BTA225B-800C [NXP]
Three quadrant triacs high commutation; 三象限三端双向可控硅整流高型号: | BTA225B-800C |
厂家: | NXP |
描述: | Three quadrant triacs high commutation |
文件: | 总4页 (文件大小:26K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
Philips Semiconductors
Preliminary specification
Three quadrant triacs
high commutation
BTA225B series C
GENERAL DESCRIPTION
QUICK REFERENCE DATA
Glass passivated high commutation
triacsin aplastic envelopesuitable for
surface mounting, intended for use in
circuitswherehigh staticanddynamic
dV/dt and high dI/dt can occur. These
devices will commutate the full rated
rms current at the maximum rated
junction temperature, without the aid
of a snubber.
SYMBOL PARAMETER
MAX. MAX. MAX. UNIT
BTA225B- 500C 600C 800C
VDRM
Repetitive peak off-state
voltages
500
600
800
V
IT(RMS)
ITSM
RMS on-state current
Non-repetitive peak on-state
current
25
180
25
180
25
180
A
A
PINNING - SOT404
PIN CONFIGURATION
SYMBOL
PIN
1
DESCRIPTION
main terminal 1
mb
T2
T1
2
main terminal 2
gate
3
2
mb main terminal 2
1
3
G
LIMITING VALUES
Limiting values in accordance with the Absolute Maximum System (IEC 134).
SYMBOL PARAMETER
CONDITIONS
MIN.
MAX.
UNIT
V
-500
-600
-800
800
VDRM
Repetitive peak off-state
voltages
-
-
5001
6001
IT(RMS)
ITSM
RMS on-state current
full sine wave;
25
A
T
mb ≤ 91 ˚C
Non-repetitive peak
on-state current
full sine wave;
Tj = 25 ˚C prior to surge
t = 20 ms
t = 16.7 ms
t = 10 ms
-
-
-
190
209
180
100
A
A
I2t
I2t for fusing
A2s
A/µs
dIT/dt
Repetitive rate of rise of ITM = 30 A; IG = 0.2 A;
on-state current after
triggering
dIG/dt = 0.2 A/µs
IGM
Peak gate current
Peak gate voltage
Peak gate power
Average gate power
Storage temperature
Operating junction
temperature
-
2
5
5
0.5
150
125
A
V
W
W
˚C
˚C
VGM
PGM
PG(AV)
Tstg
Tj
-
-
-
over any 20 ms period
-40
-
1 Although not recommended, off-state voltages up to 800V may be applied without damage, but the triac may
switch to the on-state. The rate of rise of current should not exceed 15 A/µs.
October 1997
1
Rev 1.000
Philips Semiconductors
Preliminary specification
Three quadrant triacs
high commutation
BTA225B series C
THERMAL RESISTANCES
SYMBOL PARAMETER
CONDITIONS
MIN. TYP. MAX. UNIT
Rth j-mb
Thermal resistance
full cycle
-
-
-
-
-
55
1.0
1.4
-
K/W
K/W
K/W
junction to mounting base half cycle
Rth j-a
Thermal resistance
junction to ambient
minimum footprint, FR4 board
STATIC CHARACTERISTICS
Tj = 25 ˚C unless otherwise stated
SYMBOL PARAMETER
CONDITIONS
MIN. TYP. MAX. UNIT
IGT
Gate trigger current2
VD = 12 V; IT = 0.1 A
T2+ G+
T2+ G-
T2- G-
2
2
2
18
21
34
35
35
35
mA
mA
mA
IL
Latching current
VD = 12 V; IGT = 0.1 A
T2+ G+
T2+ G-
T2- G-
-
-
-
20
30
mA
mA
mA
mA
V
-
-
-
20
IH
VT
VGT
Holding current
On-state voltage
Gate trigger voltage
VD = 12 V; IGT = 0.1 A
IT = 30 A
-
-
15
-
1.2
0.7
0.4
0.1
1.55
1.5
-
VD = 12 V; IT = 0.1 A
-
0.25
-
V
VD = 400 V; IT = 0.1 A; Tj = 125 ˚C
V
ID
Off-state leakage current VD = VDRM(max); Tj = 125 ˚C
0.5
mA
DYNAMIC CHARACTERISTICS
Tj = 25 ˚C unless otherwise stated
SYMBOL PARAMETER
CONDITIONS
MIN.
TYP.
UNIT
dVD/dt
dIcom/dt
tgt
Critical rate of rise of
off-state voltage
Critical rate of change of
commutating current
Gate controlled turn-on
time
VDM = 67% VDRM(max); Tj = 125 ˚C; exponential
waveform; gate open circuit
1000
-
V/µs
VDM = 400 V; Tj = 125 ˚C; IT(RMS) = 25 A; without
snubber; gate open circuit
3
-
14
2
A/ms
ITM = 30 A; VD = VDRM(max); IG = 0.1 A;
dIG/dt = 5 A/µs
µs
2 Device does not trigger in the T2-, G+ quadrant.
October 1997
2
Rev 1.000
Philips Semiconductors
Preliminary specification
Three quadrant triacs
high commutation
BTA225B series C
MECHANICAL DATA
Dimensions in mm
Net Mass: 1.4 g
4.5 max
1.4 max
10.3 max
11 max
15.4
2.5
0.85 max
(x2)
0.5
2.54 (x2)
Fig.1. SOT404 : centre pin connected to mounting base.
Notes
1. Epoxy meets UL94 V0 at 1/8".
MOUNTING INSTRUCTIONS
Dimensions in mm
11.5
9.0
17.5
2.0
3.8
5.08
Fig.2. SOT404 : minimum pad sizes for surface mounting.
Notes
1. Plastic meets UL94 V0 at 1/8".
October 1997
3
Rev 1.000
Philips Semiconductors
Preliminary specification
Three quadrant triacs
high commutation
BTA225B series C
DEFINITIONS
Data sheet status
Objective specification
This data sheet contains target or goal specifications for product development.
Preliminary specification This data sheet contains preliminary data; supplementary data may be published later.
Product specification
This data sheet contains final product specifications.
Limiting values
Limiting values are given in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one
or more of the limiting values may cause permanent damage to the device. These are stress ratings only and
operation of the device at these or at any other conditions above those given in the Characteristics sections of
this specification is not implied. Exposure to limiting values for extended periods may affect device reliability.
Application information
Where application information is given, it is advisory and does not form part of the specification.
Philips Electronics N.V. 1997
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the
copyright owner.
The information presented in this document does not form part of any quotation or contract, it is believed to be
accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any
consequence of its use. Publication thereof does not convey nor imply any license under patent or other
industrial or intellectual property rights.
LIFE SUPPORT APPLICATIONS
These products are not designed for use in life support appliances, devices or systems where malfunction of these
products can be reasonably expected to result in personal injury. Philips customers using or selling these products
for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting
from such improper use or sale.
October 1997
4
Rev 1.000
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