SOT545-3 [PHILIPS]

plastic thermal enganced thin quad flat package; 48 leads; body 7 x 7 x 1 mm; exposed die pad; 塑料的热enganced薄型四方扁平封装; 48线索;身体7 ×7× 1毫米;裸露的芯片焊盘
SOT545-3
型号: SOT545-3
厂家: NXP SEMICONDUCTORS    NXP SEMICONDUCTORS
描述:

plastic thermal enganced thin quad flat package; 48 leads; body 7 x 7 x 1 mm; exposed die pad
塑料的热enganced薄型四方扁平封装; 48线索;身体7 ×7× 1毫米;裸露的芯片焊盘

文件: 总1页 (文件大小:20K)
下载:  下载PDF数据表文档文件

SOT-547-1

PC BOARD FOORTPRINT

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9 PHILIPS

SOT547-2

PC BOARD FOORTPRINT

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10 PHILIPS

SOT553

SUGGESTED PAD LAYOUT

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68 DIODES

SOT553

SUGGESTED PAD LAYOUT

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9 DIODES

SOT563

SUGGESTED PAD LAYOUT

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65 DIODES

SOT563

SUGGESTED PAD LAYOUT

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11 DIODES

SOT563

TVS Diode Array WE-TVS

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28 WURTH

SOT-563

5 Volts ESD Protection Device

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19 MCC

SOT-563

OUTLINE

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193 SYNC-POWER

SOT570-3

32-bit ARM Cortex-M4/M0 MCU; up to 264 kB SRAM; Ethernet; two High-speed USBs; advanced configurable peripherals

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22 PHILIPS

SOT570-3

32-bit ARM Cortex-M3 MCU; up to 200 kB SRAM; Ethernet, two High-speed USB, LCD, and external memory controller

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9 PHILIPS

SOT666

SUGGESTED PAD LAYOUT

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20 DIODES

SOT666

GPS HIGH GAIN LNA ICs

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81 STMICROELECTR

SOT666

SUGGESTED PAD LAYOUT

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50 DIODES

SOT666

GPS HIGH GAIN LNA ICs

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49 STMICROELECTR