NUP1301U,115 [NXP]

NUP1301U - Ultra low capacitance ESD protection array SC-70 3-Pin;


型号：	NUP1301U,115
厂家：	NXP
描述：	NUP1301U - Ultra low capacitance ESD protection array SC-70 3-Pin 局域网光电二极管
文件：	总14页 (文件大小：144K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

NUP1301U

T323

Ultra low capacitance ESD protection array

Rev. 1 — 28 January 2011

Product data sheet

1. Product profile

1.1 General description

Ultra low capacitance ElectroStatic Discharge (ESD) protection array in a small

SOT323 (SC-70) Surface-Mounted Device (SMD) plastic package designed to

protect one signal line in rail-to-rail configuration from the damage caused by

ESD and other transients.

1.2 Features and benefits

 ESD protection of one signal line (rail-to-rail configuration)

 Ultra low diode capacitance: C_d= 0.6 pF

 ESD protection up to 30 kV

 IEC 61000-4-2; level 4 (ESD)

 IEC 61000-4-5 (surge); I_PP= 11 A

 AEC-Q101 qualified

1.3 Applications

 Telecommunication networks

 Video line protection

 Microcontroller protection

 I²C-bus protection

 Antenna power supply

 Analog audio

 Class-D amplifier

1.4 Quick reference data

Table 1.

Quick reference data

T_amb= 25 C unless otherwise specified.

Symbol

Per diode

V_RRM

Parameter

Conditions

Min

Typ

Max

Unit

repetitive peak reverse

voltage

C_d

I_R

diode capacitance

f = 1 MHz;

V_R= 0 V

0.6

0.75

100

reverse current

V_R= 80 V

NUP1301U

NXP Semiconductors

Ultra low capacitance ESD protection array

2. Pinning information

Table 2.

Pinning

Symbol Description

Simplified outline

Graphic symbol

GND

V_CC

I/O

ground

supply voltage

input/output

006aaa763

3. Ordering information

Table 3.

Ordering information

Type number

Package

Name

Description

Version

NUP1301U

plastic surface-mounted package; 3 leads

SOT323

4. Marking

Table 4.

Marking

Type number

NUP1301U

Marking code^[1]

*VU

[1] * = placeholder for manufacturing site code

5. Limiting values

Table 5.

Limiting values

In accordance with the Absolute Maximum Rating System (IEC 60134).

Symbol

Per diode

V_RRM

Parameter

Conditions

Min

Max

Unit

repetitive peak

reverse voltage

V_R

I_F

reverse voltage

forward current

[1]

[2]

215

500

I_FRM

repetitive peak

forward current

t_p 1 ms;   0.25

I_FSM

non-repetitive peak

forward current

square wave

t_p= 1 s

t_p= 1 ms

t_p= 1 s

0.5

NUP1301U

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Product data sheet

Rev. 1 — 28 January 2011

2 of 14

NUP1301U

NXP Semiconductors

Ultra low capacitance ESD protection array

Table 5.

Limiting values …continued

In accordance with the Absolute Maximum Rating System (IEC 60134).

Symbol

Per device

P_PP

Parameter

Conditions

Min

Max

Unit

[3][4]

[5][6]

peak pulse power

t_p= 8/20 s

T_amb 25 C

220

I_PP

peak pulse current

total power dissipation

junction temperature

ambient temperature

storage temperature

P_tot

200

150

+150

C

T_j

T_amb

T_stg

55

65

[1] Pulse test: t_p 300 s;   0.02.

[2] T_j= 25 C prior to surge.

[3] Non-repetitive current pulse 8/20 s exponential decay waveform according to IEC 61000-4-5.

[4] Measured from pin 3 to pins 1 and 2 (pins 1 and 2 are connected).

[5] Single diode loaded.

[6] Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated and standard

footprint.

Table 6.

Symbol Parameter

V_ESDelectrostatic discharge

voltage

ESD maximum ratings

Conditions

Min

Max

Unit

[1][2]

IEC 61000-4-2

(contact discharge)

machine model

400

MIL-STD-883

(human body model)

[1] Device stressed with ten non-repetitive ESD pulses.

[2] Measured from pin 3 to pins 1 and 2 (pins 1 and 2 are connected).

Table 7.

ESD standards compliance

Standard

Conditions

IEC 61000-4-2; level 4 (ESD)

> 15 kV (air); > 8 kV (contact)

> 8 kV

MIL-STD-883; class 3B (human body model)

NUP1301U

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Product data sheet

Rev. 1 — 28 January 2011

3 of 14

NUP1301U

NXP Semiconductors

Ultra low capacitance ESD protection array

001aaa631

100 %

90 %

001aaa630

120

100 % I ; 8 μs

(%)

−t

50 % I ; 20 μs

10 %

t = 0.7 ns to 1 ns

30 ns

60 ns

t (μs)

Fig 1. 8/20 s pulse waveform according to

Fig 2. ESD pulse waveform according to

IEC 61000-4-2

IEC 61000-4-5

6. Thermal characteristics

Table 8.

Thermal characteristics

Symbol Parameter

Per device

Conditions

Min

Typ

Max

Unit

[1][2]

R_th(j-a)

thermal resistance from

junction to ambient

in free air

625

300

K/W

R_th(j-sp)

thermal resistance from

junction to solder point

[1] Single diode loaded.

[2] Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint.

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Product data sheet

Rev. 1 — 28 January 2011

4 of 14

NUP1301U

NXP Semiconductors

Ultra low capacitance ESD protection array

7. Characteristics

Table 9.

Electrical characteristics

T_amb= 25 C unless otherwise specified.

Symbol Parameter

Per diode

Conditions

Min

Typ

Max Unit

V_BR

V_F

breakdown voltage

I_R= 100 A

100

[1]

forward voltage

reverse current

I_F= 1 mA

715

855

I_F= 10 mA

I_F= 50 mA

I_F= 150 mA

V_R= 25 V

V_R= 80 V

1.25

I_R

A

100

V_R= 25 V;

T_j= 150 C

V_R= 80 V;

T_j= 150 C

A

C_d

diode capacitance

clamping voltage

f = 1 MHz; V_R= 0 V

0.6

0.75 pF

Per device

[2][3]

V_CL

I_PP= 1 A

I_PP= 11 A

[1] Pulse test: t_p 300 s;   0.02.

[2] Non-repetitive current pulse 8/20 s exponential decay waveform according to IEC 61000-4-5.

[3] Measured from pin 3 to pins 1 and 2 (pins 1 and 2 are connected).

NUP1301U

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Product data sheet

Rev. 1 — 28 January 2011

5 of 14

NUP1301U

NXP Semiconductors

Ultra low capacitance ESD protection array

mbg704

006aab132

FSM

(A)

(mA)

(1) (2) (3) (4)

−1

0.2

0.4

0.6

0.8

1.0

1.2

1.4

(V)

(μs)

(1) T_amb= 150 C

(2) T_amb= 85 C

(3) T_amb= 25 C

Based on square wave currents.

T_j= 25 C; prior to surge

(4)

T_amb= 40 C

Fig 3. Forward current as a function of forward

voltage; typical values

Fig 4. Non-repetitive peak forward current as a

function of pulse duration; typical values

mbg446

006aab133

0.8

(1)

(2)

(pF

(μA)

)

0.6

−1

0.4

(3)

(4)

−2

−3

−4

−5

0.2

100

(V)

(1) T_amb= 150 C

(2) T_amb= 85 C

(3) T_amb= 25 C

T_amb= 25 C; f = 1 MHz

(4)

T_amb= 40 C

Fig 5. Reverse current as a function of reverse

voltage; typical values

Fig 6. Diode capacitance as a function of reverse

voltage; typical values

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Product data sheet

Rev. 1 — 28 January 2011

6 of 14

NUP1301U

NXP Semiconductors

Ultra low capacitance ESD protection array

ESD TESTER

4 GHz DIGITAL

acc. to IEC 61000-4-2

OSCILLOSCOPE

= 150 pF; R = 330 Ω

RG 223/U

50 Ω coax

450 Ω

10×

ATTENUATOR

50 Ω

DUT

(DEVICE

UNDER

TEST)

vertical scale = 10 V/div

vertical scale = 10 A/div

horizontal scale = 15 ns/div

GND

clamped +8 kV ESD pulse waveform

(IEC 61000-4-2 network), pin 3 to 1 and 2

unclamped +8 kV ESD pulse waveform

(IEC 61000-4-2 network)

vertical scale = 10 V/div

horizontal scale = 15 ns/div

vertical scale = 10 A/div

horizontal scale = 15 ns/div

GND

clamped −8 kV ESD pulse waveform

(IEC 61000-4-2 network), pin 3 to 1 and 2

unclamped −8 kV ESD pulse waveform

(IEC 61000-4-2 network)

006aab567

Fig 7. ESD clamping test setup and waveforms

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Product data sheet

Rev. 1 — 28 January 2011

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Ultra low capacitance ESD protection array

8. Application information

Protection of a single (high-speed) data line in rail-to-rail configuration. The protected data

line is connected to pin 3. Pin 1 is connected to ground (GND) and pin 2 is connected to

the supply rail (supply voltage V_CC). When the transient voltage exceeds the forward

voltage drop of one diode, the transient is directed either to the supply rail or to GND.

The advantages of these solutions are: low line capacitance (0.6 pF typically), fast

response time, and low clamping voltage.

NUP1301U

Audio

interface

NUP1301U

006aac518

Fig 8. Typical application for the protection of one signal line

Circuit board layout and protection device placement:

Circuit board layout is critical for the suppression of ESD, Electrical Fast Transient (EFT)

and surge transients. The following guidelines are recommended:

1. Place the NUP1301U as close to the input terminal or connector as possible.

2. The path length between the NUP1301U and the protected line should be minimized.

3. Keep parallel signal paths to a minimum.

4. Avoid running protected conductors in parallel with unprotected conductors.

5. Minimize all Printed-Circuit Board (PCB) conductive loops including power and

ground loops.

6. Minimize the length of the transient return path to ground.

7. Avoid using shared transient return paths to a common ground point.

8. Ground planes should be used whenever possible. For multilayer PCBs, use ground

vias.

9. Test information

9.1 Quality information

This product has been qualified in accordance with the Automotive Electronics Council

(AEC) standard Q101 - Stress test qualification for discrete semiconductors, and is

suitable for use in automotive applications.

NUP1301U

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Product data sheet

Rev. 1 — 28 January 2011

8 of 14

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Ultra low capacitance ESD protection array

10. Package outline

2.2

1.8

1.1

0.8

0.45

0.15

2.2 1.35

2.0 1.15

0.4

0.3

0.25

0.10

1.3

Dimensions in mm

04-11-04

Fig 9. Package outline SOT323 (SC-70)

11. Packing information

Table 10. Packing methods

The indicated -xxx are the last three digits of the 12NC ordering code.^[1]

Type number

Package Description

Packing quantity

3000

-115

10000

NUP1301U

SOT323

4 mm pitch, 8 mm tape and reel

-135

[1] For further information and the availability of packing methods, see Section 15.

NUP1301U

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Product data sheet

Rev. 1 — 28 January 2011

9 of 14

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Ultra low capacitance ESD protection array

12. Soldering

2.65

1.85

1.325

solder lands

solder resist

0.6

(3×)

solder paste

1.3

2.35

occupied area

0.5

(3×)

Dimensions in mm

0.55

(3×)

sot323_fr

Fig 10. Reflow soldering footprint SOT323 (SC-70)

4.6

2.575

1.425

(3×)

solder lands

solder resist

occupied area

1.8

3.65 2.1

Dimensions in mm

preferred transport

direction during soldering

(2×)

sot323_fw

Fig 11. Wave soldering footprint SOT323 (SC-70)

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Product data sheet

Rev. 1 — 28 January 2011

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Ultra low capacitance ESD protection array

13. Revision history

Table 11. Revision history

Document ID

Release date

20110128

Data sheet status

Change notice

Supersedes

NUP1301U v.1

Product data sheet

NUP1301U

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Product data sheet

Rev. 1 — 28 January 2011

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Ultra low capacitance ESD protection array

14. Legal information

14.1 Data sheet status

Document status^[1][2]

Product status^[3]

Development

Definition

Objective [short] data sheet

This document contains data from the objective specification for product development.

This document contains data from the preliminary specification.

This document contains the product specification.

Preliminary [short] data sheet Qualification

Product [short] data sheet Production

[1]

[2]

[3]

Please consult the most recently issued document before initiating or completing a design.

The term ‘short data sheet’ is explained in section “Definitions”.

The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status

information is available on the Internet at URL http://www.nxp.com.

malfunction of an NXP Semiconductors product can reasonably be expected

14.2 Definitions

to result in personal injury, death or severe property or environmental

damage. NXP Semiconductors accepts no liability for inclusion and/or use of

NXP Semiconductors products in such equipment or applications and

therefore such inclusion and/or use is at the customer’s own risk.

Draft — The document is a draft version only. The content is still under

internal review and subject to formal approval, which may result in

modifications or additions. NXP Semiconductors does not give any

representations or warranties as to the accuracy or completeness of

information included herein and shall have no liability for the consequences of

use of such information.

Applications — Applications that are described herein for any of these

products are for illustrative purposes only. NXP Semiconductors makes no

representation or warranty that such applications will be suitable for the

specified use without further testing or modification.

Short data sheet — A short data sheet is an extract from a full data sheet

with the same product type number(s) and title. A short data sheet is intended

for quick reference only and should not be relied upon to contain detailed and

full information. For detailed and full information see the relevant full data

sheet, which is available on request via the local NXP Semiconductors sales

office. In case of any inconsistency or conflict with the short data sheet, the

full data sheet shall prevail.

Customers are responsible for the design and operation of their applications

and products using NXP Semiconductors products, and NXP Semiconductors

accepts no liability for any assistance with applications or customer product

design. It is customer’s sole responsibility to determine whether the NXP

Semiconductors product is suitable and fit for the customer’s applications and

products planned, as well as for the planned application and use of

customer’s third party customer(s). Customers should provide appropriate

design and operating safeguards to minimize the risks associated with their

applications and products.

Product specification — The information and data provided in a Product

data sheet shall define the specification of the product as agreed between

NXP Semiconductors and its customer, unless NXP Semiconductors and

customer have explicitly agreed otherwise in writing. In no event however,

shall an agreement be valid in which the NXP Semiconductors product is

deemed to offer functions and qualities beyond those described in the

Product data sheet.

NXP Semiconductors does not accept any liability related to any default,

damage, costs or problem which is based on any weakness or default in the

customer’s applications or products, or the application or use by customer’s

third party customer(s). Customer is responsible for doing all necessary

testing for the customer’s applications and products using NXP

Semiconductors products in order to avoid a default of the applications and

the products or of the application or use by customer’s third party

customer(s). NXP does not accept any liability in this respect.

14.3 Disclaimers

Limiting values — Stress above one or more limiting values (as defined in

the Absolute Maximum Ratings System of IEC 60134) will cause permanent

damage to the device. Limiting values are stress ratings only and (proper)

operation of the device at these or any other conditions above those given in

the Recommended operating conditions section (if present) or the

Characteristics sections of this document is not warranted. Constant or

repeated exposure to limiting values will permanently and irreversibly affect

the quality and reliability of the device.

Limited warranty and liability — Information in this document is believed to

be accurate and reliable. However, NXP Semiconductors does not give any

representations or warranties, expressed or implied, as to the accuracy or

completeness of such information and shall have no liability for the

consequences of use of such information.

In no event shall NXP Semiconductors be liable for any indirect, incidental,

punitive, special or consequential damages (including - without limitation - lost

profits, lost savings, business interruption, costs related to the removal or

replacement of any products or rework charges) whether or not such

damages are based on tort (including negligence), warranty, breach of

contract or any other legal theory.

Terms and conditions of commercial sale — NXP Semiconductors

products are sold subject to the general terms and conditions of commercial

sale, as published at http://www.nxp.com/profile/terms, unless otherwise

agreed in a valid written individual agreement. In case an individual

agreement is concluded only the terms and conditions of the respective

agreement shall apply. NXP Semiconductors hereby expressly objects to

applying the customer’s general terms and conditions with regard to the

purchase of NXP Semiconductors products by customer.

Notwithstanding any damages that customer might incur for any reason

whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards

customer for the products described herein shall be limited in accordance

with the Terms and conditions of commercial sale of NXP Semiconductors.

Right to make changes — NXP Semiconductors reserves the right to make

changes to information published in this document, including without

limitation specifications and product descriptions, at any time and without

notice. This document supersedes and replaces all information supplied prior

to the publication hereof.

No offer to sell or license — Nothing in this document may be interpreted or

construed as an offer to sell products that is open for acceptance or the grant,

conveyance or implication of any license under any copyrights, patents or

other industrial or intellectual property rights.

Export control — This document as well as the item(s) described herein

may be subject to export control regulations. Export might require a prior

authorization from national authorities.

Suitability for use — NXP Semiconductors products are not designed,

authorized or warranted to be suitable for use in life support, life-critical or

safety-critical systems or equipment, nor in applications where failure or

NUP1301U

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Product data sheet

Rev. 1 — 28 January 2011

12 of 14

NUP1301U

NXP Semiconductors

Ultra low capacitance ESD protection array

Quick reference data — The Quick reference data is an extract of the

product data given in the Limiting values and Characteristics sections of this

document, and as such is not complete, exhaustive or legally binding.

14.4 Trademarks

Notice: All referenced brands, product names, service names and trademarks

are the property of their respective owners.

15. Contact information

For more information, please visit: http://www.nxp.com

For sales office addresses, please send an email to: salesaddresses@nxp.com

NUP1301U

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Product data sheet

Rev. 1 — 28 January 2011

13 of 14

NUP1301U

NXP Semiconductors

Ultra low capacitance ESD protection array

16. Contents

Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1

1.1

1.2

1.3

1.4

General description . . . . . . . . . . . . . . . . . . . . . 1

Features and benefits. . . . . . . . . . . . . . . . . . . . 1

Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1

Quick reference data . . . . . . . . . . . . . . . . . . . . 1

Pinning information. . . . . . . . . . . . . . . . . . . . . . 2

Ordering information. . . . . . . . . . . . . . . . . . . . . 2

Marking. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2

Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 2

Thermal characteristics . . . . . . . . . . . . . . . . . . 4

Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . 5

Application information. . . . . . . . . . . . . . . . . . . 8

Test information. . . . . . . . . . . . . . . . . . . . . . . . . 8

Quality information . . . . . . . . . . . . . . . . . . . . . . 8

Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 9

Packing information . . . . . . . . . . . . . . . . . . . . . 9

Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10

Revision history. . . . . . . . . . . . . . . . . . . . . . . . 11

9.1

Legal information. . . . . . . . . . . . . . . . . . . . . . . 12

Data sheet status . . . . . . . . . . . . . . . . . . . . . . 12

Definitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . 12

Disclaimers. . . . . . . . . . . . . . . . . . . . . . . . . . . 12

Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 13

14.1

14.2

14.3

14.4

Contact information. . . . . . . . . . . . . . . . . . . . . 13

Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14

Please be aware that important notices concerning this document and the product(s)

described herein, have been included in section ‘Legal information’.

For more information, please visit: http://www.nxp.com

For sales office addresses, please send an email to: salesaddresses@nxp.com

Date of release: 28 January 2011

Document identifier: NUP1301U

NUP1301U,115 [NXP]

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