TDA8939TH_技术文档

TDA8939

Zero dead time Class-D 7.5 A power comparator

Rev. 01 — 22 April 2004

Objective data sheet

1. General description

Zero dead time Class-D 7.5 A power comparator

The TDA8939 is a power comparator designed for use in a high efﬁciency class-D audio

power ampliﬁer system.

It contains power switches, drive logic, protection circuitry, bias circuitry and a fully

differential input stage (comparator).

This device is optimized for applications in fully digital open-loop class-D audio systems

(in combination with a digital PWM controller).

The TDA8939 power comparator operates with high efﬁciency and low dissipation. The

system operates over a wide supply voltage range from ±10 V up to ±30 V.

2. Features

■ Zero dead time switching

■ Maximum output current 7.5 A

■ Standby mode

■ High efﬁciency

■ Operating voltage from ±10 V to ±30 V (symmetrical) or 20 V to 60 V (asymmetrical)

■ Low quiescent current

■ High output power

■ Diagnostic output

■ Thermal protection, current protection and voltage protection.

3. Applications

■ Television sets

■ Home-sound sets

■ Multimedia systems

■ All mains fed audio systems

■ Car audio (boosters).

TDA8939

Philips Semiconductors

Zero dead time Class-D 7.5 A power comparator

4. Quick reference data

Table 1:

Quick reference data

V_P= ±25 V; f_carrier= 384 kHz.

Symbol

Parameter

Conditions

Min

Typ

Max Unit

[1]

V_P

supply voltage

symmetrical supply

voltage

±10

±25

±30

V

asymmetrical supply

voltage

20

-

50

60

V

I_q(tot)

total quiescent current no load connected; no

ﬁlters; no snubbers

70

mA

connected

η

efﬁciency

P_rated

-

90

-

%

[1] When the supply voltage is below ±12.5 V the PWM outputs will not be able to switch to the high side at the

ﬁrst PWM cycle.

5. Ordering information

Table 2:

Ordering information

Type

number

Package

Name

Description

Version

TDA8939TH HSOP24 plastic, heatsink small outline package; 24 leads; low

stand-off height

SOT566-3

9397 750 13023

Objective data sheet

Rev. 01 — 22 April 2004

2 of 21

TDA8939

Philips Semiconductors

Zero dead time Class-D 7.5 A power comparator

6. Block diagram

22

BOOT1

23

TDA8939TH

V

DDP1

3

DRIVER

HIGH

V

DDA1

4

2

21

ZERO

DEAD TIME

CONTROL

IN1P

IN1N

OUT1

1

DRIVER

LOW

V

SSA1

19

20

5

STAB

12 V

POWERUP

DIAGN

STAB1

V

SSP1

OTP temperature sensor

OCP current protection

OVP overvoltage protection

UVP undervoltage protection

S

R

7

PROTECTION

LATCH

Q

≥

15

14

6

8

ENABLE

CGND

BOOT2

V

DDP2

10

DRIVER

HIGH

V

DDA2

9

16

ZERO

DEAD TIME

CONTROL

IN2P

IN2N

OUT2

11

12

DRIVER

LOW

V

SSA2

18

17

STAB

12 V

STAB2

V

SSP2

24

sub

13

001aaa624

V

heatsink

n.c.

SSD

Fig 1. Block diagram.

9397 750 13023

Objective data sheet

Rev. 01 — 22 April 2004

3 of 21

TDA8939

Philips Semiconductors

Zero dead time Class-D 7.5 A power comparator

7. Pinning information

7.1 Pinning

V

24

23

1

2

V

SSA1

SSD

V

IN1N

DDP1

BOOT1 22

OUT1 21

3

V

DDA1

4

IN1P

V

20

5

POWERUP

ENABLE

DIAGN

CGND

SSP1

STAB1 19

STAB2 18

6

TDA8939

7

V

SSP2

17

8

OUT2 16

9

IN2P

BOOT2 15

10 V

DDA2

V

14

11 IN2N

12

DDP2

n.c. 13

V

SSA2

001aaa625

Fig 2. Pin conﬁguration.

7.2 Pin description

Table 3:

Symbol

V_SSA1

Pin description

1

Description

negative analog supply voltage for channel 1

inverting input channel 1

IN1N

2

V_DDA1

3

positive analog supply voltage for channel 1

non-inverting input channel 1

IN1P

4

POWERUP

ENABLE

DIAGN

5

enable input for switching on internal reference sources

digital enable input

6

7

digital open-drain diagnostic output for OTP, OCP, OVP and UVP

(active LOW)

CGND

8

common ground, reference ground for diagnostic, enable and

power-up

IN2P

9

non-inverting input channel 2

V_DDA2

IN2N

10

11

12

13

14

15

16

17

18

positive analog supply voltage for channel 2

inverting input channel 2

V_SSA2

n.c.

negative analog supply voltage for channel 2

not connected

V_DDP2

BOOT2

OUT2

V_SSP2

STAB2

positive power supply voltage for channel 2

bootstrap capacitor 2

PWM output channel 2

negative power supply voltage for channel 2

decoupling internal stabilizer for logic supply channel 2

9397 750 13023

Objective data sheet

Rev. 01 — 22 April 2004

4 of 21

TDA8939

Philips Semiconductors

Zero dead time Class-D 7.5 A power comparator

Table 3:

Symbol

STAB1

V_SSP1

Pin description …continued

19

20

21

22

23

24

-

Description

decoupling internal stabilizer for logic supply channel 1

negative power supply voltage for channel 1

PWM output channel 1

OUT1

BOOT1

V_DDP1

V_SSD

bootstrap capacitor 1

positive power supply voltage for channel 1

negative digital supply voltage

SUB

heat spreader of package; internally connected to V_SSD

8. Functional description

8.1 General

The TDA8939 class-D power comparator is designed for use in fully digital open-loop

class-D audio applications. Excellent timing accuracy with respect to delay times and rise

and fall times is achieved and one of the most important sources of distortion in a full

digital open-loop audio ampliﬁer is eliminated; the zero dead time switching concept is

included. The TDA8939 contains two independent class-D output stages with high power

D-MOS switches, drivers, timing and control logic. For protection a temperature sensor, a

maximum current detection and overvoltage detection circuit are integrated. An internal

protection latch keeps the power comparator in shut-down mode after a fault condition has

been detected. External reset of the latch is required via the enable input.

8.2 Protections

Overtemperature, overcurrent and overvoltage sensors are included in the TDA8939

power comparator. In the event that the maximum temperature, maximum current or

maximum supply voltage is exceeded the diagnostic output is activated (open-drain output

pulled-down via external pull-up resistor).

The diagnostic output pin is activated (active LOW) in case of:

1. Overtemperature (OTP): the junction temperature (T_j) exceeds a threshold level.

2. Overcurrent (OCP): the output current exceeds the maximum output current threshold

level (e.g. when the loudspeaker terminals are short-circuited it will be detected by the

current protection).

3. Overvoltage (OVP): the supply voltage applied to the power comparator exceeds the

maximum supply voltage threshold level.

The TDA8939 is self-protecting. If a fault condition (OTP, OCP or OVP) is detected it will

pull-down the diagnostic output (pin 7), while at the same time shutting down the power

stage. In case of a fault condition in one of the half-bridges or output channel the other

half-bridge and output channel will also shut down. All protections trigger a latch which

ensures that the power stage remains deactivated until the latch is reset again.

The latch is reset by switching the enable voltage of the power stage to LOW level. Both

set (S) and reset (R) inputs of the protection latch trigger on a negative falling slope.

9397 750 13023

Objective data sheet

Rev. 01 — 22 April 2004

5 of 21

TDA8939

Philips Semiconductors

Zero dead time Class-D 7.5 A power comparator

The block diagram of diagnostic output including OTP, OCP and OVP is illustrated in

Figure 3. The diagnostic output (pin 7) is an open-drain output; a pull-up resistor

connected to +V_pull-uphas to be applied externally.

TDA8939

+V

int

disable power stage

OTP

OCP

OVP

R1

+V

pull-up

S

R

pu

LATCH

R2

C1

open-drain

Q

DIAGN

CGND

enable

001aaa623

Fig 3. OCP, OTP and OVP protection: S/R latch.

8.3 Interfacing between controller and the TDA8939

For interfacing with a digital PWM controller IC or microcontroller in the ﬁnal system

application the following inputs and outputs are available see Table 4 and 5.

8.3.1 Inputs

Table 4:

Inputs

Pin number

Pin name

Description

IN1P and

IN1N

4 and 2

9 and 11

5

full differential input for output channel 1; referenced with respect

to each other; common mode referenced to V_SSD

IN2P and

IN2N

full differential input for output channel 2; referenced with respect

to each other; common mode referenced to V_SSD

POWERUP

ENABLE

standby switch; reference to CGND; at a LOW level the device is

in standby mode and consumes a very low standby current. At

HIGH level the device is DC-biased (switch-on of internal

reference voltages and currents). The device can only be

switched to full operating mode by the enable input, if the

power-up input is at HIGH level.

6

mode switch; reference to CGND; at a LOW level the power

D-MOS switches are open and the PWM output is ﬂoating; all

internal logic circuits are in reset condition. At a HIGH level the

power comparator is fully operational if the power-up input is also

at a HIGH level. In this condition the power comparator outputs

are controlled by the input pins (IN1P, IN1N, IN2P and IN2N); see

also Figure 6. The enable input signal is also used to reset the

protection latch.

9397 750 13023

Objective data sheet

Rev. 01 — 22 April 2004

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TDA8939

Philips Semiconductors

8.3.2 Outputs

Zero dead time Class-D 7.5 A power comparator

Table 5:

Pin name

DIAGN

Outputs

Pin number

Description

7

Digital open-drain output; referenced to CGND; output indicates

the following fault conditions: OTP, OCP, OVP and UVP. In the

event of a fault condition the output is pulled to the CGND voltage

(active LOW). If the diagnostic output functionality is used in the

application, an external pull-up resistor is required.

8.3.3 Reference voltages

Table 6:

Pin name

CGND

Reference voltages

Pin number

Description

8

common ground; reference ground for diagnostic

output, enable input and power-up input

V_SSD

24

negative digital supply; reference ground digital circuits.

The V_SSDpin should be connected to V_SSvoltage in the

application. Internally the V_SSDpin is connected to the

V_SSAxand V_SSPx(e.g. V_SSA1and V_SSP1) via an ESD

protection diode.

8.4 Start-up timing

Power comparator mode selection:

• Standby mode: when pin POWERUP is LOW, the power comparator is in standby

mode, independent of the signal on the enable input

• Reset mode: when pin POWERUP is HIGH, the status of the power comparator is

controlled by pin ENABLE; if pin ENABLE is LOW, the status of the power stage is

reset and the outputs are ﬂoating

• Operating mode: when pin ENABLE is HIGH, the power stage is in operating mode.

To ensure correct start-up of the power stage, the enable input should never be HIGH

when the power-up input is LOW. Before switching to operating mode, the ampliﬁer should

ﬁrst be switched to reset mode.

Remark: It is possible to directly connect the power-up input to the positive supply line

(e.g. V_DDA1). As soon as the supply voltage is applied the device will be DC-biased (reset

mode).

Table 7:

Mode selection

Mode

POWERUP

LOW

ENABLE

X

standby

reset

HIGH

LOW

HIGH

operating

9397 750 13023

Objective data sheet

Rev. 01 — 22 April 2004

7 of 21

TDA8939

Philips Semiconductors

Zero dead time Class-D 7.5 A power comparator

ENABLE

POWERUP

status

standby

reset

operating

reset

standby

start-up sequence

switch-off sequence

001aaa062

Fig 4. Mode selection timing diagram.

9. Limiting values

Table 8:

Limiting values

In accordance with the Absolute Maximum Rating System (IEC 60134).

Symbol

V_p

Parameter

Conditions

Min

Max

60

Unit

V

supply voltage

-

I_ORM

repetitive peak current on

output pins

7.5

A

T_stg

T_amb

T_vj

storage temperature

−55

−40

-

+150

+85

°C

ambient temperature

virtual junction temperature

150

10. Thermal characteristics

Table 9:

Symbol

R_th(j-a)

Thermal characteristics

Parameter

Conditions

Value

40

Unit

K/W

thermal resistance from junction to ambient in free air

thermal resistance from junction to case

R_th(j-c)

1.3

9397 750 13023

Objective data sheet

Rev. 01 — 22 April 2004

8 of 21

TDA8939

Philips Semiconductors

Zero dead time Class-D 7.5 A power comparator

11. Static characteristics

Table 10: Static characteristics

V_P= ±25 V; f_carrier= 384 kHz; T_amb= 25 °C; unless otherwise speciﬁed.

Symbol

Supplies

V_P

Parameter

Conditions

Min

Typ

Max

Unit

[1]

supply voltage

quiescent current

symmetrical supply voltage

asymmetrical supply voltage

±10

20

-

±25

50

±30

60

V

I_q

no load; no ﬁlters; no

snubbers connected

50

70

mA

reset mode

-

10

20

mA

I_stb

standby current

standby mode

120

170

µA

Internal stabilizer logic supplies

V_STAB1

,

stabilizer output voltage

11

12

15

V

V_STAB2

Comparator full differential input stage: pins IN1P, IN1N, IN2P and IN2N

V_i(diff)

V_i(com)

I_i(bias)

differential input voltage range

common mode input voltage

input bias current

1

3.3

12

V

V_SSA1

-

V_DDA1− 7.5 V

10

µA

Common ground: pin CGND

V_CGNDcommon ground reference

voltage

Diagnostic output: pin DIAGN

asymmetrical supply

referenced to CGND;

-

0

-

V

[2]

V_OL

LOW-level output voltage

0

1

V

I_DIAGN= 1 mA

V_pu(max)

I_L

maximum pull-up voltage

leakage current

referenced to CGND

no error condition

-

12

50

V

µA

Enable input: pin ENABLE

V_IL

V_IH

I_I

LOW-level input voltage

referenced to CGND

V_ENABLE= 12 V

0

3

-

1

V

HIGH-level input voltage

input current

-

12

140

V

70

µA

Power-up input: pin POWERUP

V_IL

V_IH

V_hys

I_I

LOW-level input voltage

HIGH-level input voltage

hysteresis voltage

input current

referenced to CGND

0

3

-

0.5

V_DDA

-

V

-

V

0.3

70

V

V_POWERUP= 12 V

-

140

µA

9397 750 13023

Objective data sheet

Rev. 01 — 22 April 2004

9 of 21

TDA8939

Philips Semiconductors

Zero dead time Class-D 7.5 A power comparator

Table 10: Static characteristics …continued

V_P= ±25 V; f_carrier= 384 kHz; T_amb= 25 °C; unless otherwise speciﬁed.

Symbol

Parameter

Conditions

Min

150

7.5

Typ

Max

Unit

°C

Temperature protection

T_diag

diagnostic trigger temperature

V_DIAGN= V_OL

-

Overcurrent protection

I_prot

diagnostic and protection trigger V_DIAGN= V_OL

current

A

Overvoltage protection

V_DD(max)diagnostic and protection trigger V_DIAGN= V_OL

maximum supply voltage

±30

±33

-

V

[1] When the supply voltage is below ±12.5 V the PWM outputs will not be able to switch to the high side at the ﬁrst PWM cycle.

[2] OTP, OCP and/or OVP protection activated.

12. Dynamic characteristics

Table 11: Dynamic characteristics

V_P= ±25 V; T_amb= 25 °C; f_carrier= 384 kHz; see also Figure 8 for deﬁnitions.

Symbol

Parameter

Conditions

Min

Typ

Max

Unit

PWM output

t_r

rise time output voltage

fall time output voltage

dead time

-

20

0

-

ns

t_f

t_dead

t_r(LH)

large signal response time

LOW-to-HIGH transition at

output

input amplitude = 3.3 V

90

t_r(HL)

large signal response time

HIGH-to-LOW transition at

output

-

90

-

ns

t_W(min)

R_{DS_ON}

η

minimal pulse width

R_{DS_ON}output transistors

efﬁciency

-

150

0.2

-

ns

Ω

-

0.3

90

[1]

P_o= P_rated

[1] Output power measured across the loudspeaker load. Power measurement based on indirect measurement by measuring the R_{DS_ON}

.

9397 750 13023

Objective data sheet

Rev. 01 — 22 April 2004

10 of 21

TDA8939

Philips Semiconductors

Zero dead time Class-D 7.5 A power comparator

input

V

i(dif)

3.3 V

V

com

t

W(min)

r(LH)

r(HL)

V

DD

output

0 V

V

o

V

SS

t

f

r

1/f

c

time

001aaa063

V_common= V_SSA1to (V_DDA1− 7.5 V).

t_deadcannot be represented in the ﬁgure.

Response times depend on input signal amplitude.

The second input pulse is not reproduced with same pulse width by the output due to minimum pulse width limitation.

Fig 5. Timing diagram PWM output.

9397 750 13023

Objective data sheet

Rev. 01 — 22 April 2004

11 of 21

TDA8939

Philips Semiconductors

Zero dead time Class-D 7.5 A power comparator

13. Output power estimation

The maximum achievable output power is not only determined by the power comparator

characteristics, but by the total system application.

The following application blocks determine the maximum achievable output power:

Power comparator:

• Minimum pulse width

• Series resistances: R_{DS_ON}, bond wires, printed-circuit board tracks, series resistance

of the coil, etc.

System application:

• Power supply voltage

• Load impedance

• Controller characteristics: maximum modulation depth and carrier frequency.

In Figure 6 an estimate is given for the output power in full-bridge application as function

of the (symmetrical) supply voltage for different values of the load-impedance. The

following variables are taken into account:

• Minimum pulse width: 150 ns

• Total series resistance: 0.4 Ω

• Carrier frequency: 384 kHz.

001aaa626

001aaa627

200

250

P

out

(W)

160

200

120

80

40

0

150

100

50

(1)

(2)

(1)

(2)

(3)

0

10

14

18

22

26

30

10

14

18

22

26

30

V

(V)

V (V)

P

(1) Z_L= 4 Ω.

(2) Z_L= 6 Ω.

(3) Z_L= 8 Ω.

(1) Z_L= 4 Ω.

(2) Z_L= 6 Ω.

(3) Z_L= 8 Ω.

Fig 6. Output power estimation as a function of

(symmetrical) supply voltage for THD = 1 %.

Fig 7. Output power estimation as a function of

(symmetrical) supply voltage for THD = 10 %.

9397 750 13023

Objective data sheet

Rev. 01 — 22 April 2004

12 of 21

TDA8939

Philips Semiconductors

Zero dead time Class-D 7.5 A power comparator

15. Test information

15.1 Quality information

The General Quality Speciﬁcation for Integrated Circuits, SNW-FQ-611 is applicable.

9397 750 13023

Objective data sheet

Rev. 01 — 22 April 2004

14 of 21

TDA8939

Philips Semiconductors

Zero dead time Class-D 7.5 A power comparator

16. Package outline

HSOP24: plastic, heatsink small outline package; 24 leads; low stand-off height

SOT566-3

E

A

D

x

X

c

y

E

H

2

v

M

A

E

D

1

D

2

12

1

pin 1 index

Q

A

2

(A )

3

E

1

A

4

θ

L

p

detail X

24

13

w

M

Z

b

p

e

0

5

10 mm

scale

DIMENSIONS (mm are the original dimensions)

A

max.

(1)

(2)

A

b

c

D

E

1

E

e

H

E

L

p

Q

v

w

x

y

Z

θ

UNIT

2

3

4

p

1

2

8°

0°

+0.08 0.53 0.32

−0.04 0.40 0.23

16.0 13.0 1.1 11.1 6.2

15.8 12.6 0.9 10.9 5.8

2.9

2.5

14.5 1.1

13.9 0.8

1.7

1.5

2.7

2.2

3.5

3.2

mm

1

3.5

0.35

0.25 0.25 0.03 0.07

Notes

1. Limits per individual lead.

2. Plastic or metal protrusions of 0.25 mm maximum per side are not included.

REFERENCES

OUTLINE

EUROPEAN

PROJECTION

ISSUE DATE

VERSION

IEC

JEDEC

JEITA

03-02-18

03-07-23

SOT566-3

Fig 9. Package outline.

9397 750 13023

Objective data sheet

Rev. 01 — 22 April 2004

15 of 21

TDA8939

Philips Semiconductors

Zero dead time Class-D 7.5 A power comparator

17. Soldering

17.1 Introduction to soldering surface mount packages

This text gives a very brief insight to a complex technology. A more in-depth account of

soldering ICs can be found in our Data Handbook IC26; Integrated Circuit Packages

(document order number 9398 652 90011).

There is no soldering method that is ideal for all surface mount IC packages. Wave

soldering can still be used for certain surface mount ICs, but it is not suitable for ﬁne pitch

SMDs. In these situations reﬂow soldering is recommended.

17.2 Reﬂow soldering

Reﬂow soldering requires solder paste (a suspension of ﬁne solder particles, ﬂux and

binding agent) to be applied to the printed-circuit board by screen printing, stencilling or

pressure-syringe dispensing before package placement. Driven by legislation and

environmental forces the worldwide use of lead-free solder pastes is increasing.

Several methods exist for reﬂowing; for example, convection or convection/infrared

heating in a conveyor type oven. Throughput times (preheating, soldering and cooling)

vary between 100 and 200 seconds depending on heating method.

Typical reﬂow peak temperatures range from 215 to 270 °C depending on solder paste

material. The top-surface temperature of the packages should preferably be kept:

• below 225 °C (SnPb process) or below 245 °C (Pb-free process)

– for all BGA, HTSSON..T and SSOP..T packages

– for packages with a thickness ≥ 2.5 mm

– for packages with a thickness < 2.5 mm and a volume ≥ 350 mm³so called

thick/large packages.

• below 240 °C (SnPb process) or below 260 °C (Pb-free process) for packages with a

thickness < 2.5 mm and a volume < 350 mm³so called small/thin packages.

Moisture sensitivity precautions, as indicated on packing, must be respected at all times.

17.3 Wave soldering

Conventional single wave soldering is not recommended for surface mount devices

(SMDs) or printed-circuit boards with a high component density, as solder bridging and

non-wetting can present major problems.

To overcome these problems the double-wave soldering method was speciﬁcally

developed.

If wave soldering is used the following conditions must be observed for optimal results:

• Use a double-wave soldering method comprising a turbulent wave with high upward

pressure followed by a smooth laminar wave.

• For packages with leads on two sides and a pitch (e):

– larger than or equal to 1.27 mm, the footprint longitudinal axis is preferred to be

parallel to the transport direction of the printed-circuit board;

9397 750 13023

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Rev. 01 — 22 April 2004

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TDA8939

Philips Semiconductors

Zero dead time Class-D 7.5 A power comparator

– smaller than 1.27 mm, the footprint longitudinal axis must be parallel to the

transport direction of the printed-circuit board.

The footprint must incorporate solder thieves at the downstream end.

• For packages with leads on four sides, the footprint must be placed at a 45° angle to

the transport direction of the printed-circuit board. The footprint must incorporate

solder thieves downstream and at the side corners.

During placement and before soldering, the package must be ﬁxed with a droplet of

adhesive. The adhesive can be applied by screen printing, pin transfer or syringe

dispensing. The package can be soldered after the adhesive is cured.

Typical dwell time of the leads in the wave ranges from 3 to 4 seconds at 250 °C or

265 °C, depending on solder material applied, SnPb or Pb-free respectively.

A mildly-activated ﬂux will eliminate the need for removal of corrosive residues in most

applications.

17.4 Manual soldering

Fix the component by ﬁrst soldering two diagonally-opposite end leads. Use a low voltage

(24 V or less) soldering iron applied to the ﬂat part of the lead. Contact time must be

limited to 10 seconds at up to 300 °C.

When using a dedicated tool, all other leads can be soldered in one operation within

2 to 5 seconds between 270 and 320 °C.

17.5 Package related soldering information

Table 12: Suitability of surface mount IC packages for wave and reﬂow soldering methods

Package ^[1]

Soldering method

Wave

Reﬂow^[2]

BGA, HTSSON..T^[3], LBGA, LFBGA, SQFP,

SSOP..T^[3], TFBGA, USON, VFBGA

not suitable

suitable

DHVQFN, HBCC, HBGA, HLQFP, HSO, HSOP,

HSQFP, HSSON, HTQFP, HTSSOP, HVQFN,

HVSON, SMS

not suitable^[4]

suitable

PLCC^[5], SO, SOJ

suitable

LQFP, QFP, TQFP

not recommended^{[5] [6]}

not recommended^[7]

not suitable

suitable

SSOP, TSSOP, VSO, VSSOP

CWQCCN..L^[8], PMFP^[9], WQCCN..L^[8]

suitable

not suitable

[1] For more detailed information on the BGA packages refer to the (LF)BGA Application Note (AN01026);

order a copy from your Philips Semiconductors sales ofﬁce.

[2] All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the

maximum temperature (with respect to time) and body size of the package, there is a risk that internal or

external package cracks may occur due to vaporization of the moisture in them (the so called popcorn

effect). For details, refer to the Drypack information in the Data Handbook IC26; Integrated Circuit

Packages; Section: Packing Methods.

[3] These transparent plastic packages are extremely sensitive to reﬂow soldering conditions and must on no

account be processed through more than one soldering cycle or subjected to infrared reﬂow soldering with

peak temperature exceeding 217 °C ± 10 °C measured in the atmosphere of the reﬂow oven. The package

body peak temperature must be kept as low as possible.

9397 750 13023

Objective data sheet

Rev. 01 — 22 April 2004

17 of 21

TDA8939

Philips Semiconductors

Zero dead time Class-D 7.5 A power comparator

[4] These packages are not suitable for wave soldering. On versions with the heatsink on the bottom side, the

solder cannot penetrate between the printed-circuit board and the heatsink. On versions with the heatsink

on the top side, the solder might be deposited on the heatsink surface.

[5] If wave soldering is considered, then the package must be placed at a 45° angle to the solder wave

direction. The package footprint must incorporate solder thieves downstream and at the side corners.

[6] Wave soldering is suitable for LQFP, QFP and TQFP packages with a pitch (e) larger than 0.8 mm; it is

deﬁnitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.

[7] Wave soldering is suitable for SSOP, TSSOP, VSO and VSOP packages with a pitch (e) equal to or larger

than 0.65 mm; it is deﬁnitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.

[8] Image sensor packages in principle should not be soldered. They are mounted in sockets or delivered

pre-mounted on ﬂex foil. However, the image sensor package can be mounted by the client on a ﬂex foil by

using a hot bar soldering process. The appropriate soldering proﬁle can be provided on request.

[9] Hot bar soldering or manual soldering is suitable for PMFP packages.

9397 750 13023

Objective data sheet

Rev. 01 — 22 April 2004

18 of 21

TDA8939

Philips Semiconductors

Zero dead time Class-D 7.5 A power comparator

18. Revision history

Table 13: Revision history

Document ID

Release date Data sheet status

20040422 Objective data sheet

Change notice Order number

9397 750 13023

Supersedes

TDA8939_1

-

9397 750 13023

Objective data sheet

Rev. 01 — 22 April 2004

19 of 21

TDA8939

Philips Semiconductors

Zero dead time Class-D 7.5 A power comparator

19. Data sheet status

Level Data sheet status^[1]Product status^{[2] [3]}

Deﬁnition

I

Objective data

Development

This data sheet contains data from the objective speciﬁcation for product development. Philips

Semiconductors reserves the right to change the speciﬁcation in any manner without notice.

II

Preliminary data

Qualiﬁcation

This data sheet contains data from the preliminary speciﬁcation. Supplementary data will be published

at a later date. Philips Semiconductors reserves the right to change the speciﬁcation without notice, in

order to improve the design and supply the best possible product.

III

Product data

Production

This data sheet contains data from the product speciﬁcation. Philips Semiconductors reserves the

right to make changes at any time in order to improve the design, manufacturing and supply. Relevant

changes will be communicated via a Customer Product/Process Change Notiﬁcation (CPCN).

[1]

[2]

Please consult the most recently issued data sheet before initiating or completing a design.

The product status of the device(s) described in this data sheet may have changed since this data sheet was published. The latest information is available on the Internet at

URL http://www.semiconductors.philips.com.

[3]

For data sheets describing multiple type numbers, the highest-level product status determines the data sheet status.

20. Deﬁnitions

21. Disclaimers

Short-form speciﬁcation — The data in a short-form speciﬁcation is

extracted from a full data sheet with the same type number and title. For

detailed information see the relevant data sheet or data handbook.

Life support — These products are not designed for use in life support

appliances, devices, or systems where malfunction of these products can

reasonably be expected to result in personal injury. Philips Semiconductors

customers using or selling these products for use in such applications do so

at their own risk and agree to fully indemnify Philips Semiconductors for any

damages resulting from such application.

Limiting values deﬁnition — Limiting values given are in accordance with

the Absolute Maximum Rating System (IEC 60134). Stress above one or

more of the limiting values may cause permanent damage to the device.

These are stress ratings only and operation of the device at these or at any

other conditions above those given in the Characteristics sections of the

speciﬁcation is not implied. Exposure to limiting values for extended periods

may affect device reliability.

Right to make changes — Philips Semiconductors reserves the right to

make changes in the products - including circuits, standard cells, and/or

software - described or contained herein in order to improve design and/or

performance. When the product is in full production (status ‘Production’),

relevant changes will be communicated via a Customer Product/Process

Change Notiﬁcation (CPCN). Philips Semiconductors assumes no

responsibility or liability for the use of any of these products, conveys no

license or title under any patent, copyright, or mask work right to these

products, and makes no representations or warranties that these products are

free from patent, copyright, or mask work right infringement, unless otherwise

speciﬁed.

Application information — Applications that are described herein for any

of these products are for illustrative purposes only. Philips Semiconductors

make no representation or warranty that such applications will be suitable for

the speciﬁed use without further testing or modiﬁcation.

22. Contact information

For additional information, please visit: http://www.semiconductors.philips.com

For sales ofﬁce addresses, send an email to: sales.addresses@www.semiconductors.philips.com

9397 750 13023

Objective data sheet

Rev. 01 — 22 April 2004

20 of 21

TDA8939

Philips Semiconductors

Zero dead time Class-D 7.5 A power comparator

23. Contents

1

2

3

4

5

6

General description . . . . . . . . . . . . . . . . . . . . . . 1

Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1

Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1

Quick reference data . . . . . . . . . . . . . . . . . . . . . 2

Ordering information. . . . . . . . . . . . . . . . . . . . . 2

Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 3

7

7.1

7.2

Pinning information. . . . . . . . . . . . . . . . . . . . . . 4

Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4

Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 4

8

Functional description . . . . . . . . . . . . . . . . . . . 5

General. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5

Protections . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5

Interfacing between controller and the TDA8939 .

6

8.1

8.2

8.3

8.3.1

8.3.2

8.3.3

8.4

Inputs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6

Outputs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7

Reference voltages. . . . . . . . . . . . . . . . . . . . . . 7

Start-up timing . . . . . . . . . . . . . . . . . . . . . . . . . 7

9

Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 8

Thermal characteristics. . . . . . . . . . . . . . . . . . . 8

Static characteristics. . . . . . . . . . . . . . . . . . . . . 9

Dynamic characteristics . . . . . . . . . . . . . . . . . 10

Output power estimation. . . . . . . . . . . . . . . . . 12

Application information. . . . . . . . . . . . . . . . . . 13

Test information. . . . . . . . . . . . . . . . . . . . . . . . 14

Quality information . . . . . . . . . . . . . . . . . . . . . 14

Package outline . . . . . . . . . . . . . . . . . . . . . . . . 15

10

11

12

13

14

15

15.1

16

17

17.1

Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16

Introduction to soldering surface mount

packages . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16

Reﬂow soldering . . . . . . . . . . . . . . . . . . . . . . . 16

Wave soldering . . . . . . . . . . . . . . . . . . . . . . . . 16

Manual soldering . . . . . . . . . . . . . . . . . . . . . . 17

Package related soldering information . . . . . . 17

17.2

17.3

17.4

17.5

18

19

20

21

22

Revision history. . . . . . . . . . . . . . . . . . . . . . . . 19

Data sheet status . . . . . . . . . . . . . . . . . . . . . . . 20

Deﬁnitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20

Disclaimers. . . . . . . . . . . . . . . . . . . . . . . . . . . . 20

Contact information . . . . . . . . . . . . . . . . . . . . 20

All rights are reserved. Reproduction in whole or in part is prohibited without the prior

written consent of the copyright owner. The information presented in this document does

not form part of any quotation or contract, is believed to be accurate and reliable and may

be changed without notice. No liability will be accepted by the publisher for any

consequence of its use. Publication thereof does not convey nor imply any license under

patent- or other industrial or intellectual property rights.

Date of release: 22 April 2004

Document order number: 9397 750 13023

Published in The Netherlands


型号：	TDA8939TH
厂家：	NXP
描述：	Zero dead time Class-D 7.5 A power comparator 零死区时间，D类7.5 A功耗比较
文件：	总21页 (文件大小：97K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

TDA8939TH [NXP]

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