SL3S1202AC2 [NXP]
512-bit user memory (G2XM only); 512位用户存储器（ G2XM只）
| 型号： | SL3S1202AC2 |
| 厂家： | 
NXP |
| 描述： | 512-bit user memory (G2XM only) |
| 文件： | 总56页 (文件大小：1406K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
SL3ICS1002/1202
UCODE G2XM and G2XL
Rev. 3.6 — 10 March 2011
139036
Product data sheet
COMPANY PUBLIC
1. General description
The UHF EPCglobal Generation 2 standard allows the commercialized provision of mass
adoption of UHF RFID technology for passive smart tags and labels. Main fields of
applications are supply chain management and logistics for worldwide use with special
consideration of European, US and Chinese frequencies to ensure that operating
distances of several meters can be realized.
The G2X is a dedicated chip for passive, intelligent tags and labels supporting the
EPCglobal Class 1 Generation 2 UHF RFID standard. It is especially suited for
applications where operating distances of several meters and high anti-collision rates are
required.
The G2X is a product out of the NXP Semiconductors UCODE product family. The entire
UCODE product family offers anti-collision and collision arbitration functionality. This
allows a reader to simultaneously operate multiple labels / tags within its antenna field.
A UCODE G2X based label/ tag requires no external power supply.
Its contact-less interface generates the power supply via the antenna circuit by
propagative energy transmission from the interrogator (reader), while the system clock is
generated by an on-chip oscillator. Data transmitted from interrogator to label/tag is
demodulated by the interface, and it also modulates the interrogator’s electromagnetic
field for data transmission from label/tag to interrogator. A label/tag can be operated
without the need for line of sight or battery, as long as it is connected to a dedicated
antenna for the targeted frequency range. When the label/tag is within the interrogator’s
operating range, the high-speed wireless interface allows data transmission in both
directions.
In addition to the EPC specifications the G2X offers an integrated EAS (Electronic Article
Surveillance) feature and read protection of the memory content. On top of the
specification of the G2XL the G2XM offers 512-bit of user memory.
SL3ICS1002/1202
NXP Semiconductors
UCODE G2XM and G2XL
2. Features and benefits
2.1 Key features
512-bit user memory (G2XM only)
240-bit of EPC memory
64-bit tag identifier (TID) including 32-bit unique serial number
Memory read protection
EAS (Electronic Article Surveillance) command
Calibrate command
32-bit kill password to permanently disable the tag
32-bit access password to allow a transition into the secured transmission state
Broad international operating frequency: from 840 MHz to 960 MHz
Long read/write ranges due to extremely low power design
Reliable operation of multiple tags due to advanced anti-collision
Forward link: 40-160 kbit/s
Return link: 40-640 kbit/s
2.2 Key benefits
High sensitivity provides long read range
Low Q-factor for consistent performance on different materials
Improved interference suppression for reliable operation in multi-reader environment
Large input capacitance for ease of assembly and high assembly yield
Highly advanced anti-collision resulting in highest identification speed
Reliable and robust RFID technology suitable for dense reader and noisy
environments
2.3 Custom commands
EAS Alarm
Enables the UHF RFID tag to be used as EAS tag without the need for a backend data
base.
Read Protect
Protects all memory content including CRC16 from unauthorized reading.
Calibrate
Activates permanent back-scatter in order to evaluate the tag-to-reader performance.
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Product data sheet
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UCODE G2XM and G2XL
3. Applications
Supply chain management
Item level tagging
Asset management
Container identification
Pallet and case tracking
Product authentication
4. Ordering information
Table 1.
Ordering information G2XM
Type number
Package
Name
Description
Bumped die on sawn wafer
Version
SL3ICS1002FUG/V7AF Wafer
-
SL3S1002FTT
TSSOP8
plastic thin shrink small outline package; SOT505-1
8 leads; body width 3 mm
SL3S1002FTB1
XSON3
plastic extremely thin small outline
package;3 terminals;
SOT1122
body 1 x 1.45 x 0,5 mm
SL3S1002AC0
SL3S1002AC2
FCS2
FCS2
plastic flip chip strap package; 2 leads,
9 mm wide tape[1]
SOT1040-1
SOT1040-1
plastic flip chip strap package; 2 leads;
9 mm wide tape[2]
Table 2.
Ordering information G2XL
Type number
Package
Name
Description
Version
-
SL3ICS1202FUG/V7AF Wafer
Bumped die on sawn wafer
SL3S1202FTT
TSSOP8
plastic thin shrink small outline package;
8 leads; body width 3 mm
SOT505-1
SL3S1202FTB1
XSON3
plastic extremely thin small outline
package;3 terminals;
SOT1122
body 1 x 1.45 x 0,5 mm
SL3S1202AC0
SL3S1202AC2
FCS2
FCS2
plastic flip chip strap package; 2 leads,
9 mm wide tape[1]
SOT1040-1
SOT1040-1
plastic flip chip strap package; 2 leads;
9 mm wide tape[2]
[1] FCS2 Polymer Strap, JEDEC outline standard Copper
[2] FCS2 Polymer Strap, JEDEC outline standard Aluminum
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UCODE G2XM and G2XL
5. Block diagram
The SL3ICS1002/1202 IC consists of three major blocks:
- Analog RF Interface
- Digital Controller
- EEPROM
The analog part provides stable supply voltage and demodulates data received from the
reader for being processed by the digital part. Further, the modulation transistor of the
analog part transmits data back to the reader.
The digital section includes the state machines, processes the protocol and handles
communication with the EEPROM, which contains the EPC and the user data.
ANALOG
RF INTERFACE
DIGITAL CONTROL
ANTICOLLISION
EEPROM
VREG
PAD
VDD
RECT
DEMOD
MOD
READ/WRITE
CONTROL
data
in
ANTENNA
MEMORY
ACCESS CONTROL
PAD
data
out
R/W
EEPROM INTERFACE
CONTROL
RF INTERFACE
CONTROL
SEQUENCER
CHARGE PUMP
001aai335
Fig 1. Block diagram of G2X IC
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UCODE G2XM and G2XL
6. Wafer layout and pinning information
6.1 Wafer layout
(1)
TP1
RFN
(5)
Y
(4)
(6)
X
(7)
TP2
(8)
RFP
(2)
(3)
not to scale!
001aai346
(1) X-scribe line width: 56.4 μm
(2) Y-scribe line width: 56.4 μm
(3) Chip step, x-length: 488.0 μm
(4) Chip step, y-length: 470,0 μm
(5) Bump to bump distance X (TP1 - RFN): 351,0 μm
(6) Bump to bump distance Y (RFN - RFP): 333,0 μm
(7) Distance bump to metal sealring X: 40,3 μm
(8) Distance bump to metal sealring Y: 40,3 μm
Bump size X x Y: 60 μm x 60 μm
Fig 2. Wafer layout and pinning information
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UCODE G2XM and G2XL
6.2 FCS2 layout strap and pinning
Fig 3. Pinning - SOT1040-1
Table 3.
Symbol
LA
Pin description of SOT1040-1
Pin Description
Antenna Connection 1
Antenna Connection 2
LB
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7. Package outline
TSSOP8: plastic thin shrink small outline package; 8 leads; body width 3 mm
SOT505-1
D
E
A
X
c
y
HE
v
M
A
Z
5
8
A2
(A3)
A
A1
pin 1 index
ꢀ
Lp
L
1
4
detail X
e
w M
bp
0
2.5
5 mm
scale
DIMENSIONS (mm are the original dimensions)
A
max.
A1
A2
A3
bp
c
D
(1)
E
(2)
e
HE
L
Lp
UNIT
v
w
y
Z(1)
ꢀ
0.15
0.05
0.95
0.80
0.45
0.25
0.28
0.15
3.1
2.9
3.1
2.9
5.1
4.7
0.7
0.4
0.70
0.35
6
Lꢁ
mm
1.1
0.65
0.25
0.94
0.1
0.1
0.1
0
Lꢁ
Notes
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
2. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
REFERENCES
OUTLINE
VERSION
EUROPEAN
PROJECTION
ISSUE DATE
IEC
JEDEC
JEITA
99-04-09
03-02-18
SOT505-1
Fig 4. Package TSSOP8, SOT505-1
Table 4.
Symbol
RFN
Pin description of TSSOP8
Pin
1
Description
Grounded antenna connector
Not used
-
2 to 7
8
RFP
Ungrouded antenna connector
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UCODE G2XM and G2XL
Table 5.
Type
TSSOP8 Marking
Type code (Marking)
Comment
SL3S1202FTT
SL3S1002FTT
SL3XL
SL3XM
UCODE G2XL
UCODE G2XM
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XSON3: plastic extremely thin small outline package; no leads; 3 terminals; body 1 x 1.45 x 0.5 mm
SOT1122
b
b
1
1
4×
(2)
L
1
3
L
e
2
e
1
e
1
4×
A
(2)
A
1
D
type code
E
terminal 1
index area
pin 1 indication
0
1
2 mm
scale
Dimensions
Unit
(1)
A
A
1
b
b
D
E
e
e
1
L
L
1
1
max 0.50 0.04 0.45 0.55 1.50 1.05
0.35 0.30
0.40 0.50 1.45 1.00 0.55 0.425 0.30 0.25
0.37 0.47 1.40 0.95 0.27 0.22
mm nom
min
Notes
1. Dimension A is including plating thickness.
2. Can be visible in some manufacturing processes.
sot1122_po
References
Outline
version
European
projection
Issue date
IEC
JEDEC
JEITA
09-10-09
SOT1122
MO-252
Fig 5. Package outline SOT1122
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Table 6.
Pin description of SOT1122
Symbol
RFP
Pin
1
Description
Ungrouded antenna connector
Grounded antenna connector
not connected
RFN
2
n.c.
3
Table 7.
SOT1122 Marking
Type
Type code (Marking)
Comment
SL3S1202FTB1
SL3S1002FTB1
UL
UCODE G2XL
UCODE G2XM
UM
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Fig 6. Package FCS2, SOT1040AA1, 12 μm Cu metallization
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Fig 7. Package FCS2, SOT1040AB2, 20 μm Al metallization
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Fig 8. Splicing drawing SOT1040-1
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8. Mechanical specification
8.1 Wafer specification
See Ref. 20 “Data sheet - Delivery type description – General specification for 8” wafer on
UV-tape with electronic fail die marking, BL-ID document number: 1093**”.
8.1.1 Wafer
• Designation:
each wafer is scribed with batch number and
wafer number
• Diameter:
200 mm (8”)
• Thickness:
150 μm ± 15 μm
• Number of pads
• Pad location:
4
non diagonal/ placed in chip corners
• Distance pad to pad RFN-RFP
• Distance pad to pad TP1-RFN:
• Process:
333.0 µm
351.0 µm
CMOS 0.14 µm
25 wafers
120.000
• Batch size:
• Dies per wafer:
8.1.2 Wafer backside
• Material:
Si
• Treatment:
• Roughness:
ground and stress release
Ra max. 0.5 μm, Rt max. 5 μm
8.1.3 Chip dimensions
• Die size without scribe:
• Scribe line width:
0.414 mm x 0.432 mm = 0.178 mm2
x-dimension:56.4 μm (width is measured on top metal layer)
y-dimension:56.4 μm (width is measured on top metal layer)
8.1.4 Passivation on front
• Type
Sandwich structure
• Material:
• Thickness:
PE-Nitride (on top)
1.75 μm total thickness of passivation
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8.1.5 Au bump
• Bump material:
> 99.9% pure Au
• Bump hardness:
• Bump shear strength:
• Bump height:
35 – 80 HV 0.005
> 70 MPa
18 μm
• Bump height uniformity:
– within a die:
± 2 μm
± 3 μm
± 4 μm
± 1.5 μm
– within a wafer:
– wafer to wafer:
• Bump flatness:
• Bump size:
– RFP, RFN
60 x 60 μm
60 x 60 μm
± 5 μm
– TP1, TP2
– Bump size variation:
• Under bump metallization:
sputtered TiW
8.1.6 Fail die identification
No inkdots are applied to the wafer.
Electronic wafer mapping (SECS II format) covers the electrical test results and
additionally the results of mechanical/visual inspection.
See Ref. 20 “Data sheet - Delivery type description – General specification for 8” wafer on
UV-tape with electronic fail die marking, BL-ID document number: 1093**”
8.1.7 Map file distribution
See Ref. 20 “Data sheet - Delivery type description – General specification for 8” wafer on
UV-tape with electronic fail die marking, BL-ID document number: 1093**”
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8.2 SOT1040 specification
Table 8.
Mechanical properties SOT1040AA1
Package name
Outline code
Lead frame format
single row
Package size
length: 9 mm
width: 4 mm
Antenna bond pad size
SOT1040
SOT1040AA1
3,0 x 3,0 mm
product pitch: 4 mm
metallization: 12 μm Cu
substrate: 38 μm PET
thickness: max. 250 μm
Table 9.
Mechanical properties SOT1040AB2
Package name
Outline code
Lead frame format
single row
Package size
Antenna bond pad size
SOT1040
SOT1040AB2
length: 9 mm
3,0 x 3,0 mm
product pitch: 4 mm
width: 4 mm
metallization: 20 μm Al
substrate: 38 μm PET
thickness: max. 250 μm
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9. Limiting values
Table 10. Limiting values[1][2]
In accordance with the Absolute Maximum Rating System (IEC 60134)
Voltages are referenced to RFN
Symbol
Die
Parameter
Conditions
Min Max
Unit
Tstg
storage temperature range
operating temperature
-55
-40
-
+125 °C
Toper
VESD
+85
°C
[3]
electrostatic discharge voltage
Human body model
± 2
kV
TSSOP8, SOT1122
Tstg
storage temperature range
-55
-
+125 °C
Ptot
total power dissipation
30
mW
Toper
VESD
operating temperature
-40
-
+85
± 2
°C
electrostatic discharge voltage
Human body model
Human body model
kV
SOT1040AA1, SOT1040AB2
[3][5]
Toper
r.h.stg
Tstg
operating temperature
relative humidity
-40
-
+70
60
°C
%
[4]
storage temperature range
electrostatic discharge voltage
antenna bonding
+15 +30
- ± 2
°C
kV
VESD
[5]
[5]
label converting
[1] Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the
device. This is a stress rating only and functional operation of the device at these or any conditions other
than those described in the Operating Conditions and Electrical Characteristics section of this specification
is not implied.
[2] This product includes circuitry specifically designed for the protection of its internal devices from the
damaging effects of excessive static charge. Nonetheless, it is suggested that conventional precautions be
taken to avoid applying greater than the rated maxima.
[3] For ESD measurement, the die chip has been mounted into a CDIP20 package.
[4] see also Section 11.1 “Storage conditions”
[5] see also Section 11.2 “Assembly conditions”
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10. Characteristics
10.1 Wafer characteristics
Table 11. Wafer characteristics
Symbol Parameter
Memory characteristics
Conditions
Min
Typ
Max
Unit
tRET
NWE
EEPROM data retention
EEPROM write endurance
Tamb ≤ 55 °C
Tamb ≤ 55 °C
50
-
-
-
year
100000 -
cycle
Interface characteristics
Ptot
foper
Pmin
Ci
total power dissipation
-
30
mW
MHz
dBm
pF
operating frequency
840
-
960
[1][2]
[3]
minimum operating power supply
input capacitance (parallel)
quality factor (Im (Zchip) / Re (Zchip)
impedance (915 MHz)
-
-
-
-
-
-
-15
-
-
-
-
-
-
0.88
9
[3]
Q
)
-
Z
22 - j195
- 4
Ω
[4]
[4]
-
modulated jammer suppression ≥1.0 MHz
unmodulated jammer suppression ≥1.0 MHz
dB
dB
-
- 4
[1] Power to process a Query command
[2] Measured with a 50 Ω source impedance
[3] At minimum operating power
[4] Values measured for a 40 kHz phase reserval command under matched conditions
10.2 Package characteristics
Table 12. Package interface characteristics
Symbol Parameter
Conditions
Min
Typ
Max
Unit
Interface characteristics SOT 1040AA1 (Cu strap)
[1]
[1]
Ci
Z
input capacitance
-
-
1.36
-
-
pF
SOT1040AA1 impedance (915 MHz)
14.8-j128
Ω
Interface characteristics SOT 1040AB2 (Al strap)
[1]
[1]
Ci
Z
input capacitance
-
-
1.42
-
-
pF
SOT1040AB2 impedance (915 MHz)
13.3-j122
Ω
Interface characteristics SOT1122
[1]
[1]
Ci
Z
input capacitance (parallel)
-
-
1.02
-
-
pF
SOT1122 impedance (915 MHz)
18.6 - j171.2
Ω
Interface characteristics TSSOP8
Ci
Z
input capacitance (parallel)
-
-
1.16
-
-
pF
TSSOP8 impedance (915 MHz)
16 - j148
Ω
[1] Measured with network analyzer at 915 MHz; values at 0.5 dBm after peakmax of on-set of die, measured in the center of the pads.
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11. Handling information for Flip Chip Strap (FCS2, SOT1040)
11.1 Storage conditions
The following storage conditions are applicable if the FCS2 products are kept in their
original packing:
• Storage temperature: +15 °C to +30 °C
• Relative humidity:
max. 60 %
• Duration of storage: max. 0.5 years
Deviating requirements have to be arranged with NXP Semiconductors.
11.2 Assembly conditions
11.2.1 General assembly recommendations
NXP recommends to use dedicated strap assembly equipment to prevent damage of the
FCS2 strap or the die itself.
In case of any doubts, the customer is constrained to contact NXP Semiconductors for
further clarification.
11.2.2 Antenna bonding
Mounting the FCS2 product onto the antenna can be done in multiple ways:
• Crimping
• Conductive gluing
• Soldering (possible, but not recommended by NXP Semiconductors)
11.2.3 Label converting
Generally, an optimization of the entire lamination process by label manufacturer is
recommended in order to minimize the stress onto the module and guarantee high
assembly yield. Roller diameter must not be smaller than 45 mm.
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12. Packing information
12.1 Flip Chip Strap (FCS2, SOT1040)
The strap is shipped on a 13 inch by 9 mm reel.
For details please refer to Ref. 21 “Data sheet - Flip chip strap - FCS2, General packing
specification, BL-ID document number: 1738**”.
12.2 Wafer
See Ref. 20 “Data sheet - Delivery type description – General specification for 8” wafer on
UV-tape with electronic fail die marking, BL-ID document number: 1093**”.
12.3 TSSOP
See http://www.standardics.nxp.com/packaging/packing/pdf/sot505-2.t4.pdf.
12.4 SOT1122
Part orientation T1. For details please refer to
http://www.standardics.nxp.com/packaging/packing/pdf/sot886.t1.t4.pdf.
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13. Functional description
13.1 Power transfer
The interrogator provides an RF field that powers the tag, equipped with a UCODE G2X.
The antenna transforms the impedance of free space to the chip input impedance in order
to get the maximum possible power for the G2X on the tag.
The RF field, which is oscillating on the operating frequency provided by the interrogator,
is rectified to provide a smoothed DC voltage to the analog and digital modules of the IC.
The antenna that is attached to the chip may use a DC connection between the two
antenna pads. Therefore the G2X also enables loop antenna design. Possible examples
of supported antenna structures can be found in the reference antenna design guide.
13.2 Data transfer
13.2.1 Reader to G2X Link
An interrogator transmits information to the UCODE G2X by modulating an RF signal in
the 840 MHz - 960 MHz frequency range. The G2X receives both information and
operating energy from this RF signal. Tags are passive, meaning that they receive all of
their operating energy from the interrogator's RF waveform.
An interrogator is using a fixed modulation and data rate for the duration of at least an
inventory round. It communicates to the G2X by modulating an RF carrier using
DSB-ASK, SSB-ASK or PR-ASK with PIE encoding.
For further details refer to Section 18, Ref. 1, section 6.3.1.2. Interrogator-to-tag (R=>T)
communications.
13.2.2 G2X to reader Link
An interrogator receives information from the UCODE G2X by transmitting a
continuous-wave RF signal to the tag; the G2X responds by modulating the reflection
coefficient of its antenna, thereby generating modulated sidebands used to backscatter an
information signal to the interrogator. The system is a reader talks first (RTF) system,
meaning that a G2X modulates its antenna reflection coefficient with an information signal
only after being directed by the interrogator.
G2X backscatter is a combination of ASK and PSK modulation depending on the tuning
and bias point. The backscattered data is either modulated with FM0 baseband or Miller
sub carrier.
For further details refer to Section 18, Ref. 1, section 6.3.1.3. tag-to-interrogator (T=>R)
communications.
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13.3 Operating distances
RFID tags based on the UCODE G2X silicon may achieve maximum operating distances
according the following formula:
(1)
2 ⋅ η
λ
4πR
⎛
⎝
⎞
⎠
----------
P
= EIRP ⋅ Gtag
tag
(2)
EIRP ⋅ Gtag ⋅ λ2
---------------------------------------
⋅ η
Rmax
=
(4π)2Ptag
Table 13. Symbol description
Symbol
Ptag
Gtag
EIRP
λ
Description
Unit
W
-
minimum required RF power for the tag
gain of the tag antenna
transmitted RF power
m
m
m
-
wavelength
Rmax
η
maximum achieved operating distance for a λ/2-dipole
loss factor assumed to be 0.5 considering matching and
package losses
R
distance
m
Table 14. Operating distances for UCODE G2X based tags and labels in released frequency
bands
Frequency range
Region
Available
power
Calculated read distance Unit
single antenna [4]
868.4 to 868.65 MHz (UHF) Europe [1]
865.5 to 867.6 MHz (UHF) Europe [2]
0.5 W ERP
2 W ERP
4 W EIRP
3.6
7.1
7.5
m
m
m
902 to 928 MHz (UHF)
America [3]
[1] CEPT/ETSI regulations [CEPT1], [ETSI1].
[2] New CEPT/ETSI regulations. [ETSI3].
[3] FCC 47 part 15 regulation [FCC1].
[4] These read distances are maximum values for general tags and labels. Practical usable values may be
lower due to damping by object materials and environmental conditions. A special tag antenna design can
help achieve higher values.
The typical write range is > 50% of the read range.
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13.4 Air interface standards
The G2X is certified according EPCglobal 1.0.9 and fully supports all parts of the
"Specification for RFID Air Interface EPCglobal, EPCTM Radio-Frequency Identity
Protocols, Class-1 Generation-2 UHF RFID, Protocol for Communications at 860 MHz -
960 MHz, Version 1.1.0".
ꢀꢁꢂꢃꢃꢂꢃꢄꢅꢂꢂꢂꢂꢂꢂꢁꢆꢇ
EPCglobal compliance and interoperability certification
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14. Physical layer and signaling
14.1 Reader to G2X communication
14.1.1 Physical layer
For interrogator-to-G2X link modulation refer to Section 18, Ref. 1, annex H.1 Baseband
waveforms, modulated RF, and detected waveforms.
14.1.2 Modulation
An interrogator sends information to one or more G2X by modulating an RF carrier using
double-sideband amplitude shift keying (DSB-ASK), single-sideband amplitude shift
keying (SSB-ASK) or phase-reversal amplitude shift keying (PR-ASK) using a
pulse-interval encoding (PIE) format. The G2X receives the operating energy from this
same modulated RF carrier.
Section 18, Ref. 1: Annex H, as well as chapter 6.3.1.2.2.
The G2X is capable of demodulating all three modulation types.
14.1.3 Data encoding
The R=>T link is using PIE. For the definition of the therefore relevant reference time
interval for interrogator-to-chip signaling (Tari) refer to Section 18, Ref. 1, chapter
6.3.1.2.3. The Tari is specified as the duration of a data-0.
14.1.4 Data rates
Interrogators shall communicate using Tari values between 6.25 μs and 25 μs, inclusive.
For interrogator compliance evaluation the preferred Tari values of 6.25 μs, 12.5 μs or
25 μs should be used. For further details refer to Section 18, Ref. 1, chapter 6.3.1.2.4.
14.1.5 RF envelope for R=>T
A specification of the relevant RF envelope parameters can be found in Section 18,
Ref. 1, chapter 6.3.1.2.5.
14.1.6 Interrogator power-up/down waveform
For a specification of the interrogator power-up and power-down RF envelope and
waveform parameters refer to Section 18, Ref. 1, chapters 6.3.1.2.6 and 6.3.1.2.7.
14.1.7 Preamble and frame-sync
An interrogator shall begin all R=>T signaling with either a preamble or a frame-sync. A
preamble shall precede a Query command and denotes the start of an inventory round.
For a definition and explanation of the relevant R=>T preamble and frame-sync refer to
Section 18, Ref. 1, chapter 6.3.1.2.8.
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14.2 G2X to reader communication
An interrogator receives information from a G2X by transmitting an unmodulated RF
carrier and listening for a backscattered reply. The G2X backscatters by switching the
reflection coefficient of its antenna between two states in accordance with the data being
sent. For further details refer to Section 18, Ref. 1, chapter 6.3.1.3.
14.2.1 Modulation
The UCODE G2X communicates information by backscatter-modulating the amplitude
and/or phase of the RF carrier. Interrogators shall be capable of demodulating either
demodulation type.
14.2.2 Data encoding
The encoding format, selected in response to interrogator commands, is either FM0
baseband or Miller-modulated subaltern. The interrogator commands the encoding choice
14.2.2.1 FM0 baseband
FM0 inverts the baseband phase at every symbol boundary; a data-0 has an additional
mid-symbol phase inversion. For details on FM0 and generator state diagram, FM0
symbols and sequences and how FM0 transmissions should be terminated refer to
Section 18, Ref. 1, chapter 6.3.1.3.
14.2.2.2 FM0 Preamble
T=>R FM0 signaling begin with one of two defined preambles, depending on the value of
the TRext bit specified in the Query command that initiated the inventory round. For
further details refer to Section 18, Ref. 1, chapter 6.3.1.3.
14.2.2.3 Miller-modulated sub carrier
Baseband Miller inverts its phase between two data-0s in sequence. Baseband Miller also
places a phase inversion in the middle of a data-1 symbol. For details on Miller-modulated
sub carrier, generator state diagram, sub carrier sequences and terminating sub carrier
transmissions refer to Section 18, Ref. 1, chapter 6.3.1.3.
14.2.2.4 Miller sub carrier preamble
T=>R sub carrier signaling begins with one of the two defined preambles. The choice
depends on the value of the TRext bit specified in the Query command that initiated the
inventory round. For further details refer to Section 18, Ref. 1, chapter 6.3.1.3.
14.2.3 Data rates
The G2X IC supports tag to interrogator data rates and link frequencies as specified in
Section 18, Ref. 1, chapter 6.3.1.3.
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14.3 Link timing
For the interrogator interacting with a UCODE G2X equipped tag population exact link and
response timing requirements must be fulfilled, which can be found in Section 18, Ref. 1,
chapter 6.3.1.6.
14.3.1 Regeneration time
The regeneration time is the time required if a G2X is to demodulate the interrogator
signal, measured from the last falling edge of the last bit of the G2X response to the first
falling edge of the interrogator transmission. This time is referred to as T2 and can vary
between 3.0 Tpri and 20 Tpri. For a more detailed description refer to Section 18, Ref. 1,
chapter 6.3.1.6.
14.3.2 Start-up time
For a detailed description refer to Section 18, Ref. 1, chapter 6.3.1.3.4.
14.3.3 Persistence time
An interrogator chooses one of four sessions and inventories tags within that session
(denoted S0, S1, S2, and S3). The interrogator and associated UCODE G2X population
operate in one and only one session for the duration of an inventory round (defined
above). For each session, a corresponding inventoried flag is maintained. Sessions allow
tags to keep track of their inventoried status separately for each of four possible
time-interleaved inventory processes, using an independent inventoried flag for each
process. Two or more interrogators can use sessions to independently inventory a
common UCODE G2X chip population.
A session flag indicates whether a G2X may respond to an interrogator. G2X chips
maintain a separate inventoried flag for each of four sessions; each flag has symmetric A
and B values. Within any given session, interrogators typically inventory tags from A to B
followed by a re-inventory of tags from B back to A (or vice versa).
Additionally, the G2X has implemented a selected flag, SL, which an interrogator may
assert or deassert using a Select command.
For a description of Inventoried flags S0 – S3 refer to Section 18, Ref. 1 chapter 6.3.2.2
and for a description of the Selected flag refer to Section 18, Ref. 1, chapter 6.3.2.3. For
tag flags and respective persistence time refer to Section 18, Ref. 1, table 6.14.
14.4 Bit and byte ordering
The transmission order for all R=>T and T=>R communications respects the following
conventions:
• within each message, the most-significant word is transmitted first, and
• within each word, the most-significant bit (MSB) is transmitted first,
whereas one word is composed of 16 bits.
To represent memory addresses and mask lengths EBV-8 values are used. An extensible
bit vector (EBV) is a data structure with an extensible data range. For a more detailed
explanation refer to Section 18, Ref. 1, Annex A.
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14.5 Data integrity
The G2X ignores invalid commands. In general, "invalid" means a command that (1) is
incorrect given the current the G2X state, (2) is unsupported by the G2X, (3) has incorrect
parameters, (4) has a CRC error, (5) specifies an incorrect session, or (6) is in any other
way not recognized or not executable by the G2X. The actual definition of "invalid" is
state-specific and defined, for each G2X state, in n Section 18, Ref. 1 Annex B and
Annex C.
All UCODE G2X backscatter error codes are summarized in Section 18, Ref. 1 Error
codes, Annex I. For a detailed description of the individual backscatter error situations
which are command specific please refer to the Section 18, Ref. 1 individual command
description section 6.3.2.10.
14.6 CRC
A CRC-16 is a cyclic-redundancy check that an interrogator uses when protecting certain
R=>T commands, and the G2X uses when protecting certain backscattered T=>R
sequences. To generate a CRC-16 an interrogator or the G2X first generates the CRC-16
precursor shown in Section 18, Ref. 1 Table 6.11, then take the ones-complement of the
generated precursor to form the CRC-16. For a detailed description of the CRC-16
generation and handling rules refer to Section 18, Ref. 1, chapter 6.3.2.1.
The CRC-5 is only used to protect the Query command (out of the mandatory command
set). It is calculated out of X5 + X3 + 1. For a more detailed CRC-5 description refer to
Section 18, Ref. 1, table 6.12.
For exemplary schematic diagrams for CRC-5 and CRC-16 encoder/decoder refer to
Section 18, Ref. 1, Annex F.
For a CRC calculation example refer to Section 16.1, Table 32 and Table 33.
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15. TAG selection, inventory and access
This section contains all information including commands by which a reader selects,
inventories, and accesses a G2X population
An interrogator manages UCODE G2X equipped tag populations using three basic
operations. Each of these operations comprises one or more commands. The operations
are defined as follows
Select:
The process by which an interrogator selects a tag population for inventory
and access. Interrogators may use one or more Select commands to select a
particular tag population prior to inventory.
Inventory: The process by which an interrogator identifies UCODE G2X equipped tags.
An interrogator begins an inventory round by transmitting a Query command
in one of four sessions. One or more G2X may reply. The interrogator detects
a single G2X reply and requests the PC, EPC, and CRC-16 from the chip. An
inventory round operates in one and only one session at a time. For an
example of an interrogator inventorying and accessing a single G2X refer to
Section 18, Ref. 1, Annex E.
Access:
The process by which an interrogator transacts with (reads from or writes to)
individual G2X. An individual G2X must be uniquely identified prior to access.
Access comprises multiple commands, some of which employ one-time-pad
based cover-coding of the R=>T link.
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15.1 G2X Memory
For the general memory layout according to the standard Section 18, Ref. 1, refer to
Figure 6.17. The tag memory is logically subdivided into four distinct banks.
In accordance to the standard Section 18, Ref. 1, section 6.3.2.1. The tag memory of the
SL3ICS1002 G2XM is organized in following 4 memory sections:
Table 15. G2X memory sections
Name
Size
Bank
00b
01b
10b
11b
Reserved memory (32 bit ACCESS and 32 bit KILL password)
EPC (excluding 16 bit CRC-16 and 16 bit PC)
TID (including unique 32 bit serial number)
User memory (G2XM only)
64 bit
240 bit
64 bit
512 bit
The logical address of all memory banks begin at zero (00h).
Addresses
3Fh
00h
TID
LS Byte
MS Byte
LSBit
MSBit
LSBit
MSBit
LSBit
1Fh
0
MSBit
LSBit
MSBit
Addresses
Bits
3Fh
20h
31
14h
11
13h
08h
11
07h
0
00h
Serial Number
Model Number
002h
Mask-Designer Identifier
Class Identifier
0
0
7
00000001h to FFFFFFFFh
006h
E2h
Addresses
Bits
1Fh
19h
6
18h
14h
Version Number
0000010b
Sub Version Number
0
0
4
00000b
Whenever the 32 bit serial
is exceeded the sub version
is incremented by 1
Sub Version Nr
Version (Silicon) Nr
Model Nr.
Mask ID
UCode EPC G2XM
UCode EPC G2XL
00000b
00000b
0000011b
0000100b
003h
004h
006h
006h
Fig 9. G2X TID memory structure
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15.1.1 Memory map
Table 16. Memory map
Bank
address
Memory
address
Type
Content
Initial [1]
Remark
Bank 00
00h – 1Fh
Reserved
kill password:
all 00h
unlocked memory
refer to Section 18, Ref. 1,
chapter 6.3.2.1.1
20h – 3Fh
Reserved
access password:
all 00h
unlocked memory
refer to Section 18, Ref. 1,
chapter 6.3.2.1.1
Bank 01
00h – 0Fh
10h – 14h
EPC
EPC
CRC-16: refer to Section 18,
Ref. 1, chapter 6.3.2.1.2
memory mapped
calculated CRC
Backscatter length:
refer to Section 18, Ref. 1,
chapter 6.3.2.1.2
00110b
0b
unlocked memory
unlocked memory
hardwired to 0
15h
EPC
EPC
EPC
EPC
TID
Reserved for future use:
refer to Section 18, Ref. 1,
chapter 6.3.2.1.2
16h
Reserved for future use:
refer to Section 18, Ref. 1,
chapter 6.3.2.1.2
0b
17h –1Fh
20h - 10Fh
00h – 07h
08h – 13h
14h – 1Fh
20h – 3Fh
00h – 1FFh
Numbering system indicator: 00h
refer to Section 18, Ref. 1,
chapter 6.3.2.1.2
unlocked memory
unlocked memory
[2]
EPC:
refer to Section 18, Ref. 1,
chapter 6.3.2.1.2
Bank 10
allocation class identifier:
refer to Section 18, Ref. 1,
chapter 6.3.2.1.3
1110 0010b
locked memory
locked memory
locked memory
locked memory
unlocked memory
TID
tag mask designer identifier: 0000 0000 0110b
refer to Section 18, Ref. 1,
chapter 6.3.2.1.3
TID
tag model number:
refer to Section 18, Ref. 1,
chapter 6.3.2.1.3
TMNR
SNR
TID
serial number:
refer to [Section 18, Ref. 1,
chapter 6.3.2.1.3
Bank 11[3]
User
user memory:
undefined
refer to [Section 18, Ref. 1,
chapter 6.3.2.1.4
[1] This is the initial memory content when delivered by NXP Semiconductors
[2] G2XL: HEX 3005 FB63 AC1F 3841 EC88 0467
G2XM: HEX 3005 FB63 AC1F 3681 EC88 0468
[3] only G2XM
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15.1.1.1 User memory (only G2XM)
The User Memory bank contains a sequential block of 512 bits (32 words of 16 bit)
ranging from address 00h to 1Fh. The user memory can be accessed via Select, Read or
Write command and it may be write locked, permanently write locked, unlocked or
permanently unlocked.
In addition reading of not only of the User Memory but of the whole memory including EPC
and TID can be protected by using the custom ReadProtect command.
15.1.1.2 Special behavior of user memory address 1Fh
WRITE or SELECT of user memory address 1Fh will falsely set an error flag. This will
affect the subsequent READ or SELECT.
The following commands will falsely set an internal error flag (without actually
causing an error):
1) WRITE to user memory with WordPtr=1Fh
2) SELECT to user memory with compare mask ending at bitaddress 1FFh
(e.g. Pointer=1FEh, length=1 or Pointer=1FDh, length=2 …)
Note: The error flag is set independent of the chip state (also chips in the e.g. Ready
state are affected).
The falsely set error flag will affect the following sub sequential commands:
A) READ command with WordCount=0 → falsely responds with "memory overrun" error
B) SELECT command with Length<>0 → falsely assumes non existing memory location
The behavior can be avoided with:
• Turning off the RF carrier to reset the chip (This is what readers typically do!).
• Using the READ command with WordCount<>0.
• Sending other command prior to READ or SELECT (e.g. WRITE to address<>1Fh,
ReqRN) or executing READ or SELECT two times.
Remark: The WRITE operation itself is not affected by this problem i.e. data is written
properly! With commercially available readers this behavior is typically not observed.
15.1.1.3 Supported EPC types
The EPC types are defined in the EPC Tag Standards document from EPCglobal.
These standards define completely that portion of EPC tag data that is standardized,
including how that data is encoded on the EPC tag itself (i.e. the EPC Tag Encodings), as
well as how it is encoded for use in the information systems layers of the EPC Systems
Network (i.e. the EPC URI or Uniform Resource Identifier Encodings).
The EPC Tag Encodings include a Header field followed by one or more Value Fields. The
Header field indicates the length of the Values Fields and contains a numbering system
identifier (NSI). The Value Fields contain a unique EPC Identifier and optional Filter Value
when the latter is judged to be important to encode on the tag itself.
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15.2 Sessions, selected and inventoried flags
Session, Selected and Inventory Flags are according the EPCglobal standard. For a
description refer to Section 18, Ref. 1, section 6.3.2.3.
15.2.1 G2X States and slot counter
For a description refer to Section 18, Ref. 1, section 6.3.2.4.
15.2.2 G2X State Diagram
The tag state are according the EPCglobal standard please refer to: Section 18, Ref. 1,
section 6.3.2.4 Tag states and slot counter.
A detailed tag state diagram is shown in Section 18, Ref. 1, figure 6.19. Refer also to
Section 18, Ref. 1, Annex B for the associated state-transition tables and to Section 18,
Ref. 1, Annex C for the associated command-response tables.
15.3 Managing tag populations
For a detailed description on how to manage an UCODE G2X tag populations refer to
Section 18, Ref. 1, chapter 6.3.2.6.
15.4 Selecting tag populations
For a detailed description of the UCODE G2X tag population selection process refer to
Section 18, Ref. 1, section 6.3.2.7.
15.5 Inventorying tag populations
For a detailed description on accessing individual tags based on the UCODE G2X refer to
Section 18, Ref. 1, section 6.3.2.8.
15.6 Accessing individual tags
For a detailed description on accessing individual tags based on the UCODE G2X refer to
Section 18, Ref. 1, section 6.3.2.9.
An example inventory and access of a single UCODE G2X tag is shown in Section 18,
Ref. 1, Annex E.1.
15.7 Interrogator commands and tag replies
For a detailed description refer to Section 18, Ref. 1, section 6.3.2.10.
15.7.1 Commands
An overview of interrogator to tag commands is located in Section 18, Ref. 1, Table 6.16.
Note that all mandatory commands are implemented on the G2X according to the
standard. Additionally the optional command Access is supported by the G2X (for details
refer to Section 15.11 “Optional Access Command”). Besides also custom commands are
implemented on the G2X (for details refer to Section 15.12 “Custom Commands”.
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15.7.2 State transition tables
The G2X responses to interrogator commands are defined by State Annex B transition
tables in Section 18, Ref. 1. Following states are implemented on the G2X:
• Ready, for a description refer to Section 18, Ref. 1, Annex B.1.
• Arbitrate, for a description refer to Section 18, Ref. 1, Annex B.2.
• Reply, for a description refer to Section 18, Ref. 1, Annex B.3.
• Acknowledged, for a description refer to Section 18, Ref. 1, Annex B.4.
• Open, for a description refer to Section 18, Ref. 1, Annex B.5.
• Secured, for a description refer to Section 18, Ref. 1, Annex B.6.
• Killed, for a description refer to Section 18, Ref. 1, Annex B.7.
15.7.3 Command response tables
The G2X responses to interrogator commands are described in following Annex C
sections of Section 18, Ref. 1:
• Power-up, for a description refer to Section 18, Ref. 1, Annex C.1.
• Query, for a description refer to Section 18, Ref. 1, Annex C.2.
• QueryRep, for a description refer to Section 18, Ref. 1, Annex C.3.
• QueryAdjust, for a description refer to Section 18, Ref. 1, Annex C.4.
• ACK, for a description refer to Section 18, Ref. 1, Annex C.5.
• NAK, for a description refer to Section 18, Ref. 1, Annex C.6.
• Req_RN, for a description refer to Section 18, Ref. 1, Annex C.7.
• Select, for a description refer to Section 18, Ref. 1, Annex C.8.
• Read, for a description refer to Section 18, Ref. 1, Annex C.9.
• Write, for a description refer to Section 18, Ref. 1, Annex C.10.
• Kill, for a description refer to Section 18, Ref. 1, Annex C.11.
• Lock, for a description refer to Section 18, Ref. 1, Annex C.12.
• Access, for a description refer to Section 18, Ref. 1, Annex C.13.
• T2 time-out, for a description refer to Section 18, Ref. 1, Annex C.17.
• Invalid command, for a description refer to Section 18, Ref. 1, Annex C.18.
15.7.4 Example data-flow exchange
For data flow-exchange examples refer to Section 18, Ref. 1, Annex K:
• K.1 Overview of the data-flow exchange
• K.2 Tag memory contents and lock-field values
• K.3 Data-flow exchange and command sequence
15.8 Mandatory Select Commands
Select commands select a particular UCODE G2X tag population based on user-defined
criteria.
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15.8.1 Select
UCODE G2XM and G2XL
For a detailed description of the mandatory Select command refer to Section 18, Ref. 1,
section 6.3.2.10.
15.9 Mandatory Inventory Commands
Inventory commands are used to run the collision arbitration protocol.
15.9.1 Query
For a detailed description of the mandatory Query command refer to Section 18, Ref. 1,
section 6.3.2.10.
15.9.2 QueryAdjust
For a detailed description of the mandatory QueryAdjust command refer to Section 18,
Ref. 1, section 6.3.2.10.
15.9.3 QueryRep
For a detailed description of the mandatory QueryRep command refer to Section 18,
Ref. 1, section 6.3.2.10.
15.9.4 ACK
For a detailed description of the mandatory ACK command refer to Section 18, Ref. 1,
section 6.3.2.10.
15.9.5 NAK
For a detailed description of the mandatory NAK command refer to Section 18, Ref. 1,
section 6.3.2.10.
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15.10 Mandatory Access Commands
Access commands are used to read or write data from or to the G2X memory. For a
detailed description of the mandatory Access command refer to Section 18, Ref. 1,
section 6.3.2.10.
15.10.1 REQ_RN
Access commands are used to read or write data from or to the G2X memory. For a
detailed description of the mandatory Access command refer to Section 18, Ref. 1,
section 6.3.2.10.
15.10.2 READ
For a detailed description of the mandatory Req_RN command refer to Section 18, Ref. 1,
section 6.3.2.10.
15.10.3 WRITE
For a detailed description of the mandatory Write command refer to Section 18, Ref. 1,
section 6.3.2.10.
15.10.4 KILL
For a detailed description of the mandatory Kill command refer to Section 18, Ref. 1,
section 6.3.2.10.
15.10.5 LOCK
For a detailed description of the mandatory Lock command refer to Section 18, Ref. 1,
section 6.3.2.10.
15.11 Optional Access Command
15.11.1 Access
For a detailed description of the optional Access command refer to Section 18, Ref. 1,
section 6.3.2.10.
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15.12 Custom Commands
15.12.1 ReadProtect
The G2X ReadProtect custom command enables reliable read protection of the entire
G2X memory. Executing ReadProtect from the Secured state will set the ReadProtect-bit
to '1'. With the ReadProtect-Bit set the G2X will continue to work unaffected but fail its
content.
Following commands will be disabled: Read, Write, Kill, Lock, Access, ReadProtect,
ChangeEAS, EAS Alarm and Calibrate. The G2X will only react upon an anticollision with
Select, Query, QueryRep, QueryAdjust, ACK (no truncated reply), NAK, ReqRN but reply
with zeros as EPC and CRC-16 content (except PC/password). ACK will return zeros
except for the PC.
The read protection can be removed by executing Reset ReadProtect. The
ReadProtect-Bit will than be cleared.
Devices whose access password is zero will ignore the command. A frame-sync must be
prepended the command.
After sending the ReadProtect command an interrogator shall transmit CW for the lesser
of TReply or 20 ms, where TReply is the time between the interrogator's ReadProtect
command and the backscattered reply. An interrogator may observe three possible
responses after sending a ReadProtect, depending on the success or failure of the
operation:
• ReadProtect succeeds: After completing the ReadProtect the G2X shall backscatter
the reply shown in Table 19 comprising a header (a 0-bit), the tag's handle, and a
CRC-16 calculated over the 0-bit and handle. Immediately after this reply the G2X will
render itself to this ReadProtect mode. If the interrogator observes this reply within 20
ms then the ReadProtect completed successfully.
• The G2X encounters an error: The G2X will backscatter an error code during the CW
period rather than the reply shown in the EPCglobal Spec (see Annex I for error-code
definitions and for the reply format).
• ReadProtect does not succeed: If the interrogator does not observe a reply within
20 ms then the ReadProtect did not complete successfully. The interrogator may
issue a Req_RN command (containing the handle) to verify that the G2X is still in the
interrogation zone, and may re-initiate the ReadProtect command.
The G2X reply to the ReadProtect command will use the extended preamble shown in
EPCglobal Spec (Figure 6.11 or Figure 6.15), as appropriate (i.e. a Tag shall reply as if
TRext=1) regardless of the TRext value in the Query that initiated the round.
Table 17. ReadProtect command
Command
16
RN
CRC-16
# of bits
16
16
-
description
11100000 00000001
handle
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Table 18. G2X reply to a successful ReadProtect procedure
Header
RN
CRC-16
# of bits
description
1
0
16
16
-
handle
Table 19. ReadProtect command-response table
Starting State
Condition
Response
Next State
ready
ready
all
all
–
–
arbitrate, reply,
acknowledged
arbitrate
open
all
-
open
secured
valid handle & invalid
access password
–
arbitrate
valid handle & valid
non zero access
password
Backscatter handle,
when done
secured
invalid handle
all
–
–
secured
killed
killed
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15.12.2 Reset ReadProtect
Reset ReadProtect allows an interrogator to resets the ReadProtect-bit and re-enables
reading of the G2X memory content according the EPCglobal specification.
The G2X will execute Reset ReadProtect from the Open or Secured states.
If a G2X in the Open or Secured states receives a Reset ReadProtect with a valid CRC-16
and a valid handle but an incorrect access password, it will not reply and transit to the
Arbitrate state.
If a G2X in the Open or Secured states receives a Reset ReadProtect with a valid CRC-16
and a valid handle but the ReadProtect-Bit is not set ('0'), it will not change the
ReadProtect-Bit but backscatter the reply shown in Table 22.
If a G2X in the Open or Secured receives a Reset ReadProtect with a valid CRC-16 but
an invalid handle, or it receives a Reset ReadProtect before which the immediately
preceding command was not a Req_RN, it will ignore the Reset ReadProtect and remain
in its current state.
A frame-sync must be prepended the Reset ReadProtect command.
After sending a Reset ReadProtect an interrogator shall transmit CW for the lesser of
TReply or 20 ms, where TReply is the time between the interrogator's Reset ReadProtect
command and the G2X backscattered reply. An interrogator may observe three possible
responses after sending a Reset ReadProtect, depending on the success or failure of the
operation:
• Write succeeds: After completing the Reset ReadProtect a G2X will backscatter the
reply shown in Table 22 comprising a header (a 0-bit), the handle, and a CRC-16
calculated over the 0-bit and handle. If the interrogator observes this reply within
20 ms then the Reset ReadProtect completed successfully.
• The G2X encounters an error: The G2X will backscatter an error code during the CW
period rather than the reply shown in Table 22 (see EPCglobal Spec for error-code
definitions and for the reply format).
• Write does not succeed: If the interrogator does not observe a reply within 20 ms then
the Reset ReadProtect did not complete successfully. The interrogator may issue a
Req_RN command (containing the handle) to verify that the G2X is still in the
interrogation zone, and may reissue the Reset ReadProtect command.
The G2X reply to the Reset ReadProtect command will use the extended preamble shown
in EPCglobal Spec (Figure 6.11 or Figure 6.15), as appropriate (i.e. a G2X will reply as if
TRext=1 regardless of the TRext value in the Query that initiated the round.
The Reset ReadProtect command is structured as following:
• 16 bit command
• Password: 32 bit Access-Password XOR with 2 times current RN16
• 16 bit handle
• CRC-16 calculate over the first command-code bit to the last handle bit
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Table 20. Reset ReadProtect command
Command
Password
RN
CRC-16
# of bits
16
32
16
16
-
description
11100000
00000010
(access
password) ⊗
2*RN16
handle
Table 21. G2X reply to a successful Reset ReadProtect command
Header
RN
CRC-16
# of bits
1
0
16
16
-
description
handle
Table 22. Reset ReadProtect command-response table
Starting State
Condition
Response
Next State
ready
ready
all
all
–
–
arbitrate, reply,
acknowledged
arbitrate
open
ReadProtect bit is set,
valid handle & valid access password
ReadProtect bit is set,
valid handle & invalid access password
ReadProtect bit is set,
invalid handle
Backscatter handle,
when done
open
–
–
–
arbitrate
open
ReadProtect bit is reset
ReadProtect bit is set,
valid handle & valid access password
ReadProtect bit is set,
valid handle & invalid access password
ReadProtect bit is set,
invalid handle
open
secured
Backscatter handle,
when done
secured
–
arbitrate
secured
–
ReadProtect bit is reset
all
–
–
secured
killed
killed
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15.12.3 ChangeEAS
A G2X equipped RFID tag can be enhanced by a stand-alone operating EAS alarm
feature. With an EAS-Alarm bit set to '1' the tag will reply to an EAS_Alarm command by
backscattering a 64 bit alarm code without the need of a Select or Query. The EAS is a
built-in solution so no connection to a backend database is required. As it is a custom
command no Select or Query is required to detect the EAS state enabling fast, reliable
and offline article surveillance.
ChangeEAS can be executed from the Secured state only. The command will be ignored
if the Access Password is zero, the command will also be ignored with an invalid CRC-16
or an invalid handle, the G2X will than remain in the current state. The CRC-16 is
calculated from the first command-code bit to the last handle bit. A frame-sync must be
prepended the command.
The G2X reply to a successful ChangeEAS will use the extended preamble, as
appropriate (i.e. a Tag shall reply as if TRext=1) regardless of the TRext value in the
Query that initiated the round.
After sending a ChangeEAS an interrogator shall transmit CW for less than TReply or
20 ms, where TReply is the time between the interrogator's ChangeEAS command and
the G2X backscattered reply. An interrogator may observe three possible responses after
sending a ChangeEAS, depending on the success or failure of the operation
• Write succeeds: After completing the ChangeEAS a G2X will backscatter the reply
shown in Table 25 comprising a header (a 0-bit), the handle, and a CRC-16 calculated
over the 0-bit and handle. If the interrogator observes this reply within
20 ms then the ChangeEAS completed successfully.
• The G2X encounters an error: The G2X will backscatter an error code during the CW
period rather than the reply shown in Table 25 (see EPCglobal Spec for error-code
definitions and for the reply format).
• Write does not succeed: If the interrogator does not observe a reply within 20 ms then
the ChangeEAS did not complete successfully. The interrogator may issue a Req_RN
command (containing the handle) to verify that the G2X is still in the interrogator's
field, and may reissue the ChangeEAS command.
Upon receiving a valid ChangeEAS command a G2X will perform the commanded
set/reset operation of the EAS_Alarm-Bit.
If EAS-Bit is set, the EAS_Alarm command will be available after the next power up and
reply the 64 bit EAS code upon execution. Otherwise the EAS_Alarm command will be
ignored.
Table 23. ChangeEAS command
Command
ChangeEas
RN
CRC-16
# of bits
16
1
16
16
description
11100000
00000011
1 ... set EAS system bit
0 ... reset EAS system bit
handle
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Table 24. G2X reply to a successful ChangeEAS command
Header
RN
CRC-16
# of bits
description
1
0
16
16
-
handle
Table 25. ChangeEAS command-response table
Starting State
Condition
Response
Next State
ready
ready
all
all
–
–
arbitrate, reply,
acknowledged
arbitrate
open
all
–
open
secured
valid handle
Backscatter handle,
when done
secured
invalid handle
all
–
secured
killed
killed
–
Starting State
Condition
Response
Next State
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15.12.4 EAS_Alarm
EAS_Alarm is a custom command causing the G2X to immediately backscatter an
EAS-Alarmcode, when EAS ALARM bit is set without any delay caused by Select, Query
and without the need for a backend database.
The EAS feature of the G2X is available after enabling it by sending a ChangeEAS
command described in Section 15.12.3 “ChangeEAS”. With an EAS-Alarm bit set to '1' the
G2X will reply to an EAS_Alarm command by backscattering a fixed 64 bit alarm code. A
G2X will reply to an EAS_Alarm command from the ready state only.
If the EAS-Alarm bit is reset ('0') by sending a ChangeEAS command in the password
protected Secure state the G2X will not reply to an EAS_Alarm command.
The EAS_Alarm command is structured as following:
• 16 bit command
• 16 bit inverted command
• DR (TRcal divide ratio) sets the T=>R link frequency as described in EPCglobal Spec.
6.3.1.2.8 and Table 6.9.
• M (cycles per symbol) sets the T=>R data rate and modulation format as shown in
EPCglobal Spec. Table 6.10.
• TRext chooses whether the T=>R preamble is prepended with a pilot tone as
described in EPCglobal Spec. 6.3.1.3.
A preamble must be prepended the EAS_Alarm command according EPCglobal Spec,
6.3.1.2.8.
Upon receiving an EAS_Alarm command the tag loads the CRC5 register with 01001b
and backscatters the 64 bit alarm code accordingly. The reader is now able to calculate
the CRC5 over the backscattered 64 bits received to verify the received code.
Table 26. EAS_Alarm command
Command Inv_Command DR
M
TRext
CRC-16
# of bits
16
16
1
2
1
16
-
description 11100000
00011111
11111011
0: DR=8
00: M=1
0: No pilot
tone
00000100
1: DR=64/3 01: M=2
10: M=4
1: Use pilot
tone
11: M=8
Table 27. G2X reply to a successful EAS_Alarm command
Header
EAS Code
# of bits
1
0
64
description
CRC5 (MSB)
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Table 28. Eas_Alarm command-response table
Starting State
Condition
Response
Next State
ready
EAS-bit is set and
non-zero access
password
Backscatter Alarm
code
ready
arbitrate, reply,
acknowledged
EAS-bit is set and
non-zero access
password
–
arbitrate
open
open
EAS-bit is set and
non-zero access
password
secured
killed
EAS-bit is set and
non-zero access
password
secured
killed
EAS-bit is set and
non-zero access
password
–
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15.12.5 Calibrate
After execution of the custom Calibrate command the G2X will continuously backscatter
the user memory content in an infinite loop. The G2XL will continuously backscatter zeros.
This command can be used for frequency spectrum measurements. Calibrate can only be
executed from the Secure state with an non-zero Access Password set otherwise the
command will be ignored.
The Calibrate command includes a CRC-16 calculated over the whole command, the
handle and a prepended frame-sync.
Table 29. Calibrate command
Command
16
RN16
16
CRC-16
# of bits
16
-
description
11100000 00000101
handle
Table 30. G2X reply to a successful Calibrate command
Header
Infinite repeat
512 (looped)
User memory data[1]
zeros[2]
# of bits
1
0
description
[1] G2XM
[2] G2XL
Table 31. Calibrate command-response table
Starting State
Condition
Response
Next State
ready
ready
all
all
–
–
arbitrate, reply,
acknowledged
arbitrate
secured
nonzero access
password
Backscatter infinite
_
access password is
zero
–
–
secured
killed
killed
all
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16. Support information
16.1 CRC Calculation EXAMPLE
Old RN = 3D5Bh
Table 32. Practical example of CRC calculation for a 'Req_RN' command by the reader
CRC Calculated @ Reader
F
F
F
E
C
8
F
F
F
F
F
F
E
C
8
1
2
4
9
3
7
F
F
F
E
C
8
0
1
2
5
F
F
F
D
9
0
2
5
9
3
7
E
F
E
E
C
9
0
1
2
4
B
4
8
0
F
E
C
9
3
7
F
E
9
A
4
8
1
2
5
A
4
9
2
4
8
1
3
6
C
1
1
0
0
0
0
0
1
0
0
1
1
1
1
0
1
0
1
0
1
1
0
1
1
0
1
2
5
A
4
9
3
7
E
D
A
5
B
7
E
D
A
4
-> ones complement:
B
A
F
3
=> Command-Sequence: C1 3D 5B BA F3 hex
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Table 33. Practical example of CRC calculation for a 'Req_RN' command by the reader
CRC Calculated @ Tag
F
F
F
E
C
8
0
1
2
5
A
4
9
3
7
E
D
A
5
B
7
E
D
A
4
9
2
5
A
4
8
0
1
3
7
E
C
8
0
0
1
F
F
F
F
F
F
E
C
8
1
2
4
9
3
7
F
F
F
E
C
8
0
1
2
5
A
4
8
1
2
4
9
2
5
B
7
E
D
B
6
D
F
F
F
D
9
0
2
5
9
3
7
E
F
E
E
C
9
0
1
2
4
B
4
8
0
3
5
8
2
5
B
7
F
C
A
6
C
B
5
9
0
F
E
C
9
3
7
F
E
9
A
4
8
1
2
5
A
4
9
2
4
8
1
3
6
C
9
3
7
F
E
C
8
0
1
3
7
E
D
B
7
F
1
1
0
0
0
0
0
1
0
0
1
1
1
1
0
1
0
1
0
1
1
0
1
1
1
0
1
1
1
0
1
0
1
1
1
1
0
0
1
1
-> Residue OK
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17. Abbreviations
Table 34. Abbreviations
Acronym
CRC
Description
Cyclic redundancy check
Continuos wave
CW
EEPROM
EPC
Electrically Erasable Programmable Read Only Memory
Electronic Product Code (containing Header, Domain Manager, Object Class
and Serial Number)
FCS
FM0
G2
Flip Chip Strap
Bi phase space modulation
Generation 2
HBM
IC
Human Body Model
Integrated Circuit
LSB
MSB
NRZ
RF
Least Significant Byte/Bit
Most Significant Byte/Bit
Non-Return to Zero coding
Radio Frequency
RTF
Tari
Reader Talks First
Type A Reference Interval (ISO 18000-6)
Ultra High Frequency
Value in binary notation
Value in hexadecimal notation
UHF
Xxb
xxhex
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18. References
[1] EPCglobal: EPC Radio-Frequency Identity Protocols Class-1 Generation-2 UHF
RFID Protocol for Communications at 860 MHz – 960 MHz, Version 1.1.0
(December 17, 2005)
[2] EPCglobal: EPC Tag Data Standards
[3] EPCglobal (2004): FMCG RFID Physical Requirements Document (draft)
[4] EPCglobal (2004): Class-1 Generation-2 UHF RFID Implementation Reference
(draft)
[5] European Telecommunications Standards Institute (ETSI), EN 302 208:
Electromagnetic compatibility and radio spectrum matters (ERM) – Radio-frequency
identification equipment operating in the band 865 MHz to 868 MHz with power
levels up to 2 W, Part 1 – Technical characteristics and test methods
[6] European Telecommunications Standards Institute (ETSI), EN 302 208:
Electromagnetic compatibility and radio spectrum matters (ERM) – Radio-frequency
identification equipment operating in the band 865 MHz to 868 MHz with power
levels up to 2 W, Part 2 – Harmonized EN under article 3.2 of the R&TTE directive
[7] [CEPT1]: CEPT REC 70-03 Annex 1
[8] [ETSI1]: ETSI EN 330 220-1, 2
[9] [ETSI3]: ETSI EN 302 208-1, 2 V<1.1.1> (2004-09-Electromagnetic compatibility
And Radio spectrum Matters (ERM) Radio Frequency Identification Equipment
operating in the band 865 - MHz to 868 MHz with power levels up to 2 W Part 1:
Technical characteristics and test methods.
[10] [FCC1]: FCC 47 Part 15 Section 247
[11] ISO/IEC Directives, Part 2: Rules for the structure and drafting of International
Standards
[12] ISO/IEC 3309: Information technology – Telecommunications and information
exchange between systems – High-level data link control (HDLC) procedures –
Frame structure
[13] ISO/IEC 15961: Information technology, Automatic identification and data capture –
Radio frequency identification (RFID) for item management – Data protocol:
application interface
[14] ISO/IEC 15962: Information technology, Automatic identification and data capture
techniques – Radio frequency identification (RFID) for item management – Data
protocol: data encoding rules and logical memory functions
[15] ISO/IEC 15963: Information technology — Radio frequency identification for item
management — Unique identification for RF tags
[16] ISO/IEC 18000-1: Information technology — Radio frequency identification for item
management — Part 1: Reference architecture and definition of parameters to be
standardized
[17] ISO/IEC 18000-6: Information technology automatic identification and data capture
techniques — Radio frequency identification for item management air interface —
Part 6: Parameters for air interface communications at 860–960 MHz
[18] ISO/IEC 19762: Information technology AIDC techniques – Harmonized vocabulary
– Part 3: radio-frequency identification (RFID)
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SL3ICS1002/1202
NXP Semiconductors
UCODE G2XM and G2XL
[19] U.S. Code of Federal Regulations (CFR), Title 47, Chapter I, Part 15:
Radio-frequency devices, U.S. Federal Communications Commission.
[20] Data sheet - Delivery type description – General specification for 8” wafer on
UV-tape with electronic fail die marking, BL-ID document number: 1093**1
[21] Data sheet - Flip chip strap - FCS2, General packing specification, BL-ID document
number: 1738**
1. ** ... document version number
139036
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2011. All rights reserved.
Product data sheet
COMPANY PUBLIC
Rev. 3.6 — 10 March 2011
139036
49 of 56
SL3ICS1002/1202
NXP Semiconductors
UCODE G2XM and G2XL
19. Revision history
Table 35. Revision history
Document ID
139036
Release date
Data sheet status
Change notice
Supersedes
20110310
Product data sheet
139035
Modifications:
• Table 5 “TSSOP8 Marking”: added
• Section 15.1.1.2 “Special behavior of user memory address 1Fh”: added
139035
20091102
Product data sheet
139034
139033
Modifications:
• Type SOT1122 added
• Figure 2 “Wafer layout and pinning information”: correction of drawing
139034
20090721
Product data sheet
Modifications:
• Table 11 “TSSOP8 characteristics” andTable 12 “Package interface characteristics”
:removed “Memory characteristics”
139033
20090605
Product data sheet
-
139032
139132
Modifications:
• This data sheet is a combination of data sheets SL3ICS1002 and SL3ICS1202
• New type FCS2 Aluminum, SOT1040AB2 added
• Section 8.1.6 “Fail die identification”: added
• Section 12 “Packing information”: edited
139032
20080716
Product data sheet
139031
Modifications:
• rephrasing of Section 2 “Features and benefits” on page 2
• added “calibrate command” in Section 2 “Features and benefits” on page 2
• redesign of Figure 1 “Block diagram of G2X IC” on page 4
• merging of Fig. 2 Pinning and Fig. 3 Wafer layout - see Figure 2 “Wafer layout and
pinning information” on page 5
• added type “FCS2 Polymer Strap - SOT1040AA1” in Section 4 “Ordering
information”, Section 6 “Wafer layout and pinning information”, Section 7 “Package
outline”, Section 8 “Mechanical specification”, Section 9 “Limiting values”, Section
10 “Characteristics”
• added Section 11 “Handling information for Flip Chip Strap (FCS2, SOT1040)” on
page 19
• added Section 12 “Packing information” on page 20
• added Table 13 “Symbol description” on page 22
• correction of Table 16 “Memory map” on page 30
• removed “ongoing” in 32 bit ongoing in Section 2.1 and Table 15 “G2X memory
sections”
139031
20080428
Product data sheet
139030
139036
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© NXP B.V. 2011. All rights reserved.
Product data sheet
COMPANY PUBLIC
Rev. 3.6 — 10 March 2011
139036
50 of 56
SL3ICS1002/1202
NXP Semiconductors
UCODE G2XM and G2XL
Table 35. Revision history …continued
Document ID
Release date
Data sheet status
Change notice
Supersedes
Modifications:
• update of Table 1 “Ordering information” on page 3
• added Section 7 “Package outline” on page 7
• added Section 8.1.7 “Map file distribution” on page 15
• added Table 9 “Limiting values TSSOP8 [1][2]” on page 14
• added room temperature in Table 11 “Memory characteristics” on page 15
• added Section 10.2 “TSSOP8 characteristics” on page 17
• update of the “EPCglobal compliance and interoperability certification” in Section 13.4 “Air
interface standards” on page 23
• correction of “(excluding 16 bit CRC-16 and 16 bit PC) in Table 15 “G2X memory sections” on page
29
• correction of Initials in “tag mask designer” in Table 16 “Memory map” on page 30
• removed the sentence “The ChangeEAS custom command will toggle the state of the EAS-Alarm
bit located in the EEprom” in Section 15.12.3 “ChangeEAS” on page 40.
• added description of ChangeEAS in Table 23 “ChangeEAS command” on page 40
139030
20071221
Product data sheet
-
139011
139010
-
Modifications:
• change of product status
• general update
139011
20070910
Objective data sheet
-
Modifications:
• removed double section Change EAS, EAS Alarm, Chapter 12.11.7
• changed “Reader” to “Tag”
139010
20070612
Objective data sheet
-
• initial version
139036
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© NXP B.V. 2011. All rights reserved.
Product data sheet
COMPANY PUBLIC
Rev. 3.6 — 10 March 2011
139036
51 of 56
SL3ICS1002/1202
NXP Semiconductors
UCODE G2XM and G2XL
20. Legal information
20.1 Data sheet status
Document status[1][2]
Product status[3]
Development
Definition
Objective [short] data sheet
This document contains data from the objective specification for product development.
This document contains data from the preliminary specification.
This document contains the product specification.
Preliminary [short] data sheet Qualification
Product [short] data sheet Production
[1]
[2]
[3]
Please consult the most recently issued document before initiating or completing a design.
The term ‘short data sheet’ is explained in section “Definitions”.
The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status
information is available on the Internet at URL http://www.nxp.com.
malfunction of an NXP Semiconductors product can reasonably be expected
20.2 Definitions
to result in personal injury, death or severe property or environmental
damage. NXP Semiconductors accepts no liability for inclusion and/or use of
NXP Semiconductors products in such equipment or applications and
therefore such inclusion and/or use is at the customer’s own risk.
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences of
use of such information.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is intended
for quick reference only and should not be relied upon to contain detailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local NXP Semiconductors sales
office. In case of any inconsistency or conflict with the short data sheet, the
full data sheet shall prevail.
Customers are responsible for the design and operation of their applications
and products using NXP Semiconductors products, and NXP Semiconductors
accepts no liability for any assistance with applications or customer product
design. It is customer’s sole responsibility to determine whether the NXP
Semiconductors product is suitable and fit for the customer’s applications and
products planned, as well as for the planned application and use of
customer’s third party customer(s). Customers should provide appropriate
design and operating safeguards to minimize the risks associated with their
applications and products.
Product specification — The information and data provided in a Product
data sheet shall define the specification of the product as agreed between
NXP Semiconductors and its customer, unless NXP Semiconductors and
customer have explicitly agreed otherwise in writing. In no event however,
shall an agreement be valid in which the NXP Semiconductors product is
deemed to offer functions and qualities beyond those described in the
Product data sheet.
NXP Semiconductors does not accept any liability related to any default,
damage, costs or problem which is based on any weakness or default in the
customer’s applications or products, or the application or use by customer’s
third party customer(s). Customer is responsible for doing all necessary
testing for the customer’s applications and products using NXP
Semiconductors products in order to avoid a default of the applications and
the products or of the application or use by customer’s third party
customer(s). NXP does not accept any liability in this respect.
20.3 Disclaimers
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) will cause permanent
damage to the device. Limiting values are stress ratings only and (proper)
operation of the device at these or any other conditions above those given in
the Recommended operating conditions section (if present) or the
Characteristics sections of this document is not warranted. Constant or
repeated exposure to limiting values will permanently and irreversibly affect
the quality and reliability of the device.
Limited warranty and liability — Information in this document is believed to
be accurate and reliable. However, NXP Semiconductors does not give any
representations or warranties, expressed or implied, as to the accuracy or
completeness of such information and shall have no liability for the
consequences of use of such information.
In no event shall NXP Semiconductors be liable for any indirect, incidental,
punitive, special or consequential damages (including - without limitation - lost
profits, lost savings, business interruption, costs related to the removal or
replacement of any products or rework charges) whether or not such
damages are based on tort (including negligence), warranty, breach of
contract or any other legal theory.
Terms and conditions of commercial sale — NXP Semiconductors
products are sold subject to the general terms and conditions of commercial
sale, as published at http://www.nxp.com/profile/terms, unless otherwise
agreed in a valid written individual agreement. In case an individual
agreement is concluded only the terms and conditions of the respective
agreement shall apply. NXP Semiconductors hereby expressly objects to
applying the customer’s general terms and conditions with regard to the
purchase of NXP Semiconductors products by customer.
Notwithstanding any damages that customer might incur for any reason
whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards
customer for the products described herein shall be limited in accordance
with the Terms and conditions of commercial sale of NXP Semiconductors.
Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
No offer to sell or license — Nothing in this document may be interpreted or
construed as an offer to sell products that is open for acceptance or the grant,
conveyance or implication of any license under any copyrights, patents or
other industrial or intellectual property rights.
Export control — This document as well as the item(s) described herein
may be subject to export control regulations. Export might require a prior
authorization from national authorities.
Suitability for use — NXP Semiconductors products are not designed,
authorized or warranted to be suitable for use in life support, life-critical or
safety-critical systems or equipment, nor in applications where failure or
139036
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2011. All rights reserved.
Product data sheet
COMPANY PUBLIC
Rev. 3.6 — 10 March 2011
139036
52 of 56
SL3ICS1002/1202
NXP Semiconductors
UCODE G2XM and G2XL
Quick reference data — The Quick reference data is an extract of the
product data given in the Limiting values and Characteristics sections of this
document, and as such is not complete, exhaustive or legally binding.
whenever customer uses the product for automotive applications beyond
NXP Semiconductors’ specifications such use shall be solely at customer’s
own risk, and (c) customer fully indemnifies NXP Semiconductors for any
liability, damages or failed product claims resulting from customer design and
use of the product for automotive applications beyond NXP Semiconductors’
standard warranty and NXP Semiconductors’ product specifications.
Non-automotive qualified products — Unless this data sheet expressly
states that this specific NXP Semiconductors product is automotive qualified,
the product is not suitable for automotive use. It is neither qualified nor tested
in accordance with automotive testing or application requirements. NXP
Semiconductors accepts no liability for inclusion and/or use of
20.4 Trademarks
non-automotive qualified products in automotive equipment or applications.
In the event that customer uses the product for design-in and use in
automotive applications to automotive specifications and standards, customer
(a) shall use the product without NXP Semiconductors’ warranty of the
product for such automotive applications, use and specifications, and (b)
Notice: All referenced brands, product names, service names and trademarks
are the property of their respective owners.
UCODE — is a trademark of NXP B.V.
21. Contact information
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
139036
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© NXP B.V. 2011. All rights reserved.
Product data sheet
COMPANY PUBLIC
Rev. 3.6 — 10 March 2011
139036
53 of 56
SL3ICS1002/1202
NXP Semiconductors
UCODE G2XM and G2XL
22. Tables
Table 1. Ordering information G2XM . . . . . . . . . . . . . . . .3
Table 2. Ordering information G2XL. . . . . . . . . . . . . . . . .3
Table 3. Pin description of SOT1040-1 . . . . . . . . . . . . . .6
Table 4. Pin description of TSSOP8. . . . . . . . . . . . . . . . .7
Table 5. TSSOP8 Marking . . . . . . . . . . . . . . . . . . . . . . . .8
Table 6. Pin description of SOT1122 . . . . . . . . . . . . . . .10
Table 7. SOT1122 Marking. . . . . . . . . . . . . . . . . . . . . . .10
Table 8. Mechanical properties SOT1040AA1 . . . . . . . .16
Table 9. Mechanical properties SOT1040AB2 . . . . . . . .16
Table 10. Limiting values[1][2] . . . . . . . . . . . . . . . . . . . . . .17
Table 11. Wafer characteristics . . . . . . . . . . . . . . . . . . . .18
Table 12. Package interface characteristics. . . . . . . . . . .18
Table 13. Symbol description . . . . . . . . . . . . . . . . . . . . . .22
Table 14. Operating distances for UCODE G2X based
tags and labels in released frequency bands . .22
Table 15. G2X memory sections . . . . . . . . . . . . . . . . . . .29
Table 16. Memory map. . . . . . . . . . . . . . . . . . . . . . . . . . .30
Table 17. ReadProtect command. . . . . . . . . . . . . . . . . . .36
Table 18. G2X reply to a successful ReadProtect
procedure . . . . . . . . . . . . . . . . . . . . . . . . . . . . .37
Table 19. ReadProtect command-response table . . . . . .37
Table 20. Reset ReadProtect command . . . . . . . . . . . . .39
Table 21. G2X reply to a successful Reset ReadProtect
command . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39
Table 22. Reset ReadProtect command-response
table . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39
Table 23. ChangeEAS command . . . . . . . . . . . . . . . . . . 40
Table 24. G2X reply to a successful ChangeEAS
command . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41
Table 25. ChangeEAS command-response table . . . . . . 41
Table 26. EAS_Alarm command . . . . . . . . . . . . . . . . . . . 42
Table 27. G2X reply to a successful EAS_Alarm
command . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 42
Table 28. Eas_Alarm command-response table. . . . . . . 43
Table 29. Calibrate command . . . . . . . . . . . . . . . . . . . . . 44
Table 30. G2X reply to a successful Calibrate
command . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 44
Table 31. Calibrate command-response table. . . . . . . . . 44
Table 32. Practical example of CRC calculation for a
'Req_RN' command by the reader . . . . . . . . . 45
Table 33. Practical example of CRC calculation for a
'Req_RN' command by the reader. . . . . . . . . . 46
Table 34. Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . 47
Table 35. Revision history . . . . . . . . . . . . . . . . . . . . . . . . 50
23. Figures
Fig 1. Block diagram of G2X IC . . . . . . . . . . . . . . . . . . . .4
Fig 2. Wafer layout and pinning information . . . . . . . . . .5
Fig 3. Pinning - SOT1040-1. . . . . . . . . . . . . . . . . . . . . . .6
Fig 4. Package TSSOP8, SOT505-1 . . . . . . . . . . . . . . . .7
Fig 5. Package outline SOT1122 . . . . . . . . . . . . . . . . . . .9
Fig 6. Package FCS2, SOT1040AA1, 12 mm Cu
metallization. . . . . . . . . . . . . . . . . . . . . . . . . . . . .11
Fig 7. Package FCS2, SOT1040AB2, 20 mm Al
metallization. . . . . . . . . . . . . . . . . . . . . . . . . . . . .12
Fig 8. Splicing drawing SOT1040-1 . . . . . . . . . . . . . . . .13
Fig 9. G2X TID memory structure . . . . . . . . . . . . . . . . .29
139036
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© NXP B.V. 2011. All rights reserved.
Product data sheet
COMPANY PUBLIC
Rev. 3.6 — 10 March 2011
139036
54 of 56
SL3ICS1002/1202
NXP Semiconductors
UCODE G2XM and G2XL
24. Contents
1
General description . . . . . . . . . . . . . . . . . . . . . . 1
14
14.1
Physical layer and signaling . . . . . . . . . . . . . 24
Reader to G2X communication . . . . . . . . . . . 24
Physical layer. . . . . . . . . . . . . . . . . . . . . . . . . 24
Modulation . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
Data encoding . . . . . . . . . . . . . . . . . . . . . . . . 24
Data rates . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
RF envelope for R=>T . . . . . . . . . . . . . . . . . . 24
Interrogator power-up/down waveform . . . . . 24
Preamble and frame-sync . . . . . . . . . . . . . . . 24
G2X to reader communication . . . . . . . . . . . . 25
Modulation . . . . . . . . . . . . . . . . . . . . . . . . . . 25
Data encoding . . . . . . . . . . . . . . . . . . . . . . . . 25
2
Features and benefits . . . . . . . . . . . . . . . . . . . . 2
Key features . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
Key benefits . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
Custom commands. . . . . . . . . . . . . . . . . . . . . . 2
14.1.1
14.1.2
14.1.3
14.1.4
14.1.5
14.1.6
14.1.7
14.2
2.1
2.2
2.3
3
4
5
Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
Ordering information. . . . . . . . . . . . . . . . . . . . . 3
Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 4
6
6.1
6.2
Wafer layout and pinning information . . . . . . . 5
Wafer layout . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
FCS2 layout strap and pinning . . . . . . . . . . . . . 6
14.2.1
14.2.2
14.2.2.1 FM0 baseband. . . . . . . . . . . . . . . . . . . . . . . . 25
14.2.2.2 FM0 Preamble . . . . . . . . . . . . . . . . . . . . . . . . 25
14.2.2.3 Miller-modulated sub carrier . . . . . . . . . . . . . 25
14.2.2.4 Miller sub carrier preamble . . . . . . . . . . . . . . 25
7
Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 7
8
8.1
Mechanical specification . . . . . . . . . . . . . . . . 14
Wafer specification . . . . . . . . . . . . . . . . . . . . . 14
Wafer . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
Wafer backside. . . . . . . . . . . . . . . . . . . . . . . . 14
Chip dimensions. . . . . . . . . . . . . . . . . . . . . . . 14
Passivation on front . . . . . . . . . . . . . . . . . . . . 14
Au bump . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Fail die identification . . . . . . . . . . . . . . . . . . . 15
Map file distribution. . . . . . . . . . . . . . . . . . . . . 15
SOT1040 specification . . . . . . . . . . . . . . . . . . 16
8.1.1
8.1.2
8.1.3
8.1.4
8.1.5
8.1.6
8.1.7
8.2
14.2.3
14.3
14.3.1
14.3.2
14.3.3
14.4
Data rates . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
Link timing . . . . . . . . . . . . . . . . . . . . . . . . . . . 26
Regeneration time . . . . . . . . . . . . . . . . . . . . . 26
Start-up time. . . . . . . . . . . . . . . . . . . . . . . . . . 26
Persistence time . . . . . . . . . . . . . . . . . . . . . . 26
Bit and byte ordering . . . . . . . . . . . . . . . . . . . 26
Data integrity . . . . . . . . . . . . . . . . . . . . . . . . . 27
CRC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27
14.5
14.6
9
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . 17
15
15.1
15.1.1
TAG selection, inventory and access . . . . . . 28
G2X Memory . . . . . . . . . . . . . . . . . . . . . . . . . 29
Memory map . . . . . . . . . . . . . . . . . . . . . . . . . 30
10
10.1
10.2
Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . 18
Wafer characteristics . . . . . . . . . . . . . . . . . . . 18
Package characteristics . . . . . . . . . . . . . . . . . 18
15.1.1.1 User memory (only G2XM) . . . . . . . . . . . . . . 31
15.1.1.2 Special behavior of user memory address 1Fh 31
15.1.1.3 Supported EPC types . . . . . . . . . . . . . . . . . . 31
11
Handling information for Flip Chip Strap
(FCS2, SOT1040) . . . . . . . . . . . . . . . . . . . . . . . 19
Storage conditions . . . . . . . . . . . . . . . . . . . . . 19
Assembly conditions. . . . . . . . . . . . . . . . . . . . 19
General assembly recommendations . . . . . . . 19
Antenna bonding . . . . . . . . . . . . . . . . . . . . . . 19
Label converting . . . . . . . . . . . . . . . . . . . . . . . 19
11.1
11.2
11.2.1
11.2.2
11.2.3
15.2
Sessions, selected and inventoried flags. . . . 32
G2X States and slot counter . . . . . . . . . . . . . 32
G2X State Diagram . . . . . . . . . . . . . . . . . . . . 32
Managing tag populations . . . . . . . . . . . . . . . 32
Selecting tag populations. . . . . . . . . . . . . . . . 32
Inventorying tag populations . . . . . . . . . . . . . 32
Accessing individual tags. . . . . . . . . . . . . . . . 32
Interrogator commands and tag replies . . . . . 32
Commands. . . . . . . . . . . . . . . . . . . . . . . . . . . 32
State transition tables. . . . . . . . . . . . . . . . . . . 33
Command response tables . . . . . . . . . . . . . . 33
Example data-flow exchange. . . . . . . . . . . . . 33
Mandatory Select Commands . . . . . . . . . . . . 33
Select. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34
Mandatory Inventory Commands. . . . . . . . . . 34
Query . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34
QueryAdjust . . . . . . . . . . . . . . . . . . . . . . . . . . 34
QueryRep. . . . . . . . . . . . . . . . . . . . . . . . . . . . 34
15.2.1
15.2.2
15.3
15.4
15.5
12
Packing information . . . . . . . . . . . . . . . . . . . . 20
Flip Chip Strap (FCS2, SOT1040) . . . . . . . . . 20
Wafer . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
TSSOP . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
SOT1122 . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
15.6
15.7
12.1
12.2
12.3
12.4
15.7.1
15.7.2
15.7.3
15.7.4
15.8
15.8.1
15.9
15.9.1
15.9.2
15.9.3
13
Functional description . . . . . . . . . . . . . . . . . . 21
Power transfer . . . . . . . . . . . . . . . . . . . . . . . . 21
Data transfer. . . . . . . . . . . . . . . . . . . . . . . . . . 21
Reader to G2X Link . . . . . . . . . . . . . . . . . . . . 21
G2X to reader Link . . . . . . . . . . . . . . . . . . . . . 21
Operating distances . . . . . . . . . . . . . . . . . . . . 22
Air interface standards . . . . . . . . . . . . . . . . . . 23
13.1
13.2
13.2.1
13.2.2
13.3
13.4
continued >>
139036
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2011. All rights reserved.
Product data sheet
COMPANY PUBLIC
Rev. 3.6 — 10 March 2011
139036
55 of 56
SL3ICS1002/1202
NXP Semiconductors
UCODE G2XM and G2XL
15.9.4
15.9.5
15.10
ACK . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34
NAK . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34
Mandatory Access Commands. . . . . . . . . . . . 35
15.10.1 REQ_RN. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35
15.10.2 READ . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35
15.10.3 WRITE . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35
15.10.4 KILL . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35
15.10.5 LOCK . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35
15.11
15.11.1 Access . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35
15.12 Custom Commands . . . . . . . . . . . . . . . . . . . . 36
Optional Access Command . . . . . . . . . . . . . . 35
15.12.1 ReadProtect . . . . . . . . . . . . . . . . . . . . . . . . . . 36
15.12.2 Reset ReadProtect . . . . . . . . . . . . . . . . . . . . . 38
15.12.3 ChangeEAS . . . . . . . . . . . . . . . . . . . . . . . . . . 40
15.12.4 EAS_Alarm . . . . . . . . . . . . . . . . . . . . . . . . . . 42
15.12.5 Calibrate . . . . . . . . . . . . . . . . . . . . . . . . . . . . 44
16
16.1
17
Support information . . . . . . . . . . . . . . . . . . . . 45
CRC Calculation EXAMPLE. . . . . . . . . . . . . . 45
Abbreviations. . . . . . . . . . . . . . . . . . . . . . . . . . 47
References . . . . . . . . . . . . . . . . . . . . . . . . . . . . 48
Revision history. . . . . . . . . . . . . . . . . . . . . . . . 50
18
19
20
Legal information. . . . . . . . . . . . . . . . . . . . . . . 52
Data sheet status . . . . . . . . . . . . . . . . . . . . . . 52
Definitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . 52
Disclaimers. . . . . . . . . . . . . . . . . . . . . . . . . . . 52
Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 53
20.1
20.2
20.3
20.4
21
22
23
24
Contact information. . . . . . . . . . . . . . . . . . . . . 53
Tables . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 54
Figures . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 54
Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 55
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
© NXP B.V. 2011.
All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
Date of release: 10 March 2011
139036
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