SL3S1203FUD/BG,005 [NXP]
SL3S1203_1213 - UCODE G2iL and G2iL+;型号: | SL3S1203FUD/BG,005 |
厂家: | NXP |
描述: | SL3S1203_1213 - UCODE G2iL and G2iL+ |
文件: | 总36页 (文件大小:330K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
SL3S1203_1213
UCODE G2iL and G2iL+
Rev. 4.3 — 27 November 2013
178843
Product data sheet
COMPANY PUBLIC
1. General description
NXP’s UCODE G2iL series transponder ICs offer leading-edge read range and support
industry-first features such as a Tag Tamper Alarm, Data Transfer, Digital Switch, and
advanced privacy-protection modes.
Very high chip sensitivity (18 dBm) enables longer read ranges with simple, single-port
antenna designs. When connected to a power supply, the READ as well as the WRITE
range can be boosted to a sensitivity of 27 dBm. In fashion and retail the UCODE G2iL
series improve read rates and provide for theft deterrence. For consumer electronics the
UCODE G2iL series is suited for device configuration, activation, production control, and
PCB tagging. In authentication applications the transponders can be used to protect
brands and guard against counterfeiting. They can also be used to tag containers,
electronic vehicles, airline baggage, and more.
In addition to the EPC specifications the G2iL offers an integrated Product Status Flag
(PSF) feature and read protection of the memory content.
On top of the G2iL features the G2iL+ offers an integrated tag tamper alarm, RF field
detection, digital switch, external supply mode, read range reduction and data transfer
mode.
2. Features and benefits
2.1 Key features
UHF RFID Gen2 tag chip according EPCglobal v1.2.0 with 128 bit EPC memory
Memory read protection
Integrated Product Status Flag (PSF)
Tag tamper alarm
RF field detection
Digital switch
Data transfer mode
Real Read Range Reduction (Privacy Mode)
External supply mode where both the READ & WRITE range are boosted to -27dBm
2.1.1 Memory
128-bit of EPC memory
64-bit Tag IDentifier (TID) including 32-bit factory locked unique serial number
32-bit kill password to permanently disable the tag
32-bit access password to allow a transition into the secured state
SL3S1203_1213
NXP Semiconductors
UCODE G2iL and G2iL+
Data retention: 20 years
Broad international operating frequency: from 840 MHz to 960 MHz
Long read/write ranges due to extremely low power design
Reliable operation of multiple tags due to advanced anti-collision
READ protection
WRITE Lock
Wide specified temperature range: 40 C up to +85 C
2.2 Key benefits
2.2.1 End user benefit
Prevention of unauthorized memory access through read protection
Indication of tag tampering attempt by use of the tag tamper alarm feature
Electronic device configuration and / or activation by the use of the digital switch / data
transfer mode
Theft deterrence supported by the PSF feature (PSF alarm or EPC code)
Small label sizes, long read ranges due to high chip sensitivity
Product identification through unalterable extended TID range, including a 32-bit serial
number
Reliable operation in dense reader and noisy environments through high interference
suppression
2.2.2 Antenna design benefits
High sensitivity enables small and cost efficient antenna designs
Low Q-Value eases broad band antenna design for global usage
2.2.3 Label manufacturer benefit
Consistent performance on different materials due to low Q-factor
Ease of assembly and high assembly yields through large chip input capacitance
Fast first WRITE of the EPC memory for fast label initialization
2.3 Custom commands
PSF Alarm
Built-in PSF (Product Status Flag), enables the UHF RFID tag to be used as EAS tag
(Electronic Article Surveillance) tag without the need for a back-end data base.
Read Protect
Protects all memory content including CRC16 from unauthorized reading.
ChangeConfig
Configures the additional features of the chip like external supply mode, tamper alarm,
digital switch, read range reduction or data transfer.
The UCODE G2iL is equipped with a number of additional features and custom
commands. Nevertheless, the chip is designed in a way standard EPCglobal
READ/WRITE/ACCESS commands can be used to operate the features. No custom
commands are needed to take advantage of all the features in case of unlocked EPC
memory.
SL3S1203_1213
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2013. All rights reserved.
Product data sheet
COMPANY PUBLIC
Rev. 4.3 — 27 November 2013
178843
2 of 36
SL3S1203_1213
NXP Semiconductors
UCODE G2iL and G2iL+
3. Applications
3.1 Markets
Fashion (Apparel and footwear)
Retail
Electronics
Fast Moving Consumer Goods
Asset management
Electronic Vehicle Identification
3.2 Applications
Supply chain management
Item level tagging
Pallet and case tracking
Container identification
Product authentication
PCB tagging
Cost efficient, low level seals
Wireless firmware download
Wireless product activation
Outside above mentioned applications, please contact NXP Semiconductors for support.
4. Ordering information
Table 1.
Ordering information
Type number
Package
Name
Wafer
IC type
G2iL
Description
Version
SL3S1203FUF
SL3S1213FUF
SL3S1203FUD/BG
bumped die on sawn 8” 75 m wafer
bumped die on sawn 8” 75 m wafer
not applicable
not applicable
not applicable
Wafer
G2iL+
G2iL
Wafer
bumped die on sawn 8” 120 m wafer,
7 m Polyimide spacer
SL3S1213FUD/BG
SL3S1203FTB0
Wafer
G2iL+
G2iL
bumped die on sawn 8” 120 m wafer,
7 m Polyimide spacer
not applicable
SOT886F1
XSON6
plastic extremely thin small outline package;
no leads; 6 terminals; body 1 1.45 0.5 mm
5. Marking
Table 2.
Marking codes
Type number
Marking code
Comment
Version
SL3S1203FTB0
UN
UCODE G2iL
SOT886
SL3S1203_1213
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2013. All rights reserved.
Product data sheet
COMPANY PUBLIC
Rev. 4.3 — 27 November 2013
178843
3 of 36
SL3S1203_1213
NXP Semiconductors
UCODE G2iL and G2iL+
6. Block diagram
The SL3S12x3 IC consists of three major blocks:
- Analog Interface
- Digital Control
- EEPROM
The analog part provides stable supply voltage and demodulates data received from the
reader for being processed by the digital part. Further, the modulation transistor of the
analog part transmits data back to the reader.
The digital section includes the state machines, processes the protocol and handles
communication with the EEPROM, which contains the EPC and the user data.
ANALOG
RF INTERFACE
DIGITAL CONTROL
ANTICOLLISION
EEPROM
VREG
PAD
VDD
RECT
DEMOD
READ/WRITE
CONTROL
data
in
ANTENNA
ACCESS CONTROL
MEMORY
MOD
PAD
data
out
R/W
EEPROM INTERFACE
CONTROL
PAD
PAD
VDD
OUT
I/O
CONTROL
RF INTERFACE
CONTROL
I/O CONTROL
SEQUENCER
CHARGE PUMP
001aam226
Fig 1. Block diagram of G2iL IC
SL3S1203_1213
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2013. All rights reserved.
Product data sheet
COMPANY PUBLIC
Rev. 4.3 — 27 November 2013
178843
4 of 36
SL3S1203_1213
NXP Semiconductors
UCODE G2iL and G2iL+
7. Pinning information
OUT
RFN
SL3S12x3FTB0
RFP
n.c.
1
2
3
6
5
4
VDD
n.c.
VDD NXP trademark
RFP
RFN
OUT
001aan103
001aam529
Transparent top view
Fig 2. Pinning bare die
Fig 3. Pin configuration for SOT886
7.1 Pin description
Table 3.
Symbol
OUT
Pin description bare die
Description
output pin
RFN
grounded antenna connector
external supply
VDD
RFP
ungrounded antenna connector
Table 4.
Pin description SOT886
Pin
1
Symbol
RFP
n.c.
Description
ungrounded antenna connector
not connected
2
3
RFN
OUT
n.c.
grounded antenna connector
output pin
4
5
not connected
6
VDD
external supply
SL3S1203_1213
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2013. All rights reserved.
Product data sheet
COMPANY PUBLIC
Rev. 4.3 — 27 November 2013
178843
5 of 36
SL3S1203_1213
NXP Semiconductors
UCODE G2iL and G2iL+
8. Wafer layout
8.1 Wafer layout
(1)
OUT
RFN
(5)
Y
(4)
(6)
X
(7)
VDD
RFP
(8)
(2)
(3)
not to scale!
001aak871
(1) Die to Die distance (metal sealring - metal sealring) 21,4 m, (X-scribe line width: 15 m)
(2) Die to Die distance (metal sealring - metal sealring) 21,4 m, (Y-scribe line width: 15 m)
(3) Chip step, x-length: 485 m
(4) Chip step, y-length: 435 m
(5) Bump to bump distance X (OUT - RFN): 383 m
(6) Bump to bump distance Y (RFN - RFP): 333 m
(7) Distance bump to metal sealring X: 40,3 m (outer edge - top metal)
(8) Distance bump to metal sealring Y: 40,3 m
Bump size X x Y: 60 m x 60 m
Remark: OUT and VDD are used with G2iL+ only
Fig 4. G2iL wafer layout
SL3S1203_1213
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2013. All rights reserved.
Product data sheet
COMPANY PUBLIC
Rev. 4.3 — 27 November 2013
178843
6 of 36
SL3S1203_1213
NXP Semiconductors
UCODE G2iL and G2iL+
9. Mechanical specification
The UCODE G2iL/G2iL+ wafers are available in 75 m and 120 m thickness. The 75m
thick wafer allows ultra thin label design but require a proper tuning of the glue dispenser
during production. Because of the more robust structure of the 120m wafer, the wafer is
ideal for harsh applications. The 120 m thick wafer is also enhanced with 7m Polyimide
spacer allowing additional protection of the active circuit.
9.1 Wafer specification
See Ref. 20 “Data sheet - Delivery type description – General specification for 8” wafer on
UV-tape with electronic fail die marking, BU-ID document number: 1093**”.
9.1.1 Wafer
Table 5. Specifications
Wafer
Designation
each wafer is scribed with batch number
and wafer number
Diameter
200 mm (8”)
Thickness
SL3S12x3FUF
75 m 15 m
SL3S12x3FUD
Number of pads
Pad location
120 m 15 m
4
non diagonal/ placed in chip corners
Distance pad to pad RFN-RFP
Distance pad to pad OUT-RFN
Process
333.0 m
383.0 m
CMOS 0.14 m
25 wafers
139.351
Batch size
Potential good dies per wafer
Wafer backside
Material
Si
Treatment
ground and stress release
Ra max. 0.5 m, Rt max. 5 m
Roughness
Chip dimensions
Die size including scribe
Scribe line width:
0.485 mm 0.435 mm = 0.211 mm2
x-dimension = 15 m
y-dimension = 15 m
Passivation on front
Type
Sandwich structure
Material
PE-Nitride (on top)
Thickness
1.75 m total thickness of passivation
7 m 1 m (SL3S12x3FUD only)
Polyimide spacer
Au bump
Bump material
> 99.9 % pure Au
SL3S1203_1213
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2013. All rights reserved.
Product data sheet
COMPANY PUBLIC
Rev. 4.3 — 27 November 2013
178843
7 of 36
SL3S1203_1213
NXP Semiconductors
UCODE G2iL and G2iL+
Table 5. Specifications
Bump hardness
Bump shear strength
Bump height
35 – 80 HV 0.005
> 70 MPa
SL3S12x3FUF
SL3S12x3FUD
Bump height uniformity
within a die
18 m
25 m[1]
2 m
3 m
4 m
1.5 m
– within a wafer
– wafer to wafer
Bump flatness
Bump size
60 60 m
60 60 m
5 m
– RFP, RFN
– OUT, VDD
Bump size variation
[1] Because of the 7 m spacer, the bump will measure 18 m relative height protruding the spacer.
9.1.2 Fail die identification
No inkdots are applied to the wafer.
Electronic wafer mapping (SECS II format) covers the electrical test results and
additionally the results of mechanical/visual inspection.
See Ref. 20 “Data sheet - Delivery type description – General specification for 8” wafer on
UV-tape with electronic fail die marking, BU-ID document number: 1093**”
9.1.3 Map file distribution
See Ref. 20 “Data sheet - Delivery type description – General specification for 8” wafer on
UV-tape with electronic fail die marking, BU-ID document number: 1093**”
10. Functional description
10.1 Air interface standards
The UCODE G2iL fully supports all parts of the "Specification for RFID Air Interface
EPCglobal, EPC Radio-Frequency Identity Protocols, Class-1 Generation-2 UHF RFID,
Protocol for Communications at 860 MHz to 960 MHz, Version 1.2.0".
10.2 Power transfer
The interrogator provides an RF field that powers the tag, equipped with a UCODE G2iL.
The antenna transforms the impedance of free space to the chip input impedance in order
to get the maximum possible power for the G2iL on the tag. The G2iL+ can also be
supplied externally.
The RF field, which is oscillating on the operating frequency provided by the interrogator,
is rectified to provide a smoothed DC voltage to the analog and digital modules of the IC.
SL3S1203_1213
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2013. All rights reserved.
Product data sheet
COMPANY PUBLIC
Rev. 4.3 — 27 November 2013
178843
8 of 36
SL3S1203_1213
NXP Semiconductors
UCODE G2iL and G2iL+
The antenna that is attached to the chip may use a DC connection between the two
antenna pads. Therefore the G2iL also enables loop antenna design. Possible examples
of supported antenna structures can be found in the reference antenna design guide.
10.3 Data transfer
10.3.1 Reader to tag Link
An interrogator transmits information to the UCODE G2iL by modulating an UHF RF
signal. The G2iL receives both information and operating energy from this RF signal. Tags
are passive, meaning that they receive all of their operating energy from the interrogator's
RF waveform. In order to further improve the read range the UCODE G2iL+ can be
externally supplied as well so the energy to operate the chip does not need to be
transmitted by the reader.
An interrogator is using a fixed modulation and data rate for the duration of at least one
inventory round. It communicates to the G2iL by modulating an RF carrier using DSB-ASK
with PIE encoding.
For further details refer to Section 16, Ref. 1. Interrogator-to-tag (R=>T) communications.
10.3.2 Tag to reader Link
An interrogator receives information from a G2iL by transmitting an unmodulated RF
carrier and listening for a backscattered reply. The G2iL backscatters by switching the
reflection coefficient of its antenna between two states in accordance with the data being
sent. For further details refer to Section 16, Ref. 1, chapter 6.3.1.3.
The UCODE G2iL communicates information by backscatter-modulating the amplitude
and/or phase of the RF carrier. Interrogators shall be capable of demodulating either
demodulation type.
The encoding format, selected in response to interrogator commands, is either FM0
baseband or Miller-modulated subcarrier.
10.4 G2iL and G2iL+ differences
The UCODE G2iL is tailored for application where mainly EPC or TID number space is
needed. The G2iL+ in addition provides functionality such as tag tamper alarm, external
supply operation to further boost read/write range (external supply mode), a Privacy mode
reducing the read range or I/O functionality (data transfer to externally connected devices)
required.
The following table provides an overview of G2iL, G2iL+ special features.
Table 6.
Overview of G2iL and G2iL+ features
Features
G2iL
yes
yes
yes
yes
-
G2iL+
yes
Read protection (bankwise)
PSF (Built-in Product Status Flag)
Backscatter strength reduction
Real read range reduction
Digital switch / Digital input
External supply mode
yes
yes
yes
yes
-
yes
SL3S1203_1213
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2013. All rights reserved.
Product data sheet
COMPANY PUBLIC
Rev. 4.3 — 27 November 2013
178843
9 of 36
SL3S1203_1213
NXP Semiconductors
UCODE G2iL and G2iL+
Table 6.
Features
Overview of G2iL and G2iL+ features …continued
G2iL
G2iL+
yes
RF field detection
Data transfer
-
-
-
yes
Tag tamper alarm
yes
10.5 Supported commands
The G2iL supports all mandatory EPCglobal V1.2.0 commands.
In addition the G2iL supports the following optional commands:
• ACCESS
• Block Write (32 bit)
The G2iL features the following custom commands described more in detail later:
• ResetReadProtect
• ReadProtect
• ChangeEAS
• EAS_Alarm
(backward compatible to G2X)
(backward compatible to G2X)
(backward compatible to G2X)
(backward compatible to G2X)
(new with G2iL)
• ChangeConfig
10.6 G2iL, G2iL+ memory
The G2iL, G2iL+ memory is implemented according EPCglobal Class1Gen2 and
organized in three sections:
Table 7.
Name
G2iL memory sections
Size
Bank
00b
01b
01b
10b
Reserved memory (32 bit ACCESS and 32 bit KILL password)
EPC (excluding 16 bit CRC-16 and 16 bit PC)
G2iL Configuration Word
64 bit
128 bit
16 bit
64 bit
TID (including permalocked unique 32 bit serial number)
The logical address of all memory banks begin at zero (00h).
In addition to the three memory banks one configuration word to handle the G2iL specific
features is available at EPC bank 01 address 200h. The configuration word is described in
detail in Section 10.7.1 “ChangeConfig”.
Memory pages (16 bit words) pre-programmed to zero will not execute an erase cycle
before writing data to it. This approach accelerates initialization of the chip and enables
faster programming of the memory.
SL3S1203_1213
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2013. All rights reserved.
Product data sheet
COMPANY PUBLIC
Rev. 4.3 — 27 November 2013
178843
10 of 36
SL3S1203_1213
NXP Semiconductors
UCODE G2iL and G2iL+
10.6.1 G2iL, G2iL+ overall memory map
Table 8.
G2iL, G2iL+ overall memory map
Bank
address
Memory
address
Type
Content
Initial
Remark
Bank 00
00h to 1Fh
20h to 3Fh
00h to 0Fh
reserved
reserved
EPC
kill password
all 00h
all 00h
unlocked memory
unlocked memory
access password
CRC-16: refer to Ref. 16
Bank 01
EPC
memory mapped
calculated CRC
10h to 14h
15h
EPC
EPC
EPC
EPC
EPC
EPC
EPC
backscatter length
UMI
00110b
0b
unlocked memory
unlocked memory
hardwired to 0
unlocked memory
unlocked memory
indicator bit
16h
XPC indicator
0b
17h to 1Fh
20h to 9Fh
200h
numbering system indicator 00h
[1]
EPC
Bank 01
Config Word
tamper alarm flag
external supply flag or input 0b[4]
signal
0b[4]
201h
indicator bit
202h
EPC
EPC
EPC
EPC
EPC
EPC
EPC
EPC
EPC
EPC
EPC
EPC
EPC
EPC
TID
RFU
0b[4]
0b[4]
0b[4]
0b[4]
0b[4]
0b[4]
0b[4]
1b[4]
0b[4]
0b[4]
0b[4]
0b[4]
0b[4]
0b[4]
locked memory
locked memory
temporary bit
203h
RFU
204h
invert digital output:
transparent mode on/off
transparent mode data/raw
RFU
205h
temporary bit
206h
temporary bit
207h
locked memory
locked memory
unlocked memory
unlocked memory
unlocked memory
locked memory
unlocked memory
unlocked memory
unlocked memory
locked memory
208h
RFU
209h
max. backscatter strength
digital output
20Ah
20Bh
read range reduction on/off
RFU
20Ch
20Dh
read protect EPC Bank
read protect TID
PSF alarm flag
allocation class identifier
20Eh
20Fh
Bank 10
TID
00h to 07h
08h to 13h
14h
1110 0010b
TID
tag mask designer identifier 0000 0000 0110b
locked memory
locked memory
locked memory
locked memory
TID
config word indicator
tag model number
serial number
1b[2]
TMNR[3]
14h to 1Fh
20h to 3Fh
TID
TID
SNR
[1] G2iL: HEX E200 6806 0000 0000 0000 0000 (0000 0000)
G2iL+: HEX E200 6807 0000 0000 0000 0000 (0000 0000)
[2] Indicates the existence of a Configuration Word at the end of the EPC number
[3] See Figure 5
[4] See also Table 12 for further details.
SL3S1203_1213
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2013. All rights reserved.
Product data sheet
COMPANY PUBLIC
Rev. 4.3 — 27 November 2013
178843
11 of 36
xxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxx x x x xxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxx xx xx xxxxx
xxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxx xxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxx x x
xxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxx
xxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxx xxx
10.6.2 G2iL TID memory details
Model Number
Mask
First 32 bit of TID
Config
Word
Indicator
Class ID
Designer
ID
Sub
Version Nr.
Version
(Silicon) Nr.
memory
Ucode G2iL
E2006806
E2006B06
E2006807
E2006B07
E2h
E2h
E2h
E2h
006h
006h
006h
006h
1
1
1
1
0000b
0110b
0000b
0110b
0000110b
0000110b
0000111b
0000111b
Ucode G2iL+
Addresses 00h
3Fh
TID
MS Byte
MS Bit LS Bit
LS Byte
MS Bit
LS Bit
Addresses 00h
07h 08h
13h 14h
1Fh 20h
3Fh
0
Class Identifier
Mask-Designer Identifier
11
Model Number
Serial Number
Bits
7
0
0
11
0
31
E2h
006h
806h or B06h
00000001h to FFFFFFFFh
(EAN.UCC)
(NXP)
(UCODE G2iL)
Addresses 14h
18h 19h
1Fh
Sub Version Number
0 6
Version Number
Bits
0
3
0
0000b or 0110b
0000110b
(UCODE G2iL)
aaa-010217
Fig 5. G2iL TID memory structure
SL3S1203_1213
NXP Semiconductors
UCODE G2iL and G2iL+
10.7 Custom commands
The UCODE G2iL, G2iL+ is equipped with a number of additional features and custom
commands.
Nevertheless, the chip is designed in a way standard EPCglobal READ/WRITE/ACCESS
commands can be used to operate the features.
The memory map stated in the previous section describes the Configuration Word used to
control the additional features located at address 200h of the EPC memory. For this
reason the standard READ/WRITE commands of an UHF EPCglobal compliant reader
can be used to select the flags or activate/deactivate features.
The features can only be activated/deactivated (written) using standard EPC WRITE
command as long the EPC is not locked. In case the EPC is locked either the bank needs
to be unlocked to apply changes or the ChangeConfig custom command is used to
change the settings.
The UCODE G2iL is also equipped with the complete UCODE G2X command set for
backward compatibility reasons. Nevertheless, the one ChangeConfig command of the
G2iL can be used instead of the entire G2X command set.
Bit 14h of the TID indicates the existence of a Configuration Word. This flag will enable
selecting Config-Word enhanced transponders in mixed tag populations.
10.7.1 ChangeConfig
Although G2iL is tailored for supply chain management, item level tagging and product
authentication the G2iL+ version enables active interaction with products. Among the
password protected features are the capability of download firmware to electronics,
activate/deactivate electronics which can also be used as theft deterrence, a dedicated
privacy mode by reducing the read range, integrated PSF (Product Status Flag) or Tag
Tamper Alarm.
The G2iL ChangeConfig custom command allows handling the special NXP
Semiconductors features described in the following paragraph. Please also see the
memory map in Section 10.6 “G2iL, G2iL+ memory” and “Section 10.7.2 “G2iL, G2iL+
special features control mechanism”. If the EPC memory is not write locked the standard
EPC READ/WRITE command can be used to change the settings.
G2iL, G2iL+ special features1
UCODE G2iL and G2iL+ common special features are:
• Bank wise read protection (separate for EPC and TID)
EPC bank and the serial number part of the TID can be read protected independently.
When protected reading of the particular memory will return '0'. The flags of the
configuration word can be selected using the standard SELECT2 command. Only
read protected parts will then participate an inventory round. The G2X ReadProtect
command will set both EPC and TID read protect flags.
1. The features can only be manipulated (enabled/disabled) with unlocked EPC bank, otherwise the ChangeConfig command can be
used.
2. SELECT has to be applied onto the Configuration Word with pointer address 200h. Selecting bits within the Configuration Word
using a pointer address not equal to 200h is not possible.
SL3S1203_1213
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2013. All rights reserved.
Product data sheet
COMPANY PUBLIC
Rev. 4.3 — 27 November 2013
178843
13 of 36
SL3S1203_1213
NXP Semiconductors
UCODE G2iL and G2iL+
• Integrated PSF (Product Status Flag)
The PSF is a general purpose flag that can be used as an EAS (Electronic Article
Surveillance) flag, quality checked flag or similar.
The G2iL offers two ways of detecting an activated PSF. In cases extremely fast
detection is needed the EAS_Alarm command can be used. The UCODE G2iL will
reply a 64-bit alarm code like described in section EAS_Alarm upon sending the
command. As a second option the EPC SELECT2 command selecting the PSF flag of
the configuration word can be used. In the following inventory round only PSF
enabled chips will reply their EPC number.
• Backscatter strength reduction
The UCODE G2iL features two levels of backscatter strengths. Per default maximum
backscatter is enabled in order to enable maximum read rates. When clearing the flag
the strength can be reduced if needed.
• Real Read Range Reduction 4R
Some applications require the reduction of the read range to close proximity for
privacy reasons. Setting the 4R flag will significantly reduce the chip sensitivity to
+12 dBm. The +12 dBm have to be available at chip start up (slow increase of field
strength is not applicable). For additional privacy, the read protection can be activated
in the same configuration step. The related flag of the configuration word can be
selected using the standard SELECT2 command so only chips with reduced read
range will be part of an inventory.
Remark: The attenuation will result in only a few centimeter of read range at 36 dBm
EIRP!
UCODE G2iL+ specific special features are:1
• Tag Tamper Alarm (G2iL+ only)
The UCODE G2iL+ Tamper Alarm will flag the status of the VDD to OUT pad
connection which can be designed as an predetermined breaking point (see
Figure 6).
GND
RFP
OUT
VDD
001aam228
Fig 6. Schematic of connecting VDD and OUT pad with a predetermined breaking point
to turn a standard RFID label into a wireless safety seal
The status of the pad connection (open/closed) can be read in the configuration register
and/or selected using the EPC SELECT2. This feature will enable designing a wireless
RFID safety seal. When breaking the connection by peeling off the label or manipulating a
lock an alarm can be triggered.
SL3S1203_1213
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2013. All rights reserved.
Product data sheet
COMPANY PUBLIC
Rev. 4.3 — 27 November 2013
178843
14 of 36
SL3S1203_1213
NXP Semiconductors
UCODE G2iL and G2iL+
• RF field detection (G2iL+ only)
The UCODE G2iL+ VDD pin can be also used as a RF field detector. Upon bringing
the tag within an RF field, a pulse signal will be immediately sent from the VDD test
pad. (for details see Ref. 21).
• Digital Switch (G2iL+ only)
The UCODE G2iL+ OUT pin can be used as digital switch. The state of the output pad
can be switched to VDD or GND depending on the Digital OUT bit of the Configuration
Word register. The state of the output is persistent in the memory even after KILL or
switching off the supply. This feature will allow activating/deactivating externally
connected peripherals or can be used as theft deterrence of electronics.
The state of the OUT pin can also be changed temporary by toggling the 'Invert Digital
Output' bit.
• Data transfer Mode (G2iL+ only)
In applications where not switching the output like described in "Digital Switch" but
external device communication is needed the G2iL+ Data Transfer Mode can be used
by setting the according bit of the Configuration Word register. When activated the air
interface communication will be directly transferred to the OUT pad of the chip.
Two modes of data transfer are available and can be switched using the Transparent
Mode DATA/RAW bit.
The default Transparent Mode DATA will remove the Frame Sync of the
communication and toggle the output with every raising edge in the RF field. This will
allow implementing a Manchester type of data transmission.
The Transparent Mode RAW will switch the demodulated air interface communication
to the OUT pad.
• External Supply Indicator - Digital Input (G2iL+ only)
The VDD pad of the UCODE G2iL+ can be used as a single bit digital input pin. The
state of the pad is directly associated with the External Supply Indicator bit of the
configuration register. Simple one bit return signaling (chip to reader) can be
implemented by polling this Configuration Word register flag. RF reset is necessary
for proper polling.
• External Supply Mode (G2iL+ only)
The UCODE G2iL+ can be supplied externally by connecting 1.85 V (Iout = 0µA)
supply. When externally supplied less energy from the RF field is needed to operate
the chip. This will not just enable further improved sensitivity and read ranges (up to
27 dBm) but also enable a write range that is equal to the read range.
The figure schematically shows the supply connected to the UCODE G2iL+.
Remark: When permanently externally supplied there will not be a power-on-reset. This
will result in the following limitations:
• When externally supplied session flag S0 will keep it’s state during RF-OFF phase.
• When externally supplied session flag S2, S3, SL will have infinite persistence time
and will behave similar to S0.
• Session flag S1 will behave regular like in pure passive operation.
SL3S1203_1213
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2013. All rights reserved.
Product data sheet
COMPANY PUBLIC
Rev. 4.3 — 27 November 2013
178843
15 of 36
SL3S1203_1213
NXP Semiconductors
UCODE G2iL and G2iL+
GND
RFP
OUT
VDD
Vsupply
001aam229
Fig 7. Schematic of external power supply
Table 9.
ChangeConfig custom command
Command
RFU
Data
RN
CRC-16
No. of bits
16
8
16
16
16
-
Description
11100000
00000111
00000000
Toggle bits
XOR RN 16
handle
The bits to be toggled in the configuration register need to be set to '1'.
E.g. sending 0000 0000 0001 0001 XOR RN16 will activate the 4R and PSF. Sending the
very same command a second time will disable the features again.
The reply of the ChangeConfig will return the current register setting.
Table 10. ChangeConfig custom command reply
Header
Status bits
16
RN
CRC-16
No. of bits
1
0
16
16
-
Description
Config-Word
Handle
Table 11. ChangeConfig command-response table
Starting state
Condition
Response
Next state
ready
all
all
-
-
ready
arbitrate, reply,
acknowledged
arbitrate
open
valid handle Status word
needs to change
Backscatter unchanged
Config-WordConfig-Word
immediately
open
valid handle Status word does Backscatter Config-Word
open
not need to change
immediately
secured
killed
valid handle Status word
needs to change
Backscatter modified
Config-Word, when done
secured
secured
killed
valid handle Status word does Backscatter Config-Word
not need to change
immediately
all
-
SL3S1203_1213
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2013. All rights reserved.
Product data sheet
COMPANY PUBLIC
Rev. 4.3 — 27 November 2013
178843
16 of 36
SL3S1203_1213
NXP Semiconductors
UCODE G2iL and G2iL+
The features can only be activated/deactivated using standard EPC WRITE if the EPC
bank is unlocked. The permanent and temporary bits of the Configuration Word can be
toggled without the need for an ACCESS password in case the ACCESS password is set
to zero. In case the EPC bank is locked the lock needs to be removed before applying
changes or the ChangeConfig command has to be used.
10.7.2 G2iL, G2iL+ special features control mechanism
Special features of the G2iL are managed using a configuration word (Config-Word)
located at address 200h in the EPC memory bank.
The entire Config-Word is selectable (using the standard EPC SELECT2 command) and
can be read using standard EPC READ command and modified using the standard EPC
WRITE or ChangeConfig custom command in case the EPC memory is locked for writing.
ChangeConfig can be executed from the OPEN and SECURED state.
The chip will take all “Toggle Bits” for ’0’ if the chip is in the OPEN state or the ACCESS
password is zero; therefore it will not alter any status bits, but report the current status
only. The command will be ignored with an invalid CRC-16 or an invalid handle. The chip
will then remain in the current state. The CRC-16 is calculated from the first
command-code bit to the last handle bit.
A ChangeConfig command without frame-sync and proceeding Req_RN will be ignored.
The command will also be ignored if any of the RFU bits are toggled.
In order to change the configuration, to activate/deactivate a feature a ’1’ has to be written
to the corresponding register flag to toggle the status. E.g. sending 0x0002 to the register
will activate the read protection of the TID. Sending the same command a second time will
again clear the read protection of the TID. Invalid toggling on indicator or RFU bits are
ignored.
Executing the command with zero as payload or in the OPEN state will return the current
register settings. The chip will reply to a successful ChangeConfig with an extended
preamble regardless of the TRext value of the Query command.
After sending a ChangeConfig an interrogator shall transmit CW for less than TReply or
20 ms, where TReply is the time between the interrogator's ChangeConfig command and
the chip’s backscattered reply. An interrogator may observe three possible responses
after sending a ChangeConfig, depending on the success or failure of the operation
• ChangeConfigChangeConfig succeeded: The chip will backscatter the reply shown
above comprising a header (a 0-bit), the current Status Word setting, the handle, and
a CRC-16 calculated over the 0-bit, the status word and the handle. If the interrogator
observes this reply within 20 ms then the ChangeConfig completed successfully.
• The chip encounters an error: The chip will backscatter an error code during the CW
period rather than the reply shown below (see EPCglobal Spec for error-code
definitions and for the reply format).
• ChangeConfig does not succeed: If the interrogator does not observe a reply within
20 ms then the ChangeStatus did not complete successfully. The interrogator may
issue a Req_RN command (containing the handle) to verify that the chip is still in the
interrogator's field, and may reissue the ChangeConfig command.
The G2iL configuration word is located at address 200h of the EPC memory and is
structured as following:
SL3S1203_1213
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2013. All rights reserved.
Product data sheet
COMPANY PUBLIC
Rev. 4.3 — 27 November 2013
178843
17 of 36
SL3S1203_1213
NXP Semiconductors
UCODE G2iL and G2iL+
Table 12. Address 200h to 207h
Indicator bits
Temporary bits
Tamper
indicator
External supply
indicator
RFU
RFU
Invert Output Transparent
mode on/off
Data mode
data/raw
RFU
0
1
2
3
4
5
6
7
Table 13. Address 208h to 20Fh
Permanent bits
RFU
max. backscatter Digital
Privacy
mode
RFU
Protect EPC Protect TID
13 14
PSF Alarm
bit
strength
output
8
9
10
11
12
15
The configuration word contains three different type of bits:
• Indicator bits cannot be changed by command:
Tag Tamper Alarm Indicator
External Supply Indicator (digital input)
• Temporary bits are reset at power up:
Invert Output
Transparent Mode on/off
Data Mode data/raw
• Permanent bits: permanently stored bits in the memory
Max. Backscatter Strength
Digital Output
Read Range Reduction
Read Protect EPC
Read Protect TID
PSF Alarm
10.7.3 ReadProtect3
The G2iL ReadProtect custom command enables reliable read protection of the entire
G2iL memory. Executing ReadProtect from the Secured state will set the ProtectEPC and
ProtectTID bits of the Configuration Word to '1'. With the ReadProtect-Bit set the G2iL will
continue to work unaffected but veil its protected content.
The read protection can be removed by executing Reset ReadProtect. The
ReadProtect-Bits will than be cleared.
Devices whose access password is zero will ignore the command. A frame-sync must be
pre-pended the command.
After sending the ReadProtect command an interrogator shall transmit CW for the lesser
of TReply or 20 ms, where TReply is the time between the interrogator's ReadProtect
command and the backscattered reply. An interrogator may observe three possible
responses after sending a ReadProtect, depending on the success or failure of the
operation:
3. Note: The ChangeConfig command can be used instead of “ReadProtect”, “ResetReadProtect”, “ChangeEAS”.
SL3S1203_1213
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2013. All rights reserved.
Product data sheet
COMPANY PUBLIC
Rev. 4.3 — 27 November 2013
178843
18 of 36
SL3S1203_1213
NXP Semiconductors
UCODE G2iL and G2iL+
• ReadProtect succeeds: After completing the ReadProtect the G2iL shall backscatter
the reply shown in Table 15 comprising a header (a 0-bit), the tag's handle, and a
CRC-16 calculated over the 0-bit and handle. Immediately after this reply the G2iL will
render itself to this ReadProtect mode. If the interrogator observes this reply within
20 ms then the ReadProtect completed successfully.
• The G2iL encounters an error: The G2iL will backscatter an error code during the CW
period rather than the reply shown in the EPCglobal Spec (see Annex I for error-code
definitions and for the reply format).
• ReadProtect does not succeed: If the interrogator does not observe a reply within
20 ms then the ReadProtect did not complete successfully. The interrogator may
issue a Req_RN command (containing the handle) to verify that the G2iL is still in the
interrogation zone, and may re-initiate the ReadProtect command.
The G2iL reply to the ReadProtect command will use the extended preamble shown in
EPCglobal Spec (Figure 6.11 or Figure 6.15), as appropriate (i.e. a Tag shall reply as if
TRext=1) regardless of the TRext value in the Query that initiated the round.
Table 14. ReadProtect command
Command
16
RN
CRC-16
# of bits
16
16
-
description
11100000 00000001
handle
Table 15. G2iL reply to a successful ReadProtect procedure
Header
RN
CRC-16
# of bits
1
0
16
16
-
description
handle
Table 16. ReadProtect command-response table
Starting State
Condition
Response
Next State
ready
ready
all
all
–
–
arbitrate, reply,
acknowledged
arbitrate
open
all
-
open
secured
valid handle & invalid
access password
–
arbitrate
valid handle & valid
non zero access
password
Backscatter handle,
when done
secured
invalid handle
all
–
–
secured
killed
killed
10.7.4 Reset ReadProtect3
Reset ReadProtect allows an interrogator to clear the ProtectEPC and ProtectTID bits of
the Configuration Word. This will re-enable reading of the related G2iL memory content.
For details on the command response please refer to Table 17 “Reset ReadProtect
command”.
SL3S1203_1213
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2013. All rights reserved.
Product data sheet
COMPANY PUBLIC
Rev. 4.3 — 27 November 2013
178843
19 of 36
SL3S1203_1213
NXP Semiconductors
UCODE G2iL and G2iL+
After sending a Reset ReadProtect an interrogator shall transmit CW for the lesser of
Reply or 20 ms, where TReply is the time between the interrogator's Reset ReadProtect
T
command and the G2iL backscattered reply. A Req_RN command prior to the Reset
ReadProtect is necessary to successfully execute the command. A frame-sync must be
pre-pended the command.
An interrogator may observe three possible responses after sending a Reset
ReadProtect, depending on the success or failure of the operation:
• Reset ReadProtect succeeds: After completing the Reset ReadProtect a G2iL will
backscatter the reply shown in Table 18 comprising a header (a 0-bit), the handle, and
a CRC-16 calculated over the 0-bit and handle. If the interrogator observes this reply
within 20 ms then the Reset ReadProtect completed successfully.
• The G2iL encounters an error: The G2iL will backscatter an error code during the CW
period rather than the reply shown in Table 18 (see EPCglobal Spec for error-code
definitions and for the reply format).
• Reset ReadProtect does not succeed: If the interrogator does not observe a reply
within 20 ms then the Reset ReadProtect did not complete successfully. The
interrogator may issue a Req_RN command (containing the handle) to verify that the
G2iL is still in the interrogation zone, and may reissue the Reset ReadProtect
command.
The G2iL reply to the Reset ReadProtect command will use the extended preamble
shown in EPCglobal Spec (Figure 6.11 or Figure 6.15), as appropriate (i.e. a G2iL will
reply as if TRext=1 regardless of the TRext value in the Query that initiated the round.
The Reset ReadProtect command is structured as following:
• 16 bit command
• Password: 32 bit Access-Password XOR with 2 times current RN16
Remark: To generate the 32 bit password the 16 bit RN16 is duplicated and used two
times to generate the 32 bit (e.g. a RN16 of 1234 will result in 1234 1234).
• 16 bit handle
• CRC-16 calculate over the first command-code bit to the last handle bit
Table 17. Reset ReadProtect command
Command
Password
RN
CRC-16
# of bits
16
32
16
16
-
description
11100000
00000010
(access
password)
2*RN16
handle
Table 18. G2iL reply to a successful Reset ReadProtect command
Header
RN
CRC-16
# of bits
1
0
16
16
-
description
handle
SL3S1203_1213
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2013. All rights reserved.
Product data sheet
COMPANY PUBLIC
Rev. 4.3 — 27 November 2013
178843
20 of 36
SL3S1203_1213
NXP Semiconductors
UCODE G2iL and G2iL+
Table 19. Reset ReadProtect command-response table
Starting State
Condition
Response
Next State
ready
ready
all
all
–
–
arbitrate, reply,
acknowledged
arbitrate
open
valid handle & valid access password
Backscatter handle,
when done
open
valid handle & invalid access password
invalid handle
–
–
arbitrate
open
secured
valid handle & valid access password
Backscatter handle,
when done
secured
valid handle & invalid access password
–
–
–
arbitrate
secured
killed
invalid handle
all
killed
10.7.5 ChangeEAS3
UCODE G2iL equipped RFID tags will also feature a stand-alone operating EAS alarm
mechanism for fast and offline electronic article surveillance. The PSF bit of the
Configuration Word directly relates to the EAS Alarm feature. With an PSF bit set to '1' the
tag will reply to an EAS_Alarm command by backscattering a 64 bit alarm code without
the need of a Select or Query. The EAS is a built-in solution so no connection to a
backend database is required. In case the EAS_Alarm command is not implemented in
the reader a standard EPC SELCET to the Configuration Word and Query can be used.
When using standard SELECT/QUERY the EPC will be returned during inventory.
ChangeEAS can be executed from the Secured state only. The command will be ignored
if the Access Password is zero, the command will also be ignored with an invalid CRC-16
or an invalid handle, the G2iL will than remain in the current state. The CRC-16 is
calculated from the first command-code bit to the last handle bit. A frame-sync must be
pre-pended the command.
The G2iL reply to a successful ChangeEAS will use the extended preamble, as
appropriate (i.e. a Tag shall reply as if TRext=1) regardless of the TRext value in the
Query that initiated the round.
After sending a ChangeEAS an interrogator shall transmit CW for less than TReply or
20 ms, where TReply is the time between the interrogator's ChangeEAS command and the
G2iL backscattered reply. An interrogator may observe three possible responses after
sending a ChangeEAS, depending on the success or failure of the operation
• ChangeEAS succeeds: After completing the ChangeEAS a G2iL will backscatter the
reply shown in Table 21 comprising a header (a 0-bit), the handle, and a CRC-16
calculated over the 0-bit and handle. If the interrogator observes this reply within
20 ms then the ChangeEAS completed successfully.
• The G2iL encounters an error: The G2iL will backscatter an error code during the CW
period rather than the reply shown in Table 21 (see EPCglobal Spec for error-code
definitions and for the reply format).
SL3S1203_1213
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2013. All rights reserved.
Product data sheet
COMPANY PUBLIC
Rev. 4.3 — 27 November 2013
178843
21 of 36
SL3S1203_1213
NXP Semiconductors
UCODE G2iL and G2iL+
• ChangeEAS does not succeed: If the interrogator does not observe a reply within
20 ms then the ChangeEAS did not complete successfully. The interrogator may
issue a Req_RN command (containing the handle) to verify that the G2iL is still in the
interrogator's field, and may reissue the ChangeEAS command.
Upon receiving a valid ChangeEAS command a G2iL will perform the commanded
set/reset operation of the PSF bit of the Configuration Word.
If PSF bit is set, the EAS_Alarm command will be available after the next power up and
reply the 64 bit EAS code upon execution. Otherwise the EAS_Alarm command will be
ignored.
Table 20. ChangeEAS command
Command
ChangeEAS
RN
CRC-16
# of bits
16
1
16
16
description
11100000
00000011
1 ... set PSF bit
0 ... reset PSF bit
handle
Table 21. G2iL reply to a successful ChangeEAS command
Header
RN
CRC-16
# of bits
1
0
16
16
-
description
handle
Table 22. ChangeEAS command-response table
Starting State
Condition
Response
Next state
ready
ready
all
all
–
–
arbitrate, reply,
acknowledged
arbitrate
open
all
–
open
secured
valid handle
backscatter handle,
when done
secured
invalid handle
all
–
–
secured
killed
killed
10.7.6 EAS_Alarm
Upon receiving an EAS_Alarm custom command the UCODE G2iL will immediately
backscatter an EAS-Alarmcode in case the PSF bit of the Configuration Word is set. The
alarm code is returned without any delay caused by Select, Query and without the need
for a backend database.
The EAS feature of the G2iL is available after enabling it by sending a ChangeEAS
command described in Section 10.7.5 “ChangeEAS3” or after setting the PSF bit of the
Configuration Word to ’1’. With the EAS-Alarm enabled the G2iL will reply to an
EAS_Alarm command by backscattering a fixed 64 bit alarm code. A G2iL will reply to an
EAS_Alarm command from the ready state only. As an alternative to the fast EAS_Alarm
command a standard SELECT2 (upon the Configuration Word) and QUERY can be used.
If the PSF bit is reset to '0' by sending a ChangeEAS command in the password protected
Secure state or clearing the PSF bit the G2iL will not reply to an EAS_Alarm command.
SL3S1203_1213
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2013. All rights reserved.
Product data sheet
COMPANY PUBLIC
Rev. 4.3 — 27 November 2013
178843
22 of 36
SL3S1203_1213
NXP Semiconductors
UCODE G2iL and G2iL+
The EAS_Alarm command is structured as following:
• 16 bit command
• 16 bit inverted command
• DR (TRcal divide ratio) sets the T=>R link frequency as described in EPCglobal Spec.
6.3.1.2.8 and Table 6.9.
• M (cycles per symbol) sets the T=>R data rate and modulation format as shown in
EPCglobal Spec. Table 6.10.
• TRext chooses whether the T=>R preamble is pre-pended with a pilot tone as
described in EPCglobal Spec. 6.3.1.3.
A preamble must be pre-pended the EAS_Alarm command according EPCglobal Spec,
6.3.1.2.8.
Upon receiving an EAS_Alarm command the tag loads the CRC5 register with 01001b
and backscatters the 64 bit alarm code accordingly. The reader is now able to calculate
the CRC5 over the backscattered 64 bits received to verify the received code.
Table 23. EAS_Alarm command
Command Inv_Command DR
M
TRext
CRC-16
# of bits
16
16
1
2
1
16
-
description 11100000
00011111
11111011
0: DR = 8
00: M = 1
0: no pilot
tone
00000100
1: DR = 64/3 01: M = 2
10: M = 4
1: use pilot
tone
11: M = 8
Table 24. G2iL reply to a successful EAS_Alarm command
Header
EAS Code
# of bits
1
0
64
description
CRC5 (MSB)
Table 25. EAS_Alarm command-response table
Starting State
Condition
PSF bit is set
PSF bit is cleard
all
Response
Next state
ready
backscatter alarm code ready
--
arbitrate, reply,
acknowledged
–
arbitrate
open
all
all
all
–
–
–
open
secured
killed
secured
killed
SL3S1203_1213
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2013. All rights reserved.
Product data sheet
COMPANY PUBLIC
Rev. 4.3 — 27 November 2013
178843
23 of 36
SL3S1203_1213
NXP Semiconductors
UCODE G2iL and G2iL+
11. Limiting values
Table 26. Limiting values[1][2]
In accordance with the Absolute Maximum Rating System (IEC 60134).
Voltages are referenced to RFN
Symbol
Parameter
Conditions
Min
Max
Unit
Bare die and SOT886 limitations
Tstg
storage temperature
ambient temperature
55
40
-
+125
+85
2
C
C
kV
Tamb
VESD
[3]
electrostatic discharge
voltage
Human body
model
Pad limitations
Vi
input voltage
absolute limits,
VDD-OUT pad
0.5
0.5
+2.5
+0.5
V
Io
output current
input power
absolute limits
input/output
current,VDD-OUT
pad
mA
Pi
maximum power
dissipation, RFP
pad
-
100
mW
[1] Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the
device. This is a stress rating only and functional operation of the device at these or any conditions other
than those described in the Operating Conditions and Electrical Characteristics section of this specification
is not implied.
[2] This product includes circuitry specifically designed for the protection of its internal devices from the
damaging effects of excessive static charge. Nonetheless, it is suggested that conventional precautions be
taken to avoid applying greater than the rated maxima.
[3] For ESD measurement, the die chip has been mounted into a CDIP20 package.
SL3S1203_1213
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2013. All rights reserved.
Product data sheet
COMPANY PUBLIC
Rev. 4.3 — 27 November 2013
178843
24 of 36
SL3S1203_1213
NXP Semiconductors
UCODE G2iL and G2iL+
12. Characteristics
12.1 UCODE G2iL, G2iL+ bare die characteristics
Table 27. G2iL, G2iL+ RF interface characteristics (RFN, RFP)
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
fi
input frequency
840
-
960
MHz
Normal mode - no external supply, read range reduction OFF
[1][2][7]
Pi(min)
Pi(min)
minimum input power
minimum input power
READ sensitivity
-
-
18
-
-
dBm
%
WRITE sensitivity,
(write range/read
range - ratio)
30
[3]
[3]
[3]
[3]
[3]
Ci
Q
Z
input capacitance
quality factor
impedance
parallel
-
-
-
-
-
0.77
-
-
-
-
-
pF
-
915 MHz
866 MHz
915 MHz
953 MHz
9.7
25 -j237
23 -j224
21 -j216
External supply mode - VDD pad supplied, read range reduction OFF
[1][2]
[2]
Pi(min)
minimum input power
Ext. supplied READ
Ext. supplied WRITE
-
-
-
27
-
-
-
dBm
dBm
27
[3]
Z
impedance
externally supplied,
915 MHz
7 -j230
Read range reduction ON - no external supply
[1][2][4]
[2][4]
[3]
Pi(min)
minimum input power
4R on READ
-
-
-
+12
-
-
-
dBm
dBm
4R on WRITE
4R on, 915 MHz
+12
Z
impedance
18 -j2
Modulation resistance
[5]
[6]
R
resistance
modulation
resistance, max.
backscatter = off
-
-
170
55
-
-
modulation
resistance, max.
backscatter = on
[1] Power to process a Query command.
[2] Measured with a 50 source impedance.
[3] At minimum operating power.
[4] It has to be assured the reader (system) is capable of providing enough field strength to give +12 dBm at the chip otherwise
communication with the chip will not be possible.
[5] Enables tag designs to be within ETSI limits for return link data rates of e.g. 320 kHz/M4.
[6] Will result in up to 10 dB higher tag backscatter power at high field strength.
[7] Results in approx. 18.5 dBm tag sensitivity on a 2 dBi gain antenna.
SL3S1203_1213
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2013. All rights reserved.
Product data sheet
COMPANY PUBLIC
Rev. 4.3 — 27 November 2013
178843
25 of 36
SL3S1203_1213
NXP Semiconductors
UCODE G2iL and G2iL+
Table 28. VDD pin characteristics
Symbol Parameter
Conditions
Min
Typ
Max
Unit
[1][3][4]
Minimum supply voltage/current - without assisted EEPROM WRITE
VDD
IDD
supply voltage
supply current
minimum voltage
-
-
-
-
1.8
7
V
minimum current,
Iout-^- = 0 A
A
I
out = 100 A
-
-
-
110
A
[2][3][4]
Minimum supply voltage/current - assisted EEPROM READ and WRITE
VDD
supply voltage
supply current
minimum voltage,
Iout = 0 A
1.8
1.85
V
Iout = 100 A
-
-
-
-
1.95
125
V
IDD
minimum current,
Iout = 0 A
A
Iout = 100 A
-
-
265
A
[3][5]
Maximum supply voltage/current
VDD
supply voltage
absolute maximum
voltage
2.2
-
-
-
-
V
Ii(max)
maximum input current
absolute maximum
current
280
A
[1] Activates Digital Output (OUT pin), increases read range (external supplied).
[2] Activates Digital Output (OUT pin), increases read and write range (external supplied).
[3] Operating the chip outside the specified voltage range may lead to undefined behaviour.
[4] Either the voltage or the current needs to be above given values to guarantee specified functionality.
[5] No proper operation is guaranteed if both, voltage and current, limits are exceeded.
Table 29. G2iL, G2iL+ VDD and OUT pin characteristics
Symbol Parameter
Conditions
Min
Typ
Max
Unit
OUT pin characteristics
VOL
VOH
Low-level output voltage
HIGH-level output voltage
Isink = 1 mA
-
-
-
100
-
mV
V
VDD = 1.8 V; Isource
1.5
= 100 µA
VDD/OUT pin characteristics
[1]
[2]
CL
Vo
load capacitance
output voltage
VDD - OUT pin max.
-
-
-
-
5
pF
maximum RF peak
voltage on VDD-OUT
pins
500
mV
[3]
[4]
[5]
VDD/OUT pin tamper alarm characteristics
RL(max)
RL(min)
maximum load resistance
minimum load resistance
resistance range high
resistance range low
-
-
-
<2
-
M
M
>20
[1] Is the sum of the allowed capacitance of the VDD and OUT pin referenced to RFN.
[2] Is the maximum allowed RF input voltage coupling to the VDD/OUT pin to guarantee undisturbed chip functionality.
[3] Resistance between VDD and OUT pin in checked during power up only.
[4] Resistance range to achieve tamper alarm flag = 1.
[5] Resistance range to achieve tamper alarm flag = 0:
SL3S1203_1213
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2013. All rights reserved.
Product data sheet
COMPANY PUBLIC
Rev. 4.3 — 27 November 2013
178843
26 of 36
SL3S1203_1213
NXP Semiconductors
UCODE G2iL and G2iL+
For further reading we recommend application note “FAQ UCODE G2iL+“ (Ref. 21)
describing the output characteristics more in detail. An example schematic is available in
application note “UCODE G2iL+ Demo board Manual“ (Ref. 22). The documents are
available at NXP Document Control or at the website www.nxp.com.
Table 30. G2iL, G2iL+ memory characteristics
Symbol
Parameter
Conditions
Min
Typ
Max Unit
EEPROM characteristics
tret
retention time
Tamb 55 C
20
-
-
-
year
Nendu(W)
write endurance
1000 10000[1]
cycle
[1] Tamb 25 C
12.2 UCODE G2iL SOT886 characteristics
Table 31. G2iL RF interface characteristics (RFN, RFP)
Symbol
Parameter
Conditions
Min
Typ
Max Unit
Normal mode - no external supply, read range reduction OFF
[1][2]
Pi(min)
minimum input power
READ
sensitivity
-
-
17.6
-
-
dB
m
[3]
Z
impedance
915 MHz
21 j199
Normal mode - externally supplied, read range reduction OFF
[1][2]
Pi(min)
minimum input power
READ
sensitivity
-
27
-
-
dB
m
[3]
Z
impedance
915 MHz
-
5.6 j204
[1] Power to process a Query command.
[2] Measured with a 50 source impedance.
[3] At minimum operating power.
Remark: For DC and memory characteristics refer to Table 28, Table 29 and Table 30.
SL3S1203_1213
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2013. All rights reserved.
Product data sheet
COMPANY PUBLIC
Rev. 4.3 — 27 November 2013
178843
27 of 36
SL3S1203_1213
NXP Semiconductors
UCODE G2iL and G2iL+
13. Package outline
XSON6: plastic extremely thin small outline package; no leads; 6 terminals; body 1 x 1.45 x 0.5 mm
SOT886
b
1
2
3
4x
(2)
L
L
1
e
6
5
4
e
1
e
1
6x
(2)
A
A
1
D
E
terminal 1
index area
0
1
2 mm
scale
Dimensions (mm are the original dimensions)
(1)
Unit
A
A
1
b
D
E
e
e
L
L
1
1
max 0.5 0.04 0.25 1.50 1.05
0.35 0.40
0.20 1.45 1.00 0.6 0.5 0.30 0.35
0.17 1.40 0.95 0.27 0.32
mm nom
min
Notes
1. Including plating thickness.
2. Can be visible in some manufacturing processes.
sot886_po
References
Outline
version
European
projection
Issue date
IEC
JEDEC
MO-252
JEITA
04-07-22
12-01-05
SOT886
Fig 8. Package outline SOT886
SL3S1203_1213
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2013. All rights reserved.
Product data sheet
COMPANY PUBLIC
Rev. 4.3 — 27 November 2013
178843
28 of 36
SL3S1203_1213
NXP Semiconductors
UCODE G2iL and G2iL+
14. Packing information
14.1 Wafer
See Ref. 20 “Data sheet - Delivery type description – General specification for 8” wafer on
UV-tape with electronic fail die marking, BU-ID document number: 1093**”
14.2 SOT886
Part orientation T1. For details please refer to
http://www.standardics.nxp.com/packaging/packing/pdf/sot886.t1.t4.pdf
15. Abbreviations
Table 32. Abbreviations
Acronym
CRC
Description
Cyclic Redundancy Check
CW
Continuous Wave
DSB-ASK
DC
Double Side Band-Amplitude Shift Keying
Direct Current
EAS
Electronic Article Surveillance
Electrically Erasable Programmable Read Only Memory
EEPROM
EPC
Electronic Product Code (containing Header, Domain Manager, Object Class
and Serial Number)
FM0
G2
Bi phase space modulation
Generation 2
IC
Integrated Circuit
PIE
Pulse Interval Encoding
Real Read Range Reduction
Product Status Flag
RRRR
PSF
RF
Radio Frequency
UHF
SECS
TID
Ultra High Frequency
Semi Equipment Communication Standard
Tag IDentifier
SL3S1203_1213
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2013. All rights reserved.
Product data sheet
COMPANY PUBLIC
Rev. 4.3 — 27 November 2013
178843
29 of 36
SL3S1203_1213
NXP Semiconductors
UCODE G2iL and G2iL+
16. References
[1] EPCglobal: EPC Radio-Frequency Identity Protocols Class-1 Generation-2 UHF
RFID Protocol for Communications at 860 MHz – 960 MHz, Version 1.1.0
(December 17, 2005)
[2] EPCglobal: EPC Tag Data Standards
[3] EPCglobal (2004): FMCG RFID Physical Requirements Document (draft)
[4] EPCglobal (2004): Class-1 Generation-2 UHF RFID Implementation Reference
(draft)
[5] European Telecommunications Standards Institute (ETSI), EN 302 208:
Electromagnetic compatibility and radio spectrum matters (ERM) – Radio-frequency
identification equipment operating in the band 865 MHz to 868 MHz with power
levels up to 2 W, Part 1 – Technical characteristics and test methods
[6] European Telecommunications Standards Institute (ETSI), EN 302 208:
Electromagnetic compatibility and radio spectrum matters (ERM) – Radio-frequency
identification equipment operating in the band 865 MHz to 868 MHz with power
levels up to 2 W, Part 2 – Harmonized EN under article 3.2 of the R&TTE directive
[7] [CEPT1]: CEPT REC 70-03 Annex 1
[8] [ETSI1]: ETSI EN 330 220-1, 2
[9] [ETSI3]: ETSI EN 302 208-1, 2 V<1.1.1> (2004-09-Electromagnetic compatibility
And Radio spectrum Matters (ERM) Radio Frequency Identification Equipment
operating in the band 865 - MHz to 868 MHz with power levels up to 2 W Part 1:
Technical characteristics and test methods.
[10] [FCC1]: FCC 47 Part 15 Section 247
[11] ISO/IEC Directives, Part 2: Rules for the structure and drafting of International
Standards
[12] ISO/IEC 3309: Information technology – Telecommunications and information
exchange between systems – High-level data link control (HDLC) procedures –
Frame structure
[13] ISO/IEC 15961: Information technology, Automatic identification and data capture –
Radio frequency identification (RFID) for item management – Data protocol:
application interface
[14] ISO/IEC 15962: Information technology, Automatic identification and data capture
techniques – Radio frequency identification (RFID) for item management – Data
protocol: data encoding rules and logical memory functions
[15] ISO/IEC 15963: Information technology — Radio frequency identification for item
management — Unique identification for RF tags
[16] ISO/IEC 18000-1: Information technology — Radio frequency identification for item
management — Part 1: Reference architecture and definition of parameters to be
standardized
[17] ISO/IEC 18000-6: Information technology automatic identification and data capture
techniques — Radio frequency identification for item management air interface —
Part 6: Parameters for air interface communications at 860–960 MHz
[18] ISO/IEC 19762: Information technology AIDC techniques – Harmonized vocabulary
– Part 3: radio-frequency identification (RFID)
SL3S1203_1213
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2013. All rights reserved.
Product data sheet
COMPANY PUBLIC
Rev. 4.3 — 27 November 2013
178843
30 of 36
SL3S1203_1213
NXP Semiconductors
UCODE G2iL and G2iL+
[19] U.S. Code of Federal Regulations (CFR), Title 47, Chapter I, Part 15:
Radio-frequency devices, U.S. Federal Communications Commission.
[20] Data sheet - Delivery type description – General specification for 8” wafer on
UV-tape with electronic fail die marking, BU-ID document number: 1093**4
[21] Application note - FAQ UCODE G2i, BU-ID document number: AN10940
[22] Application note - UCODE G2iM+ demo board documentation, BU-ID document
number: AN11237
4. ** ... document version number
SL3S1203_1213
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2013. All rights reserved.
Product data sheet
COMPANY PUBLIC
Rev. 4.3 — 27 November 2013
178843
31 of 36
SL3S1203_1213
NXP Semiconductors
UCODE G2iL and G2iL+
17. Revision history
Table 33. Revision history
Document ID
Release date
20131127
Data sheet status
Change notice Supersedes
SL3S1203_1213 v.4.3
Modifications:
Product data sheet
-
SL3S1203_1213 v.4.2
• Figure 5 “G2iL TID memory structure”: updated
SL3S1203_1213 v.4.2
Modifications:
20130701
Product data sheet
-
SL3S1203_1213 v.4.1
• Update of delivery form
• Update RF field detection
SL3S1203_1213 v.4.1
Modifications:
20120917
Product data sheet
-
-
SL3S1203_1213 v.4.0
SL3S1203_1213 v.3.9
SL3S1203_1213 v.3.8
• Update of delivery form
20120227
SL3S1203_1213 v.4.0
Modifications:
Product data sheet
• Figure 4 “G2iL wafer layout”: Figure notes (1) and (2) updated
20120130 Product data sheet
SL3S1203_1213 v.3.9
Modifications:
-
• Table 6 “Specifications”: “Passivation on front” updated
• Section 15.2.1 “General assembly recommendations”: updated
SL3S1203_1213 v.3.8
Modifications:
20120111
• Section 8.1 “Wafer layout”: Figure notes (1) and (2) updated
20111124 Product data sheet
• Table 11 “G2iL, G2iL+ overall memory map”: updated
• Table 34 “G2iL, G2iL+ RF interface characteristics (RFN, RFP)”: updated
20110803 Product data sheet
• Real Read Range Reduction feature added to G2iL
Product data sheet
-
SL3S1203_1213 v.3.7
SL3S1203_1213 v.3.7
Modifications:
-
SL3S1203_1213 v.3.6
SL3S1203_1213 v.3.6
Modifications:
-
SL3S1203_1213 v.3.5
SL3S1203_1213 v.3.4
SL3S1203_1213 v.3.3
SL3S1203_1213 v.3.5
Modifications:
20110531
• Superfluous text removed from Table 6
20110511 Product data sheet
Product data sheet
-
SL3S1203_1213 v.3.4
Modifications:
-
• Security status changed into COMPANY PUBLIC
• Delivery form of FCS2 strap added
• Section 13 “Package information”, Section 15 “Handling information” and Section 16
“Packing information” added
SL3S1203_1213 v.3.3
Modifications:
20110131
Product data sheet
-
SL3S1203_1213 v.3.2
• Section 4 “Ordering information”: new types SL3S1203FUD and SL3S1213FUD added
• Section 9 “Mechanical specification”: updated according to the new types
• Replaced wording of “ChangeStatus” with “ChangeConfig”
SL3S1203_1213 v.3.2
Modifications:
20101109
Product data sheet
-
SL3S1203_1213 v.3.1
• Version SOT886F1 added
• Section 5 “Marking”, Section 13 “Package outline” and Section 14 “Packing information”
added
SL3S1203_1213 v.3.1
Modifications:
20100922
Product data sheet
Product data sheet
Objective data sheet
-
-
-
SL3S1203_1213 v.3.0
• General Modifications
20100621
SL3S1203_1213 v.3.0
Modifications:
178810
-
• General update
20100304
178810
SL3S1203_1213
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2013. All rights reserved.
Product data sheet
COMPANY PUBLIC
Rev. 4.3 — 27 November 2013
178843
32 of 36
SL3S1203_1213
NXP Semiconductors
UCODE G2iL and G2iL+
18. Legal information
18.1 Data sheet status
Document status[1][2]
Product status[3]
Development
Definition
Objective [short] data sheet
This document contains data from the objective specification for product development.
This document contains data from the preliminary specification.
This document contains the product specification.
Preliminary [short] data sheet Qualification
Product [short] data sheet Production
[1]
[2]
[3]
Please consult the most recently issued document before initiating or completing a design.
The term ‘short data sheet’ is explained in section “Definitions”.
The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status
information is available on the Internet at URL http://www.nxp.com.
Suitability for use — NXP Semiconductors products are not designed,
18.2 Definitions
authorized or warranted to be suitable for use in life support, life-critical or
safety-critical systems or equipment, nor in applications where failure or
malfunction of an NXP Semiconductors product can reasonably be expected
to result in personal injury, death or severe property or environmental
damage. NXP Semiconductors and its suppliers accept no liability for
inclusion and/or use of NXP Semiconductors products in such equipment or
applications and therefore such inclusion and/or use is at the customer’s own
risk.
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences of
use of such information.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is intended
for quick reference only and should not be relied upon to contain detailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local NXP Semiconductors sales
office. In case of any inconsistency or conflict with the short data sheet, the
full data sheet shall prevail.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
Customers are responsible for the design and operation of their applications
and products using NXP Semiconductors products, and NXP Semiconductors
accepts no liability for any assistance with applications or customer product
design. It is customer’s sole responsibility to determine whether the NXP
Semiconductors product is suitable and fit for the customer’s applications and
products planned, as well as for the planned application and use of
customer’s third party customer(s). Customers should provide appropriate
design and operating safeguards to minimize the risks associated with their
applications and products.
Product specification — The information and data provided in a Product
data sheet shall define the specification of the product as agreed between
NXP Semiconductors and its customer, unless NXP Semiconductors and
customer have explicitly agreed otherwise in writing. In no event however,
shall an agreement be valid in which the NXP Semiconductors product is
deemed to offer functions and qualities beyond those described in the
Product data sheet.
NXP Semiconductors does not accept any liability related to any default,
damage, costs or problem which is based on any weakness or default in the
customer’s applications or products, or the application or use by customer’s
third party customer(s). Customer is responsible for doing all necessary
testing for the customer’s applications and products using NXP
Semiconductors products in order to avoid a default of the applications and
the products or of the application or use by customer’s third party
customer(s). NXP does not accept any liability in this respect.
18.3 Disclaimers
Limited warranty and liability — Information in this document is believed to
be accurate and reliable. However, NXP Semiconductors does not give any
representations or warranties, expressed or implied, as to the accuracy or
completeness of such information and shall have no liability for the
consequences of use of such information. NXP Semiconductors takes no
responsibility for the content in this document if provided by an information
source outside of NXP Semiconductors.
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) will cause permanent
damage to the device. Limiting values are stress ratings only and (proper)
operation of the device at these or any other conditions above those given in
the Recommended operating conditions section (if present) or the
Characteristics sections of this document is not warranted. Constant or
repeated exposure to limiting values will permanently and irreversibly affect
the quality and reliability of the device.
In no event shall NXP Semiconductors be liable for any indirect, incidental,
punitive, special or consequential damages (including - without limitation - lost
profits, lost savings, business interruption, costs related to the removal or
replacement of any products or rework charges) whether or not such
damages are based on tort (including negligence), warranty, breach of
contract or any other legal theory.
Terms and conditions of commercial sale — NXP Semiconductors
products are sold subject to the general terms and conditions of commercial
sale, as published at http://www.nxp.com/profile/terms, unless otherwise
agreed in a valid written individual agreement. In case an individual
agreement is concluded only the terms and conditions of the respective
agreement shall apply. NXP Semiconductors hereby expressly objects to
applying the customer’s general terms and conditions with regard to the
purchase of NXP Semiconductors products by customer.
Notwithstanding any damages that customer might incur for any reason
whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards
customer for the products described herein shall be limited in accordance
with the Terms and conditions of commercial sale of NXP Semiconductors.
Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
No offer to sell or license — Nothing in this document may be interpreted or
construed as an offer to sell products that is open for acceptance or the grant,
conveyance or implication of any license under any copyrights, patents or
other industrial or intellectual property rights.
SL3S1203_1213
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2013. All rights reserved.
Product data sheet
COMPANY PUBLIC
Rev. 4.3 — 27 November 2013
178843
33 of 36
SL3S1203_1213
NXP Semiconductors
UCODE G2iL and G2iL+
Export control — This document as well as the item(s) described herein
may be subject to export control regulations. Export might require a prior
authorization from competent authorities.
Translations — A non-English (translated) version of a document is for
reference only. The English version shall prevail in case of any discrepancy
between the translated and English versions.
Quick reference data — The Quick reference data is an extract of the
product data given in the Limiting values and Characteristics sections of this
document, and as such is not complete, exhaustive or legally binding.
Bare die — All die are tested on compliance with their related technical
specifications as stated in this data sheet up to the point of wafer sawing and
are handled in accordance with the NXP Semiconductors storage and
transportation conditions. If there are data sheet limits not guaranteed, these
will be separately indicated in the data sheet. There are no post-packing tests
performed on individual die or wafers.
Non-automotive qualified products — Unless this data sheet expressly
states that this specific NXP Semiconductors product is automotive qualified,
the product is not suitable for automotive use. It is neither qualified nor tested
in accordance with automotive testing or application requirements. NXP
Semiconductors accepts no liability for inclusion and/or use of
NXP Semiconductors has no control of third party procedures in the sawing,
handling, packing or assembly of the die. Accordingly, NXP Semiconductors
assumes no liability for device functionality or performance of the die or
systems after third party sawing, handling, packing or assembly of the die. It
is the responsibility of the customer to test and qualify their application in
which the die is used.
non-automotive qualified products in automotive equipment or applications.
In the event that customer uses the product for design-in and use in
automotive applications to automotive specifications and standards, customer
(a) shall use the product without NXP Semiconductors’ warranty of the
product for such automotive applications, use and specifications, and (b)
whenever customer uses the product for automotive applications beyond
NXP Semiconductors’ specifications such use shall be solely at customer’s
own risk, and (c) customer fully indemnifies NXP Semiconductors for any
liability, damages or failed product claims resulting from customer design and
use of the product for automotive applications beyond NXP Semiconductors’
standard warranty and NXP Semiconductors’ product specifications.
All die sales are conditioned upon and subject to the customer entering into a
written die sale agreement with NXP Semiconductors through its legal
department.
18.4 Trademarks
Notice: All referenced brands, product names, service names and trademarks
are the property of their respective owners.
UCODE — is a trademark of NXP B.V.
19. Contact information
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
SL3S1203_1213
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2013. All rights reserved.
Product data sheet
COMPANY PUBLIC
Rev. 4.3 — 27 November 2013
178843
34 of 36
SL3S1203_1213
NXP Semiconductors
UCODE G2iL and G2iL+
20. Tables
Table 1. Ordering information. . . . . . . . . . . . . . . . . . . . . .3
Table 2. Marking codes . . . . . . . . . . . . . . . . . . . . . . . . . .3
Table 3. Pin description bare die . . . . . . . . . . . . . . . . . . .5
Table 4. Pin description SOT886 . . . . . . . . . . . . . . . . . . .5
Table 5. Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . .7
Table 6. Overview of G2iL and G2iL+ features . . . . . . . .9
Table 7. G2iL memory sections . . . . . . . . . . . . . . . . . . .10
Table 8. G2iL, G2iL+ overall memory map. . . . . . . . . . .11
Table 9. ChangeConfig custom command . . . . . . . . . . .16
Table 10. ChangeConfig custom command reply. . . . . . .16
Table 11. ChangeConfig command-response table . . . . .16
Table 12. Address 200h to 207h . . . . . . . . . . . . . . . . . . .18
Table 13. Address 208h to 20Fh . . . . . . . . . . . . . . . . . . .18
Table 14. ReadProtect command. . . . . . . . . . . . . . . . . . .19
Table 15. G2iL reply to a successful ReadProtect
command . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
Table 19. Reset ReadProtect command-response table 21
Table 20. ChangeEAS command . . . . . . . . . . . . . . . . . . 22
Table 21. G2iL reply to a successful ChangeEAS
command . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
Table 22. ChangeEAS command-response table . . . . . . 22
Table 23. EAS_Alarm command . . . . . . . . . . . . . . . . . . . 23
Table 24. G2iL reply to a successful EAS_Alarm
command . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
Table 25. EAS_Alarm command-response table . . . . . . 23
Table 26. Limiting values[1][2] . . . . . . . . . . . . . . . . . . . . . . 24
Table 27. G2iL, G2iL+ RF interface characteristics
(RFN, RFP) . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
Table 28. VDD pin characteristics . . . . . . . . . . . . . . . . . . 26
Table 29. G2iL, G2iL+ VDD and OUT pin characteristics 26
Table 30. G2iL, G2iL+ memory characteristics . . . . . . . . 27
Table 31. G2iL RF interface characteristics (RFN, RFP). 27
Table 32. Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . 29
Table 33. Revision history . . . . . . . . . . . . . . . . . . . . . . . . 32
procedure . . . . . . . . . . . . . . . . . . . . . . . . . . . . .19
Table 16. ReadProtect command-response table . . . . . .19
Table 17. Reset ReadProtect command . . . . . . . . . . . . .20
Table 18. G2iL reply to a successful Reset ReadProtect
21. Figures
Fig 1. Block diagram of G2iL IC . . . . . . . . . . . . . . . . . . .4
Fig 2. Pinning bare die. . . . . . . . . . . . . . . . . . . . . . . . . . .5
Fig 3. Pin configuration for SOT886 . . . . . . . . . . . . . . . .5
Fig 4. G2iL wafer layout. . . . . . . . . . . . . . . . . . . . . . . . . .6
Fig 5. G2iL TID memory structure . . . . . . . . . . . . . . . . .12
Fig 6. Schematic of connecting VDD and OUT pad
with a predetermined breaking point to turn a
standard RFID label into a wireless safety seal. .14
Fig 7. Schematic of external power supply . . . . . . . . . .16
Fig 8. Package outline SOT886. . . . . . . . . . . . . . . . . . .28
SL3S1203_1213
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2013. All rights reserved.
Product data sheet
COMPANY PUBLIC
Rev. 4.3 — 27 November 2013
178843
35 of 36
SL3S1203_1213
NXP Semiconductors
UCODE G2iL and G2iL+
22. Contents
1
General description. . . . . . . . . . . . . . . . . . . . . . 1
12
12.1
12.2
Characteristics . . . . . . . . . . . . . . . . . . . . . . . . 25
UCODE G2iL, G2iL+ bare die characteristics 25
UCODE G2iL SOT886 characteristics. . . . . . 27
2
2.1
Features and benefits . . . . . . . . . . . . . . . . . . . . 1
Key features . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Memory. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Key benefits . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
End user benefit . . . . . . . . . . . . . . . . . . . . . . . . 2
Antenna design benefits . . . . . . . . . . . . . . . . . . 2
Label manufacturer benefit. . . . . . . . . . . . . . . . 2
Custom commands. . . . . . . . . . . . . . . . . . . . . . 2
2.1.1
2.2
2.2.1
2.2.2
2.2.3
2.3
13
Package outline. . . . . . . . . . . . . . . . . . . . . . . . 28
14
14.1
14.2
Packing information . . . . . . . . . . . . . . . . . . . . 29
Wafer . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29
SOT886 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29
15
16
17
Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . 29
References. . . . . . . . . . . . . . . . . . . . . . . . . . . . 30
Revision history . . . . . . . . . . . . . . . . . . . . . . . 32
3
3.1
3.2
Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
Markets. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
18
Legal information . . . . . . . . . . . . . . . . . . . . . . 33
Data sheet status . . . . . . . . . . . . . . . . . . . . . . 33
Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . 33
Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . 33
Trademarks . . . . . . . . . . . . . . . . . . . . . . . . . . 34
18.1
18.2
18.3
18.4
4
Ordering information. . . . . . . . . . . . . . . . . . . . . 3
Marking. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 4
Pinning information. . . . . . . . . . . . . . . . . . . . . . 5
Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 5
Wafer layout . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
Wafer layout . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
5
6
7
7.1
8
19
20
21
22
Contact information . . . . . . . . . . . . . . . . . . . . 34
Tables. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35
Figures . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35
Contents. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36
8.1
9
9.1
9.1.1
9.1.2
9.1.3
Mechanical specification . . . . . . . . . . . . . . . . . 7
Wafer specification . . . . . . . . . . . . . . . . . . . . . . 7
Wafer . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
Fail die identification . . . . . . . . . . . . . . . . . . . . 8
Map file distribution. . . . . . . . . . . . . . . . . . . . . . 8
10
10.1
10.2
10.3
10.3.1
10.3.2
10.4
10.5
10.6
Functional description . . . . . . . . . . . . . . . . . . . 8
Air interface standards . . . . . . . . . . . . . . . . . . . 8
Power transfer . . . . . . . . . . . . . . . . . . . . . . . . . 8
Data transfer. . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Reader to tag Link . . . . . . . . . . . . . . . . . . . . . . 9
Tag to reader Link. . . . . . . . . . . . . . . . . . . . . . . 9
G2iL and G2iL+ differences . . . . . . . . . . . . . . . 9
Supported commands . . . . . . . . . . . . . . . . . . 10
G2iL, G2iL+ memory . . . . . . . . . . . . . . . . . . . 10
G2iL, G2iL+ overall memory map. . . . . . . . . . 11
G2iL TID memory details . . . . . . . . . . . . . . . . 12
Custom commands. . . . . . . . . . . . . . . . . . . . . 13
ChangeConfig. . . . . . . . . . . . . . . . . . . . . . . . . 13
G2iL, G2iL+ special features . . . . . . . . . . . . . .13
G2iL, G2iL+ special features control
10.6.1
10.6.2
10.7
10.7.1
10.7.2
mechanism . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
ReadProtect . . . . . . . . . . . . . . . . . . . . . . . . . . 18
Reset ReadProtect3 . . . . . . . . . . . . . . . . . . . . 19
ChangeEAS3 . . . . . . . . . . . . . . . . . . . . . . . . . 21
EAS_Alarm . . . . . . . . . . . . . . . . . . . . . . . . . . 22
10.7.3
10.7.4
10.7.5
10.7.6
11
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . 24
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
© NXP B.V. 2013.
All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
Date of release: 27 November 2013
178843
相关型号:
©2020 ICPDF网 联系我们和版权申明