TDA8714T_技术文档

INTEGRATED CIRCUITS

DATA SHEET

TDA8714

8-bit high-speed analog-to-digital

converter

1997 Oct 29

Product speciﬁcation

Supersedes data of 1996 Jan 31

File under Integrated Circuits, IC02

Philips Semiconductors

Product speciﬁcation

8-bit high-speed analog-to-digital converter

TDA8714

FEATURES

APPLICATIONS

High-speed analog-to-digital conversion for:

• 8-bit resolution

• Sampling rate up to 80 MHz

• No missing codes guaranteed

• video data digitizing

• radar pulse analysis

• transient signal analysis

• high energy physics research

• Σ∆ modulators

• High signal-to-noise ratio over a large analog input

frequency range (7.7 effective bits at 4.43 MHz

full-scale input at f_clk= 80 MHz)

• Overflow/underflow 3-state TTL output

• TTL compatible digital inputs

• medical imaging.

• Low-level AC clock input signal allowed

• External reference voltage regulator

• Power dissipation only 340 mW (typical)

GENERAL DESCRIPTION

The TDA8714 is an 8-bit high-speed Analog-to-Digital

Converter (ADC) for professional video and other

applications. It converts the analog input signal into 8-bit

binary-coded digital words at a maximum sampling rate of

80 MHz. All digital inputs and outputs are TTL compatible,

although a low-level sine wave clock input signal is

allowed.

• Low analog input capacitance, no buffer amplifier

required

• No sample-and-hold circuit required.

QUICK REFERENCE DATA

SYMBOL

PARAMETER

analog supply voltage

CONDITIONS

MIN.

4.75

TYP.

5.0

MAX.

5.25

UNIT

V_CCA

V_CCD

V_CCO

I_CCA

V

digital supply voltage

output stages supply voltage

analog supply current

digital supply current

output stages supply current

DC integral non-linearity

DC differential non-linearity

AC integral non-linearity

maximum clock frequency

TDA8714/7

4.75

5.0

25

5.25

30

4.75

−

mA

I_CCD

−

27

33

mA

I_CCO

−

16

20

mA

INL

−

±0.4

±0.2

±0.5

±0.35

±1.0

LSB

DNL

AINL

f_clk(max)

−

note 1

−

80

60

40

−

MHz

mW

TDA8714/6

−

TDA8714/4

−

P_tot

total power dissipation

340

435

Note

1. Full-scale sine wave (f_i= 4.43 MHz; f_clk= 80 MHz).

1997 Oct 29

2

Philips Semiconductors

Product speciﬁcation

8-bit high-speed analog-to-digital converter

TDA8714

ORDERING INFORMATION

PACKAGE

TYPE

SAMPLING

NUMBER

FREQUENCY (MHz)

NAME

DESCRIPTION

VERSION

TDA8714T/4

TDA8714T/6

TDA8714T/7

SO24

plastic small outline package; 24 leads;

body width 7.5 mm

SOT137-1

SOT340-1

40

60

80

40

60

80

TDA8714M/4 SSOP24 plastic shrink small outline package; 24 leads;

body width 5.3 mm

TDA8714M/6 SSOP24

TDA8714M/7 SSOP24

BLOCK DIAGRAM

handbook, full pagewidth

V

7

CLK

16

V

CCD

CE

22

CCA

18

CLOCK DRIVER

V

RT

9

TDA8714

12 D7

13 D6

MSB

14 D5

15 D4

23 D3

24 D2

V

I

8

ANALOG -TO-DIGITAL

CONVERTER

analog

voltage input

LATCHES

TTL OUTPUTS

data outputs

1

2

D1

D0

V

LSB

CCO1

19

V

RB

4

21

11

V

CCO2

overflow / underflow

output

OVERFLOW / UNDERFLOW

LATCH

TTL OUTPUT

OGND 20

output ground

17

6

AGND

DGND

MSA669

analog ground

digital ground

Fig.1 Block diagram.

3

1997 Oct 29

Philips Semiconductors

Product speciﬁcation

8-bit high-speed analog-to-digital converter

TDA8714

PINNING

SYMBOL PIN

DESCRIPTION

data output; bit 1

D1

1

2

3

4

5

6

7

8

9

D0

data output; bit 0 (LSB)

not connected

n.c.

V_RB

n.c.

reference voltage BOTTOM input

not connected

handbook, halfpage

1

2

3

4

5

6

7

8

9

D1

D0

24 D2

23 D3

AGND

V_CCA

V_I

analog ground

analog supply voltage (+5 V)

analog input voltage

reference voltage TOP input

n.c.

22

21

CE

V

V_RT

n.c.

CCO2

RB

10 not connected

n.c.

20 OGND

O/UF

D7

11 overﬂow/underﬂow data output

12 data output; bit 7 (MSB)

13 data output; bit 6

14 data output; bit 5

15 data output; bit 4

16 clock input

V

AGND

19

18

CCO1

TDA8714

V

CCD

CCA

D6

V

I

17 DGND

16 CLK

15 D4

D5

V

RT

D4

n.c. 10

CLK

DGND

V_CCD

V_CCO1

17 digital ground

O/UF 11

14 D5

18 digital supply voltage (+5 V)

12

D7

13 D6

19 supply voltage for output stages 1

(+5 V)

MSA667

OGND

V_CCO2

20 output ground

21 supply voltage for output stages 2

(+5 V)

CE

22 chip enable input (TTL level input,

active LOW)

D3

D2

23 data output; bit 3

24 data output; bit 2

Fig.2 Pin configuration.

1997 Oct 29

4

Philips Semiconductors

Product speciﬁcation

8-bit high-speed analog-to-digital converter

TDA8714

LIMITING VALUES

In accordance with the Absolute Maximum Rating System (IEC 134).

SYMBOL

V_CCA

PARAMETER

analog supply voltage

CONDITIONS

note 1

MIN.

−0.3

MAX.

+7.0

UNIT

V

V_CCD

V_CCO

∆V_CC

digital supply voltage

note 1

−0.3

−1.0

+7.0

+1.0

output stages supply voltage

supply voltage differences between

V_CCAand V_CCD

∆V_CC

supply voltage differences between

V_CCOand V_CCD

−1.0

+1.0

V

supply voltage differences between

V_CCAand V_CCO

V_I

input voltage

referenced to AGND

referenced to DGND

−0.3

+7.0

V

V_clk(p-p)

AC input voltage for switching

(peak-to-peak value)

−

V_CCD

I_O

output current

−

10

mA

°C

T_stg

T_amb

T_j

storage temperature

operating ambient temperature

junction temperature

−55

0

+150

+70

+150

−

Note

1. The supply voltages V_CCAand V_CCDmay have any value between −0.3 V and +7.0 V provided the difference

between V_CCAand V_CCDis between −1 V and +1 V.

HANDLING

Inputs and outputs are protected against electrostatic discharges in normal handling. However, to be totally safe, it is

desirable to take normal precautions appropriate to handling integrated circuits.

THERMAL CHARACTERISTICS

SYMBOL

R_{th j-a}

PARAMETER

VALUE

UNIT

thermal resistance from junction to ambient in free air

SOT137-1

SOT340-1

75

K/W

119

1997 Oct 29

5

Philips Semiconductors

Product speciﬁcation

8-bit high-speed analog-to-digital converter

TDA8714

CHARACTERISTICS

V

_CCA= V₇to V₆= 4.75 to 5.25 V; V_CCD= V₁₈to V₁₇= 4.75 to 5.25 V; V_CCO= V₁₉and V₂₁to V₂₀= 4.75 to 5.25 V;

AGND and DGND shorted together; V_CCAto V_CCD= −0.25 to +0.25 V; V_CCOto V_CCD= −0.25 to +0.25 V;

_CCAto V_CCO= −0.25 to +0.25 V; V_i(p-p)= 1.75 V; T_amb= 0 to +70 °C; typical values measured at

V_CCA= V_CCD= V_CCO= 5 V and T_amb= 25 °C; unless otherwise speciﬁed.

V

SYMBOL

PARAMETER

CONDITIONS

MIN.

TYP.

MAX.

UNIT

Supply

V_CCA

V_CCD

V_CCO

I_CCA

analog supply voltage

4.75

−

5.0

5.25

30

V

digital supply voltage

5.0

25

output stages supply voltage

analog supply current

mA

I_CCD

digital supply current

−

27

33

I_CCO

output stages supply current

−

16

20

Inputs

CLOCK INPUT CLK (REFERENCED TO DGND); note 1

V_IL

V_IH

I_IL

LOW level input voltage

HIGH level input voltage

LOW level input current

HIGH level input current

input impedance

0

−

0.8

V_CCD

−

V

2.0

−400

−

V

V_clk= 0.4 V

−

µA

kΩ

pF

I_IH

Z_I

V_clk= 2.7 V

f_clk= 80 MHz

−

300

−

18

1

C_I

input capacitance

−

INPUT CE (REFERENCED TO DGND); see Table 2

V_IL

V_IH

I_IL

LOW level input voltage

HIGH level input voltage

LOW level input current

HIGH level input current

0

−

0.8

V_CCD

−

V

2.0

−400

−

V

V_IL= 0.4 V

V_IH= 2.7 V

µA

I_IH

20

V_I(ANALOG INPUT VOLTAGE REFERENCED TO AGND)

I_IL

I_IH

Z_I

LOW level input current

HIGH level input current

input impedance

V_I= 1.2 V

−

0

−

µA

kΩ

pF

V_I= 3.5 V

60

−

130

10

14

280

−

f_i= 4.43 MHz

C_I

input capacitance

−

Reference voltages for the resistor ladder; see Table 1

V_RB

reference voltage BOTTOM

reference voltage TOP

1.2

3.5

1.9

−

1.3

1.6

3.9

2.7

−

V

V_RT

3.6

V

V_diff

differential reference voltage V_RT− V_RB

reference current

2.3

V

I_ref

11.5

200

0.24

285

315

1.75

mA

Ω

R_LAD

TC_RLAD

V_osB

V_osT

V_i(p-p)

resistor ladder

−

temperature coefﬁcient of the resistor ladder

offset voltage BOTTOM

−

ppm

mV

V

note 2

275

305

1.45

295

325

2.15

offset voltage TOP

analog input voltage (peak-to-peak value)

1997 Oct 29

6

Philips Semiconductors

Product speciﬁcation

8-bit high-speed analog-to-digital converter

TDA8714

SYMBOL

Outputs

PARAMETER

CONDITIONS

MIN.

TYP.

MAX.

UNIT

DIGITAL OUTPUTS D7 to D0 (REFERENCED TO DGND)

V_OL

V_OH

LOW level output voltage

HIGH level output voltage

I_O= 1 mA

0

−

0.4

V

I_O= −0.4 mA

I_O= −1 mA

2.7

2.4

−20

−

V_CCD

+20

I_OZ

output current in 3-state mode

0.4 V < V_O< V_CCD

µA

Switching characteristics

CLOCK INPUT CLK (note 1; see Fig.3)

f_clk(max)

maximum clock frequency

TDA8714/4

40

60

80

6

−

MHz

ns

TDA8714/6

TDA8714/7

t_CPH

t_CPL

clock pulse width HIGH

clock pulse width LOW

6

ns

Analog signal processing

LINEARITY

INL

DC integral non-linearity

−

±0.4

±0.2

±0.5

LSB

DNL

AINL

DC differential non-linearity

AC integral non-linearity

±0.35 LSB

note 3

±1.0

LSB

BANDWIDTH (f_clk= 40 MHz); note 4

B

analog bandwidth

full-scale sine wave

−

13

20

−

MHz

75% full-scale sine

wave; small signal at

V_i= ±5 LSB, code 128

t_STLH

t_STHL

analog input settling time LOW-to-HIGH

analog input settling time HIGH-to-LOW

full-scale square

wave; Fig.6; note 5

−

2.5

3.0

3.5

4.0

ns

full-scale square

wave; Fig.6; note 5

HARMONICS (f_clk= 40 MHz)

h₁

fundamental harmonics (full scale)

f_i= 4.43 MHz

−

0

dB

h_all

harmonics (full scale);

all components

second harmonics

third harmonics

−

−64

−58

−56

−60

−55

−

dB

THD

total harmonic distortion

f_i= 4.43 MHz

SIGNAL-TO-NOISE RATIO (note 6; see Figs 7 and 13)

S/N

signal-to-noise ratio (full scale)

without harmonics;

f_clk= 40 MHz;

46

48

−

dB

f_i= 4.43 MHz

1997 Oct 29

7

Philips Semiconductors

Product speciﬁcation

8-bit high-speed analog-to-digital converter

TDA8714

SYMBOL

PARAMETER

CONDITIONS

MIN.

TYP.

MAX.

UNIT

EFFECTIVE BITS (note 6; see Figs 7 and 13)

EB

effective bits

TDA8714/4

f_clk= 40 MHz

f_i= 4.43 MHz

f_i= 7.5 MHz

−

7.75

−

bits

−

7.6

−

bits

effective bits

TDA8714/6

f

_clk= 60 MHz

f_i= 4.43 MHz

f_i= 7.5 MHz

f_i= 10 MHz

−

7.7

−

bits

7.55

7.4

effective bits

TDA8714/7

f_clk= 80 MHz

f_i= 4.43 MHz

f_i= 7.5 MHz

f_i= 10 MHz

f_i= 15 MHz

−

7.7

7.5

7.2

6.3

−

bits

TWO-TONE (note 7)

TTIR

two-tone intermodulation rejection

f

_clk= 40 MHz

−

−56

−

dB

BIT ERROR RATE

BER

bit error rate

f_clk= 40 MHz;

f_i= 4.43 MHz;

V_I= ±16 LSB at

code 128

10⁻¹¹

times/

samples

DIFFERENTIAL GAIN (note 8)

G_diff

differential gain

f_clk= 40 MHz;

f_i= 4.43 MHz

−

0.6

0.8

−

%

DIFFERENTIAL PHASE (note 8)

ϕ_diff

differential phase

f_clk= 40 MHz;

f_i= 4.43 MHz

deg

Timing (note 9; see Figs 3 and 5; f_clk= 80 MHz)

t_ds

t_h

sampling delay time

output hold time

−

5

−

2

ns

−

t_d

output delay time

10

11

3-state output delay times (see Fig.4)

t_dZH

t_dZL

t_dHZ

t_dLZ

enable HIGH

enable LOW

disable HIGH

disable LOW

−

40

12

50

10

44

16

54

14

ns

1997 Oct 29

8

Philips Semiconductors

Product speciﬁcation

8-bit high-speed analog-to-digital converter

TDA8714

Notes to the characteristics

1. In addition to a good layout of the digital and analog ground, it is recommended that the rise and fall times of the clock

must not be less than 1 ns.

2. Analog input voltages producing code 00 up to and including FF:

a) V_osB(voltage offset BOTTOM) is the difference between the analog input which produces data equal to 00 and

the reference voltage BOTTOM (V_RB) at T_amb= 25 °C.

b) V_osT(voltage offset TOP) is the difference between V_RT(reference voltage TOP) and the analog input which

produces data outputs equal to FF at T_amb= 25 °C.

3. Full-scale sine wave (f_i= 4.43 MHz; f_clk= 80 MHz).

4. The analog bandwidth is defined as the maximum input sine wave frequency which can be applied to the device.

No glitches greater than 2 LSBs, neither any significant attenuation are observed in the reconstructed signal.

5. The analog input settling time is the minimum time required for the input signal to be stabilized after a sharp full-scale

input (square-wave signal) in order to sample the signal and obtain correct output data.

6. Effective bits are obtained via a Fast Fourier Transform (FFT) treatment taking 8K acquisition points per equivalent

fundamental period. The calculation takes into account all harmonics and noise up to half of the clock frequency

(NYQUIST frequency). Conversion to signal-to-noise ratio: S/N = EB × 6.02 + 1.76 dB.

7. Intermodulation measured relative to either tone with analog input frequencies of 4.43 MHz and 4.53 MHz. The two

input signals have the same amplitude and the total amplitude of both signals provides full scale to the converter.

8. Measurement carried out using video analyser VM700A where the video analog signal is reconstructed through a

digital-to-analog converter.

9. Output data acquisition: the output data is available after the maximum delay time of t_d; in the event of 80 MHz clock

operation, the hardware design must take into account the t_dand t_hlimits with respect to the input characteristics of

the acquisition circuit.

1997 Oct 29

9

Philips Semiconductors

Product speciﬁcation

8-bit high-speed analog-to-digital converter

TDA8714

Table 1 Output coding and input voltage (typical values; referenced to AGND)

BINARY OUTPUT BITS

STEP

V_I(p-p)

O/UF

D7

D6

D5

D4

D3

D2

D1

D0

Underﬂow

<1.585

1

0

.

0

.

0

.

0

.

0

.

0

.

0

.

0

1

.

0

1.585

1

.

254

.

0

1

0

1

255

3.28

>3.28

Overﬂow

Table 2 Mode selection

CE

D7 to D0

O/UF

1

0

high impedance

active; binary

high impedance

active

t

CPL

handbook, full pagewidth

t

CPH

50 %

CLK

sample N

sample N + 1

sample N + 2

V

l

t

ds

h

V

DDO

DATA

D0 to D7

DATA

N - 2

DATA

N - 1

DATA

N

DATA

50 %

N + 1

0 V

t

d

MSA670

Fig.3 Timing diagram.

10

1997 Oct 29

Philips Semiconductors

Product speciﬁcation

8-bit high-speed analog-to-digital converter

TDA8714

V

CCD

dbook, full pagewidth

CE

50 %

dZH

t

dHZ

HIGH

90 %

output

data

50 %

LOW

t

dZL

dLZ

HIGH

output

data

50 %

TEST

t_dLZ

S1

LOW

10 %

V_CCD

t_dZL

t_dHZ

t_dZH

V_CCD

V

CCD

DGND

3.3 kΩ

15 pF

S1

TDA8714

MBD876

CE

f_CE= 100 kHz.

Fig.4 Timing diagram and test conditions of 3-state output delay time.

handbook, halfpage

D0 to D7

15 pF

MBB956 - 1

Fig.5 Load circuit for timing measurement.

1997 Oct 29

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Philips Semiconductors

Product speciﬁcation

8-bit high-speed analog-to-digital converter

TDA8714

t

STLH

STHL

50 %

handbook, full pagewidth

code 255

V

I

50 %

code 0

2 ns

CLK

50 %

MGD184

0.5 ns

Fig.6 Analog input settling-time diagram.

1997 Oct 29

12

Philips Semiconductors

Product speciﬁcation

8-bit high-speed analog-to-digital converter

TDA8714

MBD877

0

handbook, full pagewidth

amplitude

(dB)

20

40

60

80

100

120

0

2.50

5.00

7.50

10.0

12.5

15.0

17.5

20.0

f (MHz)

Effective bits: 7.80; THD = −57.82 dB.

Harmonic levels (dB): 2nd = −68.00; 3rd = −61.54; 4th = −72.46; 5th = −65.80; 6th = −68.88.

Fig.7 Fast Fourier Transform (f_clk= 40 MHz; f_i= 4.43 MHz).

MBD878

0

handbook, full pagewidth

amplitude

(dB)

20

40

60

80

100

120

0

4.69

9.39

14.1

18.8

23.5

28.2

32.9

37.5

f (MHz)

Effective bits: 7.27; THD = −49.23 dB.

Harmonic levels (dB): 2nd = −56.16; 3rd = −51.01; 4th = −69.84; 5th = −59.10; 6th = −65.34.

Fig.8 Fast Fourier Transform (f_clk= 80 MHz; f_i= 10 MHz).

1997 Oct 29

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Philips Semiconductors

Product speciﬁcation

8-bit high-speed analog-to-digital converter

TDA8714

INTERNAL PIN CONFIGURATIONS

V

CCO1

handbook, halfpage

V

CCO2

CCA

(x 90)

D7 to D0

O/UF

V

I

DGND

AGND

MLB036

MLB037

Fig.9 TTL data and overflow/underflow outputs.

Fig.10 Analog inputs.

book, halfpage

V

CCO1

handbook, halfpage

V

CCA

V

RT

RM

CE

R

LAD

V

RB

AGND

MEA050 - 1

DGND

MLB038

Fig.11 CE (3-state) input.

Fig.12 V_RBand V_RT.

1997 Oct 29

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Philips Semiconductors

Product speciﬁcation

8-bit high-speed analog-to-digital converter

TDA8714

V

CCD

handbook, full pagewidth

V

CLK

ref

30 kΩ

DGND

MCD189 - 1

Fig.13 CLK input.

1997 Oct 29

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Philips Semiconductors

Product speciﬁcation

8-bit high-speed analog-to-digital converter

TDA8714

APPLICATION INFORMATION

handbook, halfpage

D1

D2

D3

1

2

24

23

22

21

20

19

18

17

16

15

14

D0

(2)

n.c.

CE

V

3

(1)

RB

V

CCO2

4

100 nF

AGND

(2)

n.c.

OGND

5

V

AGND

CCO1

6

TDA8714

V

CCA

CCD

7

V

I

DGND

CLK

D4

8

(1)

V

RT

9

100 nF

(2)

n.c.

10

11

12

AGND

O/UF

D7

D5

D6

13

MSA668

The analog and digital supplies should be separated and decoupled.

The external voltage generator must be built such that a good supply voltage ripple rejection is achieved with respect to the LSB value.

(1) V_RBand V_RTare decoupled to AGND.

(2) Pin 5 should be connected to AGND; pins 3 and 10 to DGND in order to prevent noise influence.

Fig.14 Application diagram.

1997 Oct 29

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Philips Semiconductors

Product speciﬁcation

8-bit high-speed analog-to-digital converter

TDA8714

PACKAGE OUTLINES

SO24: plastic small outline package; 24 leads; body width 7.5 mm

SOT137-1

D

E

A

X

c

H

v

M

A

E

y

Z

24

13

Q

A

2

A

(A )

3

A

1

pin 1 index

θ

L

p

L

1

12

w

detail X

e

M

b

p

0

5

10 mm

scale

DIMENSIONS (inch dimensions are derived from the original mm dimensions)

A

max.

(1)

UNIT

A

b

c

D

E

e

H

L

Q

v

w

y

θ

1

2

3

p

E

p

Z

0.30

0.10

2.45

2.25

0.49

0.36

0.32

0.23

15.6

15.2

7.6

7.4

10.65

10.00

1.1

0.4

1.1

1.0

0.9

0.4

mm

2.65

0.25

0.01

1.27

0.050

1.4

0.25 0.25

0.01

0.1

8^o

0^o

0.012 0.096

0.004 0.089

0.019 0.013 0.61

0.014 0.009 0.60

0.30

0.29

0.419

0.394

0.043 0.043

0.016 0.039

0.035

0.016

inches 0.10

0.055

0.01 0.004

Note

1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.

REFERENCES

OUTLINE

EUROPEAN

PROJECTION

ISSUE DATE

VERSION

IEC

JEDEC

EIAJ

95-01-24

97-05-22

SOT137-1

075E05

MS-013AD

1997 Oct 29

17

Philips Semiconductors

Product speciﬁcation

8-bit high-speed analog-to-digital converter

TDA8714

SSOP24: plastic shrink small outline package; 24 leads; body width 5.3 mm

SOT340-1

D

E

A

X

v

c

H

M

A

y

E

Z

24

13

Q

A

2

A

(A )

3

A

1

pin 1 index

θ

L

p

L

1

12

detail X

w

M

b

p

e

0

2.5

5 mm

scale

DIMENSIONS (mm are the original dimensions)

A

(1)

UNIT

A

b

c

D

E

e

H

L

p

Q

v

w

y

Z

θ

1

2

3

p

E

max.

8^o

0^o

0.21

0.05

1.80

1.65

0.38

0.25

0.20

0.09

8.4

8.0

5.4

5.2

7.9

7.6

1.03

0.63

0.9

0.7

0.8

0.4

mm

2.0

0.65

1.25

0.25

0.2

0.13

0.1

Note

1. Plastic or metal protrusions of 0.20 mm maximum per side are not included.

REFERENCES

OUTLINE

EUROPEAN

PROJECTION

ISSUE DATE

VERSION

IEC

JEDEC

EIAJ

93-09-08

95-02-04

SOT340-1

MO-150AG

1997 Oct 29

18

Philips Semiconductors

Product speciﬁcation

8-bit high-speed analog-to-digital converter

TDA8714

SOLDERING

Introduction

SSOP

Wave soldering is not recommended for SSOP packages.

This is because of the likelihood of solder bridging due to

closely-spaced leads and the possibility of incomplete

solder penetration in multi-lead devices.

There is no soldering method that is ideal for all IC

packages. Wave soldering is often preferred when

through-hole and surface mounted components are mixed

on one printed-circuit board. However, wave soldering is

not always suitable for surface mounted ICs, or for

printed-circuits with high population densities. In these

situations reflow soldering is often used.

If wave soldering cannot be avoided, the following

conditions must be observed:

• A double-wave (a turbulent wave with high upward

pressure followed by a smooth laminar wave)

soldering technique should be used.

This text gives a very brief insight to a complex technology.

A more in-depth account of soldering ICs can be found in

our “IC Package Databook” (order code 9398 652 90011).

• The longitudinal axis of the package footprint must

be parallel to the solder flow and must incorporate

solder thieves at the downstream end.

Reﬂow soldering

Even with these conditions, only consider wave

soldering SSOP packages that have a body width of

4.4 mm, that is SSOP16 (SOT369-1) or

SSOP20 (SOT266-1).

Reflow soldering techniques are suitable for all SO and

SSOP packages.

Reflow soldering requires solder paste (a suspension of

fine solder particles, flux and binding agent) to be applied

to the printed-circuit board by screen printing, stencilling or

pressure-syringe dispensing before package placement.

METHOD (SO AND SSOP)

During placement and before soldering, the package must

be fixed with a droplet of adhesive. The adhesive can be

applied by screen printing, pin transfer or syringe

dispensing. The package can be soldered after the

adhesive is cured.

Several techniques exist for reflowing; for example,

thermal conduction by heated belt. Dwell times vary

between 50 and 300 seconds depending on heating

method. Typical reflow temperatures range from

215 to 250 °C.

Maximum permissible solder temperature is 260 °C, and

maximum duration of package immersion in solder is

10 seconds, if cooled to less than 150 °C within

Preheating is necessary to dry the paste and evaporate

the binding agent. Preheating duration: 45 minutes at

45 °C.

6 seconds. Typical dwell time is 4 seconds at 250 °C.

A mildly-activated flux will eliminate the need for removal

of corrosive residues in most applications.

Wave soldering

SO

Repairing soldered joints

Wave soldering techniques can be used for all SO

packages if the following conditions are observed:

Fix the component by first soldering two diagonally-

opposite end leads. Use only a low voltage soldering iron

(less than 24 V) applied to the flat part of the lead. Contact

time must be limited to 10 seconds at up to 300 °C. When

using a dedicated tool, all other leads can be soldered in

one operation within 2 to 5 seconds between

270 and 320 °C.

• A double-wave (a turbulent wave with high upward

pressure followed by a smooth laminar wave) soldering

technique should be used.

• The longitudinal axis of the package footprint must be

parallel to the solder flow.

• The package footprint must incorporate solder thieves at

the downstream end.

1997 Oct 29

19

Philips Semiconductors

Product speciﬁcation

8-bit high-speed analog-to-digital converter

TDA8714

DEFINITIONS

Data sheet status

Objective speciﬁcation

Preliminary speciﬁcation

Product speciﬁcation

This data sheet contains target or goal speciﬁcations for product development.

This data sheet contains preliminary data; supplementary data may be published later.

This data sheet contains ﬁnal product speciﬁcations.

Limiting values

Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or

more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation

of the device at these or at any other conditions above those given in the Characteristics sections of the speciﬁcation

is not implied. Exposure to limiting values for extended periods may affect device reliability.

Application information

Where application information is given, it is advisory and does not form part of the speciﬁcation.

LIFE SUPPORT APPLICATIONS

These products are not designed for use in life support appliances, devices, or systems where malfunction of these

products can reasonably be expected to result in personal injury. Philips customers using or selling these products for

use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such

improper use or sale.

1997 Oct 29

20

Philips Semiconductors

Product speciﬁcation

8-bit high-speed analog-to-digital converter

TDA8714

NOTES

1997 Oct 29

21

Philips Semiconductors

Product speciﬁcation

8-bit high-speed analog-to-digital converter

TDA8714

NOTES

1997 Oct 29

22

Philips Semiconductors

Product speciﬁcation

8-bit high-speed analog-to-digital converter

TDA8714

NOTES

1997 Oct 29

23

Philips Semiconductors – a worldwide company

Argentina: see South America

Netherlands: Postbus 90050, 5600 PB EINDHOVEN, Bldg. VB,

Tel. +31 40 27 82785, Fax. +31 40 27 88399

Australia: 34 Waterloo Road, NORTH RYDE, NSW 2113,

Tel. +61 2 9805 4455, Fax. +61 2 9805 4466

New Zealand: 2 Wagener Place, C.P.O. Box 1041, AUCKLAND,

Tel. +64 9 849 4160, Fax. +64 9 849 7811

Austria: Computerstr. 6, A-1101 WIEN, P.O. Box 213, Tel. +43 160 1010,

Fax. +43 160 101 1210

Norway: Box 1, Manglerud 0612, OSLO,

Tel. +47 22 74 8000, Fax. +47 22 74 8341

Belarus: Hotel Minsk Business Center, Bld. 3, r. 1211, Volodarski Str. 6,

220050 MINSK, Tel. +375 172 200 733, Fax. +375 172 200 773

Philippines: Philips Semiconductors Philippines Inc.,

106 Valero St. Salcedo Village, P.O. Box 2108 MCC, MAKATI,

Metro MANILA, Tel. +63 2 816 6380, Fax. +63 2 817 3474

Belgium: see The Netherlands

Brazil: see South America

Poland: Ul. Lukiska 10, PL 04-123 WARSZAWA,

Tel. +48 22 612 2831, Fax. +48 22 612 2327

Bulgaria: Philips Bulgaria Ltd., Energoproject, 15th floor,

51 James Bourchier Blvd., 1407 SOFIA,

Tel. +359 2 689 211, Fax. +359 2 689 102

Portugal: see Spain

Romania: see Italy

Canada: PHILIPS SEMICONDUCTORS/COMPONENTS,

Tel. +1 800 234 7381

Russia: Philips Russia, Ul. Usatcheva 35A, 119048 MOSCOW,

Tel. +7 095 755 6918, Fax. +7 095 755 6919

China/Hong Kong: 501 Hong Kong Industrial Technology Centre,

72 Tat Chee Avenue, Kowloon Tong, HONG KONG,

Tel. +852 2319 7888, Fax. +852 2319 7700

Singapore: Lorong 1, Toa Payoh, SINGAPORE 1231,

Tel. +65 350 2538, Fax. +65 251 6500

Colombia: see South America

Czech Republic: see Austria

Slovakia: see Austria

Slovenia: see Italy

Denmark: Prags Boulevard 80, PB 1919, DK-2300 COPENHAGEN S,

Tel. +45 32 88 2636, Fax. +45 31 57 0044

South Africa: S.A. PHILIPS Pty Ltd., 195-215 Main Road Martindale,

2092 JOHANNESBURG, P.O. Box 7430 Johannesburg 2000,

Tel. +27 11 470 5911, Fax. +27 11 470 5494

Finland: Sinikalliontie 3, FIN-02630 ESPOO,

Tel. +358 9 615800, Fax. +358 9 61580920

South America: Rua do Rocio 220, 5th floor, Suite 51,

04552-903 São Paulo, SÃO PAULO - SP, Brazil,

Tel. +55 11 821 2333, Fax. +55 11 829 1849

France: 4 Rue du Port-aux-Vins, BP317, 92156 SURESNES Cedex,

Tel. +33 1 40 99 6161, Fax. +33 1 40 99 6427

Spain: Balmes 22, 08007 BARCELONA,

Tel. +34 3 301 6312, Fax. +34 3 301 4107

Germany: Hammerbrookstraße 69, D-20097 HAMBURG,

Tel. +49 40 23 53 60, Fax. +49 40 23 536 300

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Tel. +46 8 632 2000, Fax. +46 8 632 2745

Greece: No. 15, 25th March Street, GR 17778 TAVROS/ATHENS,

Tel. +30 1 4894 339/239, Fax. +30 1 4814 240

Switzerland: Allmendstrasse 140, CH-8027 ZÜRICH,

Tel. +41 1 488 2686, Fax. +41 1 481 7730

Hungary: see Austria

India: Philips INDIA Ltd, Band Box Building, 2nd floor,

254-D, Dr. Annie Besant Road, Worli, MUMBAI 400 025,

Tel. +91 22 493 8541, Fax. +91 22 493 0966

Taiwan: Philips Semiconductors, 6F, No. 96, Chien Kuo N. Rd., Sec. 1,

TAIPEI, Taiwan Tel. +886 2 2134 2865, Fax. +886 2 2134 2874

Thailand: PHILIPS ELECTRONICS (THAILAND) Ltd.,

209/2 Sanpavuth-Bangna Road Prakanong, BANGKOK 10260,

Tel. +66 2 745 4090, Fax. +66 2 398 0793

Indonesia: see Singapore

Ireland: Newstead, Clonskeagh, DUBLIN 14,

Tel. +353 1 7640 000, Fax. +353 1 7640 200

Turkey: Talatpasa Cad. No. 5, 80640 GÜLTEPE/ISTANBUL,

Tel. +90 212 279 2770, Fax. +90 212 282 6707

Israel: RAPAC Electronics, 7 Kehilat Saloniki St, PO Box 18053,

TEL AVIV 61180, Tel. +972 3 645 0444, Fax. +972 3 649 1007

Ukraine: PHILIPS UKRAINE, 4 Patrice Lumumba str., Building B, Floor 7,

252042 KIEV, Tel. +380 44 264 2776, Fax. +380 44 268 0461

Italy: PHILIPS SEMICONDUCTORS, Piazza IV Novembre 3,

20124 MILANO, Tel. +39 2 6752 2531, Fax. +39 2 6752 2557

United Kingdom: Philips Semiconductors Ltd., 276 Bath Road, Hayes,

MIDDLESEX UB3 5BX, Tel. +44 181 730 5000, Fax. +44 181 754 8421

Japan: Philips Bldg 13-37, Kohnan 2-chome, Minato-ku, TOKYO 108,

Tel. +81 3 3740 5130, Fax. +81 3 3740 5077

United States: 811 East Arques Avenue, SUNNYVALE, CA 94088-3409,

Tel. +1 800 234 7381

Korea: Philips House, 260-199 Itaewon-dong, Yongsan-ku, SEOUL,

Tel. +82 2 709 1412, Fax. +82 2 709 1415

Uruguay: see South America

Vietnam: see Singapore

Malaysia: No. 76 Jalan Universiti, 46200 PETALING JAYA, SELANGOR,

Tel. +60 3 750 5214, Fax. +60 3 757 4880

Yugoslavia: PHILIPS, Trg N. Pasica 5/v, 11000 BEOGRAD,

Tel. +381 11 625 344, Fax.+381 11 635 777

Mexico: 5900 Gateway East, Suite 200, EL PASO, TEXAS 79905,

Tel. +9-5 800 234 7381

Middle East: see Italy

For all other countries apply to: Philips Semiconductors, Marketing & Sales Communications,

Internet: http://www.semiconductors.philips.com

Building BE-p, P.O. Box 218, 5600 MD EINDHOVEN, The Netherlands, Fax. +31 40 27 24825

SCA55

All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.

The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed

without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license

under patent- or other industrial or intellectual property rights.

Printed in The Netherlands

547047/1200/06/pp24

Date of release: 1997 Oct 29

Document order number: 9397 750 02956


型号：	TDA8714T
厂家：	NXP
描述：	8-bit high-speed analog-to-digital converter 8位高速模拟数字转换器转换器
文件：	总24页 (文件大小：158K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

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