[1][2]
Product status[3]
Development
Definition
Objective [short] data sheet
This document contains data from the objective specification for product development.
This document contains data from the preliminary specification.
This document contains the product specification.
Preliminary [short] data sheet Qualification
Product [short] data sheet Production
[1]
[2]
[3]
Please consult the most recently issued document before initiating or completing a design.
The term ‘short data sheet’ is explained in section “Definitions”.
The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status
information is available on the Internet at URL http://www.nxp.com.
Suitability for use — NXP Semiconductors products are not designed,
16.2 Definitions
authorized or warranted to be suitable for use in life support, life-critical or
safety-critical systems or equipment, nor in applications where failure or
malfunction of an NXP Semiconductors product can reasonably be expected
to result in personal injury, death or severe property or environmental
damage. NXP Semiconductors and its suppliers accept no liability for
inclusion and/or use of NXP Semiconductors products in such equipment or
applications and therefore such inclusion and/or use is at the customer’s own
risk.
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences of
use of such information.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is intended
for quick reference only and should not be relied upon to contain detailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local NXP Semiconductors sales
office. In case of any inconsistency or conflict with the short data sheet, the
full data sheet shall prevail.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
Customers are responsible for the design and operation of their applications
and products using NXP Semiconductors products, and NXP Semiconductors
accepts no liability for any assistance with applications or customer product
design. It is customer’s sole responsibility to determine whether the NXP
Semiconductors product is suitable and fit for the customer’s applications and
products planned, as well as for the planned application and use of
customer’s third party customer(s). Customers should provide appropriate
design and operating safeguards to minimize the risks associated with their
applications and products.
Product specification — The information and data provided in a Product
data sheet shall define the specification of the product as agreed between
NXP Semiconductors and its customer, unless NXP Semiconductors and
customer have explicitly agreed otherwise in writing. In no event however,
shall an agreement be valid in which the NXP Semiconductors product is
deemed to offer functions and qualities beyond those described in the
Product data sheet.
NXP Semiconductors does not accept any liability related to any default,
damage, costs or problem which is based on any weakness or default in the
customer’s applications or products, or the application or use by customer’s
third party customer(s). Customer is responsible for doing all necessary
testing for the customer’s applications and products using NXP
Semiconductors products in order to avoid a default of the applications and
the products or of the application or use by customer’s third party
customer(s). NXP does not accept any liability in this respect.
16.3 Disclaimers
Limited warranty and liability — Information in this document is believed to
be accurate and reliable. However, NXP Semiconductors does not give any
representations or warranties, expressed or implied, as to the accuracy or
completeness of such information and shall have no liability for the
consequences of use of such information. NXP Semiconductors takes no
responsibility for the content in this document if provided by an information
source outside of NXP Semiconductors.
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) will cause permanent
damage to the device. Limiting values are stress ratings only and (proper)
operation of the device at these or any other conditions above those given in
the Recommended operating conditions section (if present) or the
Characteristics sections of this document is not warranted. Constant or
repeated exposure to limiting values will permanently and irreversibly affect
the quality and reliability of the device.
In no event shall NXP Semiconductors be liable for any indirect, incidental,
punitive, special or consequential damages (including - without limitation - lost
profits, lost savings, business interruption, costs related to the removal or
replacement of any products or rework charges) whether or not such
damages are based on tort (including negligence), warranty, breach of
contract or any other legal theory.
Terms and conditions of commercial sale — NXP Semiconductors
products are sold subject to the general terms and conditions of commercial
sale, as published at http://www.nxp.com/profile/terms, unless otherwise
agreed in a valid written individual agreement. In case an individual
agreement is concluded only the terms and conditions of the respective
agreement shall apply. NXP Semiconductors hereby expressly objects to
applying the customer’s general terms and conditions with regard to the
purchase of NXP Semiconductors products by customer.
Notwithstanding any damages that customer might incur for any reason
whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards
customer for the products described herein shall be limited in accordance
with the Terms and conditions of commercial sale of NXP Semiconductors.
Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
No offer to sell or license — Nothing in this document may be interpreted or
construed as an offer to sell products that is open for acceptance or the grant,
conveyance or implication of any license under any copyrights, patents or
other industrial or intellectual property rights.
74HC_HCT4094
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Product data sheet
Rev. 6 — 31 December 2012
21 of 23
74HC4094; 74HCT4094
NXP Semiconductors
8-stage shift-and-store bus register
Export control — This document as well as the item(s) described herein
may be subject to export control regulations. Export might require a prior
authorization from competent authorities.
NXP Semiconductors’ specifications such use shall be solely at customer’s
own risk, and (c) customer fully indemnifies NXP Semiconductors for any
liability, damages or failed product claims resulting from customer design and
use of the product for automotive applications beyond NXP Semiconductors’
standard warranty and NXP Semiconductors’ product specifications.
Non-automotive qualified products — Unless this data sheet expressly
states that this specific NXP Semiconductors product is automotive qualified,
the product is not suitable for automotive use. It is neither qualified nor tested
in accordance with automotive testing or application requirements. NXP
Semiconductors accepts no liability for inclusion and/or use of
Translations — A non-English (translated) version of a document is for
reference only. The English version shall prevail in case of any discrepancy
between the translated and English versions.
non-automotive qualified products in automotive equipment or applications.
In the event that customer uses the product for design-in and use in
automotive applications to automotive specifications and standards, customer
(a) shall use the product without NXP Semiconductors’ warranty of the
product for such automotive applications, use and specifications, and (b)
whenever customer uses the product for automotive applications beyond
16.4 Trademarks
Notice: All referenced brands, product names, service names and trademarks
are the property of their respective owners.
17. Contact information
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
74HC_HCT4094
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Product data sheet
Rev. 6 — 31 December 2012
22 of 23
74HC4094; 74HCT4094
NXP Semiconductors
8-stage shift-and-store bus register
18. Contents
1
2
3
4
5
General description. . . . . . . . . . . . . . . . . . . . . . 1
Features and benefits . . . . . . . . . . . . . . . . . . . . 1
Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Ordering information. . . . . . . . . . . . . . . . . . . . . 2
Functional diagram . . . . . . . . . . . . . . . . . . . . . . 2
6
6.1
6.2
Pinning information. . . . . . . . . . . . . . . . . . . . . . 4
Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 4
7
Functional description . . . . . . . . . . . . . . . . . . . 5
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 6
Recommended operating conditions. . . . . . . . 6
Static characteristics. . . . . . . . . . . . . . . . . . . . . 7
Dynamic characteristics . . . . . . . . . . . . . . . . . . 9
Waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Package outline . . . . . . . . . . . . . . . . . . . . . . . . 16
Abbreviations. . . . . . . . . . . . . . . . . . . . . . . . . . 20
Revision history. . . . . . . . . . . . . . . . . . . . . . . . 20
8
9
10
11
12
13
14
15
16
Legal information. . . . . . . . . . . . . . . . . . . . . . . 21
Data sheet status . . . . . . . . . . . . . . . . . . . . . . 21
Definitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
Disclaimers. . . . . . . . . . . . . . . . . . . . . . . . . . . 21
Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 22
16.1
16.2
16.3
16.4
17
18
Contact information. . . . . . . . . . . . . . . . . . . . . 22
Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
© NXP B.V. 2012.
All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
Date of release: 31 December 2012
Document identifier: 74HC_HCT4094
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